JP2003034013A - Cream solder printing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cream solder printing machine equipped with a substrate positioning device capable of certainly positioning a substrate regardless of the kind of the substrate. SOLUTION: In the substrate positioning device 1 provided to the cream solder printing machine and comprising a substrate moving device 2 for moving the substrate 10 to a predetermined position and a substrate suction device 3 for fixing the positioned substrate 10, the substrate moving device 2 is equipped with a pressing roller 11 for pressing the predetermined position of the substrate 10 from above to press the substrate 10 to a reference block 19 while rotated, a pressing roller drive motor 12 for rotationally driving the pressing roller 11 and a lift device 15 for pressing the pressing roller 11 to the substrate 10. The substrate suction device 3 performs blowoff operation when the substrate 10 is moved on a suction surface 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder printing machine.

[0002]

2. Description of the Related Art When mounting electronic components on a printed circuit board, cream solder may be applied to a predetermined portion of the circuit board in advance by printing. For such printing, a mask having openings of a predetermined pattern is brought into close contact with the upper surface of the substrate, and the squeegee is slid along the upper surface of the mask while the squeegee is pressed against the upper surface of the mask with a predetermined force. A cream solder printing machine is used in which the coating material supplied to the upper surface of the mask is extruded from the opening of the mask onto the upper surface of the substrate for application. Such a printing machine includes a substrate positioning device for setting the substrate at a predetermined position so that the substrate can be printed accurately.

As shown in FIG. 5A, a board positioning device 65 provided in a cream solder printing machine includes a board suction device 67 having a vacuum generator (not shown) and one side of the board suction device 67. And the reference block 1 provided on the other side of the substrate suction device 67.
It consists of 9. The pusher 61 is driven by an air cylinder (or an electric motor or the like). The upper surface of the substrate suction device 67 serves as a suction surface 18 for sucking the transported substrate 10, and the suction surface 18 has a plurality of suction ports 18a, 18a, ... Which communicate with the inside of the substrate suction device 67.
・ Is provided. The board 10 carried to the board suction device 67 by the carrying means provided in the cream solder printing machine is placed on the suction surface 18. The pusher 61 pushes the other edge 10c so that the edge 10b of the substrate 10 contacts the reference block 19 provided at a predetermined position. After the position of the substrate 10 is determined, the substrate suction device 67
The vacuum generating device (not shown) connected to the device operates to reduce the pressure in the substrate suction device 67, and the suction ports 18a, 18a ...
The substrate 10 that has been suctioned more is fixed on the suction surface 18. In FIG. 5, the conveyance direction of the substrate 10 is from the back of the paper to the front, and the direction in which the pusher 61 pushes the substrate 10 is from the left to the right of the paper.

[0004]

According to the conventional substrate positioning device 65, when the substrate 10 is pressed against the reference block 19, the edge 10c of the substrate 10 which is in contact with the reference block 19 and the edge 10c opposite to the edge 10b. In addition, a force parallel to the surface of the substrate 10 is applied by the pusher 61. Therefore, when the substrate 10 contacts the reference block 19, a force is applied to both edges of the substrate 10, so that the substrate 10 is
For example, in the case of having a relatively large flexibility or flexibility, there is a possibility of bending as shown in FIG. 5B, and there is a gap between the suction surface 18 of the substrate suction device 67 and the substrate 10. W will be created. When the gap W is formed in this way, air leaks from the gap W, the substrate suction device 67 cannot suck the substrate 10, and the substrate 10 is not fixed, so that there is a problem that positioning is not performed accurately. It was

An object of the present invention is to provide a cream solder printing machine provided with a substrate positioning device capable of surely positioning the substrate regardless of the type of the substrate.

[0006]

In order to solve the above problems, the invention described in claim 1 has, for example, FIG. 1, FIG. 3, FIG.
In a cream solder printing machine for printing cream solder on a board (10) on which electronic components are to be mounted, as shown in FIG. 5, a board suction means for sucking and fixing the board positioned while supporting the board from below. (Substrate suction device 3)
A reference member (reference block 19) that abuts a side edge of the substrate on the substrate suction means to determine the position of the substrate, and moves the substrate on the substrate suction means toward the reference member to move the substrate. Substrate positioning means (pressing rollers 11, 53, clamp pad 22) for bringing the reference member into contact with
And the substrate positioning means has an upper surface (10
It is characterized in that it abuts against a) and pushes the substrate toward the reference member to move the substrate.

