JPH08189883A - Sample-embedded body making device and method for it - Google Patents

Sample-embedded body making device and method for it

Info

Publication number
JPH08189883A
JPH08189883A JP7001929A JP192995A JPH08189883A JP H08189883 A JPH08189883 A JP H08189883A JP 7001929 A JP7001929 A JP 7001929A JP 192995 A JP192995 A JP 192995A JP H08189883 A JPH08189883 A JP H08189883A
Authority
JP
Japan
Prior art keywords
sample
resin
concave portion
recesses
embedding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7001929A
Other languages
Japanese (ja)
Inventor
Katsumi Sasaki
克己 佐々木
Noriyuki Kitaori
典之 北折
Osamu Yoshida
修 吉田
Junko Ishikawa
准子 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Priority to JP7001929A priority Critical patent/JPH08189883A/en
Publication of JPH08189883A publication Critical patent/JPH08189883A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To eliminate warp and inclination of a sample and fabricate a sample- embedded body favorable for observation effectively by using a lower die, which is provided with recesses to be filled with a resin for embedding sample, and an upper die where projections are furnished. CONSTITUTION: A lower die 1 is formed from silicone resin, etc., and at its top surface, recesses 2 in approx imately hexagonal shape are provided in line. On the bottom surface of an upper die 3 made of silicone resin, etc., rectangular projections 4 are formed which protrude into the recesses 2 when the two dies are fitted together. The thickness of the projection s 4 should be approx. half the depth of recesses 2, and the shape should be such one being only in contact with the band-shape region where a sample is placed on the surface of resin which fills the recesses 2, i.e., rectangular having a smaller width than that of the recesses 2. When the two dies 1, 3 are fitted together, therefore, surplus resin under the sample is extruded to the both sides of each projection 4, and the area where sample is placed, is flattened easily.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば透過型電子顕微
鏡での検査に用いるサンプル包埋体の作製技術に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for producing a sample embedding body used for inspection with a transmission electron microscope, for example.

【0002】[0002]

【発明の背景】磁気テープ等の一部をカットしたサンプ
ルを樹脂で包埋し、この包埋体の切断面を透過型電子顕
微鏡(以下、TEM)で観察する品質検査がある。この
サンプル包埋体の作製にあたっては、次の点が問題とな
っている。即ち、サンプルである磁性フィルムは、通
常、カールしている為、樹脂で包埋したものについても
サンプルが反ったままの状態であることが多い。又、樹
脂を型の凹部内に充填してサンプルを載置する基層部分
を形成する際に、基層部分の表面が平坦となるよう樹脂
を充填するのが難しく、この基層上に載置されるサンプ
ルも傾斜した状態で樹脂に包埋されてしまうことが多
い。
BACKGROUND OF THE INVENTION There is a quality inspection in which a sample obtained by cutting a part of a magnetic tape or the like is embedded with a resin, and a cut surface of the embedded body is observed with a transmission electron microscope (hereinafter, TEM). The following points have been problems in producing this sample embedding medium. That is, since the magnetic film as a sample is usually curled, the sample embedded with the resin often remains in a warped state. Further, when the resin is filled in the concave portion of the mold to form the base layer portion on which the sample is placed, it is difficult to fill the resin so that the surface of the base layer portion is flat, and the resin is placed on the base layer. Samples are also often embedded in resin in a tilted state.

【0003】こうした反りが有る包埋体はTEMでの観
察に適さないので、適切な包埋体の作製は非常に難し
く、非常に効率が悪い。
Since the embedded body having such a warp is not suitable for observation with a TEM, it is very difficult to produce an appropriate embedded body and it is very inefficient.

