JP2509888B2 - Reference position display mark for inner layer circuit Mark exposure method - Google Patents

Reference position display mark for inner layer circuit Mark exposure method

Info

Publication number
JP2509888B2
JP2509888B2 JP556588A JP556588A JP2509888B2 JP 2509888 B2 JP2509888 B2 JP 2509888B2 JP 556588 A JP556588 A JP 556588A JP 556588 A JP556588 A JP 556588A JP 2509888 B2 JP2509888 B2 JP 2509888B2
Authority
JP
Japan
Prior art keywords
cutting
reference position
inner layer
cutting tool
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP556588A
Other languages
Japanese (ja)
Other versions
JPH01184899A (en
Inventor
秀隆 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP556588A priority Critical patent/JP2509888B2/en
Publication of JPH01184899A publication Critical patent/JPH01184899A/en
Application granted granted Critical
Publication of JP2509888B2 publication Critical patent/JP2509888B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、導体と絶縁体とが交互に複数の層をなして
いる多層プリント配線板における内層回路の基準位置表
示マーク露出方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a reference position indicating mark of an inner layer circuit in a multilayer printed wiring board in which a conductor and an insulator form a plurality of layers alternately. Regarding the exposure method.

(従来の技術) 多層プリント配線板の製造工程は、例えば第3図
(a)及び(b)に示すような4層の多層プリント配線
板の場合、回路未形成の外層銅箔1a,1dと回路が形成さ
れている内層銅箔1b,1cとがそれぞれ絶縁基材2a,2b,2c
を介して積層された多層プリント配線板3に対して、穴
明け、スルーホールのメッキおよび外層銅箔1a,1dの回
路形成の各処理が順次施される。この穴明けと、外層銅
箔の回路形成処理は、内層銅箔1b,1cの回路に対して正
確に相対的な位置関係が保たれた状態でおこなう必要が
あるため、これらの処理に先立って多層プリント配線板
3に基準穴を設けることが行われている。基準穴の穴明
けは、通常次に示す2工程でおこなわれる。
(Prior Art) In the manufacturing process of a multilayer printed wiring board, for example, in the case of a four-layer multilayer printed wiring board as shown in FIGS. 3 (a) and 3 (b), the outer layer copper foils 1a and 1d with no circuit are formed. The inner layer copper foils 1b and 1c on which the circuit is formed are insulating base materials 2a, 2b and 2c, respectively.
The multi-layer printed wiring board 3 laminated via the above is sequentially subjected to processing such as drilling, through hole plating, and circuit formation of the outer copper foils 1a and 1d. Since this hole formation and the circuit formation process of the outer layer copper foil must be performed in a state where the relative positional relationship is accurately maintained with respect to the circuits of the inner layer copper foils 1b and 1c, prior to these processes. A reference hole is provided in the multilayer printed wiring board 3. The reference hole is usually drilled in the following two steps.

(1)基準穴より多少大きい直径の座ぐり用カッターに
よって、内層銅箔1bにつけられた基準位置表示マーク付
近に、第4図(a)及び(b)に示すように基準位置表
示マーク4が露出するまで座ぐり加工する。
(1) With a spot facing cutter having a diameter slightly larger than the reference hole, a reference position display mark 4 is provided near the reference position display mark attached to the inner copper foil 1b as shown in FIGS. 4 (a) and 4 (b). Countersink until exposed.

(2)次に、露出した基準位置表示マーク4を目視し
て、第5図(a)及び(b)に示すように、全体を貫通
する基準穴5を正確に穴明けする。
(2) Next, the exposed reference position display mark 4 is visually inspected, and as shown in FIGS. 5A and 5B, the reference hole 5 penetrating the whole is accurately drilled.

