JPH08186134A - Dispense nozzle - Google Patents

Abstract

PURPOSE: To discharge adhesive in correspondence with the size of the adhesive surface of a semiconductor chip without replacing even when the size of the semiconductor chip is changed in a dispenser nozzle, which applies adherend for bonding the semiconductor chip to a board. CONSTITUTION: A container 2 has a plurality of nozzles 4, which are protruding downward from the lower surface, and adherend is supplied through the nozzles. The flat surface of the container has passing holes 4a for supplying the adherend into the nozzles 4. A sliding plate 1a, which is slid and moved on the flat surface so as to close the adherend passing holes 4a selectively, is provided in the container 2. Thus, the applying area of the adherend on the board is changed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dispense nozzle for ejecting an adhering material such as an adhesive or a metal paste onto a base in order to adhere a semiconductor chip to the base.

[0002]

4 (a) to 4 (c) are a side view (a), a bottom view (b) and an XX sectional view (c) showing an example of a conventional dispensing nozzle. Conventionally, as shown in FIG. 4, for example, a dispense nozzle of this type has a connector portion 13 for connecting to an adhesive material supply device for an adhesive such as an epoxy resin or a metal paste such as a silver paste. A container 10 having a space 11 to be filled, and a deposition material which is arranged vertically and horizontally at predetermined intervals on the lower surface of the container 10 according to the size range of a rectangular semiconductor chip deposited on the base. And a plurality of nozzles 4 for ejecting.

For example, when a semiconductor chip is bonded to a base of a lead frame with this dispense nozzle, first, the dispense nozzle is positioned on the base, and an adhesive material is supplied from an adhering material supply device to supply the nozzle 4 to the nozzle 4. Further, the adhesive material was discharged and dropped onto the base, and the semiconductor chip was pressed against the surface of the base on which the adhesive material was applied to heat and adhere.

Further, in the case of adhering semiconductor chips of different sizes to the base, the semiconductor chips are adhered by exchanging with a dispensing nozzle having a different number of nozzles depending on the size of the semiconductor chips.

[0005]

In the above-described conventional dispensing nozzle, it is necessary to replace the dispensing nozzle according to the size of the semiconductor chip, so that the adhered material left in the container is wasted. Especially in the case of silver paste, the loss cost becomes large. Moreover, there is a drawback that the adhered material after replacement must be taken out and washed. Further, there is a problem in that the mount device must be stopped during replacement and the operating rate is reduced. Further, there is a problem that operating cost increases because several kinds of dispense nozzles are prepared according to the size of the semiconductor chip.

Therefore, an object of the present invention is to provide a dispense nozzle capable of discharging an adhesive material according to the size of the adhered surface of the semiconductor chip without replacement even if the size of the semiconductor chip changes.

[0007]

A feature of the present invention is that a container having a space filled with a material to be deposited from a supply port and a plurality of containers arranged vertically and horizontally in a projecting shape region from a lower surface of the container. Nozzle, and a shutter mechanism having a sliding plate that moves while sliding on a flat inner surface that forms one surface of the space and selectively closes the passage holes of the material to be adhered to the plurality of nozzles. It is a dispensing nozzle.

Further, the shutter mechanism is provided with four slide plates facing the flat surface of the container in a vertical direction and a horizontal direction, respectively, and the four slide plates are independently provided. It is desirable to move.

[0009]

The present invention will be described below with reference to the drawings.

1A and 1B are a sectional view and a bottom view of a dispensing nozzle according to an embodiment of the present invention.
As shown in FIG. 1, this dispense nozzle has a container 2 having a space 5 filled with an adherend material from a supply port 12.
While sliding on the plurality of nozzles 4 protruding from the lower surface of the container 2 and arranged vertically and horizontally in a rectangular region having a width L and a length W, and a flat inner surface forming one surface of the space portion 5. A shutter mechanism 1 having a sliding plate 1a that moves and selectively closes the through holes 4a of the deposition material in a row to the plurality of nozzles 4 sequentially from the end.
It has and.

In the shutter mechanism 1, the nut 8 attached to the sliding plate 1a, the feed screw 9 screwed into the nut 8 and fixed at one end to the container 2 so as to be rotatable, and the feed screw 9 are rotated. It has a knob 7 for making it. further,
As in the conventional example, a connector portion 13 connected to the adherend supply device and a supply port 12 for supplying the adherend are provided.

The rectangular area to which the nozzle 4 is attached has a dimension of W in the vertical direction and L in the horizontal direction, and is determined from the maximum size of the semiconductor chips to be deposited. That is, it is designed so that it can be applied to various semiconductor chips having a vertical dimension W and different horizontal dimension L. Here, the pitch between the nozzles 4 is designed so that the adherend is uniformly applied to the base as in the conventional case.

Next, the procedure for setting the coating area of the adherend of the dispensing nozzle will be described. First, it is assumed that a semiconductor chip having a length W and a width L1 is attached to the base. In this case, the feed screw 9 is rotated by the rotation of the knob 7, and the sliding plate 1a is moved to the right side with respect to the paper surface via the nut 8 to close the second through hole 4a from the end. The dispenser head and the position of the base are L-L1 /
The material is supplied to the space part from the material supply device by shifting the position by 2 and the material is dropped from the nozzle 4 which is not blocked.

