JPH08162552A - Terminal indication method, and electronic part by the method - Google Patents

Abstract

PURPOSE: To surely detect a desired terminal of an electronic part provided with a number of terminals in a short time and to indicate a number of terminal numbers even in a high density mounting substrate. CONSTITUTION: In the terminal indication method of an electronic part 2 having at least 10 or more terminals 1 and an electronic part thereof, a first discrimination mark 3a which comes under the 10n-th (n=1, 2, 3...) from a first terminal of the terminals is arranged in an appearance surface near a terminal of an electronic part for indicating a terminal.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal display method which is suitably applied when an electronic component having a plurality of terminals is to be mounted on a substrate and a search for the terminals is required, and an electronic device by the method. It is about parts.

[0002]

2. Description of the Related Art Conventionally, when searching for a desired terminal of an electronic component having a plurality of terminals, counting is performed in order based on a mark indicating a base point of each terminal number.
Further, when a predetermined electronic component is mounted on, for example, a printed circuit board, the terminal number is printed and displayed in the vicinity of each terminal by silk printing on the printed circuit board.

FIG. 2 shows a package electronic component 102 including a semiconductor integrated circuit, showing a conventional configuration example with reference to FIG.
FIG. 6 is a plan view showing a state of being mounted on a substrate 104. Further, FIG. 3 is a front view of FIG. In both figures, the packaged electronic component 102 is a highly integrated multi-terminal (about 40
~ 120 terminals), and the terminal 1 is the printed circuit board 1
It is mounted on a conductive pattern provided on the surface 04.

On the other hand, in the vicinity of the terminal 1 on the printed circuit board 104, a number 103 for indicating a terminal number is silk-printed, for example, at a terminal in the vicinity of a characteristic part of the shape of the part (for example, a corner of the part). And makes the search easier.

In the above structure, in order to search for a desired terminal, the terminal is sequentially counted from the number 103 indicating the base point of the terminal number to the target number. For example, when the 37th terminal of the packaged electronic component 102 is searched, the desired terminal is found by counting 37 eyes for the first time, counting from "25" of the number 103.

Further, in recent years, the packaging density of packaged electronic components has become extremely high, and the mounting interval between electronic components has become smaller as shown in FIG. It is not possible to show it.

[0007]

However, according to the display method shown in FIG. 2, it takes time to find a desired terminal, and errors are likely to occur, which requires skill. Further, especially when the desired terminal is far away from the printed number 103, there is a problem that an error occurs when counting and searching the target number in order, which increases the probability of occurrence. In the case of high-density mounting as shown in FIG. 4, there is a problem in that the number 103 cannot be displayed, so that even the number cannot be displayed.

Therefore, the present invention has been made in view of the above-mentioned problems. For example, a desired terminal of an electronic component having a large number of terminals can be surely searched for within a short time, and high-density mounting is possible. It is an object of the present invention to provide a terminal display method capable of displaying a large number of terminal numbers on a board and an electronic component by the method.

[0009]

In order to solve the above-mentioned problems and to achieve the object, the present invention provides a terminal display method for an electronic component having at least 10 terminals, wherein The first identification mark corresponding to the 10nth (n = 1,2,3 ...) th terminal from the terminal is placed on the external surface of the electronic component in the vicinity of the terminal to display the terminal. Is characterized by.

Preferably, the first identification mark has n
Alternatively, it is characterized in that the terminal is displayed by additionally attaching a numeral of 10n.

Preferably, the first identification mark is n
Or add 10n number and mark, and 10m +
The terminal is displayed by providing a second identification mark at the 5th (m = 0,1,2 ...).

Preferably, the method is a terminal display method for an electronic component having at least 10 terminals, which corresponds to the 10nth (n = 1,2,3 ...) th terminal from the first terminal of the terminal. One identification mark, 10m + 5 (m =
The 0,1,2) th second identification mark is provided on the outer surface of the electronic component in the vicinity of the terminal to display the terminal.

[0013] Preferably, the electronic component according to the terminal display method for an electronic component having at least 10 terminals, wherein 10n (n =
The first, second, third, ...) First identification mark is provided on the outer surface of the electronic component in the vicinity of the terminal to display the terminal.

Preferably, the first identification mark has n
Alternatively, it is characterized in that the terminal is displayed by additionally attaching a numeral of 10n.

Preferably, the first identification mark is n
Or add 10n number and mark, and 10m +
The terminal is displayed by providing a second identification mark at the 5th (m = 0,1,2 ...).

[0016] Preferably, the electronic component according to the terminal display method for an electronic component having at least 10 terminals, wherein 10n (n =
1, 2, 3 ...) The first identification mark corresponding to the
It is characterized in that the terminals are displayed by arranging the second identification mark at the 0m + 5 (m = 0, 1, 2) th position on the outer surface of the electronic component in the vicinity of the terminals.

[0017]

With the above construction, the desired terminal can be easily found by counting it from the first identification mark or the second identification mark, and the desired terminal can be searched easily, quickly and accurately. To be able to

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention, which is applied to a semiconductor package which is a multi-terminal component, will be described below with reference to the drawings.