しかし、(1)の座ぐり工程は、基準位置表示マーク
を損傷しないように、カッターが内層銅箔1bに達したと
きカッターの下降を停止させる必要がある。ところが、
一般的に銅張積層板は加熱プレス成形によって得られる
ため厚さにバラツキがあって座ぐり深さが一定しない。
従って、カッターの上下動を自動化することが難しく、
従来この座ぐり作業は、熟練者によって目視で行われた
り、多層プレス成形前に基準位置表示マークに離型シー
トを貼付しておき、座ぐりが基準位置表示マークに達し
たとき離型シートによる切削抵抗の違いを手で感じとっ
て停止する方法が行われている。これを改良する方法と
して、特開昭58−33896号公報に開示されているよう
に、カッターの刃先を回転軸に対して大小をつけて2分
割するとともにそれらを電気的に絶縁し、刃策が基準位
置表示マークに触れたとき刃先同士の電気的導通を検知
して切削を停止する方法もあるが、カッターを2分割し
再度絶縁物で接着しているため刃物として安定した切削
が得られないことと、大小刃先との間にある絶縁層がせ
まいため切粉により導通し切削途中で誤停止することが
ある等、カッターとしての製作性及び構造的に難点があ
った。また特開昭61−90851号広報に開示されているよ
うに、配線板の銅箔層と絶縁基材とのカッターの切削抵
抗の違いを電流値の変化としてとらえ判断停止する方法
もあるが、絶縁基材の厚いものや、絶縁基材の樹脂とガ
ラス繊維の構成が異なっていて均一な切削抵抗が得られ
ない場合には誤動作をおこし、座ぐりができない等の問
題点がある。
However, in the spot facing step (1), it is necessary to stop the descent of the cutter when the cutter reaches the inner copper foil 1b so as not to damage the reference position display mark. However,
In general, a copper clad laminate is obtained by hot press forming, and thus the thickness varies and the counterbore depth is not constant.
Therefore, it is difficult to automate the vertical movement of the cutter,
Conventionally, this counterbore work is performed visually by a skilled person, or a release sheet is attached to the reference position display mark before multilayer press molding, and when the counterbore reaches the reference position display mark, the release sheet is used. The method of stopping by feeling the difference in cutting resistance by hand is performed. As a method for improving this, as disclosed in Japanese Patent Laid-Open No. 58-33896, the blade tip of the cutter is divided into two parts with different sizes with respect to the rotation axis, and they are electrically insulated to form a blade. There is also a method to stop the cutting by detecting the electrical continuity between the cutting edges when touches the reference position display mark, but the cutting is stable because the cutting tool is divided into two parts and they are bonded again with an insulator. In addition, there is a problem in terms of manufacturability and structure as a cutter, such as the fact that there is no gap and the insulating layer between the large and small cutting edges is small, so that there is electrical continuity due to cutting chips and erroneous stoppage during cutting. Further, as disclosed in Japanese Patent Laid-Open No. 61-90851, there is also a method of determining the difference in the cutting resistance of the cutter between the copper foil layer of the wiring board and the insulating base material as a change in the current value and stopping the judgment. If the insulating base material is thick, or if the resin of the insulating base material and the glass fiber composition are different from each other and a uniform cutting resistance cannot be obtained, a malfunction occurs and there is a problem in that a counterbore cannot be formed.

(発明が解決しようとする課題) 本発明は上記の事情に鑑みてなされたもので、銅箔切
粉に起因する導通によって誤検知することがなく安定し
た座ぐり作業が自動的に行え、切削具の刃先そのものを
特殊に加工しなくとも導通検知が可能となり、刃先も容
易に再研摩できる多層プリント配線板の内層回路基準位
置表示マークの露出方法を提供しようとすものである。
(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and a stable counterbore work can be automatically performed without erroneous detection due to conduction caused by copper foil chips and cutting. It is an object of the present invention to provide a method of exposing an inner layer circuit reference position display mark of a multilayer printed wiring board, which enables continuity detection without special processing of the cutting edge itself of the tool and can easily re-polish the cutting edge.

