JP3136079B2 - Optical semiconductor device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device and a method of manufacturing the same, particularly to a structure of a light receiving device and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIGS. 14A and 14B show a conventional optical semiconductor device. FIG. 14A is a plan view and FIG. 14B is a side view.

[0003] As shown in the figure, a conventional optical semiconductor device comprises:
A lead frame 3 composed of a chip mounting lead (primary side lead) 1 and a chip connection lead (secondary side lead) 2 and a mounting piece 1a of the chip mounting lead 1 via a conductive adhesive. A light receiving chip 4 mounted and electrically connected to a back electrode, a gold wire 5 for electrically connecting a front electrode of the light receiving chip 4 and the chip connection lead 2, And a substantially rectangular parallelepiped light-transmitting resin 6 covering the mounting piece 1 a and the gold wire 5.

The above-described optical semiconductor device is mounted on a substrate or the like by performing lead forming on an exposed portion of the lead frame 3 and dipping or reflowing.

For example, in an insertion type optical semiconductor device,
In order to insert and fix (temporarily fix) the lead frame into the positioning holes (through holes) provided in the substrate, the exposed portion of the lead frame 3 is bent in substantially the same direction, and the exposed portion of the lead frame 3 is inserted into the substrate. Fixed (temporary fixed)
Thereafter, mounting is performed by a dip soldering method or a reflow soldering method.

In a surface-mount type optical semiconductor device,
The exposed portion of the lead frame 3 is bent so as to be flush with the bottom surface of the translucent resin 6, and is fixed (temporarily fixed) by soldering to the substrate with reference to the translucent resin bottom surface and a part of the surface of the lead frame 3. Alternatively, after the bottom surface of the translucent resin 6 is fixed (temporarily fixed) to the substrate with an adhesive, it is surface-mounted by dip soldering or reflow soldering.

[0007]

However, in the conventional optical semiconductor device, since the outer package is formed of the translucent resin 6, for example, the optical system is disturbed by the input of disturbance light from the side. The structure is susceptible to malfunctions and the like.

In a surface-mount type optical semiconductor device,
When the surface-mount type optical semiconductor device is mounted at a predetermined position on the substrate, the only reference portion for temporary fixing is only the bottom surface of the translucent resin 6 and the exposed portion of the lead frame 3. Requires high precision.

The reason for this is that, for example, if the optical system is mounted at a position shifted from a predetermined position (optical axis position) on the substrate, this causes a shift in the optical system, making it difficult to perform its original function. It is.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides an optical semiconductor device capable of preventing disturbance light from entering, an optical semiconductor device capable of preventing disturbance light from entering, and a highly accurate optical axis adjustment, and a method of manufacturing the same. The purpose is to provide.

[0011]

According to a first aspect of the present invention, an optical semiconductor device includes a lead frame, a light receiving chip mounted on the lead frame, and a light-transmitting resin covering the light receiving chip. The optical semiconductor device has a light-receiving window, covers the light-receiving surface of the light-transmitting resin, and
A light-shielding mask having an outer peripheral portion protruding beyond the light- transmitting resin; and a light-shielding resin holding the light-shielding mask and covering a light-transmitting resin surface excluding the light-receiving surface. It is.

Further, an optical semiconductor device according to a second aspect of the present invention is mounted on a lead frame and the lead frame.
A light-receiving chip, and a light-transmitting resin covering the light-receiving chip.
An optical semiconductor device comprising: a light receiving window;
Light-shielding mask for covering a light-receiving surface of a conductive resin, and the light-shielding mask
And the translucent resin surface excluding the light receiving surface
And a light-shielding resin to be coated, wherein the light-shielding mask includes a protrusion protruding outward from the light-shielding resin, and positioning means is provided on the protrusion.

Further, in the optical semiconductor device according to a third aspect of the present invention, the protrusions protrude from different side surfaces of the light-shielding resin in different directions, and the positioning means detects the light reception of each of the protrusions. It is characterized by being provided at a uniform position from the center of the chip.