According to the first aspect of the invention, the substrate positioning means contacts the upper surface of the substrate and pushes it toward the reference member to move the substrate. Therefore, the substrate is held by the substrate positioning means from above until it comes into contact with the reference member, so that even a flexible substrate will not be bent, and can be securely attracted by the substrate suction means and fixed at a predetermined position. .

According to a second aspect of the present invention, in the cream solder printing machine according to the first aspect, the substrate positioning means rotates the drive roller (pressing roller 11) with the outer peripheral surface abutting on the upper surface of the substrate. A state in which the pressing roller for pressing the driving roller against the upper surface of the substrate (elevating device 15) and the rotation driving means for rotating the driving roller (pressing roller drive motor 12) are pressed against the upper surface of the substrate. It is characterized in that the substrate is moved toward the reference member by rotating the substrate.

According to the second aspect of the present invention, the drive roller holds the predetermined position on the upper surface of the substrate and moves the substrate while rotating. Therefore, since a force is applied from above the substrate when the substrate moves, even a substrate having flexibility does not bend. Therefore, since there is no gap between the substrate and the substrate suction device, the substrate is surely sucked by the substrate suction device and fixed at an accurate position.

According to a third aspect of the present invention, in the cream solder printing machine according to the first aspect, the substrate positioning means abuts against the upper surface of the substrate (clamp pad 2).
2), a pressing means (clamp pad lifting device 21) for pressing the contact body against the upper surface of the substrate, and a moving means (clamp unit moving motor 23) for moving the contact body toward the reference member. It is characterized in that the substrate is moved toward the reference member by moving the contact member toward the reference member while the contact member is pressed against the upper surface of the substrate.

According to the third aspect of the present invention, the contact body uses the frictional force between the substrate and the contact body to move the substrate until it abuts against a predetermined reference member. That is, the substrate is pressed from above by the contact body while moving. Therefore, the substrate does not bend and no gap is formed between the substrate and the substrate suction means, so that the substrate is surely sucked and fixed at a predetermined position. Further, since the contact body holds only one predetermined portion on the upper surface of the substrate and does not move on the substrate, even if a complicated wiring pattern is formed on the substrate, for example, one portion having a small influence is selected and the portion is held. be able to. Therefore, the width of the applicable substrate is widened.

According to a fourth aspect of the present invention, in the cream solder printing machine according to the third aspect, the contact body is a rotatable driven roller (pressing roller 53), and the rotation of the driven roller is predetermined. A restricting means (friction plate 25) for restricting until an external force acts is provided, and the driven roller is pressed against the upper surface of the substrate and moved, whereby the rotation of the driven roller is restricted while the substrate is moving. Then
Further, the regulating means regulates the rotation of the driven roller so that the driven roller is rotated when the substrate comes into contact with the reference member and stops moving.

According to the invention as set forth in claim 4, since the rotatable driven roller is provided with the regulating means for regulating until a predetermined external force acts, the driven roller is pressed against the upper surface of the substrate to move the substrate. At this time, since the regulating force (friction force) between the driven roller and the regulating means is larger than the frictional force between the driven roller and the substrate, the driven roller does not rotate but moves with the substrate. When the movement of the driven roller is stopped by contacting the reference member, the force of the driven roller to rotate becomes larger than the frictional force between the regulating means and the driven roller, so that the driven roller rotates. Therefore, since the driven roller does not rub the upper surface of the substrate after positioning, the load on the substrate is small,
It can be applied to various substrates.

According to a fifth aspect of the present invention, in the cream solder printing machine according to any one of the first to fourth aspects, the substrate is sucked onto the upper surface portion (suction surface 18) of the substrate suction means. A suction port (18a) for sucking air is formed at the time of moving the substrate on the substrate suction means.
An air blowing unit (vacuum generator 40) for blowing air from the suction port is provided.