[発明の構成] (課題を解決するための手段) 本発明者は、上記の目的を達成しようと鋭意研究を重
ねた結果、切削具の刃先と離れている位置に電気接点を
設けることにより上記の目的が達成できることを見いだ
し本発明を完成したものである。すなわち、本発明は、
多層プリント配線板を回転する切削具で切削して内層回
路の基準位置表示マークを露出する方法において、切削
具の切削中心と刃先とを除いた刃先外周円内に、切削具
本体と電気的に絶縁され、かつ切削具の回転軸方向に摺
動し、かつ刃先より突出する復元力を有する電気接点を
設け、刃先と電気接点とが内層回路の基準位置表示マー
クに達した時に、刃先と電気接点を通じて起こる電気的
導通を検知して切削を停止することを特徴とする多層プ
リント配線板における内層回路の基準位置表示マーク露
出方法である。
[Structure of the Invention] (Means for Solving the Problems) As a result of intensive studies to achieve the above object, the present inventor has provided an electric contact at a position apart from the cutting edge of the cutting tool. The present invention has been completed by finding out that the above object can be achieved. That is, the present invention is
In the method of exposing the reference position indication mark of the inner layer circuit by cutting the multilayer printed wiring board with a rotating cutting tool, the cutting tool main body is electrically connected to the cutting tool main body within the cutting edge outer circle excluding the cutting center and the cutting edge of the cutting tool. Provided with an electrical contact that is insulated and that slides in the direction of the cutting tool's rotation axis and that has a restoring force that protrudes from the cutting edge, when the cutting edge and the electrical contact reach the reference position indication mark of the inner layer circuit, A method of exposing a reference position indicating mark of an inner layer circuit in a multilayer printed wiring board, which is characterized in that the electrical continuity generated through a contact is detected to stop the cutting.

(作用) 切削具で切削し、電気接点が内層回路の基準位置表示
マークに達すると復元力の接触圧によって電気接点は基
準位置表示マークに接触する。電気接点の進行が停止さ
れても一方切削具は尚も切削を続け、切削具の刃先が基
準位置表示マークに達した時に始めて、刃先と電気接点
とが基準位置表示マークの銅箔によって電気的に導通
し、切削が停止する。表示マークの露出状態によっては
更に数パルス送り込み切削を行うこともできる。刃先
と、刃先外周円内に位置する電気接点とは離れているた
め、銅箔切粉による誤動作がなくなり、また刃先も安定
した切削をするものが得られる。
(Operation) When the electric contact reaches the reference position display mark of the inner layer circuit after cutting with a cutting tool, the electric contact comes into contact with the reference position display mark by the contact pressure of the restoring force. Even if the progress of the electrical contact is stopped, the cutting tool still continues cutting, and only when the cutting edge of the cutting tool reaches the reference position display mark, the cutting edge and the electrical contact are electrically connected by the copper foil of the reference position display mark. And the cutting stops. Depending on the exposed state of the display mark, it is possible to perform cutting by feeding several pulses. Since the blade tip is separated from the electrical contact located within the outer circumference of the blade tip, malfunctions due to copper foil chips are eliminated, and a blade tip capable of stable cutting is obtained.

(実施例) 次に本発明方法の一実施例を図面を参照して説明す
る。
(Example) Next, one example of the method of the present invention will be described with reference to the drawings.

