JPH08192309A - Inner layer circuit router for electronic part package - Google Patents
Inner layer circuit router for electronic part packageInfo
- Publication number
- JPH08192309A JPH08192309A JP3130195A JP3130195A JPH08192309A JP H08192309 A JPH08192309 A JP H08192309A JP 3130195 A JP3130195 A JP 3130195A JP 3130195 A JP3130195 A JP 3130195A JP H08192309 A JPH08192309 A JP H08192309A
- Authority
- JP
- Japan
- Prior art keywords
- rotary shaft
- inner layer
- electric signal
- contact
- layer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Milling Processes (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、半導体チップ等の電子
部品を収容する電子部品用パッケージの加工装置、特に
内層削り出し装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for an electronic component package containing an electronic component such as a semiconductor chip, and more particularly to an inner layer shaving apparatus.
【0002】[0002]
【従来の技術】通常、キャビティ部を凹形状にした多層
の電子部品用パッケージは、内層端子部、ダイパット部
など所要の個所にあらかじめ窓を明けた後、接着剤やロ
ーフロープリプレグ等を用いて積層し、その後に表層に
所要の回路を形成する製法が採られている。これに比し
て、内層削り出し製法は、一般に、プリプレグと内層、
外層を一体積層した後に、削り出しによって内層の所要
回路を露出させるので、回路間の絶縁の信頼性が高く、
また密封性に優れた特徴により耐吸湿性や耐透湿性の信
頼性が向上する。2. Description of the Related Art Usually, a multilayer package for electronic parts having a concave cavity is formed by pre-opening windows at desired places such as inner layer terminals and die pads, and then using an adhesive or a low flow prepreg. A manufacturing method is adopted in which layers are laminated and then a required circuit is formed on the surface layer. On the other hand, the inner layer shaving method is generally used for prepreg and inner layer,
After laminating the outer layer integrally, the required circuit of the inner layer is exposed by shaving, so the reliability of insulation between circuits is high,
Further, due to the excellent sealing property, the reliability of moisture absorption resistance and moisture permeability resistance is improved.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記内
層削り出し製法においては、内層銅箔の高さ方向の位置
にバラツキがあるため、露出されるべき回路のある内層
銅箔の位置を、電気的接触または非接触方法によって検
出する必要があるが、電気的接触検出方法による場合
は、潤滑部材(エアーベアリング、ベアリング等)の電
気的不良導体を回避して切削回転軸に電気を導通させる
必要があるが、高周波スピンドル等の高速回転スピンド
ルに安定通電させることは極めて難しい。ベルト掛け等
の低速回転のスピンドルでは電気的接触をとることは可
能だが回転数が低く生産性が悪い。また、電気的非接触
検出方法による場合は、その検出方法が極めて特殊であ
るので高速検出ができず、電気的接触検出方法に比して
さらに生産性が劣りコストは高くなる。また、電気的接
触または非接触方法ともに、1点を測定し、切削刃と削
り出す内層銅箔面との距離を推定して制御するので、内
層銅箔のうねり、傾き等の積層状態によって、切削過多
または切削不足の部分を生じることがある。また、内層
銅箔に相応の厚みのあるものを用いて、ある程度銅箔を
削り込むようにすれば、切削過多または切削不足を防止
することは可能だが、銅箔を厚くした場合、エッチング
ファクターを考慮すると微細な回路を形成することが難
しくなる。本発明はこのような問題点を鑑みてなされ、
切削回転軸と非接触にて電気信号を検出し、回転軸の高
速回転を可能にして生産性を向上させ、コスト低減を可
能にすることを目的としている。また、削り出す内層銅
箔面上の複数点をあらかじめ測定し、測定各点の深さ方
向の位置関係を計算して仮想面を算定して、この仮想面
に沿って切削刃を制御することにより、内層削り出し製
法における内層銅箔の高さ方向のうねりによる切削過多
および切削不足を防止することを目的としている。However, in the above-mentioned inner layer shaving method, since the position of the inner layer copper foil in the height direction varies, the position of the inner layer copper foil having the circuit to be exposed is electrically changed. It is necessary to detect by the contact or non-contact method, but when using the electric contact detection method, it is necessary to avoid the electrically defective conductor of the lubricating member (air bearing, bearing, etc.) and conduct electricity to the cutting rotary shaft. However, it is extremely difficult to stably energize