JPH0818282A - Substrate carrier fixing device - Google Patents

Abstract

PURPOSE:To minimize vertical motion stroke of a support block while preventing a substrate, an electronic parts, etc., and the support block from interfering while a substrate is carried. CONSTITUTION:An input means wherein a position of a lowering bottom dead point of vertical motion stroke of a support block 2 is made variable and a position of a lowering bottom dead point of the support block 2 is numerically input in advance is provided, and position data of a lowering bottom dead point of the support block 2 is registered according to the number of kinds of a substrate 1 to be carried. A lowering bottom dead point position of the support block 2 is decided and vertical motion stroke of the support block 2 is changed according to the state of rear mounting of the substrate 1 to be carried. Thereby, carry-in and carry-out time of the substrate 1 can be minimized and productivity of equipment can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for an electronic component mounting machine, an adhesive coating machine, a solder printing machine, etc., which carries out various operations while a substrate on which electronic parts are mounted is conveyed and fixed to a predetermined position. The present invention relates to a substrate transfer fixing device.

[0002]

2. Description of the Related Art A conventional technique will be described below with reference to the drawings. 3 (a) and 3 (b) are partial cross-sectional front views of a portion where a support block is provided in a conventional electronic component mounter.

FIG. 3A shows the board 1 and the board 1 arranged below the board 1 when the board 1 is carried from the upstream side in the carrying direction toward the mounting position of the electronic component 5. It shows the positional relationship with the support block 2 that is present. As shown in the figure, at this time, in order to prevent the support pin 3 provided on the support block 2 from interfering with the electronic component 4 mounted on the back surface of the substrate 1,
The support block 2 is lowered.

FIG. 3B shows a positional relationship between the substrate 1 and the support block 2 when the substrate 1 is transported to a predetermined position and the electronic component 5 is mounted on the surface of the substrate 1. Is. As shown in the figure, at this time, the support block 2 is raised, and the support pins 3 abut and fix the substrate 1 from below, thereby correcting the downward warpage of the substrate 1 itself and at the same time, The downward warpage of the substrate 1 due to the mounting pressure when the electronic component 5 is mounted by the mounting nozzle 6 is prevented.

Here, 7 is a pair of transport guides for guiding the substrate 1 along the transport path, 8 is a pair of transport belts for transporting the substrate 1, and the substrate 1 is transported with the upper extension portion of the transport guide 7. It is conveyed between the belt 8 and the upper traveling portion.

[0006]

By the way, as described above, there are cases where various electronic components 4 are already mounted on the back surface of the substrate 1 when it is transported to the component mounting position.
In addition, since there are a plurality of types of the substrate 1, the height protruding downward from the substrate 1 varies depending on the type of each substrate 1, and the maximum downward warpage of the substrate 1 itself also varies depending on the type. Therefore, in the conventional electronic component mounter,
The support pin 3 provided on the support block 2
The board 1 and the electronic components 4 mounted on the back surface of the board 1
Considering the maximum component thickness mounted on the back surface of multiple types of substrates 1 and the maximum downward warpage of the substrate 1 itself so that they will not be damaged by being interfered with during board transportation. It was lowered by a stroke larger than the sum of. As a result, the vertical movement stroke of the support block 2 becomes large, and the support block 2 is always operated at the maximum vertical movement stroke even if there is no electronic component 4 mounted on the back surface of the substrate 1.
There was an unnecessary time loss due to the time required for vertical movement of the support block when loading and unloading.

The present invention solves the above-mentioned problems of the prior art so that the board and electronic components mounted on the back surface of the board do not interfere with the support pins provided on the support block when the board is transported. However, it is an object of the present invention to provide a substrate transfer fixing device that can minimize the vertical movement stroke of the support block.

[0008]

In order to solve the above-mentioned problems, the first means as a board transfer and fixing device of the present invention carries in and out a board as a mounting target of electronic parts to a predetermined position. A carrier means, a support block which is arranged so as to be able to move upward and downward from a lower portion of the predetermined position, and which abuts on the substrate that has been carried into the predetermined position from below to fix the substrate, and the support block. It is provided with an elevating means for elevating and lowering, and the position of the lower descent dead center of the vertical movement stroke of the support block can be freely changed.

The second means of the present invention is the above-mentioned first means, further comprising input means for numerically inputting the position of the bottom-falling dead center of the support block, and the support block is based on the previously inputted numerical data. The vertical movement stroke of is changed.

