JPH08155838A - Grinding wheel and manufacture thereof - Google Patents

Abstract

PURPOSE: To form the envelope shape of abrasive grains correctly at low cost by separating the whole of a metal plating layer, both first and second adhesive layers and base material from a metal mold, and then etching the surface of the metal plating layer to expose the tips of abrasive grains. CONSTITUTION: At the time of manufacturing a grinding wheel, the surface of a metal mold 1 formed into the inverted shape of a grinding wheel is first covered with abrasive grains 2 to form a metal plating layer 3 to be a binder layer. After applying a first adhesive to the upper face of the metal plating layer 3, an abrasive face forming mold 5 to be a second mold is placed thereon and pressed so as to harden a first adhesive layer 4. After separating only the mold 5, base material 6 is bonded to the first adhesive layer 4 through a second adhesive layer 7. After separating the whole of the metal plating layer 3, both first and second adhesive layers 4, 7 and base material 6 from the metal mold 1, the surface of the metal plating layer 3 is etched, and the tip parts of the abrasive grains 2 are exposed from the metal plating layer 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a grindstone and a grindstone for grinding the surface of a hard and brittle material such as glass or a crystalline material to have a good surface roughness, and particularly to a grinding surface of the grindstone in advance. Using a mold with a surface shape that is the reverse of the finished shape,
The present invention relates to a method for manufacturing a grindstone in which the surface shape of the mold is transferred to an envelope shape of the abrasive grain tip portion of the grindstone, and a grindstone manufactured by this manufacturing method.

[0002]

2. Description of the Related Art Conventionally, a grinding grindstone has been widely used for polishing hard and brittle materials such as glass and crystal materials. As a method of manufacturing this grindstone, the surface shape of the grindstone using a mold is used. There is known a method for molding the. In this method, a mold having a surface shape in which the completed shape of the grinding surface of the grindstone is inverted in advance is used to transfer the surface shape of the mold to the envelope shape of the abrasive grain tip of the grindstone. As a method of manufacturing a grindstone using such a mold, for example, Japanese Patent Publication No.
3-41710, JP-A-2-232172, and Japanese Patent Application No. 5-96040 already filed by the applicant of the present application.

Among the above prior arts, Japanese Patent Application No. 5-960
The method disclosed in No. 40 is as shown in FIG.
(1) A metal plating layer 106 that covers the abrasive grains 104 and serves as a binder is formed on the surface of the mold 102 (FIG. 8A),
(2) The surface of the metal plating layer 106 is processed to be smooth according to the shape of the base material (FIG. 8B), and (3) the metal plating layer 1
The base 108 of the grindstone is adhered to the surface of 06 with the adhesive 110 (FIG. 8C), and (4) the metal plating layer 106, the adhesive layer 110, and the base 108 are integrated into the mold 102. (FIG. 8D), and (5) the surface of the peeled metal plating layer 106 is removed to expose the tips of the abrasive grains 104 (FIG. 8E).

On the other hand, in Japanese Examined Patent Publication No. 63-41710,
"A metal sheet, that is, a holding material layer formed so as to cover the abrasive grains is integrally bonded to the surface of the grindstone base, that is, the base material through a bonding layer such as a synthetic resin or brazing."
JP-A-2-232172 describes that "a polishing member, that is, a holding material layer formed so as to cover abrasive grains is fixed on a supporting member such as a base metal, that is, a base material by an appropriate method." However, in any of the methods, no mention is made of the shape of the surface of the holding material layer formed so as to cover the abrasive grains, its processing, or the like.

[0005]

[Patent Document 1] Japanese Patent Application No. 5-96
In the method disclosed in No. 040, the metal plating layer is processed according to the shape of the base material when the metal plating layer serving as the binder and the base material of the grindstone are bonded.

At this time, as the material of the metal mold, a material such as stainless steel, which has a relatively weak adhesion of plating, is used so that the metal plating layer can be easily peeled from the metal mold in a later step. Depending on the method of processing the layer, the plating and the mold may separate in a minute area due to the cutting force during processing.

In this case, the surface shape of the metal plating layer after the base material is adhered and the integrated metal plating layer, the adhesive layer and the base material are separated from the mold, more specifically, the metal plating There is a problem that the envelope shape of the tip of the abrasive grains exposed by removing the surface layer of the layer does not become a shape that is completely inverted from the shape of the mold.

Abrasive grains having high hardness are contained in the metal plating layer. For example, abrasive grains having a large grain size are mixed, or the abrasive grains are overlapped and taken into the metal plating layer. In this case, there is a problem that the abrasive grains in the metal plating layer are exposed on the processed surface of the metal plating layer during the processing of the metal plating layer, which makes the processing of the metal plating layer extremely difficult.