In the optical semiconductor device according to a fourth aspect of the present invention, a plurality of chip mounting leads and the same number of chip connection leads as the chip mounting leads are juxtaposed at a constant arrangement pitch. Forming a lead frame, mounting a light receiving chip on each of the chip mounting leads, electrically connecting each light receiving chip and a chip connection lead with a gold wire, A step of coating each chip with a translucent resin; a step of forming a light-shielding mask having the same number of light-receiving windows as the chip-mounting leads at the same pitch as the arrangement pitch of the chip-mounting leads; Forming one more positioning means forming windows than the chip mounting leads at the same pitch as the light receiving windows and being shifted by １ ／ pitch; Disposing the light-shielding mask on the light-receiving surface of the light-transmitting resin in a state where the center of the light-receiving portion and the center of the light-receiving chip coincide with each other; and transmitting the metal mask with the light-shielding resin and excluding the light-receiving surface. A step of coating the surface of the conductive resin, and a step of dividing by a shaft which is perpendicular to the juxtaposition direction of the chip mounting leads and passes through the center of the positioning means forming window. It is characterized by the following.

[0015]

According to the above construction, the optical semiconductor device according to the first aspect of the present invention includes a light receiving window, covers the light receiving surface of the light transmitting resin, and has an outer periphery that is smaller than the light transmitting resin in plan view.
And a light-shielding resin that covers the light-transmitting resin surface excluding the light-receiving surface while holding the light-shielding mask. Except for the corresponding light-transmitting resin surface, the light-shielding mask or light-shielding resin is covered to prevent disturbance light from entering from other than the part corresponding to the light-receiving window. can do.

The optical semiconductor device according to a second aspect of the present invention has a light receiving window and covers a light receiving surface of the translucent resin.
A light-shielding mask;
A light-shielding resin that covers the light-transmitting resin surface except the light surface
Only it becomes and, provided with a protrusion protruding from the outwardly the light-shielding resin to said light-shielding mask, since arrangement of providing a positioning means projecting portion, the translucent resin is receiving the light shielding mask
Except for the translucent resin surface corresponding to the window,
Are covered with a light-blocking resin, and
It is possible to prevent external light from entering,
Signal light can be accurately input from the optical semiconductor device, the optical semiconductor device can be easily positioned on a substrate or the like by using the positioning means, and the optical axis can be adjusted with high accuracy. Is possible.

Further, in the optical semiconductor device according to a third aspect of the present invention, the projecting portions project in different directions from different side surfaces of the light-shielding resin, and the positioning means is configured to detect the light receiving of each of the projecting portions. Since the light receiving chip is provided at an even position from the center of the chip, the center position of the light receiving chip can be calculated with high accuracy, and the positioning and fixing that enables highly accurate optical axis adjustment is possible.

In addition, according to the method of manufacturing an optical semiconductor device according to the fourth aspect of the present invention, the chip in a different direction from the center of the mounting position of the substrate or the like on which the optical semiconductor device is mounted and in the manufacturing process. By providing a holding means for holding the positioning means at a position of a half pitch of the arrangement pitch of the mounting leads, it is only necessary to hold the positioning means with the holding means and mount the optical semiconductor device. Since the center of the mounting position and the center of the light receiving chip are uniquely matched and fixed, it is possible to provide an optical semiconductor device that can perform positioning and fixing with high-precision optical axis adjustment.

[0019]

1 is a view showing an optical semiconductor device according to an embodiment of the present invention. FIG. 1 (a) is a plan view and FIG. 1 (b) is a perspective view from the side.

As shown in the figure, the optical semiconductor device of this embodiment has a lead frame 13 including a chip mounting lead (primary side lead) 11 and a chip connecting lead (secondary side lead) 12; A light-receiving chip 14 mounted on a mounting piece 11a of a chip mounting lead 11 via a conductive adhesive and electrically connected to a back electrode, a front electrode of the light-receiving chip 14 and the chip connection lead 12 And a substantially rectangular parallelepiped translucent resin 16 covering the light receiving chip 14, the mounting piece 11a and the gold wire 15, and a circular light receiving window 17. Light resin 1
6, a light-shielding mask 18 for covering the light-receiving surface of the light-transmitting resin 6,
6 and a light-shielding resin 19 covering the surface excluding the light receiving surface.

The light-shielding mask 18 is made of, for example, a metal plate such as copper or ceramic, plastic, or the like, and protrudes outward from the side surface of the light-shielding resin 19 in two directions perpendicular to the lead-out direction of the leads 11 and 12. Part 18a,
Notches (positioning means) 20 are provided at both ends of the protruding portion 18a and at equal positions from the center of the light receiving chip 14 in such a manner that the circular window is bisected by an axis passing through the center. Become.