According to the fifth aspect of the invention, the air blowing means performs a blowing operation when the substrate moves on the substrate suction means, so that the friction between the substrate suction means and the substrate is reduced. You can Therefore, the substrate can move smoothly on the substrate suction means.

[0016]

[First Embodiment]

FIG. 1 is a schematic view showing a main part of a board positioning device 1 as an example of the present invention provided in a cream solder printing machine. The substrate positioning device 1 is roughly composed of a substrate moving device 2 and a substrate suction device 3 (substrate suction means).

The substrate moving device 2 is for moving the substrate 10 to a predetermined position, and includes two front and rear guide rails 4 (see FIG. 1).
(Only one is shown), the roller unit moving lead screw 5 provided in parallel with the guide rail 4, the roller unit 7 capable of horizontally reciprocating along the guide rail 4, and the lead screw 5 are rotated. It comprises a roller unit moving motor 6 for moving the roller unit 7. The guide rails 4 are arranged orthogonal to the transport path of a transport mechanism (not shown) of the cream solder printing machine and on the front and rear sides of a mask (not shown) disposed above the substrate suction device 3. The moving body 7a of the roller unit 7 is engaged with the lead screw 5 by engaging arm portions 7b and 7b that extend left and right and are movably engaged with the guide rail 4 along the guide rail 4. , And a screwing portion (not shown) for moving the roller unit 7 by the rotation of the lead screw 5. In addition, the moving body 7a of the roller unit 7
A support member 8 is rotatably attached to the support member 8 by a pin 9. Below the support member 8, a pressing roller 11 (driving force) that presses the upper surface 10a of the substrate 10 that has been transferred by the transfer means of the cream solder printing machine. A pressing roller drive motor 12 (rotational drive means) is attached above the roller. In the pressing roller 11 and the pressing roller drive motor 12, a pulley 11 a provided coaxially with the pressing roller 11 and a drive pulley 12 a provided on the drive shaft of the pressing roller drive motor 12 are transmitted by an endless belt 13. There is.

At the center of the support member 8, one end of a roller weight balancer 14 having a spring is fastened, and the other end of the roller weight balancer 14 is attached to the upper edge of the moving body 7a of the roller unit 7. ing. Support member 8
Is urged to one side (upward in FIG. 1) by the roller weight balancer 14 and is prevented from lowering due to the weight of the pressing roller 11. A lifting device 15 (pressing means) is provided at the left end of the support member 8.
One end is attached by a pin 16 and the other end is attached by a pin 17 to the roller unit 7. The lifting device 15 is driven by a cylinder,
The left end of the support member 8 connected to the lifting device 15 swings up and down about the pin 9. Also, the lifting device 15
It may be driven by an actuator such as an electric motor other than the cylinder.

The upper surface of the substrate suction device 3 has a plurality of suction ports 18
is a suction surface 18 (upper surface portion) provided with a, 18a, ..., And the substrate suction device 3 is a vacuum generation device for sucking and fixing the substrate 10 conveyed to the suction surface 18. 40 (air blowing means) is connected. A reference block 19 with which the edge portion 10b of the substrate 10 abuts is provided on one side of the substrate suction device 3.

A circuit diagram of the vacuum generator 40 is shown in FIGS. The vacuum generator 40 has both a mechanism for sucking air and a mechanism for blowing air, and can be switched by an electromagnetic switching valve. Vacuum generator 40
Is a suction / blowout switching valve 31 for switching between suction operation and blowout operation, a suction on / off valve 32 for turning on / off the suction operation, a vacuum generation device 33 for creating a vacuum state, a silencer 34 as an exhaust mechanism, It is composed of a compressed air source 36 that generates compressed air, a blowoff amount adjusting throttle valve 35 that regulates the flow rate by a throttle action, and the like. Vacuum generator 33
Is a mechanism for generating a high-speed flow by vigorously flowing compressed air from a narrow space to a wide space, and sucking ambient air to generate a vacuum.

First, the suction operation shown in FIG. 1 will be described. The suction / blowing switching valve 31, which is an electromagnetic switching valve, is switched to the suction side, and the suction on / off valve 32 is turned on. When the compressed air is sent from the compressed air source 36 to the vacuum generating device 33, the vacuum generating device 33 sucks the air in the substrate suction device 3. The sucked air is exhausted through the silencer 34.