Further, Japanese Patent Publication No. 63-41710 and Japanese Patent Application Laid-Open No. 2-232172 do not describe processing of the surface of the metal plating layer when adhering the metal plating layer and the base material of the grindstone. When the surface of the plating layer is not processed, the metal plating layer is a plating that is grown by covering the abrasive grains, so there are irregularities on the plating surface in the areas with and without abrasive grains, or the gas during plating. Due to the occurrence of defects such as pinholes, the surface of the metal plating layer has irregularities of several tens μm to several hundreds μm. Further, when the metal plating layer is formed by the electroplating method, it is difficult to grow the plating with a uniform thickness over the entire area of the mold due to the uneven current density. Therefore, the thickness of the adhesive layer when the base material of the grindstone and the metal plating layer are bonded becomes non-uniform, and internal stress remains in the adhesive when the adhesive cures and shrinks. When internal stress remains in the adhesive in this way, the surface shape of the metal plating layer after the base material is adhered and the base material, the adhesive layer and the metal plating layer are integrated and peeled from the mold Further, there is a problem that the envelope shape of the tips of the abrasive grains exposed by removing the surface layer of the metal plating layer does not become a shape that is completely inverted from the shape of the mold.

Further, in particular, when a conventional grindstone having a shape other than a plane shape, for example, a spherical shape, is manufactured by a conventional method, the "metal plating layer covering the abrasive grains" formed on the die shown in FIG. 7 is formed.
In the method of processing and then adhering to the base material, compared with the case of manufacturing a planar grindstone, more advanced processing technology such as accurately processing the radius of curvature of the plating layer according to the radius of curvature of the base material Therefore, there is a problem that the manufacturing cost of the grindstone becomes high.

Also, when the "metal plating layer covering the abrasive grains" formed on the mold is not processed, it is adhered to the base material as well.
The surface shape of the base material is the mold surface shape and the metal plating layer,
It is necessary to decide after considering the thickness of the adhesive layer, and to control the thickness of the metal plating layer with high precision to perform metal plating. There was a problem that it became expensive.

Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to accurately form the envelope shape of the abrasive grains of a grindstone and to reduce the cost. Another object of the present invention is to provide an inexpensive grindstone manufacturing method and a grindstone manufactured by this manufacturing method.

[0013]

Means for Solving the Problems The above-mentioned problems are solved,
In order to achieve the object, the method for manufacturing a grindstone of the present invention uses a first mold having a surface shape which is the reverse of the completed shape of the grinding surface of the grindstone to be manufactured, and the surface shape of the first mold is A method of manufacturing a grindstone manufactured by transferring the abrasive particles to form the grinding surface, comprising: a first step of substantially uniformly dispersing a large number of abrasive particles on the surface of the first mold; and the abrasive particles. A second step of forming a metal plating layer on the surface of the first mold in which the metal particles are dispersed and serving as a binder for covering and bonding the abrasive grains; and a step of contacting the metal plating layer with the first mold. The first
The first adhesive is applied to the second surface on the back side of the surface of the first adhesive, and the second mold having the substantially same surface shape as the base material of the grindstone is pressed against the surface of the first adhesive. A third step of curing the first adhesive to form a layer of the first adhesive on which the surface shape of the second mold is substantially transferred; A fourth step of peeling from the layer,
A fifth step of adhering the base material of the grindstone to the surface of the first adhesive layer with a second adhesive, and peeling the first surface of the metal plating layer from the first mold. A sixth step of separating from the first mold an integrated body of the base material of the grindstone, the layers of the first and second adhesives and the metal plating layer, and the metal plating layer And a seventh step of removing the surface layer of the first surface to expose the tip end portions of the abrasive grains on the first surface.

Further, in the method for manufacturing a grindstone according to the present invention, any one of fluororesin, polyethylene, polypropylene, polyacetal and silicon resin is used as the material of the second mold.

In the method for manufacturing a grindstone according to the present invention, any one of an epoxy resin adhesive, a phenol resin adhesive, and an acrylic resin adhesive is used as the first adhesive, and the second adhesive is used. The adhesive is characterized by using any one of an epoxy resin adhesive, a phenol resin adhesive, and an acrylic resin adhesive.

In the method for manufacturing a grindstone according to the present invention, the surface shape of the second mold is substantially the same as the surface shape of the base material plus the thickness of the layer of the second adhesive. It is characterized by being.

In the method for manufacturing a grindstone according to the present invention, when the grindstone to be manufactured is a convex-shaped spherical grindstone having a radius of curvature R0, the surface of the second mold has a radius of curvature R.
2, the surface of the base material is a convex surface having a radius of curvature R3, and R2 and R3 are R2 = R0- (d + t1) R3 = R2-t2, where d: thickness of metal plating layer t1: first The thickness of the first adhesive layer is t2: the thickness of the second adhesive layer.

Further, in the method of manufacturing a grindstone according to the present invention, when the grindstone to be manufactured is a concave type spherical grindstone having a radius of curvature R0, the surface of the second mold has a radius of curvature R.
2, the surface of the base material is a concave surface having a radius of curvature R3, and R2 and R3 are R2 = R0 + (d + t1) R3 = R2 + t2 where d: thickness of metal plating layer t1: first The thickness of the adhesive layer of t2: The thickness of the second adhesive layer.

Further, in the method for manufacturing a grindstone according to the present invention, the outer peripheral portion of the second die is formed in a stepped shape or a chamfered shape, and the outer peripheral portion of the base material is of the second die. It is formed in a shape corresponding to a stepped shape or a chamfered shape of the outer peripheral portion, and a part of the outer peripheral portion of the base material and the layer of the first adhesive are bonded with the second adhesive. Is characterized by.

Further, the grindstone of the present invention is bonded to the base material which is the body of the grindstone, the metal plating layer for bonding the abrasive grains, and the back surface of the metal plating layer, and is in contact with the metal plating layer. The bonding surface on the side opposite to the surface is bonded to the first adhesive layer formed into a substantially same shape as the surface of the base material, and the bonding surface of the first adhesive layer, and the bonding surface is And a second adhesive layer for adhering to the surface of the base material.

[0021]

In the method of manufacturing a grindstone and the grindstone of the present invention configured as described above, when the metal plating layer and the base material of the grindstone are adhered, first, the surface of the metal plating layer is first coated.
The adhesive is applied, and a second mold having a surface shape substantially the same as the surface shape of the base material of the grindstone is pressed and cured. As a result, the irregularities on the surface of the metal plating layer are filled with the first adhesive to smooth the surface. Therefore, after the second mold is peeled from the layer of the first adhesive, the layer of the first adhesive is removed. The surface has a shape substantially following the surface shape of the base material of the grindstone. Also, the second
After the mold is peeled from the first adhesive layer, no residual stress remains in the first adhesive layer. By such an action, the residual stress is released from the first adhesive layer, and the surface shape of the first adhesive layer is formed into a shape that substantially matches the surface shape of the base material of the grindstone. Then, a second adhesive is further applied onto the layer of the first adhesive, and the base material of the grindstone is adhered to the surface of the layer of the first adhesive. Is a layer having a substantially uniform thickness, and internal stress is hardly generated in the second adhesive layer. By the above action, the surface shape of the metal plating layer after the one in which the base material of the grindstone, the first and second adhesive layers and the metal plating layer are integrated is peeled from the first mold, In other words, the envelope shape of the tips of the abrasive grains exposed by removing the surface layer of the metal plating layer is a shape in which the shape of the mold is very well transferred.

Further, in the case of manufacturing a full-form grindstone having a shape other than a plane, for example, a spherical shape, the base material of the grindstone is manufactured according to the surface shape of the second mold, or the first shape is prepared according to the surface shape of the base material. As long as the mold of No. 2 is manufactured, no advanced metal plating layer processing technology or advanced plating technology is required, and the manufacturing cost of the grindstone can be kept low.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. (First Embodiment) First, FIG. 1 is a schematic view showing a method of manufacturing a grindstone according to a first embodiment of the present invention step by step for each manufacturing step. A method of manufacturing the grindstone of the first embodiment will be described with reference to FIG.

First, as shown in FIG. 1 (a), the surface of a mold 1 having a surface which is the inverse of the shape of a grindstone to be manufactured, and which is finished to be smooth, is covered with abrasive grains 2 to form a binder. A metal plating layer 3 to be a layer is formed. The material of the mold 1 used here is a material having a relatively weak adhesion to the mold plating layer 3,
For example, stainless steel, cemented carbide or the like is used and is appropriately selected according to the type of metal plating. The metal plating layer 3 is
It is made of nickel, copper, chromium, zinc, or their alloys formed by a technique such as electroplating or electroless plating, and is appropriately selected according to the hardness of the grindstone to be manufactured as a bond, the compatibility with the abrasive grains used, etc. . In this embodiment,
Stainless steel was used as the material of the mold 1, and electric nickel plating was used as the metal plating layer 3.

FIG. 2 is a schematic diagram of an example of an electroplating apparatus used for forming the metal plating layer 3 in this embodiment. In FIG. 2, in a plating bath 31 filled with a plating solution 32, an anode 34 and a cathode 35, which are connected to a DC power supply 33, are arranged opposite to each other. On the surface of the cathode 35 facing the anode 34, the mold 1 is fixed in a conductive state with the cathode 35 by a fixing screw 36 having conductivity, and a stirrer 38 stirs the plating solution 32 while a DC power source is used. By applying a voltage between the anode 34 and the cathode 35 by 33, the metal plating layer 3 serving as a binder layer is formed on the mold 1. At this time, in order to prevent metal plating from being formed on an extra portion (a portion other than the surface of the mold 1), the portion on the cathode 35 side excluding the surface of the mold 1 is covered with a mask 39. Mask 39
As a masking agent such as Turco 5980-1A manufactured by Elf or No. 3 manufactured by 3M. Masking materials that are generally commercially available, such as mask tapes such as 8403, can be used, but are not limited thereto.

In this embodiment, the plating liquid 32 is 250 g / l of nickel sulfate and 70 g / l of nickel chloride.
1 and a plating solution containing boric acid at a rate of 30 g / l were used. The plating solution temperature is 48 ° C and the current density is 5
The plating treatment was performed under the conditions of A / dm ² and the rotation speed of the stirrer 38 of 60 rpm.

Before forming the plating on the mold 1, a large number of abrasive grains 2 having a predetermined grain size are dispersed and arranged on the mold 1. In this example, artificial diamond abrasive grains having an average particle diameter of 30 μm were used as the abrasive grains 2.

In order to disperse the abrasive grains 2, the anode 34 is once removed in the plating bath 31 shown in FIG. 2, and the abrasive grains 2 are introduced from above the die 1 toward the surface of the die 1.

When the abrasive grains 2 are introduced, the abrasive grains 2 are introduced almost evenly within the range corresponding to the entire surface of the mold 1 so that each abrasive grain is uniformly distributed on the entire surface of the mold 1. Further, when each abrasive grain 2 is charged while rotating the die 1 around its axis,
Each abrasive grain 2 can be distributed more uniformly.

In the present embodiment, the portion where the abrasive grains 2 come into contact with the surface of the mold is the grinding surface of the grindstone, so even if the abrasive grains 2 are slightly overlapped to form two or three layers, the grinding stone is ground. It does not necessarily affect the shape of the surface, and it is not always necessary to disperse each abrasive grain 2 in only one layer.

After disposing the abrasive grains 2 on the surface of the mold in this manner, the metal plating layer 3 to be the binder layer is formed by the above-mentioned plating method. In this example, the apparatus shown in FIG. 2 was used to perform a plating treatment for 120 minutes to form a metal plating layer 3 of about 50 μm.

Next, after applying a first adhesive to form the first adhesive layer 4 on the metal plating layer 3, as shown in FIG. 1 (b), forming an adhesive surface as a second mold. The mold 5 is placed and pressed, and the first adhesive layer 4 is cured in this state.

The adhesive 4 used here may be, for example, an epoxy adhesive, a phenol resin adhesive, an acrylic resin adhesive, or a low melting point metal such as solder, but is not limited thereto. It is not a thing, the hardness after hardening is high, the weatherability is high, and the metal plating layer 3
It suffices to satisfy that the adhesive strength with the second adhesive described later or the following is sufficient. In this example, a two-liquid mixed type epoxy adhesive was used as the first adhesive.

The adhesive surface molding die 5 used here has substantially the same surface shape as the surface shape of the base material 6 of the grindstone described later, and the material is, for example, fluororesin, polyethylene, polypropylene, polyacetal, Silicon resin or the like can be used, but the material is not limited thereto, and a material to which the first adhesive 4 is not adhered or a material having a very weak adhesive force may be used. In this example, a fluororesin (Teflon manufactured by DuPont) was used as the material for the adhesive surface molding die 5.

After the first adhesive layer 4 is sufficiently cured, as shown in FIG. 1 (c), only the adhesive surface forming die 5 is peeled off, and the die 1, the metal plating 3, and the first die are formed. Of the first adhesive layer 4 is obtained at this stage.
The surface shape of is a shape that is substantially the reverse of the surface shape of the base material 6 described later.

Next, as shown in FIG. 1D, the base material 6 is adhered to the surface of the first adhesive 4 by the second adhesive 7.
Since the surface shapes of the first adhesive layer 4 and the base material 6 are reversed and have substantially the same shape, the thickness of the second adhesive layer 7 is
Almost uniform over the entire surface.

As the second adhesive 7, for example, an epoxy resin adhesive, a phenol resin adhesive, an acrylic resin adhesive or the like can be used, but the second adhesive 7 is not limited to these and after curing. Is preferably high in hardness and has sufficient adhesive force with the first adhesive layer 4 and the base material 6. In this embodiment, a two-liquid mixed type epoxy adhesive is used as the second adhesive 7.

Thereafter, as shown in FIG. 1 (e), the metal plating layer 3 covering the abrasive grains 2, the first adhesive layer 4, the second adhesive layer 7, and the base material 6 are integrated. The product is peeled from the mold 1. At this stage, the shape of the surface of the metal plating layer 3 is
The shape of the surface of the mold 1 is reversed.

In FIG. 3, the metal plating layer 3 covering the abrasive grains 2, the first adhesive layer 4, the second adhesive layer 7, and the base material 6 are integrated into a mold 1 It is the figure which showed an example of the peeling apparatus used when peeling. In the peeling apparatus shown in FIG. 3, the fixing screws 42 are provided on the back surfaces of the mold 1 and the base material 6, respectively.
Further, by pulling in the peeling screw 43 and tightening the peeling screw 43, a tensile force is generated, and the portion of the interface of each layer having the weakest bonding force is peeled off. In this embodiment, the interface between the metal plating layer 3 and the mold 1 has the weakest bonding force, and the metal plating layer 3 covering the abrasive grains 2 and the first adhesive layer 4 are bonded together.
And the second adhesive layer 7 and the base material 6 are integrated,
The mold 1 is peeled off.

Finally, as shown in FIG. 1 (f), the surface of the metal plating layer 3 is etched with an acid or the like that dissolves the plating metal to expose the tips of the abrasive grains 2 from the surface of the metal plating layer 3. Let At this stage, the envelope shape of the tip of the abrasive grain 3 becomes a shape obtained by accurately reversing the surface shape of the mold 1.

FIG. 4 is a schematic view of an example of an etching apparatus for etching a metal plating layer. In this embodiment, a mixed solution of nitric acid and hydrochloric acid is used as an etching solution, and the etching apparatus shown in FIG. 4 is used for 10 minutes. Was removed to remove the surface layer of the metal plating layer 3, and the abrasive grains were exposed from the surface of the metal plating layer 3 by about 5 μm.

In the etching apparatus shown in FIG. 4, the etching solution 52 in the bath 51 of the etching solution is stirred by the stirrer 53, and the grindstone suspended by the string 54 or the like is immersed in the etching solution 52 for a predetermined time. The metal plating layer 3 is etched. At this time, in order to etch only the surface of the metal plating layer 3, a portion excluding the surface of the plating layer, for example, the surface of the base material 6 is masked with a mask material, a mask tape or the like so that it is not corroded by the etching solution. It is preferable.

As described above, according to the first embodiment described above, it is possible to prevent the shape of the surface of the grindstone from being changed by the internal stress of the adhesive after the portion to be the grindstone is separated from the mold. Therefore, it is possible to obtain a grindstone in which the envelope shape of the tip end portion of the abrasive grains is formed into a shape in which the surface shape of the die is transferred very well. (Second Embodiment) In the first embodiment, the case where a grindstone having a flat ground surface is manufactured has been described.
In this embodiment, a case will be described in which a so-called grindstone having a spherical grinding surface, that is, a so-called spherical dish is manufactured.

In the case of producing a spherical shaped grindstone, as a matter of course, a die having a spherical shape in which the shape of the stone to be produced is inverted is used, but a binder layer is formed on the spherical die. Assuming that the plating has a substantially uniform thickness when it is grown, the shape of the plating upper surface formed on the mold is a spherical surface with a radius of curvature different from that of the mold by the thickness of the grown plating. It becomes the shape. Therefore, in order to make the thickness of the adhesive layer uniform, it is necessary to make the base material into a spherical shape having a radius of curvature different from that of the mold.

FIG. 5 is a diagram schematically showing how to set the radii of curvature of the base material 6 and the adhesive surface molding die 5 when a spherical dish is manufactured by the method of the present invention. .

FIG. 5A shows a convex spherical dish (radius of curvature R
0) is manufactured, the radius of curvature R1 of the mold 1 (concave surface) is R1 = R0, the thickness of the metal plating layer 3 is d,
Assuming that the thickness of the first adhesive layer 4 is t1 and the thickness of the second adhesive layer 7 is t2, the radius of curvature R3 of the adhesive surface molding die 5 (convex surface) is R3 = R1− (d + t1) The radius of curvature R2 of the base material 6 (convex surface) may be R2 = R3-t2 = R1- (d + t1 + t2).

FIG. 5 (b) shows a concave spherical dish (radius of curvature R
0) is manufactured, the radius of curvature R1 ′ of the mold 1 (convex surface) is R1 ′ = R0, the thickness of the metal plating layer 3 is d, and the thickness of the first adhesive layer 4 is Is t1 and the thickness of the second adhesive layer 7 is t2, the radius of curvature R3 'of the adhesive surface molding die 5 (concave surface) is R3' = R1 '+ (d + t1) of the base material 6 (concave surface). The radius of curvature R2 'may be set to R2' = R3 '+ t2 = R1' + (d + t1 + t2).

Based on the above equation of the radius of curvature, an example of calculation for manufacturing a spherical shaped grindstone, a so-called spherical dish will be described below.

Radius of curvature of spherical dish to be manufactured R0 = 15.00 mm Thickness of metal plating layer d = 100 μm (0.100 mm) Thickness of first adhesive t1 = 30 μm (0.030 mm) Second adhesive Thickness t2 = 5 μm (0.005 mm), if the spherical plate to be manufactured has a convex surface, the radius of curvature of the mold (concave surface) R1 = 15.000 mm, the radius of curvature of the base material (convex surface) R2 = 14.865 mm, the adhesive surface The radius of curvature R3 of the molding die (convex surface) is 14.870 mm.

When the spherical dish to be manufactured has a concave surface, the radius of curvature of the mold (convex surface) R1 R1 '= 15.000 mm The radius of curvature of the base material (concave surface) R2 R2' = 15.135 mm The adhesive surface molding die (concave surface) ) Radius of curvature R3 '= 15.130 mm.

A method for forming a metal plating layer, a method for forming a first adhesive layer, a method for peeling a bonding surface molding die, a method for bonding a base material, a method for peeling a mold, in the case of manufacturing a spherical dish, and The method of removing the surface layer of the metal plating layer is almost the same as that of the first embodiment, and the description thereof is omitted.

The envelope shape of the tip end of the abrasive grains of the spherical shaped grindstone obtained as described above is very well formed into a spherical shape in which the shape of the mold surface is inverted. (Third Embodiment) In the first and second embodiments, in the case of manufacturing a flat type full-scale grindstone, a flat-shaped base material and an adhesive surface molding die are used, and a spherical shape full-scale grindstone has a spherical surface. The base material and the adhesive surface molding die are used so that the thickness of the metal plating layer, the first adhesive layer and the second adhesive layer are substantially uniform, respectively. An example of determining the shape of is described.

However, in the present invention, the thickness of the second adhesive layer is substantially uniform, that is, the shape of the base material and the shape of the adhesive surface molding die are substantially the same. The thicknesses of the metal plating layer and the first adhesive layer may not be uniform as long as the shape is the same as the shape of the base material plus the thickness of the second adhesive layer.
Extremely speaking, it is possible to use a spherical base material for the planar grindstone or use a planar base material for the spherical grindstone.

In the third embodiment, an example in which the shape of the mold is different from the shapes of the base material and the adhesive surface molding die will be described.

FIG. 6A shows an example in which the outer peripheral portion of the adhesive surface forming die 5 has a stepped structure, and the adhesive surface forming die 5 having an outer peripheral portion with a stepped structure is pressed to perform the first adhesion. When the adhesive is hardened, the first
The protrusion 4a is formed on the outer peripheral portion of the adhesive layer 4. Then, after the adhesive surface molding die 5 is peeled off, the base material 6 having a diameter slightly smaller than the diameter of the outer peripheral stepped portion 5a of the adhesive surface molding die 5 is formed on the surface of the molded first adhesive layer 4. Attach with the second adhesive 7.

When the adhesive is cured, the adhesive layer generally shrinks depending on the kind of the adhesive, so that the outer peripheral stepped portion 5a of the adhesive surface molding die 5 used here is If the first adhesive layer 4 is hardened at a right angle or an inverse taper to the molding surface, it may be clamped at the outer peripheral portion and the adhesive surface molding die 5 may not be peeled off.

Therefore, in this embodiment, as the adhesive surface forming mold 5, a peripheral stepped portion 5a having a taper of about 5 ° was used as shown in FIG.

FIG. 6B shows an example in which the outer peripheral portion of the adhesive surface molding die 5 has a chamfered structure. The adhesive surface molding die 5 whose outer peripheral portion is chamfered is pressed to form the first adhesive. When the layer 4 is cured, the chamfered portion 5a on the outer peripheral portion of the adhesive surface molding die 5 is formed.
The protruding portion 4a having a shape that is the inverse of the above is formed on the outer peripheral portion of the first adhesive layer 4. Then, after peeling off the adhesive surface molding die 5, a base material 6 having a chamfered shape substantially the same as the chamfered shape of the adhesive surface molding die 5 is attached to the surface of the molded first adhesive layer 4 by a second adhesive. Paste with.

Even when manufacturing a grindstone having a special peripheral structure as shown in FIGS. 6 (a) and 6 (b), a metal plating layer forming method, a first adhesive layer forming method, and an adhesive surface forming The method of peeling the mold, the method of adhering the base material, the method of peeling the mold, the method of removing the surface layer of the metal plating layer, and the like are almost the same as in Example 1, and therefore the description thereof is omitted.

Further, as shown in FIGS. 6 (a) and 6 (b), the substrate 6
The metal plating layer 3 and the base material 6 are adhered to each other by the first and second adhesives to reach the outer peripheral portion of the metal plating layer 3
The adhesive force between the base material 6 and the base material 6 can be increased.

When the grindstone is manufactured, particularly when the base material is bonded onto the first adhesive layer 4, the base material 6 is formed by the stepped portion or the chamfered portion 4a on the outer periphery of the first adhesive layer 4. Since the position is determined, it is possible to prevent the occurrence of troubles such as the substrate 6 being laterally displaced and adhered.

The present invention can be applied to modifications and variations of the above embodiments without departing from the spirit of the present invention.

[0063]

As described above, in the method of manufacturing a grindstone and the grindstone according to the present invention, when the metal plating layer and the base material of the grindstone are bonded, first, the first adhesive is applied to the surface of the metal plating layer. The second mold having the same surface shape as the surface shape of the base material of the grindstone is pressed and hardened.
As a result, the irregularities on the surface of the metal plating layer are filled with the first adhesive to smooth the surface. Therefore, after the second mold is peeled from the layer of the first adhesive, the layer of the first adhesive is removed. The surface has a shape substantially following the surface shape of the base material of the grindstone. Also,
After peeling the second mold from the first adhesive layer, no residual stress remains in the first adhesive layer. By such an action, the residual stress is released from the first adhesive layer, and the surface shape of the first adhesive layer is formed into a shape that substantially matches the surface shape of the base material of the grindstone. Then, a second adhesive is further applied onto the layer of the first adhesive, and the base material of the grindstone is adhered to the surface of the layer of the first adhesive. Is a layer having a substantially uniform thickness, and internal stress is hardly generated in the second adhesive layer. By the above action, the surface shape of the metal plating layer after the one in which the base material of the grindstone, the first and second adhesive layers and the metal plating layer are integrated is peeled from the first mold, In other words, the envelope shape of the tips of the abrasive grains exposed by removing the surface layer of the metal plating layer is a shape in which the shape of the mold is very well transferred.

Further, in the method according to the present invention, since the plating layer which becomes the binder after growing on the mold is not processed, the trouble such as the minute separation of the mold and the plating layer due to the cutting force does not occur. From this point of view, the shape of the metal plating layer surface is a shape that is very well transferred by reversing the shape of the mold, and after removing the surface layer of the metal plating layer to expose the abrasive grain tip, Since the shape of the metal plating layer surface is almost the envelope shape of the abrasive grain tip portion, the height of the abrasive grain tip is a grindstone that is very well aligned as desired, stably,
It can be manufactured.

Even when a spherical grindstone is manufactured, it is not necessary to determine the shape of the base material in consideration of the thickness of the plating layer or the adhesive layer, and the base material is relatively simple. Since the grindstone can be manufactured without any advanced processing technology or plating technology, the manufacturing cost of the grindstone can be reduced.

Further, by pressing the bonding surface molding die, the first
Since the adhesive layer is cured to form an adhesive surface that is almost the same shape as the base material, it is also possible to increase the adhesive strength between the binder and the base material, for example, by providing a stepped shape or chamfered shape on the outer periphery. It can be realized easily.

[0067]

[Brief description of drawings]

FIG. 1 is a schematic view showing a method of manufacturing a grindstone according to a first embodiment of the present invention step by step in each manufacturing process.

FIG. 2 is a schematic configuration diagram of an example of an electroplating apparatus used for forming a metal plating layer serving as a binder layer.

FIG. 3 is a view showing an example of a peeling device used when peeling a metal plating layer covering an abrasive grain, an adhesive layer, and a base material together from a mold.

FIG. 4 is a schematic configuration diagram of an example of an etching apparatus for removing the surface layer of the metal plating layer by etching.

FIG. 5 is a diagram schematically showing how to set the radii of curvature of the base material and the adhesive surface molding die in the case of manufacturing a spherical shaped full-scale grindstone (spherical plate).

FIG. 6 is a view showing an example in which the outer peripheral portion of the adhesive surface molding die has a stepped structure or a chamfered structure.

FIG. 7 is a view showing a state in which the outer peripheral stepped portion of the adhesive surface molding die is tapered.

FIG. 8 is a schematic diagram showing stepwise an example of a conventional method of manufacturing a grindstone in which the shape of the mold surface is reversed and transferred to the envelope shape of the abrasive grain tip.

[Explanation of symbols]

 1,102 Mold 2,104 Abrasive Grains 3,106 Metal Plating Layer 4 First Adhesive Layer 5 Adhesive Surface Forming Mold 6,108 Base Material 7 Second Adhesive Layer 110 Adhesive Layer 31 Plating Bath 32 Plating Liquid 33 DC power supply 34 Anode 35 Cathode 36 Fixing screw 38,53 Stirrer 39 Mask 41 Base 42 Fixing screw 43 Peeling screw 51 Bath 52 Plating corrosive liquid 54 String

Claims (8)

[Claims] 1. A first mold having a surface shape obtained by reversing a completed shape of a grinding surface of a grindstone to be manufactured is used, and the surface shape of the first mold is transferred to form the grinding surface. A method of manufacturing a grindstone to be manufactured, comprising: a first step of substantially uniformly dispersing a large number of abrasive grains on the surface of the first mold; and a surface of the first mold in which the abrasive grains are dispersed. A second step of forming a metal plating layer serving as a binder for covering and bonding the abrasive grains, and a second step on the back side of the first surface of the metal plating layer in contact with the first mold. The first adhesive is applied to the surface of, and the second adhesive having a surface shape substantially the same as that of the base material of the grindstone is pressed against the surface of the first adhesive to cure the first adhesive. , The first shape in which the surface shape of the second mold is substantially transferred.
A third step of forming a layer of the adhesive, and a fourth step of peeling the second mold from the layer of the first adhesive.
A fifth step of adhering the base material of the grindstone to the surface of the layer of the first adhesive with a second adhesive, and the first surface of the metal plating layer to the first A sixth step of peeling from the mold and separating from the first mold an integrated body of the base material of the grindstone, the first and second adhesive layers, and the metal plating layer; Removing a surface layer of the first surface of the metal plating layer,
A seventh step of exposing the tip end portion of the abrasive grains on the first surface. 2. The material of the second mold is fluororesin, polyethylene, polypropylene, polyacetal,
The method for manufacturing a grindstone according to claim 1, wherein any one of silicone resins is used. 3. An epoxy resin adhesive, a phenol resin adhesive, or an acrylic resin adhesive is used as the first adhesive, and an epoxy resin adhesive is used as the second adhesive. The method for manufacturing a grindstone according to claim 1, wherein one of a phenol resin adhesive and an acrylic resin adhesive is used. 4. The surface shape of the second mold is substantially the same as the surface shape of the base material plus the thickness of the layer of the second adhesive. A method for manufacturing the described whetstone. 5. When the grindstone to be manufactured is a convex-shaped spherical grindstone with a radius of curvature R0, the surface of the second mold is a convex surface with a radius of curvature R2, and the surface of the base material has a radius of curvature R3. It is a convex surface, and R2 and R3 are R2 = R0- (d + t1) R3 = R2-t2, where d: the thickness of the metal plating layer t1: the thickness of the first adhesive layer t2: the second adhesive The method of manufacturing a grindstone according to claim 4, wherein the thickness of the agent layer is: 6. When the grindstone to be manufactured is a concave spherical surface type grindstone having a radius of curvature R0, the surface of the second mold is a concave surface having a radius of curvature R2, and the surface of the base material has a radius of curvature R3. It is a concave surface, and R2 and R3 are R2 = R0 + (d + t1) R3 = R2 + t2, where: d: thickness of metal plating layer t1: thickness of first adhesive layer t2: second adhesive The method for producing a grindstone according to claim 4, wherein: 7. The outer peripheral portion of the second mold is formed into a stepped shape or a chamfered shape, and the outer peripheral portion of the base material is formed into a stepped shape or a chamfered shape of the outer peripheral portion of the second mold. It is formed in a corresponding shape, and a part of the outer peripheral portion of the base material and the layer of the first adhesive are adhered by the second adhesive. Method of manufacturing whetstone. 8. A base material to be a main body of a grindstone, a metal plating layer for bonding abrasive grains, and a back surface of the metal plating layer, which is bonded to the back surface of the metal plating layer and is opposite to the surface in contact with the metal plating layer. The bonding surface is bonded to the first adhesive layer formed in substantially the same shape as the surface of the base material, and the bonding surface of the first adhesive layer is bonded to the surface of the base material. A grindstone comprising a second adhesive layer for bonding.