According to this configuration, the optical semiconductor device of the present embodiment has the light receiving window 17 and covers the light receiving surface of the translucent resin 16, and the light shielding mask 18 is partially covered and held. And a light-shielding resin 19 for covering the surface except for the light-receiving surface of the light-transmitting resin 16, so that the light-transmitting resin 16 is formed of the light-transmitting resin 16 corresponding to the light-receiving window 17 of the light-shielding mask 18. The portion excluding the surface is a light shielding mask 16
Alternatively, it is possible to prevent disturbance light from entering from a portion other than the portion corresponding to the light receiving window 17 while being covered with the light-shielding resin 19, and to accurately input signal light from the light receiving window 17.

Therefore, it is possible to prevent malfunction due to disturbance light.

Further, the light-shielding mask 18 is provided with protrusions 18a projecting outward from two different side surfaces of the light-shielding resin 19 in two directions perpendicular to the lead-out directions of the leads 11, 12, and both ends of the protrusions 18a. And light receiving chip 1
4 is provided with a notch 20 having a shape obtained by dividing a circular window into two parts by an axis passing through the center at an equal position from the center of 4, so that the optical semiconductor device can be mounted on a substrate or the like using the notch 20. It is possible to easily perform positioning and fixing, and also to perform positioning and fixing that enables highly accurate optical axis adjustment. In particular, it is effective for a surface-mount type optical semiconductor device.

For example, as shown in FIG. 2, a projection (holding means) 21a for fitting and holding the notch 20 is provided at a predetermined position of a substrate 21 on which the optical semiconductor device is mounted by surface mounting, thereby increasing the height. It is possible to perform positioning and fixing that enables accurate optical axis adjustment. In the figure, (a) is a plan view,
(B) is a side view.

More specifically, the distance between the projection 21a and the optical axis position to be set, which is an equal position in a different direction from the optical axis position (center of the mounting position) where the projection 21a is to be set in advance, is different from the above. By setting the optical semiconductor device at the same position as the distance between the center of the light receiving chip 14 and the notch 20, the optical semiconductor device is placed and at the same time, the optical axis position to be set and the center position of the light receiving chip 14 are matched and fixed. It is possible to perform positioning and fixing that enables highly accurate optical axis adjustment.

FIGS. 3A and 3B are diagrams showing a state in which the optical semiconductor device is mounted on the substrate 21 shown in FIG. 2 by surface mounting. FIG. 3A is a plan view, and FIG. 3B is a side view.

In the above embodiment, the notch is used as the positioning means, but a through hole may be used as the positioning means. In this case, the positioning is fixed by inserting the projection provided on the substrate.

Hereinafter, a method of manufacturing the optical semiconductor device of the above embodiment will be described with reference to FIGS.

First, as shown in FIG. 4, a plurality of chip mounting leads 11 and the same number of chip connection leads 12 as the chip mounting leads 11 are arranged in parallel at a constant arrangement pitch P1. A lead frame 13 'is formed, the light receiving chip 14 is mounted on the mounting piece 11a of each chip mounting lead 11, and the light receiving chip 14 and the chip connecting lead 12 are wire-bonded with the gold wire 15. In the figure, (a) is a plan view and (b) is a side view.

Next, as shown in FIG.
For each 4, the light receiving chip 14, the mounting piece 11 a, and the gold wire 15 are primarily molded with the translucent resin 16. In the figure,
(A) is a plan view and (b) is a side view.

As shown in FIG. 6, in the separate step from the above-mentioned step, as many light receiving windows 17 as the number of the chip mounting leads 11 and the same number of the light receiving windows 17 as the chip mounting leads 11 are arranged at the same pitch as the arrangement pitch P1 of the chip mounting leads 11. One more number of positioning means forming windows 20 'than the leads 11 are respectively formed, and the light receiving window 17 and the positioning means forming windows 2' are formed.
0 'are shifted from each other by a half pitch to form a multiple light shielding mask 18'. FIG. 6 is a plan view of the light shielding mask 18 '.

Next, using a mold (lower mold) 22 shown in FIG. 7, the primary molded body and the multiple light-shielding masks 18 ′ are secondarily molded integrally with the light-shielding resin 19. In the figure, (a) is a plan view, and (b) is a side view. In the drawing, only the lower mold is shown.

As shown in FIG. 7, the mold 22 is provided with positioning pins 22 for positioning the common lead frame 13 '.
a and a positioning pin 22b for positioning the multiple light shielding mask 18 '. First, as shown in FIG. 8, a positioning hole 23a provided in a common lead frame 13' is inserted through the positioning pin 22a. As a result, the common lead frame 13 'is positioned, and then, as shown in FIG. 9, the positioning pin 22b is provided with a positioning means forming window 20' and a positioning hole provided on the multiple light shielding mask 18 '. The multiple light-shielding masks 18 'are positioned by inserting 23b. In the figure, (a) is a plan view, (b) is a side view, and (c) is an enlarged side view of a main part of (b).

