JPH08153740A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE: To fill resin into a gap between a chip and a board in the case a resin applying space on an edge part of a wiring board is narrow by applying sealing resin to the opening part between the chip and the board using an auxiliary board. CONSTITUTION: In the case of filling sealing resin 5a into the gap between the chip 2 and the board 1, an auxiliary board 11 that helps the application of the resin is used, and after applying the resin 5a on an surface of the auxiliary board 11, the surface of the auxiliary board 11 is held at right angle with a major surface of the wiring board 1, and the surface of the auxiliary board 11 is closely touched with an edge surface of the wiring board 1 so that the part of the surface, on which the resin 5a is applied, is placed on the upside of the major surface of the wiring board 1. The resin 5a on the surface of the auxiliary board 11 is applied to the opening part between the chip 2 and the board 1 by sliding the auxiliary board 11 along the contacting edge with the wiring board 1 downwards or upwards and separating between the auxiliary board 11 and the wiring board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a method for manufacturing the same, and more particularly to a semiconductor device having a single-sided resin-sealed package structure and a method for forming a resin layer for chip sealing.

[0002]

2. Description of the Related Art For semiconductor devices used in, for example, integrated circuit cards, mask ROM cards for games, small mobile phones, etc., there is a strong demand for miniaturization and thinning of packages. In order to meet such demands, mounting technology of bare semiconductor chips (bare chips) has been developed,
Chip-on-board (COB) mounting, flip-chip mounting, etc. are known.

In the flip chip mounting, the metal bump electrodes on the element forming surface of the bare chip are pressed against the electrode pads formed on one main surface of the wiring board to connect (flip chip bonding). This has a higher mounting density than the COB mounting which requires wire bonding, but has a problem that stress due to thermal expansion of the substrate is applied to the connecting portion between the substrate and the chip to impair the reliability of the connection.

As an improved example of the flip chip mounting,
A single-sided resin-sealed package structure in which a resin is interposed between a bare chip and a substrate to mechanically fix the substrate and the chip together is known, for example, from Japanese Patent Publication No. 2-7180.

Further, as an improved example of the single-sided resin-encapsulated package structure and a manufacturing method thereof, Japanese Patent Application Nos. Hei 6-32296 and Hei 6-5075, filed by the applicant of the present application, are disclosed.
Various proposals have been made in Japanese Patent No. 7 and Japanese Patent Application No. 6-60493.

FIG. 6 shows a Japanese Patent Application No. 6-507 relating to the above proposal.
57 shows an example of a single-sided resin-sealed package structure disclosed in No. 57. This package structure has a wiring board 1 having a wiring 1a including a connected portion (for example, a connection pad 1b) on one main surface, a semiconductor chip 2 mounted face down on the one main surface of the board, and the chip described above. And a wiring layer, and a resin layer 5 filled between the wiring board and the wiring board, and an external connection terminal 4 which is led out and exposed on the other main surface side of the board and electrically connected to the chip. In FIG. 6, 2a is a bump electrode and 3 is a through hole wiring.

FIG. 7 is a Japanese Patent Application No. 6-604 related to the above proposal.
An example of a single-sided resin-sealed package structure disclosed in No. 93 is shown. This package structure is an improved example of the package structure of FIG. 6, and the wiring 1a is embedded and formed so as to form substantially the same plane (planarity is about ± 10 μm) with respect to one main surface of the substrate 1. . Note that FIG.
6, the same parts as those in FIG. 6 are designated by the same reference numerals.

According to this package structure, when the resin is poured between the chip and the substrate by utilizing the capillary phenomenon,
The flatness between the chip and substrate is good, and the resin easily flows in, so a dense resin layer without voids can be formed.
The reliability of fixation between substrates can be improved.

When forming the resin layer 5 in FIGS. 6 and 7, as shown in FIG. 8, the resin 5a is applied to one side of the substrate 1 from the nozzle (needle) 71 of the resin supply device (dispenser). The resin is supplied and the resin is poured between the chip and the substrate by utilizing the so-called capillary phenomenon to fill the resin and then cured. The exposed upper surface of the chip 2 is made of a dense and robust material (for example, silicon), and there is little problem in reliability without resin sealing.

In the semiconductor device having the package structure according to the above proposal, since the burn-in test for applying the temperature stress and / or the electric field stress can be performed after the resin sealing, the resin sealing is not performed. Better than flip chip mounting.

