JPH0817137B2 - Laminated porcelain capacitors - Google Patents
Laminated porcelain capacitorsInfo
- Publication number
- JPH0817137B2 JPH0817137B2 JP30359888A JP30359888A JPH0817137B2 JP H0817137 B2 JPH0817137 B2 JP H0817137B2 JP 30359888 A JP30359888 A JP 30359888A JP 30359888 A JP30359888 A JP 30359888A JP H0817137 B2 JPH0817137 B2 JP H0817137B2
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- Japan
- Prior art keywords
- electrode
- layer
- external
- baked
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、積層磁器コンデンサに関するものである。The present invention relates to a laminated ceramic capacitor.
（従来の技術） 積層磁器コンデンサは、内部電極としての電極材料を
印刷したセラミツクグリーンシートを、順次積層し焼成
してなるものであり、上記電極材料としては、従来、P
d、Pt、Ag−Pd等の貴金属が用いられていた。しかしな
がら、これら従来の積層磁器コンデンサでは、内部電極
の層数が増えるにつれて、コンデンサの体積に対して内
部電極の占める割合が増加し、コンデンサのコストにも
大きく影響するようになってきた。(Prior Art) A laminated ceramic capacitor is formed by sequentially laminating ceramic green sheets printed with an electrode material as internal electrodes and firing the same.
Noble metals such as d, Pt and Ag-Pd were used. However, in these conventional laminated porcelain capacitors, as the number of layers of the internal electrodes increases, the ratio of the internal electrodes to the volume of the capacitor increases, and the cost of the capacitor is greatly affected.
このような理由から、最近では、内部電極として安価
な卑金属を用いた積層磁器コンデンサが種々検討されて
おり、例えば、内部電極としてNi、Fe、Co等の卑金属材
料を用い、また、外部電極としてはAg、Ag−Pd等の貴金
属粉末にガラスフリットを加えたペーストを塗布し、焼
き付けるものや、Ni、Co、Cu等の金属粉末にガラスフリ
ットを加えたペーストを焼き付けるものなどが提案され
ている。For these reasons, recently, various laminated ceramic capacitors using an inexpensive base metal as an internal electrode have been studied, and for example, a base metal material such as Ni, Fe, or Co is used as an internal electrode, and an external electrode is used. Has been proposed such as Ag, Ag-Pd or the like, which is applied with a paste containing glass frit added to a noble metal powder and baked, or Ni, Co, or Cu, which is added with a glass frit and added with glass frit. .
また、これらの積層磁器コンデンサを回路基板等に実
装する際の半田付け性を向上させる目的から、上記焼き
付け電極の表面に更にNiメッキあるいは半田メッキを施
すことも検討されている。Further, for the purpose of improving solderability when mounting these laminated ceramic capacitors on a circuit board or the like, it has been considered to further apply Ni plating or solder plating to the surface of the above-mentioned baked electrode.
（発明が解決しようとする課題） しかしながら、外部電極として、上記前者のように、
Ag、Ag−Pd等の電極材料をペーストを焼き付けた場合、
内部電極とのなじみが悪いために、内部電極と外部電極
との接続部分に接続不良が生じ、静電容量と低下や、誘
電損失の増大が起こり易かった。(Problems to be Solved by the Invention) However, as the external electrode, as in the former case,
When the paste is baked with an electrode material such as Ag or Ag-Pd,
Due to poor compatibility with the internal electrode, a connection failure occurred at the connection portion between the internal electrode and the external electrode, and the capacitance was lowered, and the dielectric loss was easily increased.
また、外部電極の電極材料として、後者のように、N
i、Co、Cu等を選択した場合は、大器中で焼き付ける
と、外部電極に接触する部分の内部電極が酸化されて、
接続不良を生じたり、あるいは高抵抗化し、静電容量の
低下や、誘電損失の増大が生じてしまう。In addition, as the electrode material of the external electrode, like the latter, N
When i, Co, Cu, etc. are selected, baking in a large device oxidizes the internal electrodes that are in contact with the external electrodes,
Connection failure may occur, or resistance may increase, resulting in a decrease in capacitance and an increase in dielectric loss.
