JPH08157779A - Bonding of plastic antistatic plate - Google Patents
Bonding of plastic antistatic plateInfo
- Publication number
- JPH08157779A JPH08157779A JP6306546A JP30654694A JPH08157779A JP H08157779 A JPH08157779 A JP H08157779A JP 6306546 A JP6306546 A JP 6306546A JP 30654694 A JP30654694 A JP 30654694A JP H08157779 A JPH08157779 A JP H08157779A
- Authority
- JP
- Japan
- Prior art keywords
- antistatic plate
- plastic
- bonding
- antistatic
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/022—Mechanical pre-treatments, e.g. reshaping
- B29C66/0224—Mechanical pre-treatments, e.g. reshaping with removal of material
- B29C66/02245—Abrading, e.g. grinding, sanding, sandblasting or scraping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプラスチック制電プレー
トの接着法に係り、特に、覗き窓を有する作業槽や覗き
窓用として接着強度に優れたプラスチック制電プレート
の接着法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adhering a plastic antistatic plate, and more particularly to a method for adhering a plastic antistatic plate having excellent adhesive strength for a work tank having a viewing window or for a viewing window.
【０００２】[0002]
【従来技術とその課題】従来、半導体、液晶等の製造工
程は無塵状態の清潔であることが要求され、静電気の発
生は極度に敬遠されるので制電処理された装置が用いら
れるが、薬液による洗浄装置も例外ではなく腐食し易い
金属に替わってプラスチック製の洗浄槽が用いられてい
る。 しかしながら、制電プレートは表面に導電層を設
けているため、そのまま従来同様の感覚で接着組立てし
ようとしても、接着強度が弱いと云う欠点がある。2. Description of the Related Art Conventionally, the manufacturing process of semiconductors, liquid crystals, etc. is required to be clean in a dust-free state, and since static electricity is extremely shunned, an antistatic device is used. Cleaning devices using chemicals are no exception, and plastic cleaning tanks are used instead of corrosive metals. However, since the antistatic plate is provided with the conductive layer on the surface, there is a drawback that the adhesive strength is weak even if the assembly is carried out as it is in the conventional manner.
【０００３】このため制電プレートメーカーは、接着し
ようとする接着部位にセロテープ等で縁取りし、溶剤を
含ませた布で表面の導電層を取除き、下地のプラスチッ
ク面を露出させ、その部位に他の制電プレートの側面を
押付け接着剤を注入して接着組立てを行なう方法を奨励
している。 しかしながら、この方法では溶剤の乾燥に
時間が掛るなど作業工数が多くなると共に、溶剤が作業
面以外に流れ出し制電プレートの表面を汚損すると云う
問題がある。For this reason, the antistatic plate maker uses an adhesive tape or the like to trim the bonding site to be bonded, removes the conductive layer on the surface with a cloth soaked in a solvent, and exposes the underlying plastic surface to the site. Another method is to press the side surface of the antistatic plate to inject the adhesive and to perform the adhesive assembly. However, this method has a problem in that the number of working steps is increased due to the time required for drying the solvent, and the solvent flows out to a place other than the working surface and stains the surface of the antistatic plate.
【０００４】[0004]
【課題を解決するための手段】本発明は上記課題を解決
するものであって、その要旨は、プラスチック制電プレ
ートの帯電防止面を摩耗処理して接着予定部位のプラス
チック下地面を露出させておき、次いで、該露出部位に
他のプラスチック制電プレートの側端面を当接接着する
ことを特徴とするプラスチック制電プレートの接着法で
ある。DISCLOSURE OF THE INVENTION The present invention is to solve the above-mentioned problems, and the gist thereof is to subject the antistatic surface of the plastic antistatic plate to abrasion treatment to expose the plastic base surface at the site to be bonded. Then, the side end surface of another plastic antistatic plate is brought into contact with and adhered to the exposed portion. Then, the plastic antistatic plate is adhered.
【０００５】[0005]
【実施例】本発明で用いるプラスチック制電プレート
は、硬質ポリ塩化ビニル、ポリメチルメタクリレート、
ポリカーボネート等の透明プラスチックからなる１．０
〜１０ｍｍ厚みのプレートの表面に、導電性金属微粉末
の塗膜を０．５〜５μｍ厚さに形成したものである。EXAMPLE A plastic antistatic plate used in the present invention is made of hard polyvinyl chloride, polymethylmethacrylate,
1.0 made of transparent plastic such as polycarbonate
A coating film of conductive metal fine powder is formed in a thickness of 0.5 to 5 μm on the surface of a plate having a thickness of 10 mm.