a high-speed rotating spindle such as a high-frequency spindle. It is possible to make electrical contact with a low-speed rotating spindle such as a belt, but the rotation speed is low and productivity is poor. Further, in the case of the electrical non-contact detection method, since the detection method is extremely special, high-speed detection cannot be performed, and the productivity is further deteriorated and the cost is increased as compared with the electrical contact detection method. In addition, both the electrical contact and non-contact methods measure one point and estimate and control the distance between the cutting blade and the inner layer copper foil surface to be cut. May cause over-cutting or under-cutting. In addition, it is possible to prevent overcutting or undercutting by cutting the copper foil to a certain extent by using an inner copper foil having a suitable thickness, but if the copper foil is thick, the etching factor is increased. Considering this, it becomes difficult to form a fine circuit. The present invention has been made in view of such problems,
The purpose is to detect electrical signals without contacting the cutting rotary shaft, enable high-speed rotation of the rotary shaft, improve productivity, and reduce costs. Also, measure multiple points on the inner layer copper foil surface to be machined beforehand, calculate the positional relationship of each measurement point in the depth direction to calculate a virtual surface, and control the cutting blade along this virtual surface. Therefore, it is intended to prevent excessive cutting and insufficient cutting due to waviness in the height direction of the inner layer copper foil in the inner layer cutting method.
【0004】[0004]
【課題を解決するための手段】上記の目的を達成するた
め、本発明の内層削り出し製法は次の構成を備える。す
なわち、切削回転軸と非接触にて電気信号を検出し、回
転軸を高速に回転させることを特徴とする。また、被切
削面の複数の測定点に基づいて計算により仮想面を算定
し、この仮想面に沿って切削刃を制御することを特徴と
する。In order to achieve the above object, the inner layer shaving method of the present invention has the following constitution. That is, it is characterized in that the electric signal is detected in a non-contact manner with the cutting rotary shaft to rotate the rotary shaft at a high speed. Further, it is characterized in that a virtual surface is calculated by calculation based on a plurality of measurement points on the surface to be cut, and the cutting blade is controlled along the virtual surface.
【0005】[0005]
【作用】本発明によれば、切削回転軸と非接触にて電気
信号を検出するので、潤滑部材等の電気的不良導体を考
慮する必要がなく、また、電気的導通のための接点を必
要としないので、回転軸を高速に回転させることによ
り、生産性を向上させてコストを低減することができ
る。また、複数の測定点に基づいて計算により仮想面を
算定し、この仮想面に沿って切削刃を制御することによ
り、内層削り出し製法における切削過多および切削不足
を防止して、その歩留まりを改善することが可能とな
る。According to the present invention, since an electric signal is detected in a non-contact manner with a cutting rotary shaft, it is not necessary to consider an electrically defective conductor such as a lubricating member, and a contact for electrical conduction is required. Therefore, by rotating the rotary shaft at a high speed, it is possible to improve productivity and reduce cost. In addition, by calculating a virtual surface based on multiple measurement points and controlling the cutting blade along this virtual surface, it is possible to prevent over-cutting and under-cutting in the inner layer cutting process, and improve the yield. It becomes possible to do.