このため、外部電極の電極材料として、Ni、Co、Cu等
を選択した場合は、N2、Ar等の中性ガス雰囲気中、ある
いは、N2に少量のH2を混合した還元性ガス雰囲気中で焼
き付けなればならなかったが、このように、中性あるい
は還元性ガス中で焼き付けを行なう場合、電極材料ペー
スト中に含まれるビヒクル類の分解が充分行なわれず、
残留した有機物のために、電極層の緻密化が妨げられ、
電極層の引張り強度が低下するという問題が発生してい
た。Therefore, as an electrode material for the external electrodes, Ni, Co, if you choose the Cu or the like, in a neutral gas atmosphere such as N 2, Ar, or a reducing gas atmosphere mixed with small amounts of H 2 to N 2 However, when baking is performed in a neutral or reducing gas, the vehicles contained in the electrode material paste are not sufficiently decomposed,
The remaining organic matter hinders the densification of the electrode layer,
There has been a problem that the tensile strength of the electrode layer is lowered.
そこで、従来は、電極層の焼き付けを行なう前に、予
め電極材料中に含まれるビヒクル類を除去するための脱
脂工程を設けなければならず、作業工程の複雑化が避け
られなかった。Therefore, conventionally, a degreasing step for removing the vehicles contained in the electrode material must be provided in advance before baking the electrode layer, and the work steps cannot be complicated.
そこで、本発明の目的は、上記従来コンデンサの問題
点を解決して、接続不良による電器的物性の低下を生ず
ることなく、また、外部電極の焼き付けを大気中におい
て容易に行なうことのできる積層磁器コンデンサを提供
することにある。Therefore, an object of the present invention is to solve the above-mentioned problems of the conventional capacitor, to prevent deterioration of electrical properties due to poor connection, and to easily burn external electrodes in the atmosphere in a laminated porcelain. To provide capacitors.
（課題を解決するための手段） 本願の第１の発明による積層磁器コンデンサは、内部
電極が卑金属からなり、外部電極として、AgとAlとガラ
スフリットとを含む焼き付け電極層を備えていることを
特徴とするものである。(Means for Solving the Problem) In the laminated ceramic capacitor according to the first invention of the present application, the internal electrode is made of a base metal, and the external electrode is provided with a baking electrode layer containing Ag, Al and glass frit. It is a feature.
上記積層磁器コンデンサは、上記焼き付け電極層上
に、Ni、Cu、Snおよび半田のうちの少なくとも１種で形
成されたメッキ層を更に備えていることが望ましい。It is preferable that the laminated ceramic capacitor further includes a plating layer formed on at least one of Ni, Cu, Sn and solder on the baked electrode layer.
本願の第２の発明による積層磁器コンデンサは、内部
電極が卑金属からなり、外部電極として、AgとAlと、N
i、Fe、Co、Crのうちから選ばれる少なくとも１種と、
ガラスフリットとを含む焼き付け電極層を備えているこ
とを特徴とするものである。In the laminated ceramic capacitor according to the second invention of the present application, the internal electrodes are made of base metal, and Ag, Al, and N are used as external electrodes.
at least one selected from i, Fe, Co, and Cr,
It is characterized by being provided with a baking electrode layer containing a glass frit.
この積層磁器コンデンサは、更に、上記焼き付け電極
層上に、Ni、Cu、Snおよび半田のうちの少なくとも１種
で形成されたメッキ層を備えていることが望ましい。It is preferable that the laminated ceramic capacitor further includes a plating layer formed of at least one of Ni, Cu, Sn and solder on the baked electrode layer.
