JPH0818276A - Electronic parts mounting apparatus and parts feeder - Google Patents

Abstract

PURPOSE:To reduce the correction quantity of the turn direction of electronic parts at carrying of the parts and improve the recognition of the positional condition of the electronic parts during carrying thereof by installing second adjusting ing structures for adjusting the position of the turn direction parallel to a mounting face of a board on a parts feeder of electronic parts mounting apparatus. CONSTITUTION:Electronic parts 12 to be fed in the condition that they are positioned at a part feeder 21 are carried to mounting positions on a mounting face of a board 14 to be fed to specified position and mounted on the mounting positions in place. This apparatus comprises first adjusting structures 25, 50 and 51 for adjusting the positions in two mutually perpendicular directions parallel to the mounting face of the board 14 and second adjusting structures 22A, 26, 27, 30, 31, 34, and 37 for adjusting the position of the turn direction parallel to the mounting face of the board 14.

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Industrial Application Conventional Technology (FIG. 4) Problem to be Solved by the Invention (FIG. 4) Means for Solving the Problem (FIGS. 1 to 4) Action (FIGS. 1 to 4) Example (FIG. 1) ~ Fig. 4) Effect of the invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supplying device and a component supplying device, and for example, to an electronic component mounting device for supplying and mounting electronic components on a printed wiring board and a component supplying device used for the electronic component mounting device. It is suitable for application.

[0003]

2. Description of the Related Art Conventionally, as one of the electronic component mounting apparatuses of this type, there is one configured as shown in FIG. 4, for example. That is, in this electronic component mounting apparatus 1, the nozzle portion 7 is mounted on the flat base plate 3 arranged on the pedestal 2 through the first and second support members 5 and 6 of the nozzle left-right movement drive portion 4 in order. It is arranged.

The nozzle 7 part is constructed by attaching a vacuum nozzle 9 and a printed wiring recognition camera 10 to a nozzle vertical rotation movement drive part 8 which engages with the second support member 6, and is provided from the nozzle horizontal movement drive part 4. On the basis of the driving force applied to the second support member 6 as a whole, the rightward direction indicated by the arrow a and the leftward direction opposite thereto (hereinafter collectively referred to as X
Called direction) is designed to be able to move freely.
In this case, the vacuum nozzle 9 includes the nozzle vertical rotation movement drive unit 8
Based on the driving force given by the arrow b, the arrow can be moved in the upward direction indicated by the arrow b and in the downward direction opposite thereto (hereinafter collectively referred to as the Z direction), and the arrow is centered on an axis parallel to the Z direction. It can freely rotate in a clockwise direction indicated by c and a counterclockwise direction opposite thereto (hereinafter collectively referred to as a θ rotation direction).

Further, the vacuum nozzle 9 has an electronic component 1 which is supplied to a component supply unit 11 on the base plate 3 at its lower end based on a negative pressure provided by a negative pressure source (not shown).
2 can be suction-held. As a result, in this electronic component mounting apparatus 1, the electronic component 12 supplied onto the component supply unit 11 in a state of being positioned so as to be pressed against the positioning stoppers 11A and 11B on the component supply unit 11 is supplied to the nozzle unit 7. The vacuum nozzle 9 sucks and holds it, and then the nozzle portion 7 moves in the X direction along the second support, so that the sucked and held electronic component 12 is supplied onto the printed wiring board fixing base 13 Board 1
4 can be conveyed up to the mounting position.

In this case, in the component supply unit 11, a position of the supplied electronic component 12 in the forward direction indicated by arrow d and in the backward direction opposite thereto (hereinafter collectively referred to as the Y direction), and X
A front-rear position fine adjustment mechanism and a left-right direction position adjustment mechanism capable of finely adjusting the position in the respective directions are provided, and by this, the electronic component 12 before being sucked by the vacuum nozzle 9 is accurately positioned in advance. It is designed to get you. Further, the printed wiring board fixing base 13 is configured to be movable in the Y direction, and thus the electronic component 12 conveyed onto the printed wiring board 14 by the nozzle portion 7 is accurately positioned above the mounting position of the printed wiring board 14. It is designed so that it can be done.