Next, the blowing operation shown in FIG. 2 will be described. The suction / blowoff switching valve 31 is switched to the blowout side, and the suction on / off valve 32 is turned off. The flow rate of the air flowing from the compressed air source 36 is adjusted by the blowing amount adjusting throttle valve 35, passes through the point A, and the substrate suction device 3
Sent in.

In the board positioning apparatus 1 having the above structure, first, the board 10 is carried onto the suction surface 18 of the board suction device 3 by the carrying mechanism (not shown) of the cream solder printing machine. At this time, the conveyance direction of the substrate 10 is from the back side of the paper surface of FIG. The roller unit moving motor 6 rotates the roller unit moving lead screw 5 and guides it to the spiral grooves 5a, 5a ... The roller unit 7 that has been moved moves rightward along the guide rail 4. The pressing roller 1 is shown in FIG.
1 shows the state of being in contact with the substrate 10, but when the roller unit 7 is moving to the right, the pressing roller 11 is lifted by the pressing roller elevating device 15 and is in contact with the substrate 10. Absent. After that, when the pressing roller 11 comes on the substrate 10, the roller unit moving motor 6 stops, and the roller unit 7 stops accordingly.

The pressing roller elevating device 15 lowers the supporting member 8 around the pin 9 until the pressing roller 11 contacts the substrate 10. When the pressing roller 11 comes into contact with the substrate 10, the pressing roller drive motor 12 is driven, and the pressing roller 11 connected by the belt 13 rotates counterclockwise in FIG. Substrate 1 on suction surface 18
0 moves with the rotation of the pressing roller 11 to the right until the edge 10b hits the reference block 19. At this time, since air is blown from the suction ports 18a, 18a, ... Of the suction surface 18, the frictional force between the substrate 10 and the suction surface 18 becomes small, and the substrate 10 moves smoothly. The substrate 10 abutted on the reference block 19 is
You can temporarily set the location there. At this time, the pressing roller 11 is spinning while rubbing the upper surface 10a of the substrate 10. When the position of the substrate 10 is determined, suction is started by the vacuum generation device 33 provided in the substrate suction device 3, the substrate 10 is fixed to the suction surface 18, and the pressing roller 11 stops rotating. Pressing roller 11
Is lifted via the supporting member 8 by the pressing roller elevating / lowering device 15 and is separated from the substrate 10. After that, the roller unit 7 is moved to a predetermined standby position (a position not overlapping the mask) by the roller unit moving motor 6.

After the positioning of the substrate 10 is completed, the cream solder printer applies a mask having an opening of a predetermined pattern to the substrate 1.
0 and the squeegee is slid along the upper surface of the mask, whereby the cream solder supplied to the upper surface of the mask is extruded from the opening of the mask onto the upper surface 10a of the substrate 10 and applied. Regarding how to bring the substrate 10 and the mask into close contact, the substrate 10 is raised by an elevating device (not shown) provided below the substrate suction device 3 and pressed against the mask, or the mask is lowered and pressed against the substrate 10. It is done by

By the way, this mask and the upper surface 1 of the substrate 10
A reference mark for aligning the position of the mask and the substrate 10 is marked on 0a, and a camera for confirming whether the position of the reference mark on the substrate 10 and the position of the reference mark on the mask match. Are provided so as to move between the mask and the substrate 10. The substrate moving device 2 in the substrate positioning device 1 is configured to fit within the space between the substrate 10 and the mask when the camera enters.

Here, in FIG. 1, the conveyance direction of the substrate 10 in the cream solder printing machine is the front-rear direction, and the movement direction of the roller unit 7 perpendicular to the front-rear direction is the left-right direction. At this time, the substrate 10 is conveyed from the back to the front, and the roller unit 7 moves from the left to the right. The guide rails 4 of the substrate moving device 2 are provided in the front and rear sides of the substrate 10 in a direction perpendicular to the carrying direction of the substrate 10 so as to straddle the substrate 10 (only one is shown in FIG. 1). It does not overlap with. Since the width of the guide rail 4 is sufficiently wider than the width of the substrate, the roller unit 7 can be moved to a position where it does not overlap the substrate 10 after the positioning is completed, and it does not interfere with printing. The guide rail 4 may be provided on either the front side or the rear side of the substrate 10.