（作 用） 本願の第１の発明による積層磁器コンデンサにおいて
は、上記したように、内部電極が卑金属からなり、外部
電極として、AgとAlとガラスフリットとを含む焼き付け
電極層を備えているので、焼き付け電極層に含まれるAl
と、内部電極の卑金属との濡れ性が良いために、内部電
極と外部電極との接続部分が良好に接続され、かつ、そ
の際、焼き付け電極中に含まれるAgの働きにより、大気
中焼き付け時の内部電極と外部電極との接続部分の酸
化、および外部電極中に含まれる上記Alの酸化が防止で
きる。(Operation) In the laminated porcelain capacitor according to the first invention of the present application, as described above, the internal electrodes are made of base metal, and the external electrodes are provided with the baking electrode layer containing Ag, Al and glass frit. , Al contained in the baking electrode layer
Since the internal electrode has good wettability with the base metal, the connection part between the internal electrode and the external electrode is well connected, and at that time, due to the action of Ag contained in the baking electrode, when baking in the atmosphere. It is possible to prevent the oxidation of the connecting portion between the internal electrode and the external electrode and the oxidation of the Al contained in the external electrode.
本願の第２の発明による積層磁器コンデンサにおいて
は、上記したように、内部電極が卑金属からなり、外部
電極として、AgとAlと、Ni、Fe、Co、Crのうちから選ば
れる少なくとも１種と、ガラスフリットとを含む焼き付
け電極層を備いているので、焼き付け電極層に含まれる
AlおよびNi、Fe、Co、Crと、内部電極の卑金属との濡れ
性が良いために、内部電極と外部電極との接続部分が良
好に接続され、かつ、その際、焼き付け電極中に含まれ
るAgの働きにより、大気中焼き付け時の内部電極と外部
電極との接続部分の酸化、および外部電極中に含まれる
上記AlおよびNi、Fe、Co、Crの酸化が防止できる。ま
た、上記２つの発明の積層磁器コンデンサの焼き付け電
極層の表面に、Ni、Cu、Snおよび半田のうちの少なくと
も１種で形成されたメッキ層を施せば、実装時の半田濡
れ性および耐半田性を向上させることができる。In the laminated ceramic capacitor according to the second invention of the present application, as described above, the internal electrodes are made of a base metal, and the external electrodes are at least one selected from Ag and Al, and Ni, Fe, Co, and Cr. Since it is equipped with a baking electrode layer containing a glass frit, it is included in the baking electrode layer.
Since Al and Ni, Fe, Co, Cr have good wettability with the base metal of the internal electrode, the connection portion between the internal electrode and the external electrode is well connected, and at that time, contained in the baking electrode. The function of Ag can prevent the oxidation of the connecting portion between the internal electrode and the external electrode during baking in the atmosphere and the oxidation of Al, Ni, Fe, Co and Cr contained in the external electrode. Further, if a plating layer formed of at least one of Ni, Cu, Sn and solder is applied to the surface of the baked electrode layers of the above-mentioned two inventions of the laminated ceramic capacitor, solder wettability and solder resistance at the time of mounting can be obtained. It is possible to improve the sex.
（実施例） 以下、添付図面を参照しつつ本発明の実施例による積
層磁器コンデンサについて説明する。(Example) Hereinafter, a laminated ceramic capacitor according to an example of the present invention will be described with reference to the accompanying drawings.
図面は、本発明の実施例による積層磁器コンデンサの
断面図である。The drawings are sectional views of multilayer ceramic capacitors according to embodiments of the present invention.
積層磁器コンデンサの構造 この積層磁器コンデンサは、卑金属であるNiで内部電
極１が形成された誘電体２を複数枚積層して形成された
コンデンサチップ本体３と、このコンデンサチップ本体
３の側面に形成された外部電極４とを備えている。Structure of Multilayer Ceramic Capacitor This multilayer ceramic capacitor has a capacitor chip body 3 formed by laminating a plurality of dielectrics 2 each having an internal electrode 1 formed of Ni, which is a base metal, and a side surface of the capacitor chip body 3. The external electrode 4 is provided.