Further, the component supply unit 1 on the base plate 3
1 and the printed wiring board fixing base 13, an electronic component recognition camera 15 is disposed, and the electronic component recognition camera 15 suctions and holds the electronic component 12 in the vacuum nozzle 9 of the nozzle portion 7 and θ. The position state in the rotational direction can be recognized. Thus, in this electronic component mounting apparatus 1, when the operation switch on the operation panel 16 provided at the front end of the base plate 3 is operated to select the operation mode, the electronic component 12 supplied to the component supply unit 11 is selected. Is held by suction by the vacuum nozzle 9 of the nozzle portion 7, and in this state, the printed wiring board 1 is passed through above the electronic component recognition camera 15 and supplied onto the printed wiring board fixing base 13.
4 is conveyed to above the mounting position.

At this time, the electronic component mounting apparatus 1 has the electronic component 12 suction-held by the vacuum nozzle 9 of the nozzle portion 7.
Of the electronic components 12 on the printed wiring board 14 is recognized by using the printed wiring board recognition camera 10 of the nozzle portion 7. To do.

Subsequently, the electronic component mounting apparatus 1 determines the θ rotation direction of the electronic component 12 sucked and held by the vacuum nozzle 9 by the nozzle vertical rotation movement drive unit 8 rotating the vacuum nozzle 9 based on these recognition results. Along with fine adjustment, the nozzle left-right movement drive unit 4 moves the nozzle unit 7 in the X direction to finely adjust the position of the electronic component 12 in the X direction, and the printed wiring board fixing base 13 moves in the Y direction. The electronic component 12 for the printed wiring board 14
Finely adjust the position in the Y direction. Further, after this, the vacuum nozzle 7 descends to mount the electronic component 12 on the mounting position on the printed wiring board 14, and then the suction of the electronic component 12 by the vacuum nozzle 9 is stopped. As a result, the electronic component 12 is mounted on the printed wiring board 14.

[0010]

However, in the electronic component mounting apparatus 1 of this type, normally, the component supply unit 11 is not provided with the fine adjustment mechanism in the θ rotation direction, and accordingly, the electronic component 1 is not provided.
The fine adjustment of the θ rotation direction of 2 is performed only by the rotation of the vacuum nozzle 9 in the nozzle portion 7 as described above. For this reason, in this type of electronic component mounting apparatus 1, there is a problem that the tact time as a whole becomes long because a fine adjustment time in the θ rotation direction in the nozzle portion 7 is always required during operation.

Further, in the electronic component mounting apparatus 1 of this type, since the component supply unit 11 is not provided with the fine adjustment mechanism for the θ rotation direction as described above, the θ rotation direction of the electronic component 12 is largely deviated. Therefore, it is necessary to secure a wide image recognition area for the electronic component recognition camera 15. For this reason, the magnification of the electronic component recognition camera 15 must be reduced, and as a result, the position recognition accuracy of the electronic component 12 decreases, so that the mounting accuracy of the electronic component 12 as a whole of the device 1 on the printed wiring board 14 is reduced. Could be low.

The present invention has been made in consideration of the above points, and it is an object of the present invention to propose an electronic component mounting apparatus and a component supply apparatus capable of shortening the tact time and accurately mounting electronic components on a printed wiring board. To do.

[0013]

In order to solve such a problem, according to the present invention, the electronic component 12 supplied in a state of being positioned by the component supply portion 21 is mounted on a mounting surface of a substrate 14 supplied at a predetermined position. In the electronic component mounting apparatus that transports the electronic component 12 to the mounting position on the mounting surface and mounts the electronic component 12 at the mounting position on the mounting surface, the component supply unit 21 is parallel to the mounting surface of the substrate 14 and perpendicular to each other. In addition to the first adjusting mechanism 25, 50, 51 for adjusting the position in the two directions, the second adjusting mechanism for adjusting the position in the rotational direction parallel to the mounting surface of the substrate 14
Adjusting mechanism 22A, 26, 27, 30, 31, 34, 3
7 is provided.

Further, in the present invention, the second adjusting mechanism includes the base portion 22 having the concave portion 22A on one surface, and the concave portion 2
2A, and has a rotating member 26 having a rotatable rotating surface parallel to one surface of the base portion 22A, and one surface contacting or facing one surface of the base portion 22, the one surface being the rotating surface of the rotating member 26. The rotating part 27 fixed to the
A rotation amount adjusting means 3 having a stopper 30 attached to the stopper 30 and a contact member attached to the rotating portion 27 and having a length adjustable to contact the stopper 30 from the first rotation direction.
1 and urging means 34 for urging the rotating member 27 so as to press the contact member of the rotation amount adjusting means 31 against the stopper 30.
37 and 37 are provided.

