JP2596394B2 - Laser soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser soldering apparatus and, more particularly, to a single-point laser soldering method for irradiating a lead of a fine lead component one by one with a laser and soldering the lead to a substrate electrode.

[0002]

2. Description of the Related Art FIG. 2 is a side view of a conventional laser soldering apparatus (Japanese Patent Application No. Hei 5-039699). This conventional soldering apparatus includes a mounting head 2 that holds and moves up and down a lead component 1, a positioning stage 4 that holds and positions a substrate 3 with respect to the lead component 1, A bonding tool 7 for pressing the leads 5 of the lead component 1 mounted on the substrate 3 one by one against the electrodes 6 of the substrate 3 after mounting the lead component 1 on the substrate 3, and a plurality of laser heads 17 for irradiating the leads 5 with laser. A vertically movable slide table 15 to which a bonding tool 7 and a laser head 17 are fixed via a bracket portion 14;
It is composed of a laser oscillator 8, a fiber 9 for introducing a laser beam oscillated by the laser oscillator 8 into a laser head 17, and a control unit 16 for controlling the entire operation.

[0003] The bracket portion 14 fixes the constituent members to each other with a push screw or the like. The relative position adjustment between the position on the lead 5 where the bonding tool 7 abuts and the laser spot irradiated by the laser from the laser head 17 is adjusted by the bracket portion. The adjustment is performed by adjusting the positional relationship of the fourteen component members.

[0004]

In the conventional laser soldering apparatus, the adjustment of the laser spot position is performed by the bracket 1.
The adjustment work is complicated because the adjustment is performed by adjusting the positional relationship of the components connected by the push screw 4 or the like.

[0005]

SUMMARY OF THE INVENTION A laser soldering apparatus according to the present invention comprises a bonding tool for pressing leads of electronic components mounted on a substrate one by one against electrodes on the substrate to which solder has been supplied in advance, and a laser. A fiber for introducing light from a light source to one end, a lens system for condensing laser light emitted from the other end of the fiber and irradiating the lead on the lead, and an optical axis of the lens system for the other end of the fiber. And a slide fine adjustment mechanism that enables relative movement with respect to the lens system only in a vertical plane.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a side view showing a single-point laser soldering apparatus according to one embodiment of the present invention.

In this embodiment, a mounting head 2 that holds and moves up and down a lead component 1, a positioning stage 4 that holds and positions a substrate 3 with respect to the lead component 1, and a lead component mounted on the substrate 3 A bonding tool 7 for pressing one lead 5 one by one on an electrode 6 of the substrate 3, a laser oscillator 8, and a fiber 9 having one end connected to the laser oscillator 8.
A lens system 10 for condensing the laser light emitted from the other end of the fiber 9 and irradiating the lead 5 with a laser beam; a housing 11 for holding the lens system 10; And the coupler 12 can be moved relative to the lens system 10 such that the other end of the fiber 9 moves only in a plane perpendicular to the optical axis of the lens system 10. Slide fine adjustment mechanism 13 and bonding tool 7
The housing 11 includes a vertically movable slide table 15 fixed via a bracket 14, and a control unit 16 for controlling the entire operation.

The slide adjusting mechanism 13 includes a housing 11
And an X-direction member screwed in the X direction perpendicular to the optical axis of the lens system 10, and the other end of the fiber 9 fixed to the X direction member in the Y direction perpendicular to the optical axis and the X direction. Made of a Y-direction member.

The relative position between the portion of the lead 5 where the bonding tool 7 contacts and the laser spot irradiated by the lens system 10 is adjusted by the slide fine adjustment mechanism 13 by adjusting the relative position between the other end of the fiber 9 and the lens system 10. It is done by changing.

[0011]

As described above, in the laser soldering apparatus of the present invention, the relative position of the other end of the fiber that emits laser light and the lens system that collects laser light is adjusted by the slide fine adjustment mechanism. Accordingly, there is an effect that the spot position of the laser beam to be irradiated by the lens system can be easily adjusted.

[Brief description of the drawings]

FIG. 1 is a side view of one embodiment of the present invention.

FIG. 2 is a side view of a conventional laser soldering apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead component 2 Mounting head 3 Substrate 4 Positioning stage 5 Lead 6 Electrode 7 Bonding tool 8 Laser oscillator 9 Fiber 10 Lens system 11 Housing 12 Coupler 13 Fine adjustment mechanism 14 Bracket part 15 Slide table 16 Control part

Claims (1)

(57) [Claims] 1. A bonding tool for pressing leads of an electronic component mounted on a substrate one by one against electrodes on the substrate supplied in advance by soldering, a fiber for introducing a laser beam from a light source to one end, and the fiber A lens system that focuses laser light emitted from the other end of the lens system and irradiates the lead on the lead, and sets the other end of the fiber relative to the lens system only in a plane perpendicular to the optical axis of the lens system. A laser soldering apparatus including a slide fine adjustment mechanism for enabling movement.