上記外部電極４は、金属とガラス成分からなるペース
トの焼結体で形成された第１層５と、メッキ層である第
２層６および第３層７からなっている。The external electrode 4 is composed of a first layer 5 formed of a sintered body of a paste containing a metal and a glass component, and a second layer 6 and a third layer 7 which are plating layers.
上記第１層５は、内部電極１と接続しやすく、大気焼
き付けが可能な金属成分と、この金属成分と濡れ性の良
いガラス成分とから構成される。具体的に、上記金属成
分としては、主成分としてAg、Alを少なくとも含み、更
にNi、Fe、Co、Cr等の卑金属を組み合せたものが望まし
い。また、上記ガラス成分は、大気焼き付け性を考慮し
て設定されるが、ホウケイ酸亜鉛系、鉛系、バリウム系
等、多種の中から、用途に応じて幅広く選択することが
できる。The first layer 5 is composed of a metal component that can be easily connected to the internal electrode 1 and that can be baked in the atmosphere, and a glass component having good wettability with this metal component. Specifically, it is desirable that the above-mentioned metal component contains at least Ag and Al as main components and that a base metal such as Ni, Fe, Co and Cr is further combined. Further, the above glass component is set in consideration of the atmospheric baking property, but can be widely selected from various types such as zinc borosilicate type, lead type, barium type, etc. according to the application.
上記第２層６および第３層７は、上記第１層５の大気
焼き付けの際に、金属成分が酸化されて、劣化する半田
に対する濡れ性を改善し、またはこの濡れ性および耐半
田性を向上させるためのものである。したがって、第２
層６は、NiまたはCuを材料として、一方、第３層７は、
Snまたは半田を材料として、無電解および電解メッキ法
を使用して形成される。The second layer 6 and the third layer 7 improve wettability with respect to solder that deteriorates due to oxidation of a metal component when the first layer 5 is baked in the atmosphere, or this wettability and solder resistance are improved. It is to improve. Therefore, the second
The layer 6 is made of Ni or Cu, while the third layer 7 is
It is formed by using electroless and electrolytic plating methods using Sn or solder as a material.
積層磁器コンデンサの製造方法 先ず、上記コンデンサチップ本体３は、卑金属である
Niで内部電極１が形成された誘電体２を複数枚積層し、
これを焼成することによって形成される。Manufacturing Method of Multilayer Porcelain Capacitor First, the capacitor chip body 3 is a base metal.
Laminating a plurality of dielectrics 2 with the internal electrodes 1 formed of Ni,
It is formed by firing this.
次に、外部電極４について説明すると、この外部電極
４の形成は、先ず第１層５を形成するための上記ペース
トの調整から行なわれる。このペーストの調整は、Ag粉
末と、Al粉末と、ガラス粉末とを、10〜89:10〜70:1〜2
0の割合で秤量した後、有機バインダー溶液を全重量に
対して20〜30％の割合で添加し、これを３本ロールミル
で混合して行なわれる。このペーストを調整する際に
は、Ni、Fe、Co、Crのうちから選ばれる少なくとも１種
の粉末を前記Al粉末との合計量が前記Al粉末の配合割合
の範囲内で混合してもよい。Next, the external electrode 4 will be described. The external electrode 4 is formed by first adjusting the paste for forming the first layer 5. This paste is prepared by mixing Ag powder, Al powder, and glass powder with 10 to 89:10 to 70: 1 to 2
After weighing at a ratio of 0, the organic binder solution is added at a ratio of 20 to 30% with respect to the total weight, and this is mixed by a three-roll mill. When preparing this paste, at least one kind of powder selected from Ni, Fe, Co, and Cr may be mixed in such a manner that the total amount with the Al powder is within the range of the mixing ratio of the Al powder. .
