JPH08166340A - Apparatus for testing separation of wiring of substrate - Google Patents

Abstract

PURPOSE: To semiautomatically and speedily inspect by a simple tester without occupying space, by moving an adhesive tape supplied onto an IC substrate in a lateral direction while pressing the tape by means of a press roller, attaching the tape onto the substrate and then moving upward thereby to separate the tape. CONSTITUTION: An IC substrate is inserted from a lower part of a press plate 4 at an upper surface 3a of a main body of the tester. At a metal fitting 11 having a pressing means built therein and moved right and left by a guide rail 12 and a moving means 13, a press roller 21 is pressed by the pressing means, so that an adhesive tape 28 is bonded to the surface of the IC substrate. A tape-attaching metal fitting 9 is set to a substrate metal fitting 10 to be movable up and down. When the press roller 21 is finished to move, the metal fitting 9 is raised by the action of a limit switch and also the adhesive tape fixedly held by the press roller 21 and pressing means is moved upward eventually to be separated from the surface of the IC substrate. The adhesive tape 28 of a wound tape 15 wound around the metal fitting 9 is taken out via rollers 19, 20, 22, 23, 24 and rolled up around a tape wind reel 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board wiring peeling tester for inspecting whether printed wiring or plated wiring provided on an IC substrate is good.

[0002]

2. Description of the Related Art Conventionally, an adhesive tape is manually stretched on an IC substrate wiring, and the tape stretched manually is peeled again.
The peeling state of the C-substrate wiring was visually inspected. For this reason, some inspectors apply stronger adhesive tapes or weaker adhesive tapes, and there are variations due to individual differences, and the inspection efficiency is poor, and improvement thereof has been desired.

[0003]

SUMMARY OF THE INVENTION The present invention eliminates the above-mentioned problem, that is, the variation due to individual differences, and keeps IC at a constant pressure.
A tape can be put on the board wiring and the adhesive tape can be peeled off with a certain force. In addition, in order to dramatically improve the inspection efficiency and reduce the inspection cost, it is necessary to automate the board wiring peeling tester. is necessary. Further, it is also necessary to be able to easily inspect various contour shapes with one testing machine.

The present invention has been invented in view of the above circumstances, and it is possible to perform a semi-automatic and speedy inspection with a simple tester that does not take up a lot of space, and eliminates variations due to individual differences. An object of the present invention is to provide a substrate wiring peeling tester capable of reducing inspection cost.

[0005]

SUMMARY OF THE INVENTION The present invention is characterized by having the following configuration in order to achieve the above object. That is, the IC substrate peeling tester of the present invention comprises an IC
An IC board backing plate for regulating the insertion position of the board, a pressing plate for pressing the IC board, a tape mounting bracket for supplying an adhesive tape on the IC board and capable of moving left and right and up and down;
A pressure roller capable of adhering the adhesive tape on the IC substrate and moving it up and down by moving the adhesive tape supplied on the substrate in the lateral direction while pressing the adhesive tape.
When the tape mounting bracket moves upward, I
And a tape winding reel capable of winding the adhesive tape separated from the C substrate. A second aspect of the present invention is that the IC board backing plate is movable back and forth by a handle, and that the pressing plate is provided with a moving means for moving the IC board backing plate backward after pressing the IC board. Features. A third aspect of the present invention is that a tape mounting bracket is mounted on a base bracket movable left and right by a guide rail and a moving means so as to be vertically movable through a vertical guide rail and a moving means. When the tape mounting bracket moves upward, the adhesive tape is sandwiched and fixed between the roller and the roller by the pressing means provided on the tape mounting bracket. It is characterized in that the adhesive tape adhered on the IC substrate is peeled off. Also,
A fourth aspect of the present invention is that a pressure roller has a metal fitting with built-in pressure means that can be moved left and right by a guide rail and a moving means.
It is characterized in that it is mounted so that it can move up and down. A fifth feature of the present invention is that the tape winding reel has a one-way clutch.