FIG. 1 is a plan view showing the semiconductor package 2 mounted on a printed circuit board 4 and then partially cut away. In this figure, the semiconductor package 2 is formed in a substantially square shape as shown in the figure, and terminal groups 1 which are soldered to the pattern provided on the substrate 4 and electrically connected to each other are formed at equal intervals. And is connected to an internal circuit section (not shown). On the surface of this semiconductor package 2, identification marks 3 are provided by printing or the like at positions corresponding to the terminal groups 1. Alternatively, at the time of resin packaging, the identification mark 3 is formed in a concavo-convex shape by the shape portion formed in a predetermined portion of the mold formed in the cavity.

The identification mark 3 in this case is 10n (n =
1, 2, 3, ...) and 10m + 5 (m = 0,1,
The second, third, ...) Different marks are provided with an inverted triangle mark and a circle mark as shown in the figure. In addition, a terminal number of 10n is displayed in m so that it can be easily confirmed. Since the above semiconductor packages are close to each other as shown in the figure and cannot be printed on the substrate 4, the identification mark 3 must be provided on the surface of the semiconductor package 2.

In the electric equipment using the semiconductor package 2 described above, for example, when it is necessary to check the electric waveform of the 37th terminal of the semiconductor package 2 in the manufacturing process or in repair such as sales service. , The mark 3a (inverted triangle) displayed as "30" is searched, and the first mark 3b indicates the number 35, and the second mark from the mark 3b is the "37" th. In this way, the desired terminal can be searched very quickly, and since marking can be performed in the immediate vicinity of the terminal, it is possible to accurately find the desired terminal with little deviation from the terminal.

In place of the above retrieval method, the retrieval can be carried out similarly quickly when counting three marks before the mark 3a printed with "40". Therefore, as described above, the number that needs to be counted in the search for the second terminal of the desired terminal is
This proves that the maximum search is 3 or less and the search can be performed as soon as possible.

As described above, in the multi-terminal component, the search operation for a desired terminal can be performed dramatically rapidly,
And the accuracy can be improved dramatically. This terminal identification mark can also be utilized for visual confirmation of component mounting, and has the effect of improving productivity.

Here, the display method is not limited to the above, and there are various methods, for example, various methods such as color-coding and increasing the size gradually, and are appropriately selected according to the electronic parts to be applied. It Further, the present invention is not limited to the above semiconductor packaging, and can be provided to various electric and electronic parts having many terminals, and various connectors, semiconductor sockets, DC ICs, etc.
It goes without saying that it can be applied to all parts including terminals or more.

[0025]

As described above, according to the present invention,
A terminal display method capable of surely searching for a desired terminal of an electronic component having a large number of terminals within a short time, and capable of displaying a large number of terminal numbers even on a high-density mounting board, and an electronic device according to the method. Parts can be provided.

[0026]

[Brief description of drawings]

FIG. 1 is a plan view of a semiconductor package showing an embodiment of the present invention.

FIG. 2 is a plan view of a conventional semiconductor package.

FIG. 3 is a front view of a conventional semiconductor package.

FIG. 4 is a plan view of a conventional semiconductor package.

[Explanation of symbols]

 1 terminal group (terminal) 2 semiconductor package (electronic component) 3 identification mark 3a mark (first identification mark) 3b mark (second identification mark)

Claims (8)

[Claims] 1. A method of displaying a terminal of an electronic component having at least 10 terminals, comprising 10n (n = 1, 2, 3) from the first terminal of the terminal.
...) The first identification mark corresponding to the second) is provided on the outer surface of the electronic component in the vicinity of the terminal to display the terminal. 2. The terminal display method according to claim 1, wherein the terminal is displayed by marking the first identification mark with a numeral n or 10n. 3. The first identification mark is further attached with a numeral n or 10n, and 10m + 5 (m = 0, 1,
The terminal display method according to claim 1, wherein the terminal is displayed by providing a second identification mark at the (2 ...) th position. 4. A method of displaying a terminal of an electronic component having at least 10 terminals, comprising 10n (n = 1, 2, 3) from the first terminal of the terminal.
...) the first identification mark corresponding to the second, 10m + 5 again
By arranging the (m = 0, 1, 2) -th second identification mark on the outer surface of the electronic component in the vicinity of the terminal,
A terminal display method comprising displaying the terminal. 5. An electronic component according to the terminal display method for an electronic component having at least 10 terminals, wherein 10n (n = 1, 2, 3) from the first terminal of the terminal.
...) The first identification mark corresponding to the second item is provided on the outer surface of the electronic component in the vicinity of the terminal to display the terminal, and the electronic component according to the terminal display method. 6. The electronic component according to the terminal display method according to claim 5, wherein the terminal is displayed by marking the first identification mark with a numeral of n or 10n. 7. The first identification mark is further attached with a numeral n or 10n, and 10m + 5 (m = 0, 1,
The electronic component according to the terminal display method according to claim 5, wherein the terminal is displayed by providing a second identification mark at the (2 ...) th position. 8. An electronic component according to the terminal display method for an electronic component having at least 10 terminals, wherein 10n (n = 1, 2, 3) from the first terminal of the terminal.
...) the first identification mark corresponding to the second, 10m + 5 again
By arranging the (m = 0, 1, 2) -th second identification mark on the outer surface of the electronic component in the vicinity of the terminal,
An electronic component according to the terminal display method, wherein the terminal is displayed.