上記ペーストを、焼成済みの上記コンデンサチップ本
体３の側面に、図面に示したようにして塗布し、乾燥し
た後、大気中で600〜850℃で焼き付けを行なって、外部
電極４の上記第１層５を形成する。The paste is applied to the side surface of the fired capacitor chip body 3 as shown in the drawing, dried, and then baked at 600 to 850 ° C. in the atmosphere to remove the first electrode of the external electrode 4. Form layer 5.
上記第２層６および第３層７は、無電解および電解メ
ッキ等をバレルメッキで行なって、上記第１層５上に形
成される。The second layer 6 and the third layer 7 are formed on the first layer 5 by performing electroless plating and electrolytic plating by barrel plating.
発明の効果を確認するための試料の作製 この試料とする内部電極にNiを用いた積層磁器コンデ
ンサとしては、例えば、特公昭60−20850号、特公昭60
−20851号、特公昭61−14607号、特公昭61−14608号、
特公昭61−14609号、特公昭61−14610号、特公昭61−14
611号、特公昭62−24388号、特開昭62−131412号、特開
昭62−131413号、特開昭62−131414号、特開昭62−1314
15号、特開昭62−157604号、特開昭62−157605号、特開
昭62−157606号、および特開昭62−157607号公報等に記
載されている誘電体磁器組成物を用いたものを使用する
事ができる。Preparation of Sample for Confirming Effect of Invention As a laminated ceramic capacitor using Ni for the internal electrode used as this sample, for example, JP-B-60-20850 and JP-B-60
-20851, JP 61-14607, JP 61-14608,
Japanese Patent Publication No. 61-14609, Japanese Publication No. 61-14610, Japanese Publication No. 61-14
611, Japanese Patent Publication No. 62-24388, Japanese Patent Laid-Open No. 62-131412, Japanese Patent Laid-Open No. 62-131413, Japanese Patent Laid-Open No. 62-131414, Japanese Patent Laid-Open No. 62-1314.
No. 15, JP-A-62-157604, JP-A-62-157605, JP-A-62-157606, JP-A-62-157607, etc. were used. You can use things.
誘電体材料としては、特公昭60−20851号公報に開示
されているように、組成式（Ba0.90 Ca0.06 Sr0.04）
（Ti0.82 Zr0.18）O3からなる主成分に対して、Li2O−B
aO−CaO−SrO−SiO2からなるガラス成分を1.0重量％添
加したものを用意した。誘電体材料と有機バインダ、分
散剤、消泡剤の混合水溶液から原料スラリを作製し、ド
クターブレード法により厚さ40μｍのセラミックグリー
ンシートを得た。このセラミックグリーンシート上に、
内部電極となるNiペーストを印刷した後、内部電極が互
いに対向するように、40枚のセラミックグリーンシート
を積層し、熱圧着した後、還元雰囲気中、1,150℃で焼
成し、外形寸法、3.15mm×2.45mm×1.15mmの評価用試料
チップを作製した。As the dielectric material, as disclosed in Japanese Patent Publication No. 60-20851, the composition formula (Ba 0.90 Ca 0.06 Sr 0.04 ) is used.
For the main component consisting of (Ti 0.82 Zr 0.18 ) O 3 , Li 2 O-B
a glass component consisting of aO-CaO-SrO-SiO 2 was prepared which was added 1.0% by weight. A raw material slurry was prepared from a mixed aqueous solution of a dielectric material, an organic binder, a dispersant, and a defoaming agent, and a 40 μm thick ceramic green sheet was obtained by a doctor blade method. On this ceramic green sheet,
After printing the Ni paste to be the internal electrodes, 40 ceramic green sheets were laminated so that the internal electrodes faced each other, thermocompression bonded, then fired at 1,150 ° C in a reducing atmosphere, external dimensions, 3.15mm A sample chip for evaluation of 2.45 mm × 1.15 mm was prepared.
