JPH0816278B2 - Cylinder high-speed plating device - Google Patents

Cylinder high-speed plating device

Info

Publication number
JPH0816278B2
JPH0816278B2 JP62037818A JP3781887A JPH0816278B2 JP H0816278 B2 JPH0816278 B2 JP H0816278B2 JP 62037818 A JP62037818 A JP 62037818A JP 3781887 A JP3781887 A JP 3781887A JP H0816278 B2 JPH0816278 B2 JP H0816278B2
Authority
JP
Japan
Prior art keywords
plating
plating solution
cylinder
supply chamber
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62037818A
Other languages
Japanese (ja)
Other versions
JPS63206496A (en
Inventor
裕 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP62037818A priority Critical patent/JPH0816278B2/en
Publication of JPS63206496A publication Critical patent/JPS63206496A/en
Publication of JPH0816278B2 publication Critical patent/JPH0816278B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は例えばエンジンシリンダやシリンダライナ、
あるいは油圧機器に使用されるシリンダなどの内周面に
メッキ処理を施すシリンダの高速メッキ装置に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to, for example, an engine cylinder or a cylinder liner,
Alternatively, the present invention relates to a high-speed plating apparatus for a cylinder that performs plating on the inner peripheral surface of a cylinder used in hydraulic equipment.

〔従来の技術〕[Conventional technology]

エンジンシリンダ等においては、耐摩耗性を向上させ
て寿命の延長化をはかるために、シリンダ内周面にメッ
キ処理を施すことが行われている。この種のエンジンシ
リンダにメッキ処理を施す装置としては、例えば実開昭
53−79819号公報に開示されたものがある。これはエン
ジンシリンダを下向きに吊下げた状態で支持する絶縁部
材と、この絶縁部材に下方へ突設された円筒状の電極と
を備えており、電極内へ供給されたメッキ液が、電極の
下端からシリンダ内周面に接触しながら軸線方向に沿っ
て上方へ流れるように構成されている。また、メッキ液
の流出口は、シリンダの一方の側のみに設けられてい
る。BACKGROUND ART In an engine cylinder or the like, in order to improve wear resistance and prolong the life thereof, a plating treatment is performed on the inner peripheral surface of the cylinder. As an apparatus for plating this type of engine cylinder, for example,
There is one disclosed in Japanese Patent Publication No. 53-79819. This includes an insulating member that supports the engine cylinder in a suspended state, and a cylindrical electrode that projects downward from the insulating member. It is configured to flow upward along the axial direction while coming into contact with the inner peripheral surface of the cylinder from the lower end. The plating solution outlet is provided only on one side of the cylinder.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

しかし、上述したメッキ装置は、メッキ液の流れが必
ずしも円滑ではなく、メッキ膜の膜厚が不均一になり易
く、しかも、メッキ効率が低いという問題があった。However, the above-described plating apparatus has a problem that the flow of the plating solution is not always smooth, the thickness of the plating film is likely to be uneven, and the plating efficiency is low.

これは、メッキ液の流出口がシリンダの一方の側にの
み設けられているからである。すなわち、メッキ液は、
電極の下端開口と流出口とを結ぶ仮装直線に略沿うよう
に直線状に流れる傾向にあり、流出口側を流れやすく、
反対側を流れにくくなるため、メッキ時に金属イオンを
シリンダの内周面に均等に供給することができない。This is because the plating solution outlet is provided only on one side of the cylinder. That is, the plating solution is
There is a tendency to flow in a straight line substantially along a provisional straight line connecting the lower end opening of the electrode and the outlet, and it is easy to flow on the outlet side,
Since it becomes difficult to flow on the opposite side, metal ions cannot be uniformly supplied to the inner peripheral surface of the cylinder during plating.

〔課題を解決するための手段〕[Means for solving the problem]

本発明はこのような事情に鑑みなされたもので、メッ
キ膜の均一性を向上させることができるシリンダの高速
メッキ装置を提供するものである。The present invention has been made in view of the above circumstances, and provides a high-speed plating apparatus for a cylinder, which can improve the uniformity of a plating film.