By the way, in the resin filling method as described above, as shown in FIG. 8, the resin (the surface shape thereof is referred to as a fillet) protruding from one side of the substrate opposite to the resin supply side is protruded. The resin protrusion amount S2 at one side of the substrate on the resin supply side is much larger than the amount (about 0.25 mm) S1. By the way, the protrusion amount on one side of the resin supply side is 0.83m at maximum when the resin supply amount is twice as large as the volume between the chip and the substrate.
m was 3.15 times, the maximum was 1.15 mm, and 4 times was the maximum 2.12 mm.

On the side opposite to the resin supply side, the resin protrusion amount S1 is substantially determined by the physical properties of the resin, but on the side of the resin supply side, the needle 71 is placed so as not to touch the tip. Since the resin is supplied in close proximity, the amount of resin squeeze out S2 is the size of the needle (the standard type currently used is 0.82 mm in outer diameter, 1.25 mm
mm).

Further, in the resin filling method as described above,
Distance between chip outer edge and substrate outer edge (resin supply space)
When trying to reduce S3, it is restricted by the outer diameter of the needle 71, and when trying to reduce the outer diameter of the needle 71, it becomes difficult to normally supply the resin to the side portion of the chip on the substrate. In other words, the resin discharged from the needle may run onto the top surface of the chip or hang down from the board end surface, resulting in variations in the finished dimensions of the package and appearance problems. It will be impossible.

As a countermeasure against this, if the outer diameter of the needle can be made smaller than the space for supplying the resin, if the outer diameter of the needle is made smaller, the inner diameter of the needle currently used (0.6 to 0.7 mm). ) Also needs to be small, and when a resin having a high viscosity is used, the resin that is about to be discharged from the needle is clogged, which makes it difficult to discharge from the needle. In addition, the amount of resin discharged at one time (supply amount) is reduced, and it is necessary to increase the number of times the resin is discharged from the dispenser in order to secure the amount of resin required to fill the space between the chip and the substrate. There is a problem that it becomes difficult.

On the other hand, further miniaturization of the single-sided resin-sealed package structure is required, and after flip chip bonding a chip and a substrate having a chip size close to each other, between the chip outer edge and the substrate outer edge on each side of the substrate. The distance S3 has been required to be, for example, 1 mm to 0.5 mm or less, but the above resin filling method cannot meet the above requirement.

[0016]

As described above, the method of filling the resin between the chip and the substrate when manufacturing the semiconductor device having the single-sided resin-sealed package structure according to the conventional proposal is as follows. If the distance is small, there is a problem that variations in the finished dimensions of the package and defects in appearance may occur.

The present invention has been made to solve the above problems, and when a resin is filled between a chip and a substrate to manufacture a semiconductor device having a single-sided resin-sealed package structure, the outer edge of the chip is sealed.・ Even when the distance between the outer edges of the substrate is small, the same dispenser and needle with a diameter that matches the properties of the resin used can be used, resulting in variations in the finished dimensions of the package and defects in the appearance It is an object of the present invention to provide a method for manufacturing a semiconductor device which can be suppressed regardless of the above, and can further reduce the size of the single-sided resin-sealed package structure.

[0018]

A method of manufacturing a semiconductor device according to the present invention is directed to a wiring board in which a wiring including a connected portion is provided on one main surface and external connection terminals are led out / exposed on the other main surface. The step of arranging the semiconductor chip so that the position of the connected part and the corresponding electrode terminal part of the semiconductor chip face each other, and the connected part of the wiring board and the electrode terminal part of the corresponding semiconductor chip are fixedly connected. And a step of subsequently filling a sealing resin between the semiconductor chip and the wiring board, and a step of curing the filled sealing resin, and filling the sealing resin At the time of using an auxiliary plate for resin supply, and supplying the sealing resin to one surface of the auxiliary plate, one surface of the auxiliary plate becomes substantially vertical to one main surface of the wiring board, and , The sealing resin on one side of the auxiliary plate was supplied The one side of the auxiliary plate in close contact with at least one end face of the wiring board so that the component is above one main surface of the wiring board, and thereafter, the auxiliary plate is connected to the wiring board. The auxiliary board is separated from the wiring board by sliding the auxiliary board downward along the contact end surface with the board or by sliding the wiring board upward along the contact end surface with the auxiliary plate. And a step of transferring the sealing resin on one surface of the plate onto the wiring board and supplying the resin to the opening between the chip and the board.