【0004】[0004]

【発明の開示】本発明の目的は、サンプルの反りや傾き
がなく、観察に好適なサンプル包埋体を効率良く作製出
来る技術を提供することである。この本発明の目的は、
サンプル包埋用の樹脂が充填される凹部が形成された下
型と、前記凹部に対応する位置に平坦な端面を有し、凹
部の深さより低い高さの凸部が形成された上型とを具備
してなり、前記下型と上型とを組み合わせた際に、前記
凸部の作用で、前記凹部内の樹脂面上に載置されたサン
プルが平坦化されるよう構成してなることを特徴とする
サンプル包埋体作製装置によって達成される。
DISCLOSURE OF THE INVENTION An object of the present invention is to provide a technique capable of efficiently producing a sample-embedded body suitable for observation without warping or inclination of the sample. The purpose of this invention is
A lower mold in which a concave portion filled with a resin for embedding the sample is formed, and an upper mold in which a convex portion having a flat end face at a position corresponding to the concave portion and having a height lower than the depth of the concave portion is formed. When the lower die and the upper die are combined, the convex portion acts to flatten the sample placed on the resin surface in the concave portion. And a sample embedding body producing apparatus.

【0005】又、下型の凹部内に所定の高さまでサンプ
ル包埋用の樹脂を充填する工程と、この充填された樹脂
面上にサンプルを載置する工程と、前記充填樹脂が硬化
する前に、平坦な端面を有する凸部が形成された上型を
前記下型と組み合わせ、樹脂面上に載置された前記サン
プルを平坦化する工程と、前記上型を取り外した後、前
記凹部内にサンプル包埋用の樹脂を充填する工程とを具
備することを特徴とするサンプル包埋体作製方法によっ
て達成される。
Further, a step of filling a resin for embedding the sample to a predetermined height in the recess of the lower mold, a step of placing a sample on the filled resin surface, and before the filling resin is cured. A step of combining an upper mold having a convex portion having a flat end face with the lower mold to flatten the sample placed on a resin surface; and after removing the upper mold, the inside of the concave portion And a step of filling a resin for embedding the sample, the method for producing a sample embedding body.

【0006】即ち、本発明では、凹部内に充填された樹
脂面上にサンプルを載置した後、一旦、上型と下型とを
組み合わせ、上型に形成された凸部でサンプルが載置さ
れた部分をサンプルと共に平坦化するものであるから、
サンプルに反りが発生していたり、充填された樹脂面が
傾斜していても、これに関係なくサンプルが平坦な状態
で樹脂に包埋されたサンプル包埋体を得ることが出来
る。従って、不良品の発生が皆無であり、サンプル包埋
体作製作業の高効率化が図れる。
That is, according to the present invention, after the sample is placed on the resin surface filled in the concave portion, the upper mold and the lower mold are once combined, and the sample is placed on the convex portion formed on the upper mold. Since the part to be flattened is to be flattened together with the sample,
Even if the sample is warped or the filled resin surface is inclined, the sample embedding body in which the sample is embedded in the resin in a flat state can be obtained regardless of this. Therefore, no defective products are generated, and the efficiency of the work for producing the sample embedding body can be improved.

【0007】尚、凸部の端面が略サンプル部分にのみ当
接するよう凹部より小さくしてなることが好ましく、こ
れによって上型と下型とを組み合わせた際に、余分な樹
脂は凸部の両側に押し出されるので、サンプルが載置さ
れる帯状部分はスムーズに平坦化される。
Incidentally, it is preferable that the end surface of the convex portion is smaller than the concave portion so that the end surface of the convex portion abuts only on the sample portion. Therefore, when the upper die and the lower die are combined, excess resin is left on both sides of the convex portion. Since it is pushed out, the strip-shaped portion on which the sample is placed is smoothly flattened.

