JPH08195150A - Electronic apparatus, base part, its manufacture - Google Patents

Abstract

PURPOSE: To reduce the number of part items and improve assembling workability by using a base part integrated with a case and a printed board mounted with parts. CONSTITUTION: A base part 10 is constituted of a platable resin and an unplatable resin. The platable resin is exposed on a circuit pattern section 18, a through hole section, and an electromagnetic shield section 19 only, and the unplatable resin is exposed on the other portion. The whole is plated, and chip parts 20 are mounted to form an electronic apparatus.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a base part in which a circuit pattern or the like is provided on a structural part serving as a base, an electronic device using the base part, and a method for manufacturing the base part.

[0002]

2. Description of the Related Art Conventionally, in order to form an electronic device such as a photoelectric sensor, a printed circuit board on which a case and a circuit board are mounted and a light projecting / receiving element are mounted on independent boards, respectively, and these are integrally connected to each other in the case. Stored and configured. 5 and 6 are cross-sectional views from different directions showing two examples of such a conventional photoelectric sensor. In this figure, a chip component 2 is mounted on a printed circuit board 1. Then, the printed board 5 on which the light projecting element 3 and the light receiving element 4 are mounted is attached vertically to the printed board 1. Since the printed circuit boards 1 and 5 are perpendicular to each other as shown in FIG. 6, they are connected by soldering in a cross pattern. A lens holder 6 is attached to the light emitting / receiving elements 3 and 4 as shown in FIG. The lens holder 6 holds the transparent lens 7 whose focus is the position of the light emitting / receiving element.
The lens holder and the substrates 1 and 5 are housed in a case 8 to form a photoelectric sensor. Also in FIG. 6, the lens holder 6 having the lens 7 is attached to the tip of the case 8 to form a photoelectric sensor.

[0003]

However, in such a photoelectric sensor, since the structural parts such as the case and the holder, the substrate and the shield member are separate parts, many steps are required and the assembling workability is poor. There was a drawback. Further, there is a drawback that the price increases because many parts are required. Further, as shown in the figure, the elements are connected to the printed circuit boards 1, 5
Since the printed circuit boards 1 and 5 are soldered to and fixed to the case or mounted on the lens holder, processing accuracy and insertion accuracy are combined between the light emitting / receiving element and the lens, resulting in an assembly error. Therefore, there is a drawback in that the detection distance of the sensor, the detection center axis, and the like are likely to vary, and the adjustment becomes complicated. Further, there is a drawback that miniaturization becomes difficult because electromechanical connection is required between the plurality of substrates and the shield plate.

The present invention has been made in view of the above-mentioned problems of the prior art, and it is possible to improve the assembling workability as well as the mounting accuracy of parts, and the electronic equipment and its base parts and base parts. It aims at providing the manufacturing method of.

[0005]

The invention according to claim 1 of the present application includes a plateable resin that can be plated on the surface and a non-platable resin that cannot be plated, and exposes the plateable resin to at least the circuit pattern portion. , A base component formed by plating, and an electronic component mounted on a circuit pattern portion of the base component.

The invention according to claim 2 of the present application includes a plateable resin that can be plated on the surface and a non-platable resin that cannot be plated, and the plateable resin is exposed at least in the circuit pattern portion and plated. It is characterized by having done.

According to a third aspect of the present invention, a step of forming a base part including a plateable resin capable of plating on a surface thereof and a non-platable resin not capable of plating, and exposing the non-platable resin at least in a circuit pattern portion. And a plating step of plating a plateable resin and a plateless resin.

According to a fourth aspect of the present invention, a step of forming a base component including a plateable resin capable of plating on a surface thereof and a non-platable resin not capable of plating and exposing the non-platable resin at least in a circuit pattern portion. And a step of forming a through hole at a predetermined position of the plateable resin, and a plating step of plating the plateable resin and the plateless resin.

[0009]

According to the present invention having such characteristics, the base component is constituted by the plateable resin which can be plated on the surface and the non-platable resin which cannot be plated. At this time, the circuit pattern portion is formed by exposing the plateable resin to the circuit pattern portion of the electronic device and performing plating. In this way, the electronic device can be configured by mounting the electronic component on the circuit pattern portion.

[0010]

FIG. 1 is an assembly configuration diagram of a photoelectric sensor according to an embodiment of the present invention. In this figure, the base component 10 is a resin formed by two-color molding of a resin that can be plated and a resin that cannot be plated. Non-platable resin is general resin 1
1. For example, PPS (polyphenylene sulfide) is used, and as a resin capable of metal plating, for example, P containing a catalyst is used.
ES (polyether sulfone) is used. FIG. 2 is a partial sectional view showing an example of the base component 10. The base component 10 is formed by secondary molding a general resin 11 that cannot be plated only on a portion that does not require plating, using one of the resins, for example, the resin 12 that can be plated. As shown in FIG. 1A, this base component 10 has two pyramidal taper portions on its upper surface, and the slopes thereof are used as the reflection plating portions 10a and 10b.

As shown in FIG. 1, a light emitting element 13 such as a light emitting diode and a light receiving element 14 such as a photodiode are mounted at the central position of the pyramid-shaped opening of the base component 10, and the upper part thereof is mounted. The lens 15 is embedded. Further, a substantially rectangular notch is formed on the side of the base component 10 as shown in the drawing to form a reflection plating portion 10c. The display element 16 is also mounted on the reflection plating portion 10c, and the transparent cover 17 is attached. Further, as shown in FIG. 1B, a groove is formed on the back surface of the base component 10. On the surface of this groove portion, a plated portion to be the circuit pattern portion 18 and the electromagnetic shield portion 19 is formed. The chip resistance and I
The chip component 20 such as C is mounted and the cable 21 is connected.