[0019]

[Operation] When a semiconductor device having a single-sided resin-encapsulated package structure is filled with resin between the chip and the substrate, an auxiliary plate for assisting resin supply is used, and one side of the encapsulating resin is used. , The one side of the auxiliary plate becomes substantially perpendicular to the one main surface of the wiring board, and the part of the one side of the auxiliary board to which the sealing resin is supplied is above the one main surface of the wiring board. In such a manner, one side of the auxiliary plate is brought into close contact with at least one end face of the wiring board. After that, by sliding the auxiliary plate downward along the contact end surface with the wiring board or by sliding the wiring board upward along the contact end surface with the auxiliary plate, the auxiliary plate and the wiring board are separated from each other. , The sealing resin on one side of the auxiliary plate is supplied to the opening between the chip and the substrate.

As a result, even when the distance between the outer edge of the chip and the outer edge of the substrate is small and the resin supply space on the end portion of the wiring board is narrow, the capillary action of the resin between the chip and the substrate is used to make use of the chip / substrate. It becomes possible to fill the resin by pouring it in between.

According to such a method, even when the resin supply space on the end portion of the wiring substrate is narrow, or even when the distance between the chip outer edge and the substrate outer edge is small, the same dispenser as in the prior art is used. You can use a needle with a diameter that matches the properties of the resin, and regardless of the diameter of the needle, you can stably and reliably supply an almost constant amount of resin between the chip and the substrate. It does not hang down from the end face, and it is possible to suppress variations in the finished dimensions of the package and appearance defects.

[0022]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 to 3 schematically show an example of a manufacturing process of a semiconductor device having a single-sided resin-sealed package structure according to an embodiment of the present invention, particularly a resin-sealed process.

FIG. 4 shows a sectional structure of the completed semiconductor device. This semiconductor device has a connection part 1b on one main surface.
A wiring substrate 1 having a wiring 1a including a semiconductor chip 2 mounted face down on one main surface of the substrate,
A resin layer 5 filled with a resin between the chip and the substrate and cured, and led out / exposed to the other main surface side of the substrate,
And an external connection terminal 4 electrically connected to the chip.

Next, an example of steps for bonding the wiring board 1 and the semiconductor chip 2 will be briefly described. As the chip 2, a chip having a bump electrode (for example, a diameter of 100 μm and a height of 30 μm) 2a made of a conductive substance, such as a metal, is prepared on the pad for external connection on the element formation surface. The bump electrodes 2a are, for example, gold bumps formed by electroplating or gold ball bumps formed by ball bonding.

The wiring board 1 has a wiring 1a including a connected portion 1b on one main surface, and is led out and exposed from the connected portion 1b to the other main surface side through the through-hole wiring 3.
The thing provided with the planar type external connection terminal 4 arranged in the shape of a lattice is prepared.

In this example, the substrate 1 has the wiring 1a buried therein so as to be substantially flush with the main surface (planarity is about ± 10 μm). The substrate 1
When forming the connected portion 1b on one main surface, the substrate 1 having the wiring 1a on one main surface is fixed on, for example, the stage of a screen printing machine with a vacuum suction mechanism, and on the substrate 1 the metal of the chip is attached. A flat type connection pad (for example, diameter 150 μm, height 80 μm) 1b is formed in a portion corresponding to the bump electrode 2a. At this time, a conductive paste, for example, a silver paste (silver particle size 1 μm, viscosity 100 ps) is formed on the wiring formation surface of the substrate using a metal mask having openings (for example, 150 μm × 150 μm) corresponding to the bump electrodes 2a of the chip. The connection pad 1b is formed by screen printing.

Next, flip-chip bonding is carried out to mount the chip 2 on the substrate 1 in a face-down type by using a bonding apparatus having a mechanism capable of vacuum-adsorbing the chip 2. In this case, the bump electrodes 2a corresponding to the chip are arranged so as to face the connection pads 1b on the substrate, and the bonding head is pressed down to press-fit the connection pads so that at least the tip portions of the bump electrodes are embedded. Are fixed, and in this state, the silver paste for the connection pad 1b is thermally cured to bond them.

Next, in the state where the chip is flip-chip bonded on the substrate as described above, the resin layer 5 is formed.
To form. The resin layer 5 covers the portion filled between the chip and the substrate (30 to 40 μm in this example), the outer peripheral side upper edge of the chip to the outer peripheral edge of the substrate upper surface, and each outer peripheral side surface of the chip. And a portion having a substantially uniform fillet.