【0008】[0008]

【実施例】図1〜図7は本発明の一実施例を示すもの
で、図1はサンプル包埋体作製装置の要部斜視図、図2
は下型の凹部内に樹脂を充填した状態を示す断面図、図
3は樹脂面にサンプルを載置した状態を示す断面図、図
4は上型が組み合わされた状態を示す断面図、図5は図
4のX−X線での断面図、図6は下型の凹部上限まで樹
脂が充填された状態を示す断面図、図7は型から取り出
されたサンプル包埋体の斜視図である。
1 to 7 show an embodiment of the present invention, in which FIG. 1 is a perspective view of an essential part of a sample embedded body manufacturing apparatus, and FIG.
Is a cross-sectional view showing a state where a resin is filled in the recess of the lower die, FIG. 3 is a cross-sectional view showing a state where a sample is placed on the resin surface, and FIG. 4 is a cross-sectional view showing a state in which the upper die is combined. 5 is a cross-sectional view taken along line XX of FIG. 4, FIG. 6 is a cross-sectional view showing a state where the lower mold is filled with resin up to the upper limit of the recess, and FIG. 7 is a perspective view of the sample embedding body taken out from the mold. is there.

【0009】各図中、1はシリコン樹脂等から構成され
た下型であり、その上面側には略六角形状の凹部2が並
んで形成されている。3は下型1と同じくシリコン樹脂
等から構成された上型であり、この上型3の底面には、
下型1と組み合わされた際に凹部2内に突出する矩形状
の凸部4が形成されている。尚、凸部4の厚みは、凹部
2の深さ寸法の約1/2程度としている。
In each figure, reference numeral 1 denotes a lower mold made of silicon resin or the like, and a substantially hexagonal concave portion 2 is formed side by side on the upper surface side thereof. 3 is an upper mold made of silicon resin or the like like the lower mold 1, and the bottom surface of the upper mold 3 is
A rectangular convex portion 4 that protrudes into the concave portion 2 when combined with the lower mold 1 is formed. The thickness of the convex portion 4 is set to about 1/2 of the depth of the concave portion 2.

【0010】上記下型1及び上型3を備えたサンプル包
埋体作製装置は、上型3が、図1中、矢印で示す如く、
回動可能であるよう構成されている。そして、凸部4
は、凹部2内に充填される樹脂面において、サンプルが
載置される帯状の領域のみに当接する形状、即ち凹部2
が六角形状であるのに対して、この凹部2の幅より小さ
な幅の矩形状となっている。従って、下型1と上型3と
を組み合わせた際、サンプル下方の余分な樹脂が凸部4
の両側に押し出され、サンプルを載置した部分が容易に
平坦化されるようになっている。
In the sample embedding body manufacturing apparatus provided with the lower mold 1 and the upper mold 3, the upper mold 3 is as shown by an arrow in FIG.
It is configured to be rotatable. And the convex portion 4
Is a shape that abuts only the band-shaped region on which the sample is placed on the resin surface filled in the recess 2, that is, the recess 2
Has a hexagonal shape, but has a rectangular shape with a width smaller than the width of the recess 2. Therefore, when the lower mold 1 and the upper mold 3 are combined, the excess resin below the sample is removed by the convex portion 4
It is extruded to both sides of the so that the portion on which the sample is placed can be easily flattened.

【0011】5はサンプルであり、本実施例では磁気テ
ープを長さ数mm、最大幅1mm程度のクサビ形にカッ
トしたものを用いている。6はサンプル5を包埋するエ
ポキシ樹脂、Fはエポキシ樹脂6でサンプル5を包埋し
てなるサンプル包埋体である。次に、本発明のサンプル
包埋体作製方法を図2〜図7に基づいて説明する。
Reference numeral 5 is a sample, and in this embodiment, a magnetic tape cut into a wedge shape having a length of several mm and a maximum width of about 1 mm is used. 6 is an epoxy resin that embeds the sample 5, and F is a sample embedding body that embeds the sample 5 with the epoxy resin 6. Next, a method for producing a sample embedding body of the present invention will be described with reference to FIGS.

【0012】先ず、図2に示す如く、下型1の凹部2内
に上限の1/2程度の高さまでエポキシ樹脂6を充填す
る。続いて、エポキシ樹脂6の表面にサンプル5を2片
載置するのであるが、この時点では、通常、サンプル5
は、図3に示す如く、円弧状に反った状態となってお
り、又、サンプル5が載置された部分におけるエポキシ
樹脂6の表面も平坦ではなく、多少うねったものとなっ
ている。
First, as shown in FIG. 2, the epoxy resin 6 is filled in the recess 2 of the lower mold 1 to a height of about ½ of the upper limit. Subsequently, two pieces of the sample 5 are placed on the surface of the epoxy resin 6. At this point, the sample 5 is usually
As shown in FIG. 3, the surface of the epoxy resin 6 is warped in an arc shape, and the surface of the epoxy resin 6 in the portion where the sample 5 is placed is not flat but is somewhat undulated.