A third means of the present invention, in the second means, is provided with a plurality of position data of the lower falling dead center of the support block according to the number of kinds of substrates to be conveyed.

According to a fourth means of the present invention, in the third means, the program for mounting the electronic component on the board is selected, and at the same time, the support block descends and falls depending on the kind of the board to be transported. The point position data is automatically changed to the corresponding data.

A fifth means of the present invention is the measuring means for measuring the state of the back surface of the substrate in the first means, and the position of the lower descent dead center of the support block is calculated based on the measurement result. However, the calculation control means for changing the vertical movement stroke of the support block based on the calculation result is provided.

[0013]

According to the above-mentioned first means, the optimum lowering dead center position of the support block is determined in accordance with the backside mounting state of the substrate to be conveyed, and the vertical movement stroke of the support block is changed to It is possible to minimize the vertical stroke of the support block while preventing the electronic components mounted on the back side of this board and the support pins provided on the support block from interfering with each other when the board is transported. Therefore, the loading / unloading time of the substrate can be minimized.

Further, according to the second and third means, the lower descent dead center position of the support block can be accurately positioned. Further, according to the fourth means, the position data of the bottom-falling dead center of the support block can be automatically changed according to the type of substrate to be transported.

Further, according to the fifth means, the optimum lowering dead center position of the support block is determined according to the state of the back surface of the substrate, and the vertical movement stroke of the support block can be minimized. .

[0016]

Embodiments of the present invention will be described below with reference to FIGS. It should be noted that those having the same functions as those of the conventional one are designated by the same reference numerals and the description thereof will be omitted.

FIG. 1 is a schematic side view of an electronic component mounting machine according to an embodiment of the present invention. In FIG. 1, 11
Is a support block elevating motor as an elevating means for elevating and lowering the support block 2 via the pinion rack mechanism 12, and 13 is a carrying motor for driving the carrying belt 8. In this electronic component mounter, the position of the lower descent of the support block 2 can be freely changed, and the input means (not shown) for inputting the numerical value of the position of the lower descent of the support block 2 in advance. Is provided, and the position data of the lower-falling dead center of the support block 2 is registered according to the number of types of substrates 1 to be transported.
Then, a control unit (not shown) provided in the electronic component mounter performs a control operation according to the position data.

As shown in FIG. 1, the electronic component mounting machine has a board loading detection sensor 14 for detecting the board 1 carried in from the upstream side in the board carrying direction, and a front surface (top surface).
A board arrival sensor 15 that detects arrival of the board 1 at a mounting position where the electronic component 5 is mounted on the side and a board unload sensor 16 that detects that the board 1 has been carried out are provided.

When the substrate 1 which has been loaded to the loading position is detected by the substrate loading detection sensor 14, the transport motor 1
3 is rotated and the substrate 1 is conveyed toward the mounting position by the conveyor belt 8. Next, the board 1 that has arrived at the mounting position
When the board arrival sensor 15 detects
3 is stopped. After that, the support block vertical motor 11 is rotated to raise the support block 2. When the fixing of the substrate 1 by the support block 2 is completed, the mounting operation of the electronic component 5 is executed. When the mounting operation of the electronic component 5 is completed, the support block vertical motor 11 is reversely rotated and the support block 2 is lowered.

In this case, the position of the bottom-falling dead center of the support block 2 is determined according to the type of the board 1 to be carried in and out based on the numerical data that has been numerically input in advance. The rotation amount of the vertical motor 11 is controlled so that the vertical movement stroke of the support block 2 is minimized. When the raising and lowering operations of the support block 2 are completed, the carry motor 13
Is rotated and the substrate 1 is unloaded. Substrate carry-out sensor 1
When the unloading of the substrate 1 is confirmed by 6, the transport motor 13 is stopped and the unloading operation is completed.

In the control section of the electronic component mounting machine, at the same time as selecting the program for mounting the electronic component on the substrate 1, the position of the lower-falling dead center of the support block 2 is selected according to the type of the substrate 1 to be transported. The data is automatically changed to the corresponding data.

In this way, the optimum lowering dead center position of the support block 2 is determined according to the mounting state of the back surface of the substrate 1 to be conveyed, and the vertical movement stroke of the support block 2 is changed. While the electronic components 4 (see FIG. 2) mounted on the back surface of the substrate 1 and the support pins 3 provided on the support block 2 can be prevented from interfering with each other while the substrate is being transported, The vertical operation stroke can be minimized, and the loading / unloading time of the substrate 1 can be minimized.