【0006】[0006]
【実施例】以下、本発明に係る実施例について添付図面
とともに説明する。図1は、本発明に好適な内層削り出
し装置の全体構成を示している。この装置は一般的に知
られているNCルーターマシンから構成されており、図
では本発明に関係のある主要部分の構成のみを示してい
る。図において、20は回転軸であり、その先端にチャ
ックを介して、超硬または焼結ダイヤモンド等の切削刃
30が固着されている。回転軸20はその軸線方向、す
なわちZ軸方向に往復運動されて、回転する切削刃によ
ってサグリ加工が行われる。回転軸20の上部には、非
接触にて電気信号を検出するリングセンサー10が設置
されている。このリングセンサー10は高周波微少電流
を励起し、装置自体を導電体として、切削刃30が被切
削面50に接触した瞬間に電気信号が出力されて、数値
演算装置40に伝播される。数値演算装置40では、伝
播された電気信号によってプログラムコントロールし、
回転軸のZ軸方向を制御する。なお、被切削面50は導
電性を有している必要がある。図2は、被切削面50の
上面方向から見た複数の測定点を示している。図では便
宜的に9点の測定点としている。測定点P1、測定点P
2および測定点P3は三角形面130を結ぶ。この三角
形面130は、各測定点の高さに対応した傾斜を有して
いる(図3)。同様にして三角形面を次々に結ぶと、被
切削面50は8面の三角形面が連続した仮想面とするこ
とができる(図4)。この仮想面に沿って切削刃を制御
することにより、被切削面50の実体に対して高精度の
ザグリ加工が可能である。測定点の数を多くすればその
精度をさらに向上するので望ましい。また、高精度かつ
高速の測定装置と高速の数値演算装置を用いればさらに
効果的である。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows the overall configuration of an inner layer shaving apparatus suitable for the present invention. This device is composed of a generally known NC router machine, and in the figure, only the structure of the main part relevant to the present invention is shown. In the figure, reference numeral 20 is a rotary shaft, and a cutting blade 30 of cemented carbide or sintered diamond or the like is fixed to the tip of the rotary shaft via a chuck. The rotary shaft 20 is reciprocated in the axial direction, that is, the Z-axis direction, and the rotary cutting blade performs sag processing. A ring sensor 10 that detects an electric signal in a non-contact manner is installed above the rotating shaft 20. The ring sensor 10 excites a high-frequency minute current, and an electric signal is output at the moment when the cutting blade 30 contacts the surface to be cut 50 by using the device itself as a conductor, and the signal is transmitted to the numerical calculation device 40. In the numerical operation device 40, program control is performed by the propagated electric signal,
Controls the Z-axis direction of the rotation axis. The surface to be cut 50 needs to have conductivity. FIG. 2 shows a plurality of measurement points viewed from the top surface direction of the surface to be cut 50. In the figure, 9 measurement points are used for convenience. Measurement point P1, measurement point P
2 and the measurement point P3 connect the triangular surface 130. The triangular surface 130 has an inclination corresponding to the height of each measurement point (FIG. 3). Similarly, if the triangular surfaces are connected one after another, the cut surface 50 can be a virtual surface in which eight triangular surfaces are continuous (FIG. 4). By controlling the cutting blade along this virtual surface, it is possible to perform highly accurate counterboring on the substance of the surface to be cut 50. It is desirable to increase the number of measurement points because the accuracy is further improved. Further, it is more effective to use a highly accurate and high speed measuring device and a high speed numerical operation device.
【0007】[0007]
【発明の効果】本発明によれば、切削回転軸と非接触に
て電気信号を検出するので、潤滑部材等の電気的不良導
体を考慮する必要がなく、また、電気的導通のための接
点を必要としないので、通常の高速高周波スピンドル等
を用いて回転軸を高速に回転させることにより、生産性
を向上させてコストを低減することができる。また、複
数の測定点に基づいて計算により仮想面を算定するの
で、この仮想面は内層銅箔面の実体を高精度で表現して
おり、この仮想面に沿って切削刃を制御するので、内層
削り出し製法における内層銅箔の高さ方向のうねりによ
る切削過多および切削不足を防止しすることができる。
結果、その歩留まりを改善し、コストを低減することが
できる。According to the present invention, since an electric signal is detected in a non-contact manner with a cutting rotary shaft, it is not necessary to consider an electrically defective conductor such as a lubricating member and a contact for electrical conduction. Therefore, by rotating the rotary shaft at a high speed by using a normal high-speed high-frequency spindle or the like, productivity can be improved and cost can be reduced. Further, since the virtual surface is calculated by calculation based on a plurality of measurement points, this virtual surface represents the substance of the inner layer copper foil surface with high accuracy, and the cutting blade is controlled along this virtual surface, It is possible to prevent excessive cutting and insufficient cutting due to waviness in the height direction of the inner layer copper foil in the inner layer shaving method.