上記のようにして作製された評価用試料チップの側面
に、以下に説明するようにして、外部電極４を形成し
て、本発明の実施例によるサンプル１〜38を作製した。External electrodes 4 were formed on the side surface of the evaluation sample chip manufactured as described above, and Samples 1 to 38 according to the examples of the present invention were manufactured.
外部電極の第１層を形成するにあたって、先ず第１表
に示す組成比の粉末材料を用意し、これらを混合した
後、有機バインダ溶液を粉末に対して、15〜35重量パー
セントの割合で添加し、３本ロールミルで混合して、外
部電極の第１層用のペーストを作成した。粘度の調整
は、有機溶剤で行なう。このペーストを側面に塗布した
評価用試料チップを大気中で、600〜850℃で60分程度焼
き付け、外部電極の第１層を形成した。この第１層の焼
成後の膜厚は、平面部で60〜80μｍ、角部で10〜30μｍ
であった。When forming the first layer of the external electrode, first prepare powder materials having the composition ratios shown in Table 1, mix these, and then add the organic binder solution at a ratio of 15 to 35 weight% to the powder. Then, they were mixed with a three-roll mill to prepare a paste for the first layer of the external electrode. The viscosity is adjusted with an organic solvent. A sample chip for evaluation in which this paste was applied to the side surface was baked at 600 to 850 ° C. for about 60 minutes in the atmosphere to form the first layer of the external electrode. The thickness of the first layer after firing is 60 to 80 μm in the flat portion and 10 to 30 μm in the corner portion.
Met.
この第１層の上に、第２層として、NiおよびCuから選
ばれる無電解ないしは電解メッキ層を設け、更に、その
上に第３層として、電解錫または電解半田（Sn−Pb）メ
ッキ層を形成し、サンプルを作製した。An electroless or electrolytic plating layer selected from Ni and Cu is provided as a second layer on the first layer, and an electrolytic tin or electrolytic solder (Sn-Pb) plating layer is further provided as a third layer thereon. Was formed to prepare a sample.
また、第１表に示したように、ペーストの組成を本発
明のものとは変えて、本発明のサンプルの方法とはほぼ
同一の作製方法で比較例１〜８を作製した。Further, as shown in Table 1, Comparative Examples 1 to 8 were manufactured by changing the composition of the paste from that of the present invention and by a manufacturing method almost the same as the method of the sample of the present invention.
試料の測定 以上のようにして得られたサンプルおよび比較例のチ
ップコンデンサを、室温で、周波数1KHz、入力電圧1V
で、静電容量、誘電損失を測定した。また、直流電圧10
0Vを20秒間印加し、絶縁抵抗値を測定した。更に、半田
耐熱性の評価は、試料を300℃および330℃の半田溶液中
に、３秒間浸漬し、電器特性および外観を調べた。更に
また、外部電極の固着力評価試験として、試料を銅配線
ガラスエポキシ基板に半田付けし、裏から該試料を押
し、破壊時の強度を調べた。結果を第１表に示した。 Sample measurement The sample capacitors and the comparative example chip capacitors obtained as described above were operated at room temperature with a frequency of 1 KHz and an input voltage of 1 V.
Then, the capacitance and the dielectric loss were measured. Also, the DC voltage 10
0 V was applied for 20 seconds and the insulation resistance value was measured. Further, the solder heat resistance was evaluated by immersing the sample in a solder solution at 300 ° C. and 330 ° C. for 3 seconds and examining the electrical characteristics and appearance. Furthermore, as a test for evaluating the adhesive strength of the external electrodes, the sample was soldered to a copper wiring glass epoxy substrate, the sample was pressed from the back, and the strength at break was examined. The results are shown in Table 1.
この第１表から分かるように、本実施例のサンプル
は、静電容量、誘電損失、絶縁抵抗値、半田耐熱性、強
度の全ての点で満足のゆくものであった。As can be seen from Table 1, the sample of this example was satisfactory in all points of capacitance, dielectric loss, insulation resistance, solder heat resistance, and strength.
