JPH08176247A - Resin composition and insulated wire - Google Patents

Abstract

PURPOSE: To enable an insulated wire having an insulating layer formed from an ultraviolet-curable urethane acrylate resin to be soldered at a low temp. in a short time. CONSTITUTION: 100 pts.wt. ultraviolet-curable urethane acrylate resin is compounded with 1-10 pts.wt. inorg. metal compd. (e.g. zinc chloride or iron chloride) or organometallic compd. (e.g. dibutyltin dilaurate, cobalt naphthenate, or iron 2-ethylhexoate), then applied to a conductor 1, and cured by irradiating with ultraviolet ray, thus forming an insulating layer 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultraviolet curable resin composition and an insulated wire having good solderability, which is obtained by applying and curing the resin composition to form an insulating layer.

[0002]

2. Description of the Related Art There is known an insulated electric wire in which a urethane acrylate-based ultraviolet curable resin is applied to a conductor and is irradiated with ultraviolet rays to be cured to form an insulating layer. In this insulated wire, the urethane bond in the cured resin exerts a flux function during soldering, and the insulating layer must be removed in advance, as with ordinary polyurethane wires that have an insulating layer made of thermosetting polyurethane. Instead, it has the characteristic that it can be directly soldered.

However, in the insulated wire having the insulating layer made of the urethane acrylate-based UV-curable resin, the decomposition temperature of the cured resin is higher than that of the polyurethane resin used for the polyurethane wire. Soldering is performed by raising the soldering temperature. Therefore, when soldering at such a high temperature,
There are drawbacks such as thin conductors and disconnection.

[0004]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to reduce the soldering temperature of an insulated wire having an insulating layer made of a urethane acrylate-based UV curable resin.

[0005]

[Means for Solving the Problems] The problem is to promote thermal decomposition of a cured resin by adding an inorganic metal compound such as zinc chloride or an organometallic compound such as dibutyltin laurate to a urethane acrylate-based ultraviolet curable resin. You can solve it by doing.

The present invention will be described in detail below. FIG.
Shows an example of the insulated wire of the present invention, and the one denoted by reference numeral 1 is a conductor, and one layer of insulating layer 2 is provided on this conductor 1 to form the insulated wire of this example. . The insulating layer 2 is made of urethane acrylate-based UV curable resin 10
A resin composition prepared by adding 1 to 10 parts by weight of one or more kinds of an inorganic metal compound or an organometallic compound described below to 0 part by weight was applied onto the conductor 1 and was irradiated with ultraviolet rays to be cured. It has a thickness of 10 to 200 μm.

Examples of the urethane acrylate-based UV-curable resin include a photopolymerizable prepolymer in which an oligoester or oligoether having a hydroxyl group at the terminal and an acrylic acid ester having a hydroxyl group are bound with diisocyanate, 2-ethylhexyl acrylate, and 2 -A photopolymerizable monomer such as hydroxypropyl acrylate, polyethylene glycol diacrylate, or pentaerythritol triacrylate, and a photopolymerization initiator such as benzophenone as main components, to which a sensitizer, a coloring pigment, a filler, etc. are mixed. Are used.

Examples of the inorganic metal compound include zinc chloride, tin chloride and iron chloride. Examples of the organometallic compound include tin octoate, dibutyltin (2-ethylhexoate), 2-ethylhexoate lead, 2-ethylhexoate iron, 2-ethylhexoate cobalt, dibutyltin laurate, Examples thereof include lead naphthenate, cobalt naphthenate, zinc naphthenate, and tetra-n-butyltin. These metal compounds are used as catalysts for urethane curing reaction. The amount of addition of these metal compounds is the urethane acrylate-based UV curable resin 1
It is 1 to 10 parts by weight with respect to 00 parts by weight. If it is less than 1 part by weight, the effect of promoting the thermal decomposition of the cured resin cannot be obtained, and if it exceeds 10 parts by weight, the characteristics of the insulating layer are deteriorated, which is disadvantageous.

The compounding of these metal compounds with the urethane acrylate-based UV-curable resin can be easily carried out by simply adding the specified amount thereof and stirring and dispersing or dissolving them in the resin. Further, the resin composition can be applied to the conductor by using a coating die as in the case of a usual insulating varnish. Further, the irradiation of ultraviolet rays is performed by a method of irradiating ultraviolet rays from an ultraviolet light source such as a high pressure mercury lamp, a halogen lamp, and a xenon lamp from the entire circumferential direction of the conductor.

