JPH0817682A - Chip type electronic component - Google Patents

Abstract

PURPOSE:To make a lead frame use in common with a capacitor element regardless of the size of the capacitor element of a chip type solid electrolytic capacitor. CONSTITUTION:The connection end part of a second outer lead member 5A is formed of a vertically arranged part 21 and a bent piece 21a, which is extended from the side end of this vertically arranged part 21, and the part 21 and the piece 21a are respectively bonded on the bottom part and the side surface part of a capacitor element 1a, whereby it is contrived to use a first outer lead frame 10A in common with the element 1a regardless of the size of the element 1a and the position of the connection of a first outer lead member 3 with an anode lead 2 can be also slidingly changed according to the size of the element 1a. Accordingly, it is made possible to use the frame 10A in common with the element 1a and a good electrode-attaching state is obtained without needing a positioning jig at the time of an electrode-attaching work.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type electronic component, and more particularly to a chip type electronic component capable of sharing a lead frame regardless of the size of the capacitor element of the chip type solid electrolytic capacitor.

[0002]

2. Description of the Related Art A specific example of a chip type electronic component, for example, a chip type solid electrolytic capacitor will be described below with reference to FIG. In FIG. 5, reference numeral 1 denotes a capacitor element 3 in which metal powder having the same valve action is pressure-molded into a rectangular parallelepiped shape and sintered on the outer periphery of one end of a metallic anode lead 2 having a valve action such as tantalum or titanium. A first outer lead member 4 welded to the tip of the anode lead 2 protruding from the capacitor element 1 is an oxide layer on the peripheral surface of the capacitor element 1, an electrode lead layer formed via a semiconductor layer, 5
Is a second external lead member adhered to a part of the outer circumference of the electrode lead layer 4 with a conductive adhesive 6 such as Ag paste, and 7 is a first external lead member.
It is a molded exterior resin material that exposes the tips of the second external lead members 3 and 5 and seals the main parts.
The first and second external lead members 3 and 5 are led out from two opposite side surfaces of the exterior resin material 7 and are bent along the side surface and the back surface of the exterior resin member 7. Some of these chip-type solid electrolytic capacitors have a structure in which the connection end of the second external lead member 5 connected to the capacitor element 1 is formed in a trapezoidal shape, and the capacitor element 1 of various sizes is provided. And the connection area with the connection end of the second external lead member 5 can be kept to the maximum, and the lead frame can be shared, and at the time of attaching the pole to the capacitor element 1. It is possible to accurately position the capacitor element 1 (Japanese Utility Model Laid-Open No. 64-22022). To manufacture this chip type solid electrolytic capacitor 8, as shown in FIG. 6, a lead frame 10 is prepared in which a plurality of pairs of external lead members 3 and 5 are assembled and connected by a tie bar 9. And
After the external lead members 3 and 5 are fitted in the concave grooves 11 of the positioning jig 12 in which the concave grooves 11 are formed so as to correspond to the external lead members 3 and 5 of the lead frame 10, the concave grooves 11 are formed.
The capacitor element 1 is inserted into the inside, the capacitor element 1 is adhered onto the second external lead member 5 of each set of the lead frame 10 with the conductive adhesive 6, and the anode lead is applied onto the first external lead member 3. Weld two.

[0003]

There are various sizes of the capacitor element 1 described above, and the lead frame 10 having an external lead member connected to the capacitor element 1 can be said to be commonly used. However, in the case of the capacitor element 1 having a small size as shown in FIG. 7, that is, when the width dimension L1 of the capacitor element 1 is narrower than the width dimension of the second external lead member 5 of the lead frame 10, the positioning jig 12 is recessed. When inserting the capacitor element 1 into the groove 11 and connecting the external lead members 3 and 5, there is a problem that the element 1 is displaced in the width direction in the groove 11 and cannot be accurately poled. there were. On the other hand, in the case of the large-sized capacitor element 1, that is, as shown in FIG. 8, the width dimension L2 of the capacitor element 1 is the second dimension of the lead frame 10.
If it is wider than the external lead member 5, the positional deviation of this element in the width direction can be regulated by the concave groove 11 of the positioning jig 12, but on the other hand, the connecting end portion 5a of the capacitor element 1 and the second external lead member 5 can be controlled. There is a problem in that the adhesive area between and becomes smaller, which reduces the adhesive strength between the two. As described above, it has not been easy to commonly use a lead frame including the external lead members 3 and 5 connected to the capacitor element 1 because of various problems.

[0004]

SUMMARY OF THE INVENTION The present invention has been proposed in view of the above problems, and it is connected to a first external lead member connected to an anode lead of a capacitor element and a cathode electrode extraction layer of the capacitor element. In the chip-type electronic component in which the main part including the capacitor element is covered with resin by pulling out the second external lead member in opposite directions to each other, the second external lead is provided on the bottom surface and the side surface of the capacitor element. The connection end of the member is connected to the standing end and the bending piece extending from the end of the standing, and the welding point of the anode lead and the first outer lead member is made to respond depending on the size of the capacitor element. It is characterized by.