これに対して、比較例のものは、例えば静電容量が極
めて低かったり、強度の点で満足がゆかないものであっ
た。なお、比較例においては、静電容量の点で満足のゆ
かないものについては、他の試験は行なわなかった。On the other hand, in the comparative example, for example, the electrostatic capacity was extremely low, or the strength was not satisfactory. In the comparative examples, the other tests were not conducted for those which were not satisfactory in terms of capacitance.
（発明の効果） 以上説明したように、本発明によれば、積層磁器コン
デンサの外部電極の焼き付けを大気中で容易に行なえる
ばかりでなく、製品としての積層磁器コンデンサも静電
容量等の電器的特性が良好なものであるととともに、接
続強度の点でも満足のゆくものである。(Effects of the Invention) As described above, according to the present invention, not only the external electrodes of a laminated ceramic capacitor can be easily baked in the atmosphere, but also the laminated ceramic capacitor as a product is an electric device such as an electrostatic capacitor. In addition to having good performance characteristics, it is also satisfactory in terms of connection strength.
図は、本発明の実施例による積層磁器コンデンサの断面
図である。 １……内部電極 ２……誘電体 ４……外部電極 ５……第１層 ６……第２層 ７……第３層FIG. 1 is a sectional view of a laminated ceramic capacitor according to an embodiment of the present invention. 1 ... Internal electrode 2 ... Dielectric 4 ... External electrode 5 ... First layer 6 ... Second layer 7 ... Third layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中村 俊哉 東京都台東区上野６丁目16番20号 太陽誘 電株式会社内 (72)発明者 岸 弘志 東京都台東区上野６丁目16番20号 太陽誘 電株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshiya Nakamura 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Electric Co., Ltd. (72) Inventor Hiroshi Kishi 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction Company
Claims (3)
て、AgとAlとガラスフリットとを含む焼き付け電極層を
備えていることを特徴とする積層磁器コンデンサ。1. A laminated ceramic capacitor, wherein the internal electrode is made of a base metal, and a baked electrode layer containing Ag, Al and glass frit is provided as an external electrode.
て、AgとAlと、Ni、Fe、Co、Crのうちから選ばれる少な
くとも１種と、ガラスフリットとを含む焼き付け電極層
を備えていることを特徴とする積層磁器コンデンサ。2. The internal electrode is made of a base metal, and the external electrode is provided with a baked electrode layer containing Ag, Al, at least one selected from Ni, Fe, Co and Cr, and a glass frit. A laminated porcelain capacitor characterized by the above.
よび半田のうちの少なくとも１種で形成されたメッキ層
を備えていることを特徴とする請求項第１項又は第２項
記載の積層磁器コンデンサ。3. The baked electrode layer is further provided with a plating layer formed of at least one of Ni, Cu, Sn and solder. The laminated porcelain capacitor described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30359888A JPH0817137B2 (en) | 1988-11-30 | 1988-11-30 | Laminated porcelain capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30359888A JPH0817137B2 (en) | 1988-11-30 | 1988-11-30 | Laminated porcelain capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02150008A JPH02150008A (en) | 1990-06-08 |
| JPH0817137B2 true JPH0817137B2 (en) | 1996-02-21 |
Family
ID=17922927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30359888A Expired - Lifetime JPH0817137B2 (en) | 1988-11-30 | 1988-11-30 | Laminated porcelain capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0817137B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8009012B2 (en) | 2007-07-24 | 2011-08-30 | Tdk Corporation | Stacked electronic part and method of manufacturing the same |
-
1988
- 1988-11-30 JP JP30359888A patent/JPH0817137B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8009012B2 (en) | 2007-07-24 | 2011-08-30 | Tdk Corporation | Stacked electronic part and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02150008A (en) | 1990-06-08 |
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