【0013】充填されたエポキシ樹脂6が硬化する前、
例えば半硬化の時点に、図4に示す如く、上型3を下型
1に組み合わせ、サンプル5が載置された帯状部分がサ
ンプル5と共に平坦となるようプレスする。この際、エ
ポキシ樹脂6の余剰分は、図5に示す如く、凸部4の両
側から押し出される。温度60℃で、この状態を3時間
保持した後、上型3を外し、更に凹部2内にエポキシ樹
脂5を充填する。そして、12時間かけて温度60℃で
硬化させ、下型1から取り出した。このようにして得ら
れたサンプル包埋体Fを図7に示す。
Before the filled epoxy resin 6 is cured,
For example, at the time of semi-curing, the upper mold 3 is combined with the lower mold 1 as shown in FIG. At this time, the excess epoxy resin 6 is extruded from both sides of the convex portion 4 as shown in FIG. After maintaining this state for 3 hours at a temperature of 60 ° C., the upper mold 3 is removed and the recess 2 is filled with the epoxy resin 5. Then, it was cured at a temperature of 60 ° C. for 12 hours and taken out from the lower mold 1. The sample embedded body F thus obtained is shown in FIG.

【0014】このサンプル包埋体Fは、サンプルが樹脂
内部に完全に平坦な状態で包埋されており、サンプルの
反りや傾斜といった不具合が無く、TEMでの観察試料
として非常に好ましいものであった。上述したように本
発明のサンプル包埋体作製技術によれば、TEMでの観
察に適したサンプル包埋体を効率良く作製することが可
能であって、包埋体作製作業が大幅に簡略化される。
The sample embedding body F is a sample which is embedded in the resin in a completely flat state, has no problems such as warpage and inclination of the sample, and is very preferable as an observation sample by TEM. It was As described above, according to the technique for producing a sample embedding medium of the present invention, it is possible to efficiently produce a sample embedding medium suitable for observation with a TEM, and the work for producing an embedding medium is greatly simplified. To be done.

【0015】[0015]

【効果】本発明によれば、サンプルの反りや傾斜のない
観察に好適なサンプル包埋体を効率良く作製出来る。
[Effect] According to the present invention, a sample embedding body suitable for observation without warpage or inclination of a sample can be efficiently produced.

【図面の簡単な説明】[Brief description of drawings]

【図1】サンプル包埋体作製装置の要部斜視図である。FIG. 1 is a perspective view of a main part of a sample embedded body manufacturing apparatus.

【図2】下型の凹部内に樹脂を充填した状態を示す断面
図である。
FIG. 2 is a cross-sectional view showing a state where a resin is filled in the recess of the lower mold.

【図3】樹脂表面にサンプルを載置した状態を示す断面
図である。
FIG. 3 is a cross-sectional view showing a state in which a sample is placed on a resin surface.

【図4】上型が組み合わされた状態を示す断面図であ
る。
FIG. 4 is a cross-sectional view showing a state in which upper molds are combined.

【図5】図4のX−X線での断面図である。5 is a cross-sectional view taken along line XX of FIG.

【図6】下型の凹部上限まで樹脂が充填された状態を示
す断面図である。
FIG. 6 is a cross-sectional view showing a state in which resin is filled up to the upper limit of the recess of the lower mold.

【図7】型から取り出されたサンプル包埋体の斜視図で
ある。
FIG. 7 is a perspective view of a sample embedding body taken out of a mold.