Further, in the present invention, in the component supply device for adjusting the position of the supplied component 12, the base portion 22 having the concave portion 22A on one surface, and the rotation fitted in the concave portion 22A and parallel to the one surface of the base portion 22A. A rotating member 26 having a freely rotating surface, and a rotating portion 27 having one surface that abuts or faces one surface of the base portion 22, and the one surface is fixed to the rotating surface of the rotating member 26, and is attached to the rotating portion 27. Of the rotation amount adjusting means 31 and a rotation amount adjusting means 31 attached to the rotating portion 27 and having a length adjustable contact member which is attached to the rotating portion 27 and contacts the stopper 30 from the first rotation direction. Biasing means 34 and 37 for urging the rotating portion 27 so as to press the contact member against the stopper 30 are provided.

[0016]

The second adjusting mechanism 22A, 26, 27, 30, 31, 34, 37 for adjusting the position of the electronic component mounting apparatus 20 in the rotational direction parallel to the mounting surface of the substrate 12 in the component supplying section 21.
By providing the electronic component 12, the correction amount in the rotation direction of the electronic component 12 performed when the electronic component 12 is transported can be reduced, and the position state of the electronic component 12 during the transport can be accurately recognized. it can.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 4, reference numeral 20 denotes an electronic component mounting apparatus in which the conventional component supply unit 11 is replaced by the component supply unit 21 of the embodiment. The component supply unit 21
As shown in FIGS. 1 and 2, the base plate 3 (FIG. 4)
On the base plate 22 fixed to the
And a micrometer mounting base 24 fixed to the θ rotation plate 23, and an electronic component mounting base 25 movable in two axial directions (X direction, Y direction) relative to the micrometer mounting base 24 are sequentially stacked. It has been configured.

In this case, an annular groove 22A is provided on the upper surface of the base plate 22, and a thrust bearing 26 is fitted in the groove, whereby a θ rotation plate 23 and a micrometer mounting base 24 are formed. The rotating unit 27 and the electronic component mounting base 25 are integrally rotatable on the base plate 22 in the θ rotation direction.
A θ rotation direction position adjusting micrometer 31 is attached to one side surface of the base plate 22, and a θ rotation direction stopper 30 is attached to one side surface of the θ rotation plate 23 so as to correspond thereto.

Further, the first θ rotation plate is arranged so as to bridge the pin 32 fixed to one end side of the front end face of the base plate 22 and the pin 33 fixed to the other end side of the front end face of the θ rotation plate 23. A tension spring 34 is attached and bridges a pin 35 fixed to the other end of the rear end face of the base plate 22 and a pin 36 fixed to one end of the rear end face of the θ rotation plate 23. A second θ-rotation plate tension spring 37 is attached to these first and second
The θ rotation direction position adjusting micrometer 31 is pressed against the θ rotation direction stopper 30 by the elastic force of the θ rotation plate tension springs 34 and 37.

As a result, in this component supply unit 21, the θ rotation unit 27 and the electronic component mounting base 2 for the base plate 22 are operated by operating the θ rotation direction position adjusting micrometer 31.
The rotation amount of 5 in the θ rotation direction can be adjusted. The θ rotation position fixing plate 4 is provided on the other side surface of the base plate 22.
0 is attached, and the other side surface of the θ rotation plate 23 is bent in an L-shape corresponding to this.
The rotation position adjustment plate 41 is attached, and the θ position rotation fixing screw 42 is screwed to the θ rotation position fixing plate 40 through the θ rotation position adjustment opening 41A formed in the θ rotation position adjustment plate 41.

As a result, in this component supply unit 21, the θ position rotation fixing screw 42 and the θ rotation position fixing plate 40 are firmly screwed into the θ rotation position fixing plate 40, so that the θ rotation position adjusting plate is combined with the θ position rotation fixing plate 42. 41 can be fixedly held, and thus the positions of the θ rotation portion 27 and the electronic component mounting base 25 with respect to the base plate 22 in the θ rotation direction can be fixed.

Furthermore, a front-back direction position adjusting micrometer 50 is attached to the front side surface of the micrometer mounting base 24, and a left-right direction position adjusting micrometer 51 is mounted to one side face of the micrometer mounting base 24. By operating the front-rear direction position adjustment micrometer 50 and the left-right direction position adjustment micrometer 51, the front-rear direction and the left-right position of the electronic component mounting base 25 with respect to the micrometer mounting base 24 can be finely adjusted. It is done like this.