【０００６】本発明は、上記プラスチック制電プレート
の導電性金属微粉末の塗膜面を、サンドペーパーなど機
械的手段により摩耗して接着を予定している部位の塗膜
を除去し、プラスチック下地面を露出させたのち、該露
出部位に接着相手の他のプラスチック制電プレートの側
端面を当接し接着するものである。According to the present invention, the coating film of the conductive metal fine powder of the plastic antistatic plate is abraded by mechanical means such as sandpaper to remove the coating film at the site where adhesion is planned, and After exposing the ground, a side end surface of another plastic antistatic plate, which is a bonding partner, is brought into contact with and bonded to the exposed portion.
【０００７】本発明の実施方法として、例えば、透明な
厚み５．０ｍｍの硬質ポリ塩化ビニル基板の両面に、３
μｍ厚みの導電性金属微粉末の塗膜層を形成してなる制
電プレートを用意し、該制電プレートの厚さと略同一厚
み断面を有するプレートに、ペーパー番手＃８００以上
のサンドペーパーを貼付してなる治具を用いて、制電プ
レートの接着部位に沿い定規を当てて、上記治具のサン
ドペーパー貼付面を擦り付けて制電プレートの塗膜層を
摩耗除去し、しかるのち、擦りガラス面状となった部位
に接着相手の他の制電プレートの側端面を当接し、テト
ラヒドロフラン：メチルエチルケトン＝８：２の比率で
混合してなる溶剤型接着剤を用いて接着を行なうことが
できる。As a method for carrying out the present invention, for example, a transparent hard polyvinyl chloride substrate having a thickness of 5.0 mm is coated on both sides with 3
Prepare an antistatic plate formed with a coating layer of conductive metal fine powder having a thickness of μm, and attach sandpaper with a paper count of # 800 or more to a plate having a cross section of the same thickness as the thickness of the antistatic plate. Apply a ruler along the adhesion area of the antistatic plate using the jig, and rub the sandpaper pasting surface of the jig to remove the coating layer of the antistatic plate by abrasion, and then rub the glass. Adhesion can be performed by using a solvent-type adhesive formed by bringing the side end surface of another antistatic plate, which is an adhesion partner, into contact with the planarized portion and mixing them at a ratio of tetrahydrofuran: methyl ethyl ketone = 8: 2.
【０００８】次に、本発明により制電プレートの接着部
位の塗膜をサンドペーパーで摩耗除去し接着した場合
と、比較例として、制電プレートの接着部位の塗膜を溶
剤を用いて除去し接着した場合並びに制電プレート相互
間を直接接着した場合について、各々下記試験法により
接着強さ試験を行ない、その結果を下記表１に表わす。Next, according to the present invention, the coating film on the adhesion part of the antistatic plate is removed by abrasion with sandpaper, and as a comparative example, the coating film on the adhesion part of the antistatic plate is removed using a solvent. An adhesive strength test was carried out by the following test method for each of the cases of adhesion and the case of directly adhering between the antistatic plates, and the results are shown in Table 1 below.
【０００９】接着強さは、厚み５．０ｍｍ供試試料を用
いＪＩＳＫ６８５０（引張りせん断接着強さ試験法）に
基づき、破壊荷重の測定値と該破壊荷重測定値を接着断
面積で除し算出した引張強さで表示した。The adhesive strength was calculated by dividing the measured value of the breaking load and the measured value of the breaking load by the adhesive cross-sectional area based on JISK 6850 (tensile shear adhesive strength test method) using a test sample having a thickness of 5.0 mm. It is indicated by tensile strength.
【００１０】[0010]
【表１】 [Table 1]
【００１１】上記表１の結果から、本発明の実施例のも
のは、比較例の制電プレート相互間を直接接着した場合
に比較し、破壊荷重及び引張強さ等の接着強さにおいて
大幅に改良され、また溶剤を用いて塗膜を除去したうえ
で接着した場合の比較例と比較しても略同等の高い接着
強度を具えている。From the results shown in Table 1 above, the examples of the present invention are significantly different in the breaking strength and the adhesive strength such as tensile strength as compared with the case where the antistatic plates of the comparative example are directly bonded. It is improved and has substantially the same high adhesive strength as compared with the comparative example in which the coating film is removed by using a solvent and then bonded.