As a result, the yield can be improved and the cost can be reduced.
【図1】内層削り出し装置の主要部分の構成図。FIG. 1 is a configuration diagram of a main part of an inner layer shaving device.
【図2】被切削面の複数の測定点の図。FIG. 2 is a diagram of a plurality of measurement points on a surface to be cut.
【図3】測定各点が結ぶ三角形面の図。FIG. 3 is a diagram of a triangular surface connecting measurement points.
【図4】三角形面が連続した仮想面の図。FIG. 4 is a diagram of a virtual surface in which triangular surfaces are continuous.
10 リングセンサー 20 回転軸 30 切削刃 40 数値演算装置 50 被切削面 60 ワーク 70 測定点P1 80 測定点P2 90 測定点P3 100 測定点P1の高さ 110 測定点P2の高さ 120 測定点P3の高さ 130 測定各点が結ぶ三角形面 10 ring sensor 20 rotary shaft 30 cutting blade 40 numerical operation device 50 surface to be cut 60 workpiece 70 measuring point P1 80 measuring point P2 90 measuring point P3 100 height of measuring point P1 110 height of measuring point P2 120 of measuring point P3 Height 130 Triangular surface connecting measurement points
Claims (2)
品用パッケージの内層回路を削り出す装置において、 高周波微少電流を励起するリングセンサーを用いて内層
銅箔の位置を検出することにより、切削回転軸と非接触
にて電気信号を検出し、回転軸を高速に回転させること
を可能としたことを特徴とする内層回路削り出し装置。1. A device for shaving an inner layer circuit of a multi-layer electronic component package having a concave cavity portion, by detecting the position of the inner layer copper foil by using a ring sensor that excites a high-frequency minute current. An inner layer circuit shaving device which is capable of rotating an axis of rotation at a high speed by detecting an electric signal without contacting the axis of rotation.
あらかじめ測定し、測定各点を結ぶ仮想面を算定して、
この仮想面に沿って切削刃を制御することを特徴とす
る、請求項1記載の内層回路削り出し装置。2. A plurality of height positions on the inner copper foil surface to be carved are measured in advance, and a virtual surface connecting the measured points is calculated,
The inner layer circuit shaving device according to claim 1, wherein the cutting blade is controlled along the virtual surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03130195A JP3425251B2 (en) | 1995-01-10 | 1995-01-10 | Apparatus and method for cutting out inner layer circuit for electronic component package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03130195A JP3425251B2 (en) | 1995-01-10 | 1995-01-10 | Apparatus and method for cutting out inner layer circuit for electronic component package |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002372462A Division JP2003179180A (en) | 2002-12-24 | 2002-12-24 | Device and method for carving inner layer circuit for electronic component package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08192309A true JPH08192309A (en) | 1996-07-30 |
JP3425251B2 JP3425251B2 (en) | 2003-07-14 |
Family
ID=12327472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03130195A Expired - Lifetime JP3425251B2 (en) | 1995-01-10 | 1995-01-10 | Apparatus and method for cutting out inner layer circuit for electronic component package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3425251B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008229789A (en) * | 2007-03-22 | 2008-10-02 | Nec Corp | Recessed part forming method and device, and material for forming recessed part |
JP2013215812A (en) * | 2012-04-05 | 2013-10-24 | Toyo Advanced Technologies Co Ltd | Method and device for measuring position of workpiece |
-
1995
- 1995-01-10 JP JP03130195A patent/JP3425251B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008229789A (en) * | 2007-03-22 | 2008-10-02 | Nec Corp | Recessed part forming method and device, and material for forming recessed part |
JP2013215812A (en) * | 2012-04-05 | 2013-10-24 | Toyo Advanced Technologies Co Ltd | Method and device for measuring position of workpiece |
Also Published As
Publication number | Publication date |
---|---|
JP3425251B2 (en) | 2003-07-14 |
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