FIG. 2 is an enlarged side view of a main portion of a side portion of a thickness gauge of an electronic component in an electronic component mounter according to another embodiment of the present invention. As shown in FIG. 2, in this electronic component mounter, the equipment and the carry-in detection sensor 1 on the upstream side in the board transport direction are provided.
4, a pair of substrate thickness detection sensors 19 in which a plurality of light emitting / receiving sensors 18 are arranged at equal intervals are installed so as to sandwich the substrate 1, and when the substrate 1 passes through this loading position, The light emitting / receiving sensor 18 is shielded from light by the electronic component 4 mounted on the back surface of the substrate 1, and the maximum value of the thickness of the electronic component 4 mounted on the back surface of the substrate 1 is detected. Reference numeral 20 is a transport guide for upstream equipment.

When the substrate 1 is transported from the transport guide 20 of the upstream equipment toward the loading position of this electronic component mounting machine,
When passing through the loading position of this electronic component mounter, the board 1
The electronic component 4 mounted on the back surface of the
Is blocked. As a result, at the time when the board carry-in detection sensor 14 confirms the carry-in of the board 1, the maximum value of the thickness of the electronic component 4 mounted on the back surface of the board 1 is detected, and the support block is detected according to the detected board thickness. Vertical motor 11
Is controlled. This will support block 2
The vertical stroke of can be minimized,
The loading / unloading time of the substrate 1 can be minimized.

The same effect can be obtained by using a one-dimensional or two-dimensional line sensor as the measuring means for detecting the thickness of the substrate 1. Furthermore, when connecting a plurality of equipment, the equipment for detecting the thickness of the substrate as described above may be provided in the equipment on the most upstream side, and the thickness data of the substrate may be transmitted along with the sequential transportation of the substrate, In this case, it is not necessary to attach a substrate thickness detection sensor to each equipment.

These mechanisms described as the embodiments above,
The control method can be applied not only to the electronic component mounter but also to general equipment that needs to convey the substrate and fix it with the support block from below the substrate. Specific examples include adhesive coating machines and solder printing machines.

[0027]

As described above, according to the electronic component mounter of the present invention, the optimum lower descent position of the support block is determined according to the mounting state of the back surface of the substrate to be conveyed, and the vertical movement stroke of the support block is determined. By changing the, the loading / unloading time of the substrate can be minimized and the productivity of the equipment can be improved.

[Brief description of drawings]

FIG. 1 is a schematic side view of an electronic component mounter according to an embodiment of the present invention.

FIG. 2 is an enlarged side view of an essential part of a thickness gauge side portion of an electronic component in an electronic component mounter according to another embodiment of the present invention.

3 (a) and 3 (b) are partial cross-sectional front views of a portion where a support block is provided in a conventional electronic component mounting machine, respectively.

[Explanation of symbols]

 1 substrate 2 support block 3 support pin 4 electronic component mounted on the back surface 7 transport guide 8 transport belt 11 support block vertical motor (elevating means) 18 light emitting and receiving sensor 19 substrate thickness detection sensor (measuring means)

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuhiro Noma 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Koichi Yabuki, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (5)

[Claims] 1. A transfer means for loading and unloading a board to which an electronic component is attached to and from a predetermined position, and a transfer means arranged so as to be movable upward and downward from a position below the predetermined position. A support block that abuts on the substrate that has been loaded into the substrate from below to fix the substrate, and elevating means for elevating the support block are provided, and the position of the lower descent dead center of the vertical movement stroke of the support block can be freely changed. PCB transfer fixing device. 2. The substrate according to claim 1, further comprising input means for numerically inputting the position of the bottom-falling dead center of the support block, and changing the vertical movement stroke of the support block based on the numerical data inputted in advance. Conveyor fixing device. 3. The substrate transfer / fixing device according to claim 2, further comprising a plurality of pieces of position data of the lower-falling dead center of the support block, which are provided in accordance with the number of kinds of substrates to be transferred. 4. A program for mounting an electronic component on a board is selected, and at the same time, the position data of the lower descent point of the support block is automatically changed to the corresponding data according to the type of the board to be transported. Substrate transfer fixing device. 5. A measuring means for measuring the state of the back surface of the substrate, and the position of the lower descent dead center of the support block is calculated based on this measurement result, and the vertical movement stroke of the support block is changed based on this calculation result. The substrate transfer / fixing device according to claim 1, further comprising an arithmetic control unit for performing the operation.