本発明に係るシリンダの高速メッキ装置は、外面に開
口するメッキ液供給室を有しこの開口縁に設けたシール
材を介してシリンダの開口端を支承する装置本体と、前
記メッキ液供給室の開口と対向する部位に配設され前記
シリンダを前記装置本体側へ押圧する押圧部材と、前記
装置本体の開口から前記シリンダ側へ突設されてシリン
ダのシリンダ孔内に臨みかつ内部が装置本体外と連通さ
れた円筒電極とを備え、前記メッキ液供給室から前記円
筒電極とシリンダ内周面との間に形成される円筒状メッ
キ液通路にメッキ液を供給し、円筒電極の突出側開口か
ら内部へ排出する構造とし、前記メッキ液供給室にメッ
キ液を導入するメッキ液供給口をメッキ液供給室の内側
面に開口させ、前記円筒状メッキ液通路を、前記メッキ
液供給室および円筒電極の内部より通路断面積が小さく
なるように形成したものである。A high-speed plating apparatus for a cylinder according to the present invention has a plating solution supply chamber having an opening on an outer surface thereof, the apparatus main body supporting an opening end of the cylinder through a sealing material provided at the opening edge, and the plating solution supply chamber. A pressing member that is disposed at a portion facing the opening and presses the cylinder toward the apparatus main body, and a pressing member that protrudes from the opening of the apparatus main body toward the cylinder and faces the cylinder hole of the cylinder and the inside is outside the apparatus main body. A cylindrical electrode in communication with the cylindrical electrode, the plating liquid is supplied from the plating liquid supply chamber to a cylindrical plating liquid passage formed between the cylindrical electrode and the inner peripheral surface of the cylinder, The structure is such that the plating solution is discharged to the inside, the plating solution supply port for introducing the plating solution into the plating solution supply chamber is opened on the inner side surface of the plating solution supply chamber, and the cylindrical plating solution passage is provided in the plating solution supply chamber and the cylinder. It is obtained by forming such cross-sectional area than the interior of the electrode is reduced.

〔作用〕[Action]

本発明においては、メッキ液はメッキ液供給口からメ
ッキ液供給室を介して円筒状メッキ液通路内へ流れが乱
れた状態で流入し、シリンダの装置本体側開口端から内
周面に沿って他端側へ流れた後に、円筒電極の内部を通
って外部に排出される。前記円筒状メッキ液通路はメッ
キ液供給室より通路断面積が小さくなるように形成して
いるから、メッキ液がメッキ液供給室から円筒状メッキ
液通路へ流入するときに流速が上昇する。また、円筒状
メッキ液通路は円筒電極の内部より通路断面積が小さく
なるように形成しているから、この円筒状メッキ液通路
の出口でメッキ液が滞ることがない。In the present invention, the plating liquid flows from the plating liquid supply port through the plating liquid supply chamber into the cylindrical plating liquid passage in a state where the flow is disturbed, and along the inner peripheral surface from the opening end of the cylinder on the apparatus main body side. After flowing to the other end side, it is discharged to the outside through the inside of the cylindrical electrode. Since the cylindrical plating liquid passage is formed so as to have a smaller passage cross-sectional area than the plating liquid supply chamber, the flow velocity increases when the plating liquid flows from the plating liquid supply chamber into the cylindrical plating liquid passage. Further, since the cylindrical plating liquid passage is formed so that the passage cross-sectional area is smaller than the inside of the cylindrical electrode, the plating liquid does not stay at the outlet of the cylindrical plating liquid passage.