The positioning pins 22a and 22b and the positioning holes 23a and 23b are arranged so that the center of each light receiving chip 14 and the center of the light receiving window 17 coincide with each other. In the state shown in FIG. It is in a state.
In the drawing, reference numeral 24 denotes a concave portion for molding a light-shielding resin.

In this state, an upper mold (not shown) is arranged, the lead frame is sandwiched, and insert molding with the light-shielding resin 19 is performed. FIG. 10 is a view showing a state after molding, (a) is a plan view, (b) is a side view,
(C) is a front view.

Thereafter, as shown in FIG. 11, unnecessary portions of the common lead frame 13 'and the multiple light shielding masks 18' are removed, and as shown in FIG.
12, the positioning means forming window 20 'is
As a result, a single-piece optical semiconductor device is obtained.
Here, a multiple optical semiconductor device may be formed instead of a single product. 11 and 12 are plan views, respectively.

In the above manufacturing process, the chip mounting lead 11 and the chip connecting lead 12 are formed on a common lead frame 13 '. May be performed.

Although the positioning means forming window 20 'is formed in advance in the multiple light shielding mask 18', the positioning means forming window 20 'may be formed after the secondary molding.

FIG. 13 shows another multiple light shielding mask 18 '.
FIG. 4A is a plan view showing the configuration of FIG. 5A, in which a positioning means forming window 20 ′ is a square (square);
(B) is also an elliptical shape. These positioning means forming windows are divided into two in the same manner as described above, and serve as positioning means, that is, notches.

According to the above manufacturing method, the distance from the center of the mounting position of the substrate or the like on which the optical semiconductor device is to be mounted is different from the center of the mounting pitch of the chip mounting lead in the manufacturing direction. By providing a holding means for holding the positioning means at a position, just by mounting the optical semiconductor device while holding the positioning means with the holding means,
Since the center of the mounting position and the center of the light receiving chip are uniquely fixed and fixed, it is possible to provide an optical semiconductor device that can perform positioning and fixing with high-precision optical axis adjustment.

[0042]

As described above, according to the first aspect of the present invention,
According to the optical semiconductor device described in the above, the light-receiving window is provided and covers the light-receiving surface of the translucent resin, and the outer peripheral portion is in front in plan view.
A light-shielding mask projecting from the light-transmitting resin and a light-shielding resin that holds the light-shielding mask and covers the light-transmitting resin surface excluding the light-receiving surface are provided. The portion of the light-shielding mask other than the light-transmitting resin surface corresponding to the light-receiving window is covered with the light-shielding mask or light-shielding resin, so that disturbance light can be prevented from entering from portions other than the light-receiving window, and signals from the light-receiving window can be prevented. Light can be accurately incident, and malfunction due to disturbance light can be prevented.

According to the optical semiconductor device of the second aspect of the present invention, a light receiving window is provided and the light receiving surface of the translucent resin is covered.
A light-shielding mask to cover and hold the light-shielding mask
Light-shielding resin covering the light-transmitting resin surface excluding the light-receiving surface
Be provided bets, said comprising a protrusion from the light-shielding resin in the light-shielding mask projecting outwardly, so configuration formed by providing the positioning means projecting portion, the translucent resin light shielding mask
Except for the translucent resin surface corresponding to the light receiving window of
Covered with a screen or light-shielding resin, corresponding to the light receiving window
It is possible to prevent disturbance light from entering
Signal light can be accurately entered from the optical window, and disturbance light
In addition, the optical semiconductor device can be easily positioned on a substrate or the like using the positioning means, and the positioning can be performed with high-precision optical axis adjustment.

Further, according to the optical semiconductor device of the third aspect of the present invention, the protruding portions protrude from different side surfaces of the light-shielding resin in different directions, and the positioning means is provided on each of the protruding portions. Since the light receiving chip is provided at an equal position from the center of the light receiving chip, the center position of the light receiving chip can be calculated with high accuracy, and the positioning and fixing can be performed with high-precision optical axis adjustment.

In addition, according to the method of manufacturing an optical semiconductor device according to the fourth aspect of the present invention, the chip in a different direction from the center of the mounting position of the substrate or the like on which the optical semiconductor device is mounted and in the manufacturing process. By providing a holding means for holding the positioning means at a position of a half pitch of the arrangement pitch of the mounting leads, it is only necessary to hold the positioning means with the holding means and mount the optical semiconductor device. Since the center of the mounting position and the center of the light receiving chip are uniquely matched and fixed, it is possible to provide an optical semiconductor device that can perform positioning and fixing with high-precision optical axis adjustment.