If the size of the substrate 1 is, for example, 15 mm in length and width and 0.2 mm in thickness, and the size of the chip 2 is, for example, 13 mm in length and width and 0.25 mm in thickness, each side of the substrate 1 is assumed. The distance S3 between the outer edge of the chip and the outer edge of the substrate is extremely small (1 mm or less), and when the resin is supplied onto the end of one side of the substrate 1, the resin supply space is narrow, so the resin runs on the top surface of the chip. It is necessary to devise it so that it does not hang down from the substrate end face.

Therefore, in the present embodiment, when the resin is filled, as shown in FIGS. 1 to 3, an auxiliary plate (for example, a rubber plate) 11 for assisting the resin supply is used, and one side thereof is sealed. The step of supplying the resin for molding 5a, and thereafter, one surface of the rubber plate becomes substantially perpendicular to one main surface of the substrate 1, and the portion of the one surface of the rubber plate to which the sealing resin is supplied is the substrate. Step of bringing one side of the rubber plate into close contact with one end surface of the substrate so that the rubber plate is above the main surface, and thereafter, the rubber plate is in a substantially vertical direction along the contact end surface with the substrate. The resin on one side of the rubber plate by pulling the rubber plate away from the substrate by sliding it downwards (or sliding the substrate upwards in a substantially vertical direction along the contact end face with the rubber plate). And the process of supplying this resin to the opening between the chip and the substrate. Comprising.

Then, after the rubber plate is separated from the substrate and the filling of the resin is completed, the filled resin is cured by heat or the like to form a resin layer between the chip and the substrate.
A semiconductor device having a single-sided resin-sealed package structure is completed.

The steps of this embodiment are automatically carried out by using an existing automatic assembly apparatus for semiconductor devices and a newly produced special apparatus. When the sealing resin is supplied to one side of the rubber plate, as shown in FIG. 1, a substantially constant amount is dispensed from the needle 10 onto the one side of the rubber plate by using, for example, a conventional resin supply dispenser. However, as shown in FIGS. 4 (a) and 4 (b),
Using the resin borrowing auxiliary plate 12, after supplying a substantially constant amount of resin from the needle of the dispenser onto the resin borrowing auxiliary plate, the resin feed assisting rubber plate is placed on the upper surface of the resin borrowing auxiliary plate. The resin on the resin borrowing auxiliary plate may be wiped off on one surface of the rubber plate by sliding the lower end surface of 11.

Further, as a material of the rubber plate 11, the resin on the rubber plate has a property of repelling the resin (plasticity) so that the resin can be easily transferred onto the wiring board, and compared with the wiring board. It is desirable to use a material that is flexible and has adhesion to the wiring board. As the rubber plate having the above-mentioned properties, it is desirable to use, for example, silicone rubber when the insulating base material of the wiring board is a ceramic type or a resin type.

As the size of the rubber plate, any thickness can be used, but the width of the rubber plate is on one side of the rubber plate when the rubber plate is slid along the contact end face with the wiring board. By using a resin that is wide enough to prevent the resin from wrapping around to the back side of the rubber plate (for example, one that is wider than the wiring board), it is easy to transfer the resin on the rubber board onto the wiring board. It will be possible to do.

That is, in the method of the above-mentioned embodiment, when the resin is filled between the chip and the substrate, the sealing resin is supplied to one side of the resin-supplied rubber plate, and then one side of the rubber plate is changed to the substrate. The one end surface of the substrate so as to be substantially perpendicular to one main surface of the substrate, and abut the rubber plate, slide the rubber plate along the contact end face with the substrate, and transfer the resin onto the end portion of the substrate.・ Supply to the opening between the substrates.

As a result, even when the distance S3 between the outer edge of the chip and the outer edge of the substrate is small and the resin supply space on the edge of the substrate is narrow, the resin on one side of the rubber plate is transferred onto the edge of the substrate. The resin can be attached to the side surface of the chip near the center of the opening between the chip and the substrate. When the resin adheres to the side surface of the chip in this way, the capillary action of the resin starts, and it becomes possible to flow and fill the resin between the chip and the substrate by utilizing the capillary action of the resin between the chip and the substrate.

Therefore, according to the method of the above-mentioned embodiment, even when the distance between the outer edge of the chip and the outer edge of the substrate is very small, the same dispenser as the conventional one and a needle having a diameter suitable for the properties of the resin used can be used. A stable and reliable supply of a fixed amount of resin between the chip and the substrate can be achieved regardless of the diameter of the package, and the resin does not run onto the top surface of the chip and the resin does not hang down from the substrate end surface. It is possible to prevent the appearance of defects. This makes it possible to improve the yield of semiconductor devices and reduce the cost.