〔実施例〕〔Example〕

以下、本発明の一実施例を図により詳細に説明する。
第１図は本発明に係るシリンダの高速メッキ装置の要部
を示す断面図、第２図は第１図のII−II線断面図で、こ
れらの図において符号１で示すものは高速メッキ装置を
示す。２はこの高速メッキ装置１を使用してメッキ処理
を施すシリンダとしてのエンジンシリンダで、シリンダ
ヘッドが一体に形成されている。An embodiment of the present invention will be described in detail below with reference to the drawings.
FIG. 1 is a sectional view showing an essential part of a high-speed plating apparatus for a cylinder according to the present invention, and FIG. 2 is a sectional view taken along the line II-II in FIG. 1, in which the reference numeral 1 indicates a high-speed plating apparatus. Indicates. Reference numeral 2 is an engine cylinder as a cylinder for performing a plating process using the high-speed plating apparatus 1, and a cylinder head is integrally formed.

３は樹脂製の装置本体で、この装置本体３には、装置
本体３の外面となる上面に開口されたメッキ液供給室４
が形成されている。前記メッキ液供給室４の開口縁には
環状の支承部材５が嵌合されており、この支承部材５の
開口縁に前記エンジンシリンダ２の下面を支承する環状
のシール材６が嵌着されている。すなわち、本実施例に
おいては、シール材６はメッキ液供給室４の開口縁に直
接設けられるのではなく、支承部材５を介して前記開口
縁に設けられている。換言すれば、エンジンシリンダ２
はシール材６および支承部材５を介して装置本体３に支
承されている。なお、前記メッキ液供給室４は第２図に
示すように断面円形状に形成されている。Reference numeral 3 denotes a resin-made apparatus main body, and the apparatus main body 3 has a plating liquid supply chamber 4 formed in an upper surface which is an outer surface of the apparatus main body 3.
Are formed. An annular support member 5 is fitted to the opening edge of the plating solution supply chamber 4, and an annular seal member 6 that supports the lower surface of the engine cylinder 2 is fitted to the opening edge of the support member 5. There is. That is, in the present embodiment, the sealing material 6 is not directly provided on the opening edge of the plating liquid supply chamber 4, but is provided on the opening edge via the support member 5. In other words, the engine cylinder 2
Is supported by the apparatus main body 3 via the seal member 6 and the support member 5. The plating solution supply chamber 4 has a circular cross section as shown in FIG.

11はメッキ液供給室４の開口から上方（前記エンジン
シリンダ２側）へ突設させた円筒電極である。12はメッ
キ液供給室４の底部中央に穿設された貫通孔13に嵌合さ
れた金属製のブッシュであり、その内孔に円筒電極11の
下端部を上方から挿入させることによっって、円筒電極
11をメッキ液供給室４の中央に支持している。このた
め、円筒電極11の外周面とシリンダ内周面との間にはメ
ッキ液を流通させる円筒状メッキ液通路14が形成されて
いる。この円筒状メッキ液通路14は、第２図に示すよう
に、前記メッキ液供給室４および円筒電極11の内部11a
より通路断面積が小さくなるように形成されている。Reference numeral 11 denotes a cylindrical electrode projecting upward from the opening of the plating solution supply chamber 4 (on the side of the engine cylinder 2). Reference numeral 12 denotes a metal bush fitted in a through hole 13 formed in the center of the bottom of the plating solution supply chamber 4, and by inserting the lower end of the cylindrical electrode 11 into the inner hole from above. , Cylindrical electrode
11 is supported at the center of the plating solution supply chamber 4. Therefore, a cylindrical plating liquid passage 14 is formed between the outer peripheral surface of the cylindrical electrode 11 and the inner peripheral surface of the cylinder to allow the plating liquid to flow therethrough. As shown in FIG. 2, this cylindrical plating liquid passage 14 is provided inside the plating liquid supply chamber 4 and the cylindrical electrode 11a.
It is formed so that the passage cross-sectional area becomes smaller.