[0006]

In the present invention, after the inspector inserts the IC board into a predetermined position of the IC board wiring peeling tester of the present invention, the IC board wiring peeling tester of the present invention automatically operates, and Since the adhesive tape is adhered to the printed wiring or the plated wiring on the substrate and peeled off, the inspector need only take out the IC substrate and visually inspect the peeled state of the IC substrate wiring. The operation is started when the inspector steps on the pedal switch on the floor in front of the IC substrate wiring peel tester. When the operation is started, first, (1) the substrate abutment is advanced to a predetermined position by the moving means. Therefore,
(2) The inspector places the IC board on the upper surface of the main body with the surface wired on the IC board facing up, and inserts the IC board until it comes into contact with the IC board backing plate. (3) An optical sensor is provided below the IC board contact plate, and when it is confirmed that the IC board contacts the IC board contact plate, (4) the pressure plate is in the frame pressure means built-in part. The IC substrate is pressed down by the pressing means.
When pressed, the limit switch (not shown) operates,
(5) The IC substrate backing plate is retracted to a predetermined position by the moving means. When retracted, a limit switch (not shown) is activated, and (6) the tape mounting metal fitting that has moved to the left end and waited moves to the right end, and the adhesive tape is installed directly above the upper surface of the IC substrate. When the facility is installed, a limit switch (not shown) is operated, and (7) the pressure roller is moved to the left end by the pressure means of the metal means with built-in pressure means, which has been on standby, and the pressure roller is pressed at a predetermined pressure by the adhesive tape.
The pressing roller is pressed onto the IC substrate, and the pressure roller is also moved while pressing on the adhesive tape as the metal fitting for the pressing means is moved to the right end by the guide rail and the moving means. The adhesive tape is adhered to the IC substrate surface. When the metal fitting with built-in pressurizing means reaches the right end, a limit switch (not shown) is activated. (8) As the metal fitting with built-in pressurizing means is moved to the left end by the moving means, the pressurizing roller is moved. -Also moves while pressing the adhesive tape again. When the metal fitting with built-in pressurizing means reaches the left end, a limit switch (not shown) is operated to move the pressurizing roller upward and return to the initial position. When it returns to the initial position, the limit switch (not shown) operates, and (9) the pressing means at the lower end of the tape mounting bracket operates, sandwiching and fixing the adhesive tape with the roller. To do. When fixed, a limit switch (not shown) is actuated, a moving means provided on the base metal fitting is operated, and the tape mounting bracket is pulled upward. When the tape mounting bracket is pulled upward, the adhesive tape sandwiched and fixed by the roller and the pressing means is also pulled upward and peeled off the IC substrate surface. In order to peel the adhesive tape from the IC substrate surface, the above-mentioned moving means alone may be used. However, the adhesive force of the adhesive tape is quite strong, and the peeling time can be reduced by assisting with a spring as shown in the figure. . When the tape mounting bracket is pulled up to the upper end, a limit switch (not shown) is actuated, and (10) the tape winding reel is started to wind off the peeled adhesive tape, and at the same time, the tape is wound. -The mounting bracket starts to move to the left end, and at the same time is pulled down against the spring by the moving means provided on the base mounting, and returns to its original position. When it returns to the initial position, the limit switch (not shown) is activated, the tape winding reel is stopped, and the pressing means at the lower end of the tape mounting bracket is activated to clamp the adhesive tape. Remove the inclusion. When the sandwiching pressurizing means returns to the original position, the limit switch (not shown) is operated, and (11) IC
The pressing plate that has pressed the substrate is pulled up by the pressing unit until it comes into contact with the end of the built-in pressing unit. When pulled up, a limit switch (not shown) is actuated, and (12) the IC board backing plate is pushed forward to a predetermined position by the moving means and stopped. (13) The inspector takes out the IC substrate and judges the quality by visual inspection. One cycle is completed in the above order. To inspect the next IC board, depress the pedal switch again and insert the IC board, but after the second time the IC board backing plate is pushed forward to the predetermined position. (2) of the above process
And the above operation is automatically repeated by the substrate wiring peeling tester.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing an overall schematic structure of the present embodiment, and FIG. 2 is a front view of the embodiment of FIG. 1 from which a pressure plate, a frame, a column for supporting the frame and a bolt or a thumbscrew are removed. FIG. 3 is a state diagram showing a state in which the tape fitting is moved upward in FIG. 2 and the adhesive tape is lifted upward accordingly, and FIG. 4 is a diagram in which a spring is removed to avoid complication. It is a partially notched side view of FIG.