第1図は、この実施例に使用した切削具の斜視図を示
す。切削具の切削中心と刃先を除いた刃先外周円内に
回転軸方向に沿う溝(穴でもよい)9を加工し、絶縁層
7によって電気的に絶縁した電気接点8を設け収納固定
してある。この電気接点8は、回転軸方向(矢印A・B
方向)に摺動し、かつスプリング等によって刃先より突
出する方向に復元力を有するコンタクトプローブで、自
由状態時において刃先より多少突出した形で固定され
る。この電気接点8の先端形状は、切削面を損傷しない
ように球面状のものが好ましい。この実施例で使用した
電気接点8の摺動ストロークは5mm,バネ圧は100gのもの
である。ストロークやバネ圧は状況に応じて必要な大き
さのものを使用することができる。電気接点の摩耗は少
なくて通常の超硬チップカッターの使用限界1000穴以上
まで十分使用できるため、切削具の刃先再研摩時に交換
すればよく、またその交換は簡便にできる。
FIG. 1 shows a perspective view of the cutting tool used in this example. A groove (may be a hole) 9 along the rotation axis direction is machined in the cutting edge outer peripheral circle excluding the cutting center of the cutting tool 6 and the cutting edge, and an electrical contact 8 electrically insulated by an insulating layer 7 is provided and fixed. is there. This electric contact 8 is in the direction of the rotation axis (arrow
The contact probe has a restoring force in a direction in which it slides in the direction) and protrudes from the cutting edge by a spring or the like, and is fixed so as to slightly project from the cutting edge in the free state. The shape of the tip of the electrical contact 8 is preferably spherical so as not to damage the cutting surface. The electric contact 8 used in this embodiment has a sliding stroke of 5 mm and a spring pressure of 100 g. The stroke and the spring pressure can be of the required magnitude depending on the situation. Since there is little wear of the electrical contacts and it can be used up to 1000 holes or more, which is the limit of use of a normal carbide tip cutter, it can be replaced when the cutting edge of the cutting tool is re-polished, and the replacement is easy.

次に、第2図を参照し、内層回路の基準位置表示マー
クを露出させる切削装置について説明する。該切削装置
は、絶縁チャック14とチャック17で把握された切削具
と、切削具をベルトなどを介して回転させる切削具回
転モーター15と、切削具を下降・上昇させる駆動部10
と、切削具の位置を検出する位置検出部11と、この位
置検出部11の検出結果に基づいて切削具の下降、上昇
動作を制御する制御部12と、多層プリント配線板3を押
さえるクランプ装置(図示せず)とによって構成されて
いる。多層プリント配線板3の基準位置表示マークの真
上に、切削具の回転軸がくるように多層プリント配線板
3を移動させて位置合せを行う。次に装置のスタートス
イッチ13を押すとクランプがおりるとともに切削具
回転しながら下降し、外層銅箔1aに切削具の刃先と電
気接点8が接触して電気的導通信号が生じ、この導通信
号はスリップリング16を経由して下降・上昇動作制御部
12の中のカウンター回路に加算され、さらに駆動部10の
パルスモーターのコントロールで下降速度の減速信号を
出す。次に絶縁基材2aを座ぐってゆき、内層銅箔1b上に
ある基準位置表示マーク4に刃先と電気接点が接触して
第二の導通信号がカウンター回路に加算される。カウン
ター回路のカウント数が層設定スイッチ18で設定した層
設定数と一致した時に、モータ制逆駆動回路により切削
具を停止、上昇させる。層設定数と一致した導通信号が
あった時、直ちに切削具を停止、上昇させるさせるこ
とができるが、露出マークの状態によりさらに数パルス
送り込めるようにすることもできる。切削具が上昇す
るとクランプが上昇し座ぐりのサイクルが終了する。こ
うしてきれいに基準位置表示マークを露出させることが
できる。
Next, a cutting device for exposing the reference position display mark of the inner layer circuit will be described with reference to FIG. The cutting device includes a cutting tool 6 grasped by an insulating chuck 14 and a chuck 17.
When a cutting tool rotating motor 15 for rotating the cutting tool 6 via a belt driving unit 10 for lowering-raising the cutting tool 6
Pressing the, a position detector 11 for detecting the position of the cutting tool 6, the descent of the cutting tool 6 on the basis of the detection result of the position detection unit 11, a control unit 12 for controlling the lifting operation, the multilayer printed wiring board 3 It is constituted by a clamp device (not shown). Positioning is performed by moving the multilayer printed wiring board 3 so that the rotation axis of the cutting tool is located right above the reference position display mark of the multilayer printed wiring board 3. Next, when the start switch 13 of the device is pressed, the clamp is lowered and the cutting tool 6 is lowered while rotating, and the cutting edge of the cutting tool 6 and the electrical contact 8 are brought into contact with the outer layer copper foil 1a to generate an electrical conduction signal, This conduction signal passes through the slip ring 16 and the descending / ascending operation control unit
It is added to the counter circuit in 12 and the deceleration signal of the descending speed is output by the control of the pulse motor of the drive unit 10. Next, the insulating base material 2a is spotted, the cutting edge and the electrical contact come into contact with the reference position indicating mark 4 on the inner layer copper foil 1b, and the second conduction signal is added to the counter circuit. When the count number of the counter circuit matches the layer set number set by the layer setting switch 18, the motor control / reverse drive circuit stops and raises the cutting tool. The cutting tool 6 can be immediately stopped and raised when there is a conduction signal that matches the set number of layers, but it is also possible to send several more pulses depending on the state of the exposure mark. When the cutting tool 6 rises, the clamp rises and the counterbore cycle ends. In this way, the reference position display mark can be exposed neatly.