円筒電極11の上端はシリンダ内の上端部付近において
開口されると共に、内部11aは前記ブッシュ12に下方か
ら挿入された樹脂製の管体15を介して装置本体３外に連
通されている。16はブッシュ12の下側を覆う給電リン
グ、17はその下側を覆う絶縁リングであり、給電リング
16は給電配線18で直流電源のプラス側端子19に接続され
ている。The upper end of the cylindrical electrode 11 is opened near the upper end in the cylinder, and the inside 11a is communicated with the outside of the apparatus main body 3 through a resin pipe 15 inserted into the bush 12 from below. 16 is a power supply ring that covers the lower side of the bush 12, and 17 is an insulating ring that covers the lower side of the bush 12.
Reference numeral 16 is a power supply wiring 18 which is connected to the positive side terminal 19 of the DC power supply.

21は装置本体３の上方に昇降自在に配設され図示しな
いエアシリンダ装置等によって駆動される金属製の押圧
部材であり、下端部にエンジンシリンダ２の上端面に当
接してこれを押圧するフランジ21aを有している。22は
この押圧部材21を直流電源のマイナス側端子23に接続す
る給電配線である。すなわち、押圧部材21はエンジンシ
リンダ２を上方から押圧してシール材６とエンジンシリ
ンダ２および支承部材５とを密接させるだけでなく、シ
リンダ内周面を陰極とするための給電部材としても機能
している。Reference numeral 21 denotes a metal pressing member which is arranged above the apparatus body 3 so as to be able to move up and down and driven by an air cylinder device or the like (not shown). Have 21a. Reference numeral 22 is a power supply wiring for connecting the pressing member 21 to the negative side terminal 23 of the DC power supply. That is, the pressing member 21 not only presses the engine cylinder 2 from above to bring the seal material 6 into close contact with the engine cylinder 2 and the support member 5, but also functions as a power supply member for making the inner peripheral surface of the cylinder a cathode. ing.

25はメッキ液供給室４内と外部とを連通しメッキ液供
給室４から前記円筒状メッキ液通路14にメッキ液を供給
するメッキ液供給口である。このメッキ液供給口25は第
２図に示すように、メッキ液供給室４の内側面に円筒状
メッキ液通路14の接線方向に沿って開口されている。実
施例においては、メッキ液供給口25から流入したメッキ
液がメッキ液供給室４内および円筒状メッキ液通路14に
おいて左方向へ旋回するように開口されている。Reference numeral 25 denotes a plating solution supply port that communicates the inside and outside of the plating solution supply chamber 4 and supplies the plating solution from the plating solution supply chamber 4 to the cylindrical plating solution passage 14. As shown in FIG. 2, the plating solution supply port 25 is opened in the inner surface of the plating solution supply chamber 4 along the tangential direction of the cylindrical plating solution passage 14. In the embodiment, the plating solution flowing from the plating solution supply port 25 is opened in the plating solution supply chamber 4 and in the cylindrical plating solution passage 14 so as to swirl to the left.

26は上方へ開口されたメッキ液槽で、例えばクロム酸
溶液等のメッキ液が溜められている。27はこのメッキ槽
26と前記メッキ液供給口25との間を連通する供給管、28
はメッキ液槽26と管体15との間を連通する回収管であ
る。供給管27にはメッキ液槽26からメッキ液を吸い上げ
てメッキ液供給口25内に圧送するポンプ29が設けられて
いる。これらメッキ液槽26、供給管27、回収管28、ポン
プ29は装置本体３よりも下方に配置されている。Reference numeral 26 is a plating solution tank having an opening upward, in which a plating solution such as a chromic acid solution is stored. 27 is this plating tank
A supply pipe for communicating between the plating solution supply port 25 and 26;
Is a recovery pipe that communicates between the plating liquid tank 26 and the pipe body 15. The supply pipe 27 is provided with a pump 29 that sucks up the plating solution from the plating solution tank 26 and pressure-feeds it into the plating solution supply port 25. The plating liquid tank 26, the supply pipe 27, the recovery pipe 28, and the pump 29 are arranged below the apparatus main body 3.