In order to promote the capillary phenomenon,
If a temperature of, for example, about 60 ° C. is applied to the resin-filled portion, the viscosity of the resin is reduced and the resin pouring speed is improved. In addition, the step of filling the resin between the chip and the substrate (after supplying the resin to one side of the rubber plate, the one side of the rubber plate is almost perpendicular to one main surface of the substrate with respect to one end surface of the substrate). Contact with each other in a close contact state, slide the rubber plate along the contact end surface with the substrate, transfer the resin onto the end portion of the substrate, and supply the resin to the opening between the chip and the substrate). It is desirable to carry out in multiple steps.

That is, the amount of resin supplied to the rubber plate at one time is reduced, and first, the resin supplied to the rubber plate at the first time is transferred onto the end portion of the substrate. The resin transferred for the first time is filled between the chip and the substrate due to the capillary phenomenon, and after the amount of the resin on the end portion of the substrate is reduced, the resin supplied for the second time to the rubber plate is transferred over the end portion of the substrate. Such work is repeated.

In this way, the distance between the outer edge of the chip and the outer edge of the substrate is reduced to 0.
Even if the resin supply space on the edge of the substrate is narrowed down to about 2 to 0.3 mm, the amount of resin to be transferred onto the edge of the substrate at one time can be small, so the chip size is large and filling is attempted. Even if the amount of resin to be used is large, it is possible to deal with it.

Further, since the amount of resin supplied at one time between the chip and the substrate is reduced and the resin starts to be filled from the central portion of the opening between the chip and the substrate, voids caused by the air being entrained by the resin are generated. Can be suppressed, and the reliability of the resin layer between the chip and the substrate can be improved.

Further, as described above, when the resin is supplied from the needle, the resin is set to the condition that it exhibits appropriate fluidity, or the liquid resin is used. Further, the resin has a property of alleviating deterioration of the connection portion between the chip and the substrate due to internal stress caused by the difference in the material of the chip and the substrate (Young's modulus, coefficient of thermal expansion, etc.) when formed as a resin layer. And has a diameter that allows it to enter between the chip and substrate when filling it between the chip and substrate (for example, 25 μm
It is desirable to select one containing the following fillers.

Further, in the above embodiment, when the resin is supplied, one rubber plate is brought into close contact with the end face of one side of the substrate and supplied only on one side, but two rubber plates are supplied. The plate may be brought into close contact with the end faces of the two orthogonal sides of the substrate so as to be supplied onto the two sides, respectively. Further, four rubber plates may be provided on the four sides of the chip of the substrate. It is also possible to contact the respective end faces of the above in close contact with each other and supply them to the four side portions.

When the resin filled between the chip and the substrate is cured, the resin may be cured while applying a load to the chip and the substrate to prevent displacement between the bump electrodes of the chip and the connection pads of the substrate. desirable.

Further, if a substrate having a solid wiring pattern formed on the outer peripheral edge portion on one main surface is prepared as the substrate, it is reinforced by the solid wiring pattern when performing the flip chip bonding. By the action, the generation of cracks or warpage of the wiring board is suppressed, the yield of the finished product is improved, and the noise resistance is also improved when the finished product is incorporated into a memory card or the like. Further, the bump electrodes may be formed on the substrate side instead of the chip side.

The substrate and the chip are not limited to have a square outer shape, but may have a rectangular outer shape. Also,
The substrate is not limited to an alumina-based or aluminum nitride-based substrate, and a resin-based substrate (BT resin substrate or the like) may be used. Further, as shown in FIG. 7, the substrate is one in which wiring and external connection terminals are embedded so as to be substantially flush with the substrate (for example, a green sheet method is applied to an alumina-based insulating base material). Or a resin-based insulating base material formed by the prepreg method)
However, as shown in FIG. 6, the wiring and the external connection terminal may be formed so as to project from the substrate. Further, the substrate may have a structure in which the upper and lower surfaces are electrically connected via a blind via hole or a multilayer structure.

Further, when the chip is flip-chip bonded onto the substrate, the method is not limited to the method of press-fitting so that at least the tip end portion of the bump electrode is embedded in the connection pad as in the above-mentioned embodiment, but the above-mentioned Japanese Patent Application No. 6-50757. As described in detail in Section 1), for example, solid phase diffusion may occur between the gold connection pad and the gold bump electrode so as to be joined.