[Brief description of the drawings]

FIGS. 1A and 1B are views showing an optical semiconductor device according to an embodiment of the present invention, wherein FIG. 1A is a plan view and FIG. 1B is a perspective view from the side.

2A and 2B are diagrams showing a substrate on which the optical semiconductor device shown in FIG. 1 is mounted, wherein FIG. 2A is a plan view and FIG. 2B is a side view.

3A and 3B are diagrams showing a state in which the optical semiconductor device is mounted on the substrate shown in FIG. 2, wherein FIG. 3A is a plan view and FIG. 3B is a side view.

FIG. 4 is a view for explaining a manufacturing process of the optical semiconductor device shown in FIG. 1;

FIG. 5 is also a view for explaining a manufacturing process.

FIG. 6 is a view for explaining a manufacturing process.

FIG. 7 is a view for explaining a manufacturing process.

FIG. 8 is also a view for explaining a manufacturing process.

FIG. 9 is a view for explaining a manufacturing process.

FIG. 10 is a view for explaining the manufacturing process.

FIG. 11 is a view for explaining the manufacturing process.

FIG. 12 is a view for explaining a manufacturing process.

FIG. 13 is a plan view showing the structure of another multiple light shielding mask.

14A and 14B are diagrams showing a conventional example, in which FIG. 14A is a plan view and FIG. 14B is a side view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Lead for chip mounting 11a Mounting piece 12 Lead for chip connection 13 Lead frame 13 'Common lead frame 14 Light receiving chip 15 Gold wire 16 Translucent resin 17 Light receiving window 18 Light shielding mask 18' Multiple light shielding mask 18a Projection Part 19 Light-shielding resin 20 Notch (positioning means) 20 'Positioning means forming window P1 Arrangement pitch

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-6-77526 (JP, A) JP-A-54-109389 (JP, A) JP-A-63-240078 (JP, A) JP-A-2- 206179 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 31/00-31/0392

Claims (4)

(57) [Claims] 1. An optical semiconductor device comprising a lead frame, a light receiving chip mounted on the lead frame, and a light transmitting resin covering the light receiving chip, comprising: a light receiving window; together when coating the surface
A light-shielding mask having an outer peripheral portion projected from the light- transmitting resin in plan view, and a light-shielding resin that holds the light-shielding mask and covers the light-transmitting resin surface excluding the light-receiving surface. An optical semiconductor device characterized by being provided. 2. A lead frame and a lead frame.
Light receiving chip to be mounted and light transmission covering the light receiving chip
An optical semiconductor device comprising a transparent resin, a light-shielding mask having a light-receiving window and covering a light-receiving surface of the translucent resin.
And the light-receiving surface while holding the light-shielding mask.
Excluding a light-shielding resin that covers the light-transmitting resin surface
Ri, the light shielding mask said comprises a protrusion protruding outward from the light-shielding resin, the optical semiconductor device you characterized by comprising providing a positioning means projecting portion. 3. The method according to claim 2, wherein the projecting portions project in different directions from different side surfaces of the light-shielding resin, and the positioning means is provided at an equal position from the center of the light receiving chip of each projecting portion. 3. The optical semiconductor device according to claim 2, wherein: 4. A step of forming a lead frame in which a plurality of chip mounting leads and the same number of chip connection leads as the chip mounting leads are juxtaposed at a fixed arrangement pitch, respectively. Mounting the light receiving chips on the leads, electrically connecting the respective light receiving chips and the chip connecting leads with gold wires, covering each of the light receiving chips with a translucent resin, Forming a light-shielding mask having the same number of light-receiving windows as the chip-mounting leads at the same pitch as the arrangement pitch of the chip-mounting leads; and positioning one more number than the chip-mounting leads on the light-shielding mask. Forming the means forming window at the same pitch as the light receiving window and at a position shifted by ピ ッ チ pitch; and aligning the center of each light receiving portion with the center of the light receiving chip. Disposing the light-shielding mask on the light-receiving surface of the light-transmitting resin in a state in which the light-shielding resin is placed; holding the metal mask with the light-shielding resin and covering the light-transmitting resin surface excluding the light-receiving surface; A step of dividing by an axis perpendicular to the juxtaposition direction of the positioning leads and passing through the center of the positioning means forming window.