このように構成されたシリンダの高速メッキ装置１に
おいては、エンジンシリンダ２を装置本体３上に載置し
て押圧部材21で押圧すると、シール材６でエンジンシリ
ンダ２と装置本体３との間がシールされるため、エンジ
ンシリンダ２と装置本体３との間に密閉されたメッキ室
を形成することができる。この状態で、ポンプ29を駆動
すると、メッキ液はメッキ液槽26から吸い上げられてメ
ッキ液供給口25内へ圧送され、メッキ液供給室４に導入
される。In the high-speed plating apparatus 1 for a cylinder configured as described above, when the engine cylinder 2 is placed on the apparatus main body 3 and pressed by the pressing member 21, the sealing material 6 causes a gap between the engine cylinder 2 and the apparatus main body 3. Since it is sealed, it is possible to form a sealed plating chamber between the engine cylinder 2 and the apparatus body 3. When the pump 29 is driven in this state, the plating solution is sucked up from the plating solution tank 26, pressure-fed into the plating solution supply port 25, and introduced into the plating solution supply chamber 4.

る。It

メッキ液供給室４にメッキ液供給口25からメッキ液が
導入されると、メッキ液供給口25が円筒状メッキ液通路
14の接線方向に沿って開口されているため、メッキ液は
メッキ液供給室４内で円筒電極11を中心にこの外周面に
沿って旋回するようになる。そして、メッキ液は前記メ
ッキ液供給室４から円筒状メッキ液通路14に流入する。
すなわち、メッキ液は円筒状メッキ液通路14内に流れが
乱された状態で流入することになる。When the plating solution is introduced into the plating solution supply chamber 4 through the plating solution supply port 25, the plating solution supply port 25 is provided with a cylindrical plating solution passage.
Since the opening is formed along the tangential direction of 14, the plating solution is swirled in the plating solution supply chamber 4 around the cylindrical electrode 11 along this outer peripheral surface. Then, the plating solution flows from the plating solution supply chamber 4 into the cylindrical plating solution passage 14.
That is, the plating solution flows into the cylindrical plating solution passage 14 with the flow being disturbed.

メッキ液が円筒状メッキ液通路14に流入するときに
は、円筒状メッキ液通路14の通路断面積がメッキ液供給
室４より小さいことから、円筒状メッキ液通路14の入口
部分が絞りとなって流速が上昇する。また、上述したよ
うに円筒状メッキ液通路14の通路断面積がメッキ液供給
室４より小さいことから、メッキ液供給室４内に生じた
メッキ液からなる旋回流が弱められることがない。When the plating liquid flows into the cylindrical plating liquid passage 14, since the passage cross-sectional area of the cylindrical plating liquid passage 14 is smaller than that of the plating liquid supply chamber 4, the inlet portion of the cylindrical plating liquid passage 14 becomes a throttle and the flow velocity. Rises. Further, as described above, since the cross-sectional area of the cylindrical plating liquid passage 14 is smaller than that of the plating liquid supply chamber 4, the swirling flow of the plating liquid generated in the plating liquid supply chamber 4 is not weakened.

このため、メッキ液は相対的に速度が速められた状態
で円筒状メッキ液通路14中を流れが乱された状態で上昇
するようになる。Therefore, the plating solution rises in a state where the flow is disturbed in the cylindrical plating solution passage 14 with the speed relatively increased.

円筒状メッキ液通路14の最上部に流れたメッキ液は、
円筒電極11の開口から内部11aに流入して排出される。
このとき、円筒電極11の内部11aの通路断面積は円筒状
メッキ液通路14より大きいので、円筒状メッキ液通路14
を高速に流れたメッキ液は流れが滞ることなく円滑に円
筒電極11の内部に流入する。すなわち、円筒状メッキ液
通路14に流入してから円筒電極11内へ排出されるまでメ
ッキ液を高速に流すことができる。The plating liquid that has flowed to the top of the cylindrical plating liquid passage 14 is
From the opening of the cylindrical electrode 11, it flows into the inside 11a and is discharged.
At this time, since the passage cross-sectional area of the inside 11a of the cylindrical electrode 11 is larger than that of the cylindrical plating liquid passage 14, the cylindrical plating liquid passage 14
The plating liquid that has flowed at high speed smoothly flows into the cylindrical electrode 11 without stopping the flow. That is, the plating solution can flow at a high speed until it flows into the cylindrical plating solution passage 14 and is discharged into the cylindrical electrode 11.