[0048]

As described above, according to the method of manufacturing the semiconductor device of the present invention, when the resin is filled between the chip and the substrate to manufacture the semiconductor device having the single-sided resin-sealed package structure, Even if the distance between the outer edge of the chip and the outer edge of the substrate is very small, you can use the same dispenser as the conventional one and a needle with a diameter that matches the properties of the resin used. Can be suppressed regardless of the diameter, and the single-sided resin-sealed package structure can be further downsized.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing a part of an example of a manufacturing process of a semiconductor device having a single-sided resin-encapsulated package structure according to an embodiment of the method for manufacturing a semiconductor device of the present invention, particularly a resin-sealing process. .

FIG. 2 is a perspective view and a cross-sectional view schematically showing a part of an example of a step that follows the step of FIG.

FIG. 3 is a sectional view schematically showing a part of an example of a step that follows the step of FIG.

4A and 4B are a perspective view and a cross-sectional view showing an example of a semiconductor device formed through the resin sealing process of FIGS.

5 is a perspective view schematically showing a modified example of the process of FIG.

FIG. 6 is a sectional view showing an example of a single-sided resin-sealed package structure according to the prior application.

FIG. 7 is a sectional view showing an example of a single-sided resin-sealed package structure according to another prior application.

FIG. 8 is a diagram showing a process of forming the resin layer of FIGS. 6 and 7;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Wiring board, 1a ... Wiring, 1b ... Connected part (connection pad), 2 ... Semiconductor chip, 2a ... Bump electrode, 3 ... Through hole wiring, 4 ... External connection terminal, 5 ... Resin layer, 5a
… Resin, S3… Distance between chip outer edge and substrate outer edge, 11…
Rubber plate.

Front Page Continuation (72) Inventor Yumiko Oshima 33, Shinisogo-cho, Isogo-ku, Yokohama-shi, Kanagawa Stock Company Toshiba Production Engineering Laboratory

Claims (6)

[Claims] 1. A connected portion of a wiring board having wirings including a connected portion on one main surface, and external connection terminals led out and exposed on the other main surface, and an electrode terminal portion of a semiconductor chip corresponding to the connected portion. The step of arranging the semiconductor chip so that the positions of the semiconductor chips face each other, the step of fixedly connecting the connected part of the wiring board and the electrode terminal part of the semiconductor chip corresponding thereto, and then the semiconductor chip and the wiring board And a step of curing the filled sealing resin, wherein the step of filling the sealing resin uses an auxiliary plate for resin supply assistance. A step of supplying a sealing resin to one surface of the auxiliary board, and thereafter, one surface of the auxiliary plate is substantially perpendicular to one main surface of the wiring board, and The resin-supplied part should be above the main surface of the wiring board. A step of bringing one surface of the auxiliary plate into close contact with at least one end surface of the wiring board; and thereafter, sliding the auxiliary plate downward along the contact end surface with the wiring board, or By sliding the wiring board upward along the contact end surface with the auxiliary plate, the auxiliary board and the wiring board are separated from each other,
A step of transferring the sealing resin on one surface of the auxiliary plate onto the end portion of the wiring board, and supplying the resin to the opening between the chip and the board. Method. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the step of filling the resin between the chip and the substrate is performed in plural times. 3. The method of manufacturing a semiconductor device according to claim 2, wherein when a sealing resin is supplied to one surface of the auxiliary plate,
Using the resin borrowing auxiliary plate, a step of supplying a substantially constant amount of resin on the resin borrowing auxiliary plate from the needle of the resin feeding dispenser, and the resin feeding assisting plate on the upper surface of the resin borrowing auxiliary plate. And sliding the lower end surface of the auxiliary plate to wipe the resin on the resin borrowing auxiliary plate onto one surface of the auxiliary plate for assisting the resin supply, the method for manufacturing a semiconductor device. . 4. The method of manufacturing a semiconductor device according to claim 1, wherein a material of the auxiliary plate for assisting the resin supply is more elastic than that of the wiring board, and the wiring is provided. A method of manufacturing a semiconductor device, which uses a material having good adhesion to a substrate and having a plastic liquid property with respect to the resin. 5. The method of manufacturing a semiconductor device according to claim 4, wherein an auxiliary plate for assisting the resin supply is wider than the wiring board. 6. The method of manufacturing a semiconductor device according to claim 1, wherein the insulating base material of the wiring board is a ceramic type or a resin type, and an auxiliary plate for assisting the resin supply is formed. A method of manufacturing a semiconductor device, characterized in that silicone rubber is used as a material.