First, the outline of the substrate wiring peeling tester of this embodiment will be described with reference to FIGS. The testing machine 1 regulates the insertion depth of a main body 3 arranged roughly as shown in the drawing, a pressing plate 4 provided on the front side of the upper surface 3a of the main body, and an IC board 31 inserted from below the pressing plate. An IC board backing plate 33 (see FIG. 4), a panel 2 standing upright at a substantially central portion in the depth of the upper surface of the main body, two guide rails 12 attached to this panel, and a fitting with built-in pressurizing means attached to the panel. Moving means 13; a pressure means built-in metal fitting 11 which moves left and right by the guide rail and the moving means;
The adhesive tape 2 is formed by the pressing means in the metal fitting with built-in pressing means.
A pressure roller 21 for pressing the substrate 8 against the IC substrate 31, a base metal 10 which is moved left and right by the guide rail 12 and the base metal moving means 14, and a vertical guide rail 38 which is moved by the base metal. A tape mounting bracket 9 mounted to be vertically movable via means 17 and a wound tape wound with an adhesive tape mounted on the upper end of the tape mounting bracket.
Roll 15 and the roller 1
A tape winding reel 16 for winding a tape 28 drawn out through the fixing rollers 9, 22, and the fixing rollers 22, 23, 24;
Various switches (not shown), various limit switches (not shown), and a protection bar (not shown) for safety are provided in front of the pressure plate 4.

Next, the operation procedure and the like of the substrate wiring peeling tester of this embodiment will be described with reference to FIGS. Most of the power source of this tester is a rodless air cylinder or a general air cylinder and requires compressed air, but it is not necessary to incorporate it into the compressor. The tester can be operated by connecting to. However, the present invention is
The present invention is not limited to this, and a hydraulic cylinder or an electric screw rod or the like can be used as long as it can move. The tape winding reel 16 shown in FIG. 1 has a shaft 39, gears 37 and 36 as shown in FIG.
The motor is operated by the tape winding reel motor 35 through. As shown in FIG. 1, the main body 3 is provided with casters and fixing feet for convenience of movement. After transporting and fixing this tester to a predetermined position, first, it is connected to a power source and a power source such as a compressed air source. After that, the handle 25 adjusts the insertion depth of the IC board according to the position of the IC board wiring to be inspected. As shown in FIG. 4, when the handle is turned, the gear 2
The screw rod 34 is rotated via the components 9 and 30, and the moving means 32 of the IC board contact plate 33 engaged with the screw rod is moved back and forth (right and left in FIG. 4) to thereby contact the IC board. The insertion depth of the board can be adjusted. In this case, the IC board backing plate is based on the state in which the moving means 32 is pushed out most. The IC board backing plate is formed by a plurality of narrow plates fork-shaped through a long hole formed in the upper surface 3a of the main body and protrudes upward from the upper surface of the main body slidably with respect to the long hole. The IC substrate inserted above can be brought into contact. Sensor-40 is
It is fixed to the moving means 32 via a fixing plate or the like.
The C-substrate backing plate is provided immediately below the state where it is most pushed out by the moving means 32. Therefore, when the moving means 32 moves with the handle 25, the sensor 40 also moves.
Although the optical sensor is used in this embodiment, the optical sensor
The present invention is not limited to this, and any device may be used as long as it can transmit an electric signal when the IC substrate 31 comes into contact with a plurality of IC substrate contact plates 33 protruding above the upper surface of the main body.