このように円筒電極11の内部11aに排出されたメッキ
液は、円筒電極11を流下し、回収管28を経てメッキ液槽
26へ戻される。The plating liquid thus discharged to the inside 11a of the cylindrical electrode 11 flows down through the cylindrical electrode 11, passes through the recovery pipe 28 and the plating liquid tank.
Returned to 26.

したがって、メッキ液がエンジンシリンダ２の一端か
ら他端へ向けて直線的に流れるのを防ぎつつこのメッキ
液をシリンダ内周面に沿って円滑に流すことができる。
その結果、金属イオンを円筒状メッキ液通路内で十分に
撹拌させながらシリンダ内周面の全域に略均等にしかも
高速に接触させることができるから、メッキ膜の膜厚を
略均一にできるとともに、高いメッキ効率が得られる。Therefore, it is possible to smoothly flow the plating liquid along the inner peripheral surface of the cylinder while preventing the plating liquid from linearly flowing from one end to the other end of the engine cylinder 2.
As a result, the metal ions can be brought into contact with the entire area of the inner peripheral surface of the cylinder substantially uniformly and at high speed while sufficiently stirring the metal ions in the cylindrical plating liquid passage, and therefore the film thickness of the plating film can be made substantially uniform, and High plating efficiency can be obtained.

また、メッキ液供給口25がエンジンシリンダ２の下方
に位置しているから、ポンプ29を停止すれば、エンジン
シリンダ２内のメッキ液を重力によって流下させ、メッ
キ液供給口25から排出させることができる。その結果、
メッキ液を排出するという特別な作業を行うことなく、
エンジンシリンダ２を装置本体３から取外すことができ
る。Further, since the plating solution supply port 25 is located below the engine cylinder 2, if the pump 29 is stopped, the plating solution in the engine cylinder 2 can be caused to flow down by gravity and discharged from the plating solution supply port 25. it can. as a result,
Without the special work of draining the plating solution,
The engine cylinder 2 can be removed from the device body 3.

なお、上記実施例においては、エンジンシリンダ２に
メッキ処理を施した例について説明したが、本発明はこ
れに限定されるものではなく、シリンダライナや、ある
いは油圧機器用のシリンダのメッキ処理に使用すること
もできる。また、円筒状のシリンダライナにメッキ処理
を施す場合には、蓋体を介して押圧すればよく、押圧部
材21を絶縁材から形成し、別個に給電部材を設けてもよ
い。It should be noted that in the above embodiment, an example in which the engine cylinder 2 is plated is described, but the present invention is not limited to this, and it is used for plating a cylinder liner or a cylinder for hydraulic equipment. You can also do it. When the cylindrical cylinder liner is plated, it may be pressed through the lid, and the pressing member 21 may be formed of an insulating material and a power supply member may be separately provided.