Further, a pair of component positioning stoppers 52A and 52B are attached to the upper surface 25A of the electronic component mounting base 25, and the electronic component is positioned so as to be pressed against these component positioning stoppers 52A and 52B. It is supplied on the component mounting 25th. Therefore, in this component supply device 21, by operating the front-rear direction position adjustment micrometer 50 and the left-right direction position adjustment micrometer 51, the electronic components mounted on the electronic component mounting base 25 via the electronic component mounting base 25 are positioned. While the position of the component 12 in the front-rear direction and the left-right direction can be finely adjusted, by operating the θ-rotation direction position adjustment micrometer 31, the θ-rotation unit 27 and the electronic component mounting table 25 are sequentially moved as shown in FIG. Through this, the position of the electronic component 12 in the θ rotation direction can be finely adjusted.

In the above structure, the electronic component mounting device 2
0 (FIG. 4) operates in the operation mode in the same manner as in the operation mode of the electronic component mounting apparatus 1 described above. Therefore, in this electronic component mounting apparatus 20, the θ rotation direction position adjusting micrometer 31 of the component supply unit 21 is operated to perform θ of the electronic component 12 which may be performed by the nozzle unit 7 in the operation mode.
By correcting the position of the electronic component 12 in the θ rotation direction in the component supply unit 11 in advance by the same angle as the position correction amount Δθ in the rotation direction, the θ of the electronic component 12 performed by the nozzle unit 7 in the operation mode. The correction amount in the rotation direction can be reduced. Therefore, by configuring the component supply unit 21 in this way, the takt time of the electronic component mounting apparatus 20 can be shortened.

Further, in such a case, the position of the electronic component 12 sucked and held by the vacuum nozzle 9 in the θ rotation direction is not largely deviated, so that the electronic component recognition camera 1
5 can be increased, and thus the position recognition accuracy of the electronic component 12 by the electronic component recognition camera 15 can be improved. Therefore, by configuring the component supply unit 21 in this way, the position states of the electronic component 12 in the front-rear, left-right direction and in the θ rotation direction can be adjusted more accurately, and thus the electronic component mounting apparatus 20. It is possible to improve the mounting accuracy of the electronic component 12 on the printed wiring board 14 as a whole.

According to the above-mentioned structure,
By providing a position adjusting mechanism capable of adjusting the position in the θ rotation direction in addition to the position adjusting mechanism of the mounted electronic component 12 in the front-rear and left-right directions, the electronic component 12 performed by the nozzle unit 7 during operation. It is possible to reduce the correction amount in the θ rotation direction of the electronic component recognition camera 15
It is possible to improve the position recognition accuracy of the electronic component 12 by the above, and thus to realize the component supply unit which can shorten the tact time and can mount the electronic component 12 on the printed wiring board 14 with high accuracy.

In the above-described embodiment, the θ rotation direction position adjusting micrometer 31 is connected to the θ rotation direction stopper 30.
A θ rotation plate tension spring 34 as a biasing means for biasing the θ rotation plate 32 so as to press the
Although the case where 37 is used has been described, the present invention is not limited to this, and various other elastic members such as a rubber material can be applied.

Further, in the above-mentioned embodiment, the electronic component mounting base is operated by operating the θ rotation direction position adjusting micrometer 31, the front and rear direction position adjusting micrometer 50 and the left and right direction position adjusting micrometer 51 of the component supplying section 21. Although a case has been described in which the position of the electronic component 12 supplied on the 25 is adjusted in the θ rotation direction and the front-rear, left-right direction, the present invention is not limited to this. For example, the θ rotation direction performed by the vacuum nozzle 9, The θ rotation unit 27 is automatically (using a control circuit, a motor, etc.) according to the correction amount in the front-back, left-right direction.
Also, the position adjustment of the electronic component mounting base 25 in the X direction and the Y direction may be performed. In short, as long as the component supply unit 21 is provided with the adjustment function of the biaxial direction and the θ rotation direction. Various other configurations can be applied as the configuration of the adjusting mechanism.

Further, in the above-described embodiment, the case where the component supply unit 21 according to the present invention is applied to the electronic component mounting apparatus 20 has been described, but the present invention is not limited to this, and various other apparatuses can be used. Can be applied.