According to the substrate positioning apparatus 1 in the first embodiment, the pressing roller 11 causes the substrate 10 conveyed on the suction surface 18 to be immediately near the reference block 19 to which the end 10b is pressed. , Hold it from above and move it. Therefore, even if the rigidity of the substrate 10 is low, since the substrate 10 is moved while being pressed from above, the substrate 10 does not bend. That is, the suction surface 18 of the substrate suction device 3
Since there is no gap W between the substrate 10 and the substrate 10, the substrate 10 is reliably sucked and fixed by the substrate suction device 3.

The present invention is not limited to the above embodiment. For example, although the pressing roller 11 in the above embodiment is one, it can be appropriately changed depending on the size of the substrate to be conveyed, and may be two or more. In addition, the pressing roller 1 is considered in consideration of the wiring pattern of the substrate.
If you press 1, press the place where there is no problem,
Control may be performed so that the position of the pressing roller 11 can be changed.

[Second Embodiment] FIG. 3 is a schematic view showing a main part of a substrate positioning device 41 according to a second embodiment of the present invention. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. Further, the positional relationship between the cream solder printing machine and the substrate moving device 42 (substrate positioning means) is also the same as that in the first embodiment, and therefore its description is omitted.

The substrate positioning device 41 according to the second embodiment has a clamp unit 20 instead of the roller unit 7 of the substrate positioning device 1 according to the first embodiment.
Is used. The clamp unit 20 includes a clamp pad 22 (contact body) that presses the substrate 10 with a predetermined force, and a clamp pad elevating device 21 (pressing means) that can reciprocate the clamp pad 22 in the vertical direction.
Etc. The clamp unit 20 is driven by a motor 23 (moving means) for moving the clamp unit, and extends along the upper and lower two parallel guide rails 4 and 4 and the lead screw 24 for moving the clamp unit sandwiched therebetween. It is possible to reciprocate horizontally. By supporting the two guide rails 4 and 4 in this manner, the clamp unit 20 is stable and can operate more reliably. The guide rails 4 and 4 may be provided in front of and behind the mask as in the first embodiment.

Similar to the first embodiment, first, the substrate 10
Is conveyed to the suction surface 18 of the substrate suction device 3 from the back side of the paper in FIG. The clamp unit 20 standing by at the left end of the guide rails 4 and 4 moves to a position where it can contact the substrate 10 by the clamp unit moving motor 23, and the clamp pad lifting device 21 causes the clamp pad 22 to move to the upper surface of the substrate 10. It is pressed against 10a with a predetermined force. The clamp unit 20 is driven by a clamp unit moving motor 23 and moves to the right. At this time, since the clamp pad 22 is in contact with the substrate 10 so as to be pressed against it, the substrate 10 also moves rightward together with the clamp unit 20, and the edge portion 10 b thereof is pressed against the reference block 19. Board 10 with fixed position
Is fixed by the substrate suction device 3, and the clamp pad 22
Is lifted by the clamp pad lifting device 21, and the clamp unit 20 moves leftward and returns to the original standby position.

According to the substrate positioning device 41 in the second embodiment, the clamp pad 22 is moved and positioned while applying force to the upper surface 10a of the substrate 10, so that the substrate 10 has flexibility. The substrate 10 does not bend even if it is present. Therefore, since no gap W is formed between the substrate 10 and the suction surface 18 of the substrate suction device 3, the inside of the substrate suction device 3 becomes a vacuum without air leakage. Therefore, the substrate 10 sucked by the substrate suction device 3 is surely fixed at a predetermined position, so that defective printing can be prevented. Further, since the clamp pad 22 presses only one place of the substrate 10, it can be applied to a substrate having a complicated wiring pattern.

The present invention is not limited to the above embodiment. For example, although the number of the clamp pads 22 in the above-described embodiment is one, it can be appropriately changed depending on the size of the substrate to be moved, as in the first embodiment, and may be two or more. Further, as in the first embodiment, air may be blown out from the substrate suction device 3 when positioning the substrate 10.