FIG. 3 is a longitudinal sectional view of the photoelectric sensor thus constructed. Further, FIG. 3B is an enlarged sectional view showing the circular portion of FIG. Reference numeral 22 denotes a through hole formed in the base component 10. As shown in the figure, since the printed circuit board and the case are composed of the base component 10, the printed circuit board, the case, and the lens holder are separately configured as in the conventional example, and these are combined to manufacture a photoelectric sensor. No need. As a result, the assembly workability can be significantly improved, and the mounting accuracy between the components can be significantly improved.

Next, the manufacturing process of the base component will be described with reference to FIG. In this figure, the resin 12 that can be plated to form a plated portion is used as a base. Then, a general resin 11 that cannot be plated is secondarily formed on the entire surface of the plateable resin 12 as shown in the figure, except for a portion where a circuit pattern, an electromagnetic shield, etc. are required and a reflection surface for reflecting light. Then, the entire base component is plated.
In this way, the portion 1 where the platable resin 12 is exposed on the surface
Only 1a is selectively plated and the circuit pattern portion 1
8. Through holes, electromagnetic shields 19, cord connections, light reflection plating, etc. can be formed. If the electromagnetic shield portion 19 has a recess formed in a plateable resin, the electromagnetic shield portion 19 becomes the electromagnetic shield portion 19 by plating as it is. Further, if through holes are formed in the plateable resin 12 in advance, it is possible to form through holes 22 that penetrate both surfaces of the base component 10 and are electrically conductive, as shown in FIG. 3B.

FIG. 4A is a perspective view of a base component showing an example of a photoelectric sensor according to another embodiment of the present invention, and FIG. 4B is a sectional view thereof. In this embodiment, the base component 30 is formed by mounting the chip component 20 on both sides through through holes, and the end portion of the base component 30 has a cylindrical shape.
3 and the light receiving element 14 are attached respectively. Then, the shield part 30a for shielding between these light emitting / receiving elements is used as the base component 3
Molded to 0 at the same time. By accommodating the base component 30 in the cylindrical case 31 as shown in FIG. 5, it is not necessary to make a solder connection in a cross-shaped pattern like the conventional photoelectric sensor, and the assembly can be easily performed. Further, as shown in FIG. 4 (c), the base part 30 can be extended to the tip side to form the lens holder 30b at the same time. By doing so, the lens can be accurately arranged at the position of the light emitting / receiving element, and the assembling accuracy can be improved.
A chip component is mounted on this base component 30, and
As shown in (b) and (c), the photoelectric sensor can be formed by covering the outer peripheral portion with the case 31.

Although the present embodiment has been described with reference to the photoelectric sensor, the present invention can be applied not only to the photoelectric sensor but also to other electronic sensors such as a proximity sensor. In addition to the photoelectric sensor and the proximity sensor, the present invention can be applied to various electronic devices mounting electronic components.

In this embodiment, PPS is used as a general resin that cannot be plated and PES containing a catalyst is used as a resin that can be plated. However, it is also possible to use liquid crystal polymer or the like as a resin that can be plated and a resin that cannot be plated. is there.

[0017]

As described in detail above, according to the present invention, the base component can be configured as a component including the functions of a printed circuit board and a case, and a plurality of substrates and a shield plate, a case, etc. are integrated into a three-dimensional structure. Can be configured. Therefore, it is not necessary to connect a plurality of printed circuit boards by double soldering or the like, and the workability of assembling the electronic device can be improved. Moreover, an excellent effect that the assembling accuracy between the parts can be greatly improved can be obtained. Furthermore, the number of parts is reduced, which facilitates design and part management. Further, since the plating can be used as a light reflecting member, it is possible to obtain an effect that the light of the light projecting element or the indicator lamp can be easily recognized.

[Brief description of drawings]

FIG. 1 is an assembly configuration diagram of a photoelectric sensor according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a base part of the photoelectric sensor according to the first embodiment of the present invention.

3A is a vertical sectional view of the photoelectric sensor according to the present embodiment, and FIG. 3B is a partially enlarged sectional view thereof.

4A is a perspective view of a base component of a photoelectric sensor according to a second embodiment of the present invention, and FIGS. 4B and 4C are vertical sectional views thereof.

FIG. 5 is a sectional view showing an example of a conventional photoelectric sensor.

FIG. 6 is a vertical sectional view showing an example of a conventional photoelectric sensor.

[Explanation of reference signs] 10,30 Base parts 10a, 10b, 10c Reflective plating part 11 General resin 12 Platable resin 13 Light emitting element 14 Light receiving element 15 Lens 16 Indicator lamp 17 Transparent cover 18 Circuit pattern 19 Electromagnetic shield part 20 Chip Parts 21 Cable 31 Case

Claims (4)

[Claims] 1. A platable resin capable of plating on a surface,
A base component that includes a non-platable resin that cannot be plated, and that is formed by exposing the plateable resin to at least the circuit pattern portion and performing plating; and an electronic component that is mounted on the circuit pattern portion of the base component. An electronic device composed of. 2. A plateable resin capable of being plated on the surface,
A base component comprising a non-platable resin that cannot be plated, and at least the circuit pattern portion is exposed with the plateable resin and is plated. 3. A plateable resin capable of being plated on the surface,
A step of forming a base component including an unplatable resin that cannot be plated and exposing the unplatable resin in at least a circuit pattern portion, and a plating step of plating the plateable resin and the non-platable resin. And a method for manufacturing a base part. 4. A plateable resin capable of being plated on the surface,
A step of forming a base part including an unplatable resin that cannot be plated and exposing the unplatable resin in at least a circuit pattern portion; a step of forming a through hole at a predetermined position of the plateable resin; And a plating step of plating resin and non-platable resin.