When such an insulated wire is soldered, since the above-mentioned metal compound is contained in the cured resin forming the insulating layer 2, thermal decomposition of the cured resin easily progresses. . Therefore, the soldering temperature can be lowered or the soldering time can be shortened.
There will be no inconvenience such as thinning of the paper. Further, various mechanical, electrical and thermal characteristics of the insulating layer 2 itself are hardly deteriorated by the addition of the metal compound.

FIG. 2 shows another example of the insulated wire of the present invention, in which a primary insulating layer 3 made of a polyurethane resin film is provided on a conductor 1, and the primary insulating layer 3 is provided.
A secondary insulating layer 4 made of a resin composition obtained by adding the metal compound to the urethane acrylate-based UV-curable resin is provided on the top. The primary insulating layer 3 is formed by applying a normal polyurethane insulating varnish on the conductor 1 and baking it, and has a thickness of about 10 to 200 μm. The secondary insulating layer 4 may be the same as the insulating layer 2 of the example shown in FIG. 1. In this case, since the primary insulating layer 3 is the underlying layer, its thickness can be reduced.

The insulated wire of this example is good together with the decomposition of the primary insulating layer 3 and the secondary insulating layer 4 during soldering, and exhibits excellent solderability. Further, since there are two insulating layers, the electrical characteristics are excellent, and the influence of the presence of the metal compound can be completely prevented.

Specific examples are shown below, but the present invention is not limited thereto. (Examples 1 to 3, Comparative Examples 1 and 2, Conventional Example) Urethane acrylate-based UV curable resin ("Kayarad EMR-0"
1 ”product name, manufactured by Nippon Kayaku Co., Ltd., viscosity 900 cps / 2
(5 ° C.) 100 parts by weight of zinc chloride, 0.5 parts by weight (Comparative Example 1) 1.0 parts by weight (Example 1) 5.0 parts by weight (Example 2) 10 parts by weight (Example 3) 20 Parts by weight (Comparative Example 2) 0 parts by weight (Conventional Example 1) were added, and the resin composition was added with a conductor diameter of 0.18 mm.
Was applied to the annealed copper wire and cured by irradiation with ultraviolet rays, and an insulating layer having a thickness of about 15 to 17 μm was provided to obtain an insulated wire.

With respect to these insulated wires, the flexibility due to the self diameter, the number of pinholes in the insulating layer, the thermal softening temperature of the insulating layer and the solderability at a temperature of 400 ° C. for 2 seconds were examined. The results are shown in Table 1.

(Examples 4 to 6) In Example 1, 5 parts by weight of zinc naphthenate was used in place of zinc chloride (Example 4),
5 parts by weight of dibutyltin laurate (Example 5) and 2
-An insulated wire was prepared in the same manner except that 5 parts by weight of lead ethylhexoate (Example 6) was added, and the same items were examined. The results are shown in Table 1.

[0016]

[Table 1]

As is clear from the results in Table 1, when the amount of the metal compound added is less than 1 part by weight, the solderability is not improved, and when it exceeds 10 parts by weight, the heat resistance of the insulating layer is lowered. Further, it is clear that the solderability is improved by using about 5 parts by weight of these metal compounds.

[0018]

As described above, according to the present invention, a normal polyurethane wire can be soldered without removing the insulating layer when soldering the insulated wire having the insulating layer formed of the urethane acrylate-based UV curable resin. It becomes possible to carry out the process at a temperature as low as the above and in a short time, and the solderability is greatly improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an insulated wire of the present invention.

FIG. 2 is a cross-sectional view showing another example of the insulated wire of the present invention.

[Explanation of symbols]

1 ... Conductor, 2 ... Insulating layer, 3 ... Primary insulating layer, 4 ... Secondary insulating layer

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical display location C08L 75/16 NGD C09D 175/16 PDZ H01B 3/30 B (72) Inventor Takehito Sawamoto Koto, Tokyo 1-5-1, Kiba, ward Fujikura stock company

Claims (2)

[Claims] 1. A tin octoate, dibutyltin di (2-ethylhexoate), lead 2-ethylhexoate, and 2-ethylhexoate iron based on 100 parts by weight of a urethane acrylate-based ultraviolet curable resin. , 2-ethylhexoate cobalt, zinc chloride, tin chloride, iron chloride, lead naphthenate, cobalt naphthenate, zinc naphthenate, dibutyltin laurate, and tetra-n-butyltin. A resin composition obtained by adding 1 to 10 parts by weight. 2. An insulated wire obtained by applying the resin composition according to claim 1 directly on a conductor or via a urethane resin film and curing the resin composition.