[Third Embodiment] FIG. 4 is a schematic view showing a main part of a substrate positioning apparatus 51 according to a third embodiment of the present invention. In this embodiment, a pressing roller 53 (following roller) having a frictional load is used instead of the clamp pad 22 of the substrate positioning device 41 in the second embodiment of the present invention. . The board positioning device 51 of the cream solder printing machine according to the third embodiment is structurally substantially the same as the board positioning device 1 according to the first embodiment. Substrate moving device 52 of substrate positioning device 51 in the form of
Is a roller unit 5 instead of the pressing roller 11 of the roller unit 7 of the substrate moving device 2 of the first embodiment.
4, a pressing roller 53, which is not driven to rotate and whose rotation is restricted by the friction plate 25, is provided. Therefore, the same components as those in the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted. The roller shaft 53a of the pressing roller 53 has a U-shaped friction plate 25.
It is rotatably sandwiched between (regulating means). Friction plate 25
Is formed in a U shape by two members 25a and 25b, and these members 25a and 25b are rotatably fastened to each other by a pin 55. Two members 25
A spring 26 is attached between a and 25b, and the two members 25a and 25b are biased toward each other. The pressing roller 53 is adjusted by the friction plate 25 and the spring 26 so as not to rotate until a predetermined force is applied.

The pressing roller 53 lowered by the pressing roller elevating device 15 comes into contact with the upper surface 10a of the substrate 10 conveyed to the suction surface 18 of the substrate suction device 3,
The roller unit 5 is driven by the roller unit moving motor 6.
4 moves to the right. At this time, the friction plate 25 moves the roller shaft 5
3a is sandwiched between the friction plate 25 and the roller shaft 53.
Friction occurs between a and the pressing roller 53 does not rotate. Therefore, the pressing roller 53 does not rotate while pressing the substrate 10, but moves together with the substrate 10. When the edge portion 10b of the substrate 10 comes into contact with the reference block 19, the movement of the substrate 10 stops, and the force of the pressing roller 53 to rotate becomes larger than the frictional force between the friction plate 25 and the roller shaft 53a. The rotation of the substrate 10 is started, and the movement of the pressing roller 53 is stopped when the substrate 10 is fixed to the substrate suction device 3.

According to the substrate positioning device 51 of the third embodiment, the pressing roller 53 does not rotate when moving the substrate 10, but rotates after positioning the substrate 10. Therefore, the same effects as those of the first and second embodiments are obtained, and since the pressing roller 53 moves on the substrate 10 while rotating after positioning the substrate, the substrate 1
The upper surface 10a of the substrate 10 is not rubbed with the momentum when 0 is stopped, and the possibility of damaging the substrate 10 is low. Therefore, various types of substrates such as a flexible or flexible substrate can be used.

[0039]

According to the first aspect of the invention, in the cream solder printing machine, the board positioning means contacts the upper surface of the board and moves it to the reference member. Therefore, while the substrate is being moved, a force applied from above is applied, and since no force is applied to both edges as in the conventional case, the substrate does not bend even if it has flexibility. Therefore, there is no gap between the board and the board suction means, and the board is surely sucked by the board suction means and fixed at the correct position, so that the printing quality of the cream solder is improved. Further, since the substrate does not bend and is not fixed to the substrate suction means, the series of printing steps does not stop, so that the productivity of the cream solder printing machine can be improved.

According to the second aspect of the invention, the drive roller is pressed against the upper surface of the substrate by the pressing means and is rotated by the rotation drive means. With this rotation, the substrate moves toward the reference member. Therefore, the same effect as the first aspect can be obtained.

According to the third aspect of the present invention, since the contact body moves the substrate from above until it abuts against the predetermined reference member, the substrate is pressed from above until it reaches the predetermined position. Will be there. Therefore, claim 1
The same effect as can be obtained. Further, since the contact body presses only one predetermined place on the upper surface of the substrate and does not move on the substrate, it is suitable even when the substrate has flexibility or a large number of wiring patterns are provided. There is. In other words, it is possible to select a place on the board that has little effect even if pressed, and the place to be pressed is the minimum,
The damage given to the substrate can be reduced.