〔発明の効果〕〔The invention's effect〕

以上説明したように本発明に係るシリンダの高速メッ
キ装置は、外面に開口するメッキ液供給室を有しこの開
口縁に設けたシール材を介してシリンダの開口端を支承
する装置本体と、前記メッキ液供給室の開口と対向する
部位に配設され前記シリンダを前記装置本体側へ押圧す
る押圧部材と、前記装置本体の開口から前記シリンダ側
へ突設されてシリンダのシリンダ孔内に臨みかつ内部が
装置本体外と連通された円筒電極とを備え、前記メッキ
液供給室から前記円筒電極とシリンダ内周面との間に形
成される円筒状メッキ液通路にメッキ液を供給し、円筒
電極の突出側開口から内部へ排出する構造とし、前記メ
ッキ液供給室にメッキ液を導入するメッキ液供給口をメ
ッキ液供給室の内側面に開口させ、前記円筒状メッキ液
通路を、前記メッキ液供給室および円筒電極の内部より
通路断面積が小さくなるように形成したため、メッキ液
をシリンダの装置本体側開口端からシリンダ内周面に添
って流れが乱れた状態で他端側へ高速に流した後に、円
筒電極から外部に流出させることができる。As described above, the high-speed plating apparatus for a cylinder according to the present invention includes an apparatus body that has a plating solution supply chamber that opens to the outer surface, and that supports the opening end of the cylinder via a sealing material provided at the opening edge, A pressing member that is disposed at a portion facing the opening of the plating solution supply chamber and presses the cylinder toward the apparatus body side; and a pressing member that protrudes from the opening of the apparatus body toward the cylinder side and faces the cylinder hole of the cylinder. A cylindrical electrode is provided, the inside of which is communicated with the outside of the apparatus main body, and the plating liquid is supplied from the plating liquid supply chamber to a cylindrical plating liquid passage formed between the cylindrical electrode and the inner peripheral surface of the cylinder. The projecting side opening of the plating solution is discharged to the inside, and the plating solution supply port for introducing the plating solution into the plating solution supply chamber is opened on the inner side surface of the plating solution supply chamber, and the cylindrical plating solution passage is provided with the plating solution. Since the passage cross-sectional area is smaller than the inside of the supply chamber and the cylindrical electrode, the plating liquid flows from the opening end on the device body side of the cylinder along the inner peripheral surface of the cylinder to the other end at high speed with the flow being disturbed. After that, it can be discharged to the outside from the cylindrical electrode.

したがって、シリンダ内におけるメッキ液の流れを流
速が速い乱流状態とし、金属イオンを円筒状メッキ液通
路内で十分に撹拌させながらシリンダ内周面の全域に均
等にかつ高速に供給することができるから、メッキ膜の
均一性を向上させることができると共に、高いメッキ効
率をもってメッキ膜を形成することができる。Therefore, the flow of the plating solution in the cylinder can be made turbulent with a high flow rate, and the metal ions can be uniformly and rapidly supplied to the entire inner surface of the cylinder while sufficiently stirring the metal ions in the cylindrical plating solution passage. Therefore, the uniformity of the plated film can be improved, and the plated film can be formed with high plating efficiency.

【図面の簡単な説明】[Brief description of drawings]