First, when the inspector steps on the pedal switch 26 on the floor in front of the board wiring peeling tester 1, (1) the IC board backing plate 33 moves forward to a predetermined position by the moving means 32. (2) At this point, the inspector inserts the IC substrate 31 to be inspected into contact with the IC substrate contact plate 33 as shown in FIG. In this case, when the IC board is inserted obliquely, it only comes into contact with one IC board backing plate, so that the sensor 40 does not transmit an electric signal and cannot proceed to the next step. (3) Therefore, when the IC substrate 31 is inserted in parallel and abuts at two or more locations on the IC substrate contact plate, (4) the pressure means in which the pressure plate 4 projects downward from the frame 5 at two locations. The IC board 31 is pressed down by the pressurizing means in the built-in portion 6. The frame 5 is fixed to be parallel by two bolts, nuts 8 and thumb screws 7 erected on the front surface of the main body upper surface 3a. Since the pressing plate 4 is lowered by the two pressing means, the IC substrate 31 can be pressed uniformly at a predetermined pressure. When the pressure plate 4 presses the IC substrate 31, a limit switch (not shown) is operated, and (5) I
The C-substrate backing plate 33 is moved backward by the moving means 32 to a predetermined position. As the IC board backing plate 33 retreats,
In a later step, when the pressure roller 21 moves left and right, contact with the pressure roller 21 can be prevented. Upon retreating, a limit switch (not shown) is actuated, and (6) the tape mounting bracket 9 which has moved to the left end and waited is slid up and down via the up and down guide rail 38 and the moving means 17. The base metal fitting 10 movably mounted is moved to the right end by two guide rails 12 and base metal moving means 14. As a result, the adhesive tape 2 pulled out from the wound tape 15 mounted on the upper end of the tape mounting bracket 9.
8 is stretched on the IC substrate 31 via rollers 19 and 20. The adhesive tape 28 is further extended to reach the tape winding reel 16 via the fixed rollers 22, 23, 24. Has a one-way clutch so that it does not rotate in the reverse direction.
8 can be mounted on the IC substrate. When the tape mounting bracket 9 slidably mounted on the base bracket 10 reaches the right end, the limit switch (not shown) is actuated, and (7) the pressurization which has moved to the left end and is on standby. The pressure roller 21 presses the adhesive tape 28 onto the IC substrate 31 at a predetermined pressure by the pressurizing means of the means built-in metal fitting 11, and the fitting means built-in metal fitting 11 includes the guide rail 12 and the pressing means. As the built-in metal fitting moving means 13 moves to the right end, the pressure roller 21 also moves while pressing on the adhesive tape 28 to adhere the adhesive tape to the IC substrate surface. In this case, the base metal fitting 10 on which the tape mounting metal fitting 9 is slidable in the vertical direction also moves on the same guide rail. The pressure means built-in fitting 11 moves until it comes into contact with the base fitting 10 which has already reached the right end. When the metal fitting 11 with built-in pressurizing means reaches the right end, a limit switch (not shown) is operated, and (8) the metal fitting 11 with built-in pressurizing means is moved to the left end by the moving means 13 of the metal built-in pressurizing means. Accordingly, the pressure roller 21 also moves while pressing the adhesive tape 28 again. When the metal fitting 11 with built-in pressurizing means reaches the left end, a limit switch (not shown) is operated to move the pressurizing roller 21 upward to return to the initial position.
When returning to the initial position, the limit switch (not shown) is operated, and (9) the pressurizing means 18 at the lower end of the tape mounting bracket 9 is operated to move the adhesive tape 28 to the roller 20. Hold it between and fix it. When it is fixed, a limit switch (not shown) is operated, and a moving means 17 provided on the base metal fitting 10 is operated to pull up the tape mounting fitting 9 upward. When the tape mounting bracket 9 is pulled upward, the adhesive tape 28 sandwiched and fixed by the roller 20 and the pressing means 18 is also pulled upward and peeled off the IC substrate 31 surface. In order to peel the adhesive tape 28 from the IC substrate surface, the moving means 17 alone may be used. However, the adhesive force of the adhesive tape 28 is quite strong. be able to. When the tape mounting bracket 9 is pulled up to the upper end, a limit switch (not shown) operates,
(10) The tape winding reel 16 is peeled off, and at the same time the winding of the adhesive tape 28 is started, the base metal fitting 10 to which the tape mounting metal fitting 9 is attached starts to move to the left end. The moving means 17 provided on the base metal fitting 10 pulls it downwards against the spring 41, and returns to the initial position. Also in this case, since the base metal fitting 10 moves to the left end using the same guide rail 12, the base metal fitting 10 does not pass the metal fitting 11 with built-in pressing means, but has already moved to the left end and stopped. Then, it comes into contact with the metal fitting 11 with built-in pressurizing means and stops.
When it returns to the initial position, the limit switch (not shown) operates, the tape winding reel 16 stops winding, and the pressing means 18 at the lower end of the tape mounting bracket 9 operates, Adhesive tape 2
8 is released. When the sandwiching pressurizing means 18 returns to the original position, a limit switch (not shown) is operated, and (11) the pressurizing plate 4 which has pressed the IC board 31 is built in by the pressurizing means. It is pulled up until it touches the end of the part 6. Limit switch (not shown) when pulled up
(12) The IC substrate contact plate 33 is pushed forward to a predetermined position by the moving means 32 and stopped. (13) The inspector takes out the IC board 31 and judges the quality by a visual inspection. After one cycle is completed in the above order, in order to inspect the next IC board, the pedal switch is depressed again and another I
Insert the C board 31 and the board wiring peeling tester 1 performs the above (2).
The above operation is automatically repeated from the step. As a result of the inspection using the substrate wiring peeling tester of the present invention which operates as described above, the inspector himself adhered the adhesive tape on the IC substrate, peeled it off, and judged the quality by visual inspection after peeling. Therefore, the time required to inspect one IC board was about 1 minute, but the time required to inspect one IC board is about 5 minutes by using the substrate wiring peeling tester of the present invention. This is on the order of seconds, which has greatly improved the inspection efficiency. Further, conventionally, since each inspector adheres the adhesive tape on the IC substrate, the inspection result varies depending on the person who adheres strongly or the person who adheres weakly. With the machine,
Since the adhesive tape could always be adhered with a constant pressure, a stable inspection result could be obtained.