According to the fourth aspect of the present invention, the driven roller does not rotate when moving the substrate while pressing it from above, and starts rotating when the substrate hits the reference block and stops moving. Therefore, the same effect as the first aspect can be obtained. Further, since the driven roller rotates after the substrate stops, the driven roller does not rub the substrate with the momentum when the substrate stops, and the load on the substrate is small. Therefore, various types of substrates such as a thin substrate and a flexible substrate can be used.

According to the fifth aspect of the present invention, since the air blowing means performs the blowing operation when the substrate moves on the upper surface of the substrate suction means, the frictional force between the upper surface and the substrate is reduced. You can Therefore, since the substrate can move smoothly on the upper surface portion, when the driving roller, the abutment body, and the driven roller move on the substrate, only the driving roller does not move on the substrate. Can move together.

[Brief description of drawings]

FIG. 1 is a schematic view showing a main part of a board positioning device of a cream solder printing machine as an example of the present invention.

FIG. 2 is a circuit diagram when the vacuum generating device of the substrate suction device of the cream solder printing machine performs a blowing operation.

FIG. 3 is a schematic view showing a main part of a board positioning device of a cream solder printing machine as another example of the present invention.

FIG. 4 is a schematic view showing a main part of a board positioning device of a cream solder printing machine as another example of the present invention.

FIG. 5A is a schematic diagram showing a main part of a conventional substrate positioning apparatus, and FIG. 5B is a diagram showing a state where the substrate is bent in the substrate positioning apparatus of FIG.

[Explanation of symbols]

1, 41, 51 Substrate positioning device 2, 42, 52 Substrate moving device 3 Substrate suction device (substrate suction means) 10 Substrate 10a Upper surface 10b, 10c Edges 11, 53 Push roller (drive roller, driven roller) 12 Push roller drive Motor (rotational drive means) 15 Lifting device (pressing means) 18 Suction surface (upper surface) 18a Suction port 19 Reference block (reference member) 21 Clamp pad lifting device (pressing means) 22 Clamp pad (contact body) 23 Clamp unit Motor for movement (moving means) 25 Friction plate (regulating means) 40 Vacuum generator (air blowing means)

Claims (5)

[Claims] 1. A cream solder printing machine for printing cream solder on a substrate on which electronic components are to be mounted, and a substrate suction means for sucking and fixing the substrate positioned while supporting the substrate from below. A reference member for contacting a side edge of the substrate on the substrate suction means to determine the position of the substrate, and a substrate for moving the substrate on the substrate suction means toward the reference member to bring the substrate into contact with the reference member. A cream solder printing machine comprising: a board positioning means, wherein the board positioning means abuts an upper surface of the board and pushes the board toward the reference member to move the board. 2. A drive roller that the substrate positioning means rotates by bringing the outer peripheral surface into contact with the upper surface of the substrate, a pressing means that presses the drive roller against the upper surface of the substrate, and a rotation drive means that rotationally drives the drive roller. 2. The cream solder printing machine according to claim 1, further comprising: and rotating the roller while pressing the roller against the upper surface of the substrate to move the substrate toward the reference member. 3. An abutting body with which the substrate positioning means abuts the upper surface of the substrate, a pressing means for pressing the abutting body against the upper surface of the substrate, and a moving means for moving the abutting body toward the reference member. And moving the contact body toward the reference member in a state where the contact body is pressed against the upper surface of the substrate, thereby moving the substrate toward the reference member. The cream solder printing machine according to claim 1. 4. The contact member is a rotatable follower roller, and a restricting means is provided for restricting rotation of the follower roller until a predetermined external force acts, and the follower roller is pressed against the upper surface of the substrate to move. By controlling the rotation of the driven roller while the substrate is moving, the rotation of the driven roller is stopped when the substrate comes into contact with the reference member and stops moving. 4. The cream solder printing machine according to claim 3, wherein the regulation means regulates the rotation of the driven roller. 5. A suction port for sucking air to adsorb the substrate is formed on an upper surface of the substrate adsorbing unit, and air is sucked from the suction port when the substrate is moved on the substrate adsorbing unit. The cream solder printing machine according to any one of claims 1 to 4, further comprising air blowing means for blowing air.