【００１２】[0012]
【発明の効果】本発明は上記構成よりなるので下記効果
を奏する。即ち、本発明によれば、溶剤を用いて塗膜を
除去したうえで接着する従来法に比較して同等の高い接
着強度を維持しつつ、従来法の課題であった制電プレー
トの表面が汚損されたり、溶剤の乾燥時間など接着作業
に工数が掛ると云う問題を解消することができるもので
ある。Since the present invention has the above-mentioned structure, it has the following effects. That is, according to the present invention, while maintaining the same high adhesive strength as compared with the conventional method of adhering after removing the coating film using a solvent, the surface of the antistatic plate, which was a problem of the conventional method, It is possible to solve the problem that the number of man-hours is required for the bonding work such as stains and solvent drying time.
Claims (1)
を摩耗処理して接着予定部位のプラスチック下地面を露
出させておき、次いで、該露出部位に他のプラスチック
制電プレートの側端面を当接接着することを特徴とする
プラスチック制電プレートの接着法。1. An antistatic surface of a plastic antistatic plate is subjected to abrasion treatment to expose a plastic base surface of a site to be adhered, and then a side end surface of another plastic antistatic plate is abutted and adhered to the exposed site. A method of adhering a plastic antistatic plate characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6306546A JPH08157779A (en) | 1994-12-09 | 1994-12-09 | Bonding of plastic antistatic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6306546A JPH08157779A (en) | 1994-12-09 | 1994-12-09 | Bonding of plastic antistatic plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08157779A true JPH08157779A (en) | 1996-06-18 |
Family
ID=17958346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6306546A Pending JPH08157779A (en) | 1994-12-09 | 1994-12-09 | Bonding of plastic antistatic plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08157779A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002282783A (en) * | 2001-03-05 | 2002-10-02 | Sika Ag | Structural bonding method in coated surface |
-
1994
- 1994-12-09 JP JP6306546A patent/JPH08157779A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002282783A (en) * | 2001-03-05 | 2002-10-02 | Sika Ag | Structural bonding method in coated surface |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5688360A (en) | Method and apparatus for polishing a semiconductor substrate wafer | |
| KR100235572B1 (en) | Abrasive sheet and method of manufacturing the same | |
| KR100222228B1 (en) | Regeneration method and apparatus of wafer and substrate | |
| US6406923B1 (en) | Process for reclaiming wafer substrates | |
| JP4832664B2 (en) | Contact cleaning sheet and method | |
| DE102004055233B4 (en) | Method for producing a semiconductor wafer | |
| JP5832468B2 (en) | Manufacturing method of glass substrate, manufacturing method of glass substrate for display, and cleaning method of end surface of glass substrate for display | |
| KR20030030813A (en) | Cleaning seat | |
| DE102019212581A1 (en) | buff | |
| JPH02220838A (en) | Laminate and support material of member to be polished and polishing cloth used therewith | |
| JPH08157779A (en) | Bonding of plastic antistatic plate | |
| JPH11347902A (en) | Sheet machining and machining device thereof | |
| US6140211A (en) | Method for recycling wafers used for quality assurance testing of integrated circuit fabrication equipment | |
| KR20070074398A (en) | Semiconductor wafer including contamination removal part | |
| US20050282470A1 (en) | Continuous contour polishing of a multi-material surface | |
| JPH0232110B2 (en) | ||
| JP2000233354A (en) | Wafer notch polishing device | |
| JP7426898B2 (en) | Cleaning body, cleaning device and cleaning method | |
| JPH08162429A (en) | Pattern area protecting method for wiring board | |
| JP2003017538A (en) | Local analysis method of substrate surface | |
| US6448084B1 (en) | Multiple metal etchant system for integrated circuits | |
| JP2510038B2 (en) | Method for manufacturing semiconductor device | |
| DE102020210458A1 (en) | PROCESSING PROCESS FOR WAFER | |
| JPS641932B2 (en) | ||
| JPH02257626A (en) | Coupling apparatus of jig of semiconductor substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20040322 |