[0005]

By connecting the standing portion, which is the connecting end portion of the capacitor element and the second external lead member, and the bending piece extending from the side end of the standing portion, at the bottom surface portion and the side surface portion of the element. It is possible to attach electrodes while keeping the bonding area between the connecting ends of the large and small capacitor elements and the second external lead member to a maximum, and also the welding point between the anode lead and the first external lead member. Since it can be changed according to the size of the capacitor element, the lead frame can be shared and the element can be accurately positioned when poled to the capacitor element, resulting in misalignment when poled. Can be prevented.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The same parts as those shown in FIGS. 5 to 8 are designated by the same reference numerals, and the description thereof will be omitted. The features of the chip-type solid-state electric field capacitor 20 according to the present invention are that a standing portion 21 which is a connecting end portion of the second external lead member 5A and this standing portion 21 are provided on the bottom surface portion and the side surface portion of the capacitor element 1. The connecting end portions 21 and 21a of the second external lead member 5A connected to the side surface portion of the capacitor element 1 connected to the bent piece 21a extending from the side end thereof are erected as shown in the perspective view of FIG. It comprises an installation portion 21 and a bent piece 21a extending in a direction perpendicular to the side end of the standing portion 2. And
When the external lead members 3 and 5 are poled to the capacitor element 1a having a narrow width shown in the plan view of FIG. 3, the conductive adhesive 6 is applied to the connection end portions 21 and 21a of the second external lead member 5A. The bottom surface portion and the side surface portion of the capacitor element 1a are joined together. Further, when the anode lead 2 of the capacitor element 1a is welded onto the first outer lead member 3, the welding position is slidably changed according to the element size and the welding is performed. Further, when the external lead members 3 and 5A are poled to the capacitor element 1b having a wide width shown in the plan view of FIG. 4, the connection can be made in the same manner as above. Therefore, by joining the connection end portions 21 and 21a of the second external lead member 5 to the side surface portions of the capacitor elements 1a and 1b, the above-mentioned capacitor elements 1a and 1b can be maintained while keeping the bonding area at a maximum.
The same lead frame 10A can be used regardless of the dimensions. As a result, of course, a stable poled state can be obtained after poled. The subsequent manufacturing process of the chip type solid electrolytic capacitor 20 is the same as the conventional general method, and the description thereof is omitted.

[0007]

According to the present invention, the standing portion, which is the connecting end portion of the second external lead member, and the refraction piece extending from the side end of the standing portion are provided on the bottom surface portion and the side surface portion of the capacitor element. The external lead member can be joined regardless of the size of the capacitor element, and the lead frame can be shared. That is, regardless of the size of the capacitor element, it is possible to attach the capacitor element and the second external lead member while maintaining the bonding area, and it is possible to improve the bonding strength. In addition, at the time of pole attachment, it is possible to perform regular positioning without exchanging the positioning jig due to the size of the capacitor element, and a good pole attachment state can be obtained. Furthermore, the structure is simple and the manufacturing cost is low.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an embodiment of a chip-type solid electrolytic capacitor according to the present invention.

FIG. 2 is a perspective view showing a connection end portion of a second external lead member.

FIG. 3 is a plan view for explaining a positioning procedure of a capacitor element having a narrow width dimension.

FIG. 4 is a plan view for explaining how to position a capacitor element having a narrow width.

FIG. 5 is a vertical sectional view of a conventional chip-type solid capacitor

FIG. 6 is a partial plan view of a lead frame set on a positioning jig.

FIG. 7 is a plan view for explaining how to connect a small-sized capacitor element.

FIG. 8 is a plan view for explaining how to connect a large-sized capacitor element.

[Explanation of symbols]

 1 Capacitor Element 1a Narrow Width Capacitor Element 1b Wide Width Capacitor Element 2 Anode Lead 3 First External Lead Member 4 Electrode Lead Layer 5A Second External Lead Member 6 Conductive Adhesive 7 Exterior Resin Material 10A Lead Frame 20 Chip type solid electrolytic capacitor 21 Connection end part (standing part) 21a Connection end part (folded piece)

Claims (3)

[Claims] 1. A first external lead member connected to an anode lead of a capacitor element and a second external lead member connected to a cathode electrode extraction layer of the capacitor element are led out in mutually opposite directions to include a capacitor element. In a chip-type electronic component whose main part is covered with a resin, the connection portion of the second external lead member is connected to the bottom surface portion and the side surface portion of the capacitor element to connect the anode lead of the capacitor element and the first external lead member. A chip-type electronic component characterized in that the welding point is made to respond to the size of the capacitor element. 2. The chip-type electronic component according to claim 1, wherein the connection end portion of the second external lead member comprises a standing portion and a bending piece extending from a side end of the standing portion. 3. The connecting end portion of the second external lead member comprises an upright portion that rises in a right angle direction and a bent piece that extends in a right angle direction from a side end of the upright portion. The described chip-type electronic component.