[0011]

According to the present invention, the following remarkable effects are obtained. 1) Variations in test results due to individual differences can be eliminated, and stable test results can always be obtained. 2) Inspection efficiency can be greatly improved. 3) Since the board wiring peeling tester is small and lightweight, it can be easily moved.

[Brief description of drawings]

FIG. 1 is a schematic front view showing the overall schematic structure of a substrate wiring peel tester according to the present invention.

FIG. 2 is a schematic front view of the substrate wiring peeling tester of FIG. 1 from which a pressure plate, a frame, a column supporting the frame, a bolt or a thumbscrew are removed.

FIG. 3 is a state diagram showing a state in FIG. 2 in which a tape mounting bracket is moved upward, and an adhesive tape is also lifted upward accordingly.

[Fig. 4] Fig. 1 with a spring removed to avoid complication.
FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Board wiring peeling tester 2 Panel 3 Main body 3a Main body upper surface 4 Pressing plate 5 Frame 6 Pressurizing means built-in part 7 Thumb screw 8 Nut 9 Tape mounting bracket 10 Base bracket 11 Pressing unit built-in bracket 12 Guide rail 13 Moving means of metal fitting with built-in pressurizing means 14 Base metal fitting moving means 15 Rolled tape 16 Tape take-up reel 17 Moving means 18 Pressurizing means 19 Roller 20 Roller 21 Pressurizing roll Reference numeral 22 Fixed roller 23 Fixed roller 24 Fixed roller 25 Handle 26 Pedal switch 27 Code 28 Adhesive tape 29 Gear 30 Gear 31 IC board 32 Moving means 33 IC board backing plate 34 Screw rod 35 Tape take-up reel motor 36 Gear 37 Gear 38 Vertical guide rail 39 Shaft 40 Sensor 41 Spring

Claims (5)

[Claims] 1. An IC board backing plate that regulates an insertion position of an IC board, a pressure plate that presses an IC board, and a tape that supplies an adhesive tape on the IC board and that can be moved left and right and up and down.
The pressure tape which can be attached to the IC substrate and moved up and down by pressing the mounting tape and the adhesive tape supplied on the IC substrate in the horizontal direction while pressing the adhesive tape. And a tape winding reel capable of winding an adhesive tape peeled off from the IC substrate by moving the tape mounting bracket upward. Board wiring peel tester. 2. The IC board backing plate can be moved back and forth by a handle, and the pressing plate presses the IC board.
2. The apparatus according to claim 1, further comprising a moving means for moving the substrate backing plate backward. 3. A tape mounting bracket is mounted on a base bracket movable left and right by a guide rail and a moving means so as to be vertically movable through a vertical guide rail and a moving means. When the tape mounting bracket moves upward, the adhesive tape is sandwiched and fixed between the roller and the roller by the pressurizing means provided on the tape mounting bracket, so that the tape is mounted on the IC substrate. 3. The apparatus according to claim 2, wherein the adhesive tape is peeled off. 4. The pressurizing roller is vertically movably mounted on a pressurizing means built-in fitting which can be moved left and right by a guide rail and a moving means.
The board wiring peel tester according to the above. 5. The apparatus according to claim 4, wherein the tape winding reel has a one-way clutch.