Further, in the above-mentioned embodiment, the case where the θ rotation direction position adjusting micrometer 31 is used as the position adjusting means in the θ rotation direction of the electronic parts supplied to the parts supplying section 21 has been described. The present invention is not limited to this, in short, as long as it has a length-adjustable contact member that contacts the stopper from one rotation direction,
As the position adjusting means, a device other than the θ rotation direction position adjusting micrometer 31 may be used.

Further, in the above-mentioned embodiment, the case where the thrust bearing is used as a means for freely rotating the θ rotary plate in the θ rotary direction on the base plate of the component supplying section has been described. Not limited to this, the point is that a bearing other than the thrust bearing may be used as long as it has a rotatable surface parallel to the upper surface of the base plate.

[0033]

As described above, according to the present invention, an electronic component supplied while being positioned in the component supply section is conveyed to a mounting position on a mounting surface of a substrate which is supplied to a predetermined position, In the electronic component mounting apparatus that mounts the electronic component at the mounting position on the mounting surface so that it is mounted, in the component supply unit,
In addition to the first adjusting mechanism for adjusting the position in two directions parallel to the mounting surface of the electronic component and perpendicular to each other, a second adjusting mechanism for adjusting the position in the rotation direction parallel to the mounting surface of the board is provided. By doing so, it is possible to reduce the amount of correction of the rotation direction of the electronic component that is performed when the electronic component is transported, and it is possible to accurately recognize the position state when the electronic component is transported, thus shortening the takt time. In addition, it is possible to realize an electronic component mounting apparatus and a component supply apparatus capable of mounting electronic components on a substrate with high accuracy.

[Brief description of drawings]

FIG. 1 is a top view showing a component supply device according to an embodiment.

FIG. 2 is a side view of the component supply device according to the embodiment with a partial cross section.

FIG. 3 is a top view showing how the rotating unit rotates.

FIG. 4 is a schematic perspective view showing an overall configuration of an electronic component mounting apparatus.

[Explanation of symbols]

1, 20 ... Electronic component mounting device, 11, 21 ... Component supply unit, 22 ... Base plate, 22A ... Groove, 24 ... Thrust bearing, 25 ... Electronic component mounting base, 27 ... Rotating unit, 30 ...... Stopper, 31 ...... θ rotation direction position adjustment micrometer, 34, 37 …… θ rotation plate tension spring, 50 …… Left and right direction position adjustment micrometer,
51 ... Front-rear direction position adjusting micrometer.

Claims (3)

[Claims] 1. An electronic component, which is supplied while being positioned in a component supply section, is transported to a mounting position on a mounting surface of a substrate which is supplied to a predetermined position, and is mounted thereon. In the electronic component mounting device mounted on the mounting surface at the mounting position, in addition to a first adjusting mechanism for adjusting the position of the electronic component in two directions parallel to the mounting surface and perpendicular to each other, in the component supply unit. An electronic component mounting apparatus is characterized in that a second adjusting mechanism for adjusting the position of the substrate in the rotational direction parallel to the mounting surface is provided. 2. The second adjusting mechanism comprises: a base portion having a concave portion on one surface; a rotating member fitted in the concave portion and having a rotatable rotating surface parallel to the one surface of the base portion; A rotating part having one surface contacting or facing the one surface of the rotating part, the one surface being fixed to the rotating surface of the rotating member, a stopper attached to the rotating part, and attached to the rotating part, First for the stopper
Rotation amount adjusting means having a length-adjustable abutting member that abuts in the rotation direction of, and biasing means for biasing the rotating portion so as to press the abutting member of the rotation amount adjusting means against the stopper. An electronic component mounting device characterized by comprising: 3. A component supply device for adjusting the position of a supplied component, which has a base portion having a recess on one surface and a rotatable rotation surface fitted in the recess and parallel to the one surface of the base portion. A rotary member, a rotary portion having one surface that abuts or opposes the one surface of the base portion, the one surface being fixed to the rotary surface of the rotary member, and a stopper attached to the rotary portion; It is attached to the rotating part and is the first with respect to the stopper.
Rotation amount adjusting means having a length-adjustable abutting member that abuts in the rotation direction of, and biasing means for biasing the rotating portion so as to press the abutting member of the rotation amount adjusting means against the stopper. A component supply device comprising: