JPH08153753A - Semiconductor element mounting method - Google Patents

Abstract

PURPOSE: To enable positioning of a semiconductor element to connecting terminals of an electric interconnection on a mounting substrate easily and surely, even using opaque material for the terminals. CONSTITUTION: Gold bumps 3 are formed on input/output terminals 2 of a semiconductor element 1 and contacted with connecting terminals 5 of an electric interconnection 6 on a mounting substrate 8. In this condition, the element 1 is secured to the substrate 8 with a resin 9. A positioning identification means 4 is formed on the back side of the element 1 and the positioning is made by seeing the means 4 through a light permeable window 7 on the substrate 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element mounting method, and more particularly to a semiconductor element mounting method by an FDB (Face Down Bonding) method.

[0002]

2. Description of the Related Art Conventionally, when a semiconductor element is mounted on an adherend substrate by the FDB method, a gold bump 3 is provided on the input / output terminal portion 2 of the semiconductor element 1 as shown in FIG. The semiconductor device 1 is mounted by being brought into contact with the connection terminal portion 5 formed continuously with the electric wiring 6 formed on the adherend substrate 8 and fixing the semiconductor element 1 on the adherend substrate 8 with a photocurable resin 9 or the like. Was there. In this case, the connection terminal portion 5 on the adherend substrate 8
It is necessary to form a material that does not form a surface oxide film that becomes an electric insulating film, and ITO (Indium Tin Oxide) or gold is generally used.

[0003]

However, when ITO is used as the material of the connection terminal portion 5, ITO has a large electric resistance of itself, and the connection between the gold bump 3 of the semiconductor element 1 and the connection terminal portion 5 is large. There is a problem that the resistance becomes large and the connection resistance also varies.

Therefore, in order to avoid such a problem, as shown in FIG. 4, a method of forming a connection terminal portion 5 by providing a metal layer 11 of chromium or the like as a base layer of the ITO 10 is adopted. It was

On the other hand, gold may be used as the material for forming the connection terminal portion 5 when the film formation process of the ITO film is not required when forming the pixel electrodes, such as in a reflective liquid crystal display.

However, when an opaque metal is used as the material for forming the connection terminal portion 5, as shown in FIG. 5, light is blocked and the gold bumps 3 of the semiconductor element 1 are removed from the rear surface side of the adherend substrate 8. There is a problem that the substrate 8 to be adhered and the semiconductor element 1 are difficult to be accurately aligned because they cannot be visually recognized.

[0007]

The method of manufacturing a semiconductor device according to the present invention has been made in view of the above problems of the prior art, and is characterized in that the input / output of a semiconductor element is performed. A metal element is provided on the terminal substrate, and the metal element is abutted on a connection terminal portion formed continuously with the electric wiring on the adherend substrate to fix the semiconductor element on the adherend substrate with resin. In the mounting method, the electric wiring and the connection terminal portion on the adherend substrate are formed of an opaque conductive material, a light transmission window is provided in the electric wiring in the vicinity of the connection terminal portion, and the light transmission window of the semiconductor element is provided. The point is that identification means is provided in the facing portion.

[0008]

With the above-mentioned structure, even if an opaque metal is used for the connection terminal portion, the semiconductor element can be easily aligned.

[0009]

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The same parts as in the conventional example will be described with the same reference numerals. FIG. 1 is a sectional view showing an embodiment of a semiconductor element mounting method according to the present invention, in which 1 is a semiconductor element,
Denoted at 8 is an adherend substrate made of a translucent member such as glass, and 9 is a resin for fixing the semiconductor element 1 onto the adherend substrate 8.

A plurality of input / output terminal portions 2 are provided on the back surface side of the semiconductor element 1, and metal projections (gold bumps) 3 made of gold (Au) or the like are provided on the input / output terminal portions 2, respectively. Has been.

An electric wiring 6 made of an opaque conductive material such as gold (Au), aluminum (Al), nickel (Ni), chromium (Cr) or titanium (Ti) is formed on the adhered substrate 8. There is. The electric wiring 6 is formed by a sputtering method, a vapor deposition method, or the like. A connection terminal portion 5 made of a metal layer such as gold (Au) that is not easily oxidized is provided at the tip of the electric wiring 6.

A light transmitting window 7 is provided near the tip of the electric wiring 6.
Are provided respectively. The light transmitting window 7 may be formed at the same time when the electric wiring 6 is patterned by photolithography or the like.

An identification means 4 is provided in a portion of the semiconductor element 1 facing the light transmission window 7. When the identification means 4 is provided in the input / output terminal portion 2 facing the light transmission window 7 as described above, even if the electrical wiring 6 and the metal layer 5 are formed of an opaque conductive material, the identification is performed from the back surface side of the adherend substrate 8. The semiconductor element 1 can be accurately aligned with the means 4 as a reference.

The identification means 4 may be a metal projection when the portion of the semiconductor element 1 facing the light transmission window 7 is the input / output terminal portion 2, for example. If the identification means 4 is a metal protrusion 3, the metal protrusion 3 for connecting the semiconductor element 1 is connected.
Although it is desirable in that it can be formed in the same step as above, it is not limited to metal protrusions, and colored resin or the like may be applied.

Further, it is desirable that the light transmitting window 7 and the identifying means 4 are provided at a plurality of positions in order to perform accurate alignment.

When the semiconductor element 1 is fixed to the substrate 8 to be adhered, a light or thermosetting resin 9 made of a phenol resin, an epoxy resin or the like is applied to predetermined portions of the substrate 1 to be adhered,
The metal protrusion 3 of the input / output terminal portion 2 of the semiconductor element 1 is brought into contact with the metal layer 5 of the adherend substrate 8, and the resin 9 is aligned from the rear surface side of the adherend substrate 8 with the identifying means 4 as a reference. By curing with heat or light, the metal protrusions 3 are fixed in contact with the metal 5 of the output terminal portion.

FIG. 2 is a view of the connection terminal portion viewed from the back surface side of the adherend substrate 8. A rectangular light transmission window 7 is formed in the electric wiring 6 made of an opaque conductive material, and the identification means 4 can be visually recognized through the light transmission window 7. Since the electric wiring 6 is formed of an opaque conductive material, the metal protrusions 3 connecting the semiconductor element 1 and the electric wiring 6 cannot be visually recognized from the back surface side of the adherend substrate 1.

Further, in the above invention, the light transmission window 7 is formed only in the opaque electric wiring 6, but the output terminal portion 5 is formed in a large area and the light transmission is carried out to both the output terminal portion 5 and the electric wiring 6. The window 7 may be formed. This is the invention described in claim 4, and the same effect as the invention described in claim 1 can be obtained.

[0019]

As described above, according to the method of manufacturing a semiconductor device of the present invention, the electric wiring and the connection terminal portion on the substrate to be adhered are formed of an opaque conductive material, and the vicinity of the connection terminal portion is formed. Since a light transmission window is provided in the electric wiring, and the identification means is provided in a portion facing the light transmission window of the semiconductor element,
Even if an opaque material is used for the connection terminal portion, the connection terminal portion and the semiconductor element can be easily and reliably aligned with each other.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor element mounting method according to the present invention.

FIG. 2 shows a method of mounting a semiconductor device according to the present invention,
It is the figure which looked at the adhesion part of a semiconductor element from the back side of a to-be-adhered substrate.

FIG. 3 is a cross-sectional view showing a conventional semiconductor element mounting method.

FIG. 4 is a diagram showing a connection terminal portion used in a conventional semiconductor element mounting method.

FIG. 5 is a view of a fixing portion of a semiconductor element as seen from the back surface side of a substrate to which the semiconductor element is mounted in a conventional semiconductor element mounting method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor element, 2 ... I / O terminal part, 3 ... Connection bump, 4 ... Positioning bump, 5 ...
Connection terminal part, 6 ... Electric wiring, 7 ... Light transmitting window, 8
... Substrate, 9 ... Resin

Claims (4)

[Claims] 1. An input / output terminal portion of a semiconductor element is provided with a metal protrusion, and the metal protrusion is brought into contact with a connection terminal portion formed continuously with an electric wiring on a substrate to be adhered to attach the semiconductor element to the adherend. In a method of mounting a semiconductor element fixed on a substrate with a resin, an electric wiring and a connecting terminal portion on the adherend substrate are formed of an opaque conductive material, and a light transmitting window is provided in the electric wiring near the connecting terminal portion. A mounting method for a semiconductor element, characterized in that identification means is provided in a portion of the semiconductor element facing the light transmission window. 2. The method of mounting a semiconductor element according to claim 1, wherein the light transmission window and the identification means are provided at two or more places. 3. The semiconductor device according to claim 1, wherein a portion of the semiconductor element facing the light transmission window is an input / output terminal portion of the semiconductor element, and the identifying means is a metal protrusion. Semiconductor device mounting method. 4. A semiconductor element is attached to the semiconductor element by providing a metal projection on an input / output terminal section of the semiconductor element, and abutting the metal projection on a connection terminal section formed continuously with an electric wiring on the adhesion substrate. In a method of mounting a semiconductor element fixed on a substrate with a resin, an electric wiring and a connection terminal portion on the adherend substrate are formed of an opaque conductive material, and a light transmission window is provided in the connection terminal portion and the electric wiring, A method of mounting a semiconductor element, wherein an identification means is provided in a portion of the semiconductor element facing the light transmission window.