第１図は本発明に係るシリンダの高速メッキ装置の要部
を示す断面図、第２図は第１図のII−II線断面図であ
る。 ２……エンジンシリンダ、３……装置本体、４……メッ
キ液供給室、６……シール材、11……円筒電極、11a…
…内部、14……円筒状メッキ液通路、21……押圧部材、
25……メッキ液供給口。FIG. 1 is a sectional view showing an essential part of a high-speed plating apparatus for a cylinder according to the present invention, and FIG. 2 is a sectional view taken along the line II-II in FIG. 2 ... Engine cylinder, 3 ... Device body, 4 ... Plating liquid supply chamber, 6 ... Seal material, 11 ... Cylindrical electrode, 11a ...
… Inside, 14 …… Cylindrical plating liquid passage, 21 …… Pressing member,
25: Plating liquid supply port.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】外面に開口するメッキ液供給室を有しこの
開口縁に設けたシール材を介してシリンダの開口端を支
承する装置本体と、前記メッキ液供給室の開口と対向す
る部位に配設され前記シリンダを前記装置本体側へ押圧
する押圧部材と、前記装置本体の開口から前記シリンダ
側へ突設されてシリンダのシリンダ孔内に臨みかつ内部
が装置本体外と連通された円筒電極とを備え、前記メッ
キ液供給室から前記円筒電極とシリンダ内周面との間に
形成される円筒状メッキ液通路にメッキ液を供給し、円
筒電極の突出側開口から内部へ排出する構造とし、前記
メッキ液供給室にメッキ液を導入するメッキ液供給口を
メッキ液供給室の内側面に開口させ、前記円筒状メッキ
液通路を、前記メッキ液供給室および円筒電極の内部よ
り通路断面積が小さくなるように形成したことを特徴と
するシリンダの高速メッキ装置。1. A device main body having a plating solution supply chamber having an opening on an outer surface and supporting an opening end of a cylinder through a sealing material provided at an opening edge, and a portion facing the opening of the plating solution supply chamber. A pressing member arranged to press the cylinder toward the apparatus main body, and a cylindrical electrode protruding from the opening of the apparatus main body toward the cylinder side so as to face the cylinder hole of the cylinder and communicate with the outside of the apparatus main body. And a structure in which the plating liquid is supplied from the plating liquid supply chamber to a cylindrical plating liquid passage formed between the cylindrical electrode and the inner circumferential surface of the cylinder, and is discharged from the projecting side opening of the cylindrical electrode to the inside. A plating solution supply port for introducing the plating solution into the plating solution supply chamber is opened to an inner side surface of the plating solution supply chamber, and the cylindrical plating solution passage has a passage cross-sectional area from the inside of the plating solution supply chamber and the cylindrical electrode. Is small High speed plating apparatus of a cylinder, characterized in that formed in Kunar so.
JP62037818A 1987-02-23 1987-02-23 Cylinder high-speed plating device Expired - Fee Related JPH0816278B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62037818A JPH0816278B2 (en) 1987-02-23 1987-02-23 Cylinder high-speed plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62037818A JPH0816278B2 (en) 1987-02-23 1987-02-23 Cylinder high-speed plating device

Publications (2)

Publication Number Publication Date
JPS63206496A JPS63206496A (en) 1988-08-25
JPH0816278B2 true JPH0816278B2 (en) 1996-02-21

Family

ID=12508101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62037818A Expired - Fee Related JPH0816278B2 (en) 1987-02-23 1987-02-23 Cylinder high-speed plating device

Country Status (1)

Country Link
JP (1) JPH0816278B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2681336B1 (en) * 1991-09-18 1995-01-27 Peugeot INSTALLATION FOR PERFORMING AN ELECTROLYTIC DEPOSIT, PARTICULARLY ON THE INTERNAL WALLS OF A MOTOR VEHICLE INTERNAL COMBUSTION ENGINE BLOCK.
WO2005123989A1 (en) * 2004-06-16 2005-12-29 Honda Motor Co., Ltd. Plating apparatus
JP5400525B2 (en) * 2009-08-07 2014-01-29 本田技研工業株式会社 Surface treatment apparatus for cylinder barrel inner surface and surface treatment method thereof
CN105734634B (en) * 2016-02-29 2018-04-03 隆鑫通用动力股份有限公司 The anode installing mechanism foreign-plated for engine cylinder-body groove
CN105734633B (en) * 2016-02-29 2018-04-20 隆鑫通用动力股份有限公司 The anode assembly foreign-plated for engine cylinder body groove
CN105839170B (en) * 2016-02-29 2018-04-20 隆鑫通用动力股份有限公司 The air draft mechanism foreign-plated for engine cylinder body groove
CN105970264A (en) * 2016-06-27 2016-09-28 隆鑫通用动力股份有限公司 Electroplating liquid for cylinder outside-tank electroplating
CN105887147A (en) * 2016-06-27 2016-08-24 隆鑫通用动力股份有限公司 Groove external electroplating technology of cylinder body

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025759U (en) * 1983-07-22 1985-02-21 スズキ事務器工業株式会社 Tank structure in an electrodeposition tank for electrodeposition coating

Also Published As

Publication number Publication date
JPS63206496A (en) 1988-08-25

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