[発明の効果] 以上の説明したように、本発明の多層プリント配線板
における内層回路の基準位置表示マーク露出方法は、刃
先中心と刃先を除いた刃先外周円内に電気接点を設けた
ことによって、切削具の刃先の加工を要せずに導通検知
が可能となって切削具の切削の耐久性を低下させず、ま
た検知部の刃先と電気接点の間が広くあいているため銅
箔切粉による導通で誤検知することが少なく、従って安
定した座ぐりを自動的に行うことができる。また電気接
点はソケットに接続して刃先の再研摩時に取り外すこと
により、刃先は容易に再研摩できる。
[Effects of the Invention] As described above, the method for exposing the reference position display mark of the inner layer circuit in the multilayer printed wiring board according to the present invention is to provide the electrical contacts in the outer circumference of the cutting edge excluding the center of the cutting edge and the cutting edge. Continuity can be detected without the need to machine the cutting edge of the cutting tool, which does not reduce the cutting durability of the cutting tool. There is little false detection due to conduction by powder, and therefore stable spot facing can be automatically performed. Further, the cutting edge can be easily re-polished by connecting the electrical contact to the socket and removing it when re-polishing the cutting edge.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例を示す切削具の斜視図、第2
図は本発明の内層回路の基準位置表示マーク露出装置を
概念的に示す図、第3図(a)及び(b)、第4図
(a)及び(b)並びに第5図(a)及び(b)は多層
プリント配線板に基準穴を穿孔する工程を示す斜視図又
は断面図である。 1a,1d……外層銅箔、1b,1c……内層銅箔、2a,2b,2c……
絶縁基材、3……多層プリント配線板、4……基準位置
表示マーク、5……基準穴、……切削具、7……絶縁
層、8……電気接点、9……溝又は穴、10……駆動部、
11……位置検出部、12……制御部、13……スタートスイ
ッチ、14……絶縁チャック、15……切削具回転モータ
ー、16……スリップリング、17……チャック、18……層
設定スイッチ。
FIG. 1 is a perspective view of a cutting tool showing an embodiment of the present invention, and FIG.
The drawings conceptually show a reference position display mark exposing device for an inner layer circuit of the present invention, FIGS. 3 (a) and (b), 4 (a) and (b), and 5 (a) and (B) is a perspective view or a sectional view showing a step of forming a reference hole in a multilayer printed wiring board. 1a, 1d …… Outer layer copper foil, 1b, 1c …… Inner layer copper foil, 2a, 2b, 2c ……
Insulating substrate, 3 ... Multilayer printed wiring board, 4 ... Reference position mark, 5 ... Reference hole, 6 ... Cutting tool, 7 ... Insulating layer, 8 ... Electrical contact, 9 ... Groove or hole , 10 …… Drive unit,
11 …… Position detection part, 12 …… control part, 13 …… start switch, 14 …… insulation chuck, 15 …… cutting tool rotary motor, 16 …… slip ring, 17 …… chuck, 18 …… layer setting switch .