【符号の説明】[Explanation of symbols]

1 下型 2 凹部 3 上型 4 凸部 5 サンプル 6 エポキシ樹脂 F サンプル包埋体 1 lower mold 2 concave part 3 upper mold 4 convex part 5 sample 6 epoxy resin F sample embedding body

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01J 37/20 F (72)発明者 石川 准子 栃木県芳賀郡市貝町大字赤羽2606 花王株 式会社情報科学研究所内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Internal reference number FI Technical indication location H01J 37/20 F (72) Inventor Junko Ishikawa 2606 Kaohu stock company Kakai-cho, Haga-gun, Tochigi Company Information Science Laboratory

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 サンプル包埋用の樹脂が充填される凹部
が形成された下型と、前記凹部に対応する位置に平坦な
端面を有し、凹部の深さより低い高さの凸部が形成され
た上型とを具備してなり、 前記下型と上型とを組み合わせた際に、前記凸部の作用
で、前記凹部内の樹脂面上に載置されたサンプルが平坦
化されるよう構成してなることを特徴とするサンプル包
埋体作製装置。
1. A lower mold having a concave portion filled with a resin for embedding a sample, and a convex portion having a flat end face at a position corresponding to the concave portion and having a height lower than the depth of the concave portion. And the upper die is combined with the lower die, and when the lower die and the upper die are combined, the convex portion acts to flatten the sample placed on the resin surface in the concave portion. An apparatus for producing a sample embedding body, which is configured.
【請求項2】 凸部の端面の大きさが、凹部の形状より
小さく、かつ、凹部内に配置されるサンプルを覆うこと
が出来る形状であることを特徴とする請求項1に記載の
サンプル包埋体作製装置。
2. The sample package according to claim 1, wherein the size of the end surface of the convex portion is smaller than the shape of the concave portion, and the shape is such that the sample arranged in the concave portion can be covered. Embedded body manufacturing equipment.
【請求項3】 下型の凹部内に所定の高さまでサンプル
包埋用の樹脂を充填する工程と、 この充填された樹脂面上にサンプルを載置する工程と、 前記充填樹脂が硬化する前に、平坦な端面を有する凸部
が形成された上型を前記下型と組み合わせ、樹脂面上に
載置された前記サンプルを平坦化する工程と、 前記上型を取り外した後、前記凹部内にサンプル包埋用
の樹脂を充填する工程とを具備することを特徴とするサ
ンプル包埋体作製方法。
3. A step of filling a resin for embedding a sample to a predetermined height in the recess of the lower mold, a step of placing a sample on the filled resin surface, and before the filling resin is cured. A step of combining an upper mold having a convex portion having a flat end face with the lower mold to flatten the sample placed on a resin surface; and after removing the upper mold, the inside of the concave portion And a step of filling a resin for embedding the sample, the method for producing a sample embedding body.
JP7001929A 1995-01-10 1995-01-10 Sample-embedded body making device and method for it Pending JPH08189883A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7001929A JPH08189883A (en) 1995-01-10 1995-01-10 Sample-embedded body making device and method for it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7001929A JPH08189883A (en) 1995-01-10 1995-01-10 Sample-embedded body making device and method for it

Publications (1)

Publication Number Publication Date
JPH08189883A true JPH08189883A (en) 1996-07-23

Family

ID=11515304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7001929A Pending JPH08189883A (en) 1995-01-10 1995-01-10 Sample-embedded body making device and method for it

Country Status (1)

Country Link
JP (1) JPH08189883A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012515926A (en) * 2009-01-22 2012-07-12 バイオパス・オートメーション・エル・エル・シー Microtome sliced biopsy support for positioning tissue specimens
JP2013061192A (en) * 2011-09-12 2013-04-04 Toppan Printing Co Ltd Embedding plate and embedding method of sample for cross-sectional observation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012515926A (en) * 2009-01-22 2012-07-12 バイオパス・オートメーション・エル・エル・シー Microtome sliced biopsy support for positioning tissue specimens
JP2013061192A (en) * 2011-09-12 2013-04-04 Toppan Printing Co Ltd Embedding plate and embedding method of sample for cross-sectional observation

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