JPH08172262A - Laser soldering apparatus - Google Patents

Abstract

PURPOSE: To obtain a laser soldering apparatus by which the spot position of a laser beam radiated from a lens system is adjusted easily. CONSTITUTION: In a laser soldering apparatus, leads 5 for an electronic component 1 are soldered onto electrodes on a printed-circuit board 3 with solder supplied in advance in such a way that the leads are irradiated with a laser beam while the leads are being pressed one by one. The laser soldering apparatus is constituted of fibers 9 which introduce laser beams from ends on one side, of lens systems 10 which condense the laser beams radiated from ends, on the other side, of the fibers, of housings 11 which hold the lens systems, of couplers 12 for mounting of the fibers, which are installed at the housings and of slide fine-adjustment mechanisms 13 which can move the couplers relatively with the lens systems at the inside of planes in which image formation positions in the direction of every optical axis by the lens systems at the ends, on the other side, of the fibers are not changed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser soldering apparatus and, more particularly, to a single-point laser soldering method for irradiating a lead of a fine lead component one by one with a laser and soldering the lead to a substrate electrode.

[0002]

2. Description of the Related Art FIG. 2 is a side view of a conventional laser soldering apparatus (Japanese Patent Application No. Hei 5-039699). This conventional soldering apparatus includes a mounting head 2 that holds and moves up and down a lead component 1, a positioning stage 4 that holds and positions a substrate 3 with respect to the lead component 1, A bonding tool 7 for pressing the leads 5 of the lead component 1 mounted on the substrate 3 one by one against the electrodes 6 of the substrate 3 after mounting the lead component 1 on the substrate 3, and a plurality of laser heads 17 for irradiating the leads 5 with laser. A vertically movable slide table 15 to which a bonding tool 7 and a laser head 17 are fixed via a bracket portion 14;
It is composed of a laser oscillator 8, a fiber 9 for introducing a laser beam oscillated by the laser oscillator 8 into a laser head 17, and a control unit 16 for controlling the entire operation.

The bracket portion 14 is formed by fixing constituent members to each other with push screws or the like. The relative position of the laser spot irradiated with the laser from the laser head 17 on the lead 5 is adjusted by the bracket portion. This is done by adjusting the positional relationship of the 14 constituent members.

[0004]

In the conventional laser soldering apparatus, the laser spot position is adjusted by the bracket portion 1.
The adjustment work is complicated because the adjustment is performed by adjusting the positional relationship of the components connected by the push screw 4 or the like.

[0005]

SUMMARY OF THE INVENTION A laser soldering apparatus according to the present invention comprises a bonding tool for pressing leads of electronic components mounted on a substrate one by one against electrodes on the substrate to which solder has been supplied in advance, and a laser. A fiber for introducing light from a light source to one end, a lens system for condensing laser light emitted from the other end of the fiber and irradiating the lead on the lead, and an optical axis of the lens system for the other end of the fiber. And a slide fine adjustment mechanism that enables relative movement with respect to the lens system only in a vertical plane.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a side view showing a single-point laser soldering apparatus according to one embodiment of the present invention.

In this embodiment, a mounting head 2 that holds and moves up and down a lead component 1, a positioning stage 4 that holds and positions a substrate 3 with respect to the lead component 1, and a lead component mounted on the substrate 3 A bonding tool 7 for pressing one lead 5 one by one on an electrode 6 of the substrate 3, a laser oscillator 8, and a fiber 9 having one end connected to the laser oscillator 8.
A lens system 10 for condensing the laser light emitted from the other end of the fiber 9 and irradiating the lead 5 with a laser beam; a housing 11 for holding the lens system 10; And the coupler 12 can be moved relative to the lens system 10 such that the other end of the fiber 9 moves only in a plane perpendicular to the optical axis of the lens system 10. Slide fine adjustment mechanism 13 and bonding tool 7
The housing 11 includes a vertically movable slide table 15 fixed via a bracket 14, and a control unit 16 for controlling the entire operation.

The slide adjusting mechanism 13 includes a housing 11
And an X-direction member screwed in the X direction perpendicular to the optical axis of the lens system 10, and the other end of the fiber 9 fixed to the X direction member in the Y direction perpendicular to the optical axis and the X direction. Made of a Y-direction member.

The relative position between the portion of the lead 5 where the bonding tool 7 contacts and the laser spot irradiated by the lens system 10 is adjusted by the slide fine adjustment mechanism 13 by adjusting the relative position between the other end of the fiber 9 and the lens system 10. It is done by changing.

[0011]

As described above, in the laser soldering apparatus of the present invention, the relative position of the other end of the fiber that emits laser light and the lens system that collects laser light is adjusted by the slide fine adjustment mechanism. Accordingly, there is an effect that the spot position of the laser beam to be irradiated by the lens system can be easily adjusted.

[Brief description of drawings]

FIG. 1 is a side view of an embodiment of the present invention.

FIG. 2 is a side view of a conventional laser soldering apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead component 2 Mounting head 3 Substrate 4 Positioning stage 5 Lead 6 Electrode 7 Bonding tool 8 Laser oscillator 9 Fiber 10 Lens system 11 Housing 12 Coupler 13 Fine adjustment mechanism 14 Bracket part 15 Slide table 16 Control part

Claims (1)

[Claims] 1. A bonding tool for pressing leads of an electronic component mounted on a substrate one by one against electrodes on the substrate which are previously solder-supplied, a fiber for introducing laser light from one end to a light source, and this fiber. A lens system that collects laser light emitted from the other end of the fiber and irradiates it onto the lead; and the other end of the fiber relative to the lens system only in a plane perpendicular to the optical axis of the lens system. And a slide fine adjustment mechanism that enables movement.