Further, the discharge area of the dispense nozzle can be automatically set by a known technique. For example, instead of a knob, attach a pulse motor,
When 100 pulses of the output pulse from the motor power source are sent to the pulse motor, the sliding plate 1a may be moved so as to close the row of through holes. Then, by simply inputting the L1 size, the size obtained by subtracting the input size L1 from the reference size L is automatically calculated, and if the number of pulses corresponding to this size difference is sent to the pulse motor, the pulse motor will respond to the number of pulses. 2 to move the sliding plate 1a
The setting is completed by closing the passage holes 4a in the second row.

2 (a) to 2 (c) are a top view (a) and a bottom view (b) and an XX sectional view (c) of a dispensing nozzle showing another embodiment of the present invention. As shown in FIG. 2, this dispensing nozzle is provided with a space 5 of the container 2a.
The four slide plates 1a, 1c, 1b, 1d facing the longitudinal direction and the lateral direction, respectively, are arranged on the flat surface of the region where the passage holes 4a are arranged in the vertical and horizontal rows and which form one surface of a,
A shutter mechanism for independently moving each of the four sliding plates 1a, 1c, 1b, 1d is provided. Other than that is the same as the above-mentioned embodiment.

The sliding plates 1a, 1c which slide in the lateral direction can be independently moved via the nuts 8a, 8b by rotating the feed screws 9a, 9c by the knobs 7a, 7c.
Further, the sliding plates 1b and 1d that slide in the vertical direction are provided with the knob 7
Rotate the feed screws 9b and 9d with b and 7d to rotate the nut 8
It can be moved independently via b and 8d. This mechanism is the same as the above-mentioned embodiment. Further, the supply port 12 and the connector portion 13 for supplying the adherend to the space 5a of the container 2a are the same as in the conventional example.

FIGS. 3 (1) to 3 (12) are views for explaining the procedure for setting the discharge range of the dispense nozzle of FIG. Next, the setting of the ejection range in which the adherend is ejected from the nozzle of the dispensing nozzle will be described. First,
In FIG. 3 (1), the sliding plates 1a, 1b, 1c, 1e are in the farthest state, and the discharge range is widest, and the adherend is discharged from 8 × 8 = 64 nozzles.

Next, as shown in FIGS. 3 (2) to 3 (5),
By moving only the sliding plates 1a and 1c in the lateral direction, it is possible to sequentially change the discharge range from 64 → 56 → 48 → 40 → 32 nozzles.

Next, as shown in FIGS. 2 (6) to (12), one of the vertical sliding plates 1b and 1d is moved by one pitch, so that 32 → 28 nozzles 28 → 2 are moved.
It is possible to change the discharge range up to 4 → 20 → 16 → 12 → 8 → 4.

In this embodiment, one dispense nozzle can be applied to deposit rectangular or square semiconductor chips of 16 sizes, which is more advantageous than the above-mentioned embodiments. The shape of the sliding plate described in the above embodiment is not necessarily rectangular, but may be polygonal or arcuate. Further, various patterns of the adhered area can be formed by combining the width dimension and the movement of the sliding plate in the vertical direction and the horizontal direction.

[0021]

As described above, the present invention slides on a flat surface having an adhering material passing hole to a nozzle in a container having a plurality of nozzles to which the adhering material is supplied and which projects downward from the lower surface. While a sliding plate that moves and selectively closes the adhered material passage hole is provided, and the shape and size of the adhered area of the adhered material discharged from the nozzle is changed, various sizes can be obtained with one dispense nozzle. It can be applied to the deposition of semiconductor chips, and as a result, the replacement of the dispenser is eliminated, the operating rate of the device is improved, the waste of expensive adherend is eliminated, and there is no need to prepare several types of dispense nozzles. There is an effect that the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a sectional view and a bottom view of a dispensing nozzle according to an embodiment of the present invention.

FIG. 2 is a top view (a), a bottom view (b) and an XX sectional view (c) of a dispensing nozzle showing another embodiment of the present invention.

FIG. 3 is a diagram for explaining a procedure for setting a discharge range of the dispense nozzle of FIG.

FIG. 4 is a side view (a), a bottom view (b) and an XX sectional view (c) showing an example of a conventional dispensing nozzle.

[Explanation of symbols]

 1 Shutter mechanism 1a, 1b, 1c, 1d Sliding plate 2, 2a, 10 Container 4 Nozzle 4a Pass-through hole 5, 5a, 11 Space part 7, 7a, 7b, 7c, 7d Knob 8, 8a, 8b, 8c, 8d Nut 9,9a, 9b, 9c, 9d Feed screw 12 Supply port 10 Connector part

Claims (2)

[Claims] 1. A container having a space filled with a material to be deposited from a supply port, a plurality of nozzles vertically and horizontally arranged in a rectangular shape projecting from a lower surface of the container, and one surface of the space. And a shutter mechanism having a sliding plate that moves while sliding on a flat inner surface to be formed and selectively closes through holes of the material to be adhered to the plurality of nozzles. 2. The shutter mechanism is provided with four slide plates facing the flat surface of the container in a vertical direction and a horizontal direction, respectively, and each of the four slide plates is independently provided. The dispensing nozzle according to claim 1, wherein the dispensing nozzle moves.