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】多層プリント配線板を回転する切削具で切
削して内層回路の基準位置表示マークを露出する方法に
おいて、切削具の切削中心と刃先とを除いた刃先外周円
内に、切削具本体と電気的に絶縁され、かつ切削具の回
転軸方向に摺動し、かつ刃先より突出する復元力を有す
る電気接点を設け、刃先と電気接点とが内層回路の基準
位置表示マークに達した時に、刃先と電気接点を通じて
起こる電気的導通を検知して切削を停止することを特徴
とする多層プリント配線板における内層回路の基準位置
表示マーク露出方法。
1. A method of exposing a reference position indicating mark of an inner layer circuit by cutting a multilayer printed wiring board with a rotating cutting tool, wherein the cutting tool is provided within a cutting edge outer circumference circle excluding a cutting center and a cutting edge of the cutting tool. An electric contact that is electrically insulated from the main body, slides in the direction of the rotating shaft of the cutting tool, and has a restoring force that protrudes from the cutting edge is provided, and the cutting edge and the electric contact have reached the reference position display mark of the inner layer circuit. A method for exposing a reference position indicating mark of an inner layer circuit in a multilayer printed wiring board, wherein cutting is stopped by detecting electrical continuity that occurs through a cutting edge and an electrical contact.
JP556588A 1988-01-13 1988-01-13 Reference position display mark for inner layer circuit Mark exposure method Expired - Lifetime JP2509888B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP556588A JP2509888B2 (en) 1988-01-13 1988-01-13 Reference position display mark for inner layer circuit Mark exposure method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP556588A JP2509888B2 (en) 1988-01-13 1988-01-13 Reference position display mark for inner layer circuit Mark exposure method

Publications (2)

Publication Number Publication Date
JPH01184899A JPH01184899A (en) 1989-07-24
JP2509888B2 true JP2509888B2 (en) 1996-06-26

Family

ID=11614734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP556588A Expired - Lifetime JP2509888B2 (en) 1988-01-13 1988-01-13 Reference position display mark for inner layer circuit Mark exposure method

Country Status (1)

Country Link
JP (1) JP2509888B2 (en)

Also Published As

Publication number Publication date
JPH01184899A (en) 1989-07-24

Similar Documents

Publication Publication Date Title
US5645673A (en) Lamination process for producing non-planar substrates
JP2958399B2 (en) Method and apparatus for counterboring a printed circuit board
JPS61125712A (en) Method for drilling hole of multi-layer printing wiring board
JPH07285097A (en) Device for punching printed circuit board,etc
JP2509888B2 (en) Reference position display mark for inner layer circuit Mark exposure method
JP4184575B2 (en) Workpiece machining method, tool breakage detection method, and machining apparatus
EP1649240B1 (en) Method and apparatus for measuring a depth of holes in composite-material workpieces being machined by an orbiting cutting tool
JP4034612B2 (en) Blind hole machining method for multilayer circuit boards
JP2676084B2 (en) Method and device for drilling reference holes in multilayer circuit board
JPS61131804A (en) Drilling method of spot facing of internal layer reference section in multilayer circuit substrate
JPH0620653B2 (en) Automatic counterbore for copper clad laminates
JPH08323697A (en) Multi-layered printed circuit board drilling method
JP3404771B2 (en) Multilayer wiring board processing apparatus and processing method
JPH0433578B2 (en)
JPS61125714A (en) Method for detecting hole drilling position on multi-layer printing wiring board
JPH0749166B2 (en) Machining method and device using the work surface as a reference
JPS624880B2 (en)
WO1997009630A1 (en) A method for determining the relative positions of a plurality of layers of a multilayer circuit board, a device suitable for carrying out such a method and also a measuring pin and a circuit board suitable for being used with such a method
JP3336109B2 (en) Method and apparatus for measuring interlayer thickness of multilayer printed wiring board
JP3425251B2 (en) Apparatus and method for cutting out inner layer circuit for electronic component package
JPH07299698A (en) Engraving machine with automatic detecting device for reference plane of workpiece and its engraving method
JPH01252311A (en) Spot facing device
JP6909535B2 (en) Substrate processing equipment and substrate processing method
JPH0217493Y2 (en)
JPH04171159A (en) Automatic control type cutting device and guide pin positioning mark cutting device for multi-layer printed wiring board