JPH08148889A - Automatic electronic component mounting device - Google Patents

Abstract

PURPOSE: To conduct stably an angle swing for positioning the angle of a component in the case where a plurality of suction nozzles are changed over and the component is mounted on a printed board and moreover, to contrive to eliminate a loss of the positioning time of the printed board at the time of the mounting the component. CONSTITUTION: A rotator 30 is rotated by a motor 28; a suction nozzle 14 is positioned at its use position, which is located under the lower part of the rotator 30, to suck and take out an electronic component; the component is conformed to the position of the angle of the component on the basis of mounting data; the nozzle 14 positioned at the use position, which is made to coincide with the center of rotation of the rotor 23 by the rotation of the motor 22, is rotated and the angle of the component is positioned. Then, the component is mounted at a prescribed position on a printed board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses one suction nozzle among a plurality of suction nozzles provided on a plurality of mounting heads provided on the periphery of a rotary table to suck an electronic component. Electronic parts automatic mounting that conveys the parts by intermittent rotation of the table and positions the parts at a predetermined angular position by rotating the suction nozzle about the vertical axis and then mounts the parts at a predetermined position on the printed circuit board. Regarding the device.

[0002]

2. Description of the Related Art A device for automatically mounting electronic components of this kind is disclosed in Japanese Patent Laid-Open No.
As disclosed in Japanese Patent Laid-Open No. 192824/1992, a mounting head provided with a plurality of suction nozzles for sucking an electronic component is rotatably provided around a vertical axis with respect to a rotary table. The head is rotated for switching the nozzles, and is also rotated for positioning the component sucked by the nozzles at a predetermined angular position. Since the rotation for the angular positioning is performed at a predetermined station when the rotary table is stopped, when the mounting speed of the component becomes high, the stop time becomes short, and the angle of the head is swung during this period. I can't do exactly that. Therefore, it is conceivable to mount a motor for rotating the head on the rotary table so that the angular positioning can be performed not only during the stop time.

[0003]

However, in the above-mentioned prior art, since the suction nozzle is eccentric with respect to the center of rotation of the head, the position of the component in the head is different by swinging the angle, especially 180 degrees. When it rotates, it moves the largest distance. However, in many cases, the mounting program is created so that the XY table can move a short distance in the mounting order for mounting the component on the printed circuit board. If the angular position with respect to the head differs from the angular position with respect to the head of the suction nozzle sucking the component to be mounted next by a large angle (for example, 180 degrees), the XY table must be moved more than the movement amount of the mounting program. However, it takes time to position the printed circuit board, which is an obstacle to increasing the mounting speed. In particular, when it is necessary to mount polar parts in order with opposite polarities, the XY table is always longer than the distance to be mounted next to each other because the angular position of the 180-degree suction nozzle with respect to the mounting head always changes. -The bull has to move.

Therefore, according to the present invention, when a plurality of suction nozzles are switched to mount a component, angular swing for angular positioning of the component is stably performed, and there is no loss of time for positioning the printed circuit board during mounting. The purpose is to

[0005]

Therefore, according to the present invention, an electronic component is provided by using one suction nozzle among a plurality of suction nozzles provided in a plurality of mounting heads provided at the periphery of a rotary table. The component is picked up and conveyed by intermittent rotation of the table, and the component is positioned at a predetermined angular position by rotation of the suction nozzle about the vertical axis, and then the component is mounted at a predetermined position on the printed circuit board. In the automatic electronic component mounting apparatus, a rotary drive source for rotating the mounting head around a vertical axis is mounted on a rotary table, and a desired suction nozzle of the suction nozzles of the suction nozzles is mounted at the center of rotation of the head by the rotary drive source. Nozzle position switching means for arranging so that the axes coincide with each other is provided.

Further, according to the present invention, one of the plurality of suction nozzles provided in the mounting heads provided at the periphery of the rotary table is used to suck the electronic component to suck the electronic component. An XY table that conveys the component by intermittent rotation and angularly positions the component at a predetermined angular position by rotating the suction nozzle about the vertical axis and then mounts the substrate at a predetermined position on the printed circuit board. In an electronic component automatic mounting apparatus that moves and positions to mount the component, a rotary drive source that rotates a mounting head around a vertical axis is mounted on a rotary table, and the plurality of suction nozzles are mounted around a horizontal axis. Nozzle position switching means is provided to rotate and switch the desired suction nozzle so that its axis coincides with the center of rotation of the head by the rotation drive source.

Further, according to the present invention, one of the plurality of suction nozzles provided in the mounting heads provided at the periphery of the rotary table is used to suck the electronic component to suck the electronic component. In an electronic component automatic mounting device that conveys the component by intermittent rotation, positions the component at a predetermined angular position by rotating the suction nozzle about a vertical axis, and then mounts the component at a predetermined position on a printed circuit board, A drive motor that is mounted on the rotary table and that rotates the mounting head directly on its output shaft;
Nozzle position switching means is provided to position the drive motor so that the axis of the desired suction nozzle of the suction nozzles coincides with the center of rotation of the head.

The present invention also provides the mounting head with the nozzle position switching means.

[0009]

According to the structure of the present invention, the nozzle position switching means switches the desired suction nozzle so that the shaft center coincides with the rotation center of the mounting head, and the rotary drive source is rotating or stopping the rotary table. Then, the mounting head is rotated to position the component to be sucked by the suction nozzle at a predetermined angular position, and then the component is mounted on the printed circuit board.

According to the structure of claim 2, the nozzle switching means installs a desired suction nozzle among the plurality of suction nozzles around the horizontal axis so that the center of rotation of the mounting head coincides with the axis. When the rotary drive source rotates and the rotary head rotates the mounting head to position the component of the suction nozzle at a predetermined angular position, the XY table mounts the substrate on the substrate. It is moved so as to be positioned at a predetermined position and then mounted on a printed circuit board.

According to the third aspect of the present invention, the nozzle position switching means switches the desired suction nozzle so that the axis center coincides with the rotation center of the mounting head, and the drive motor is operated while the rotary table is rotating or stopped. The mounting head is directly rotated on the output shaft to position the component to be sucked by the suction nozzle at a predetermined angular position, and then the component is mounted on the printed circuit board.

According to the structure of claim 4, the nozzle switching means switches the desired suction nozzle during rotation or stop of the rotary table so that the axis center coincides with the rotation center of the mounting head, and the rotation drive source is set. While the rotary table is rotating or stopped, the mounting head is rotated to position the component of the suction nozzle at a predetermined angular position and then mount the component on the printed circuit board.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. In FIG. 2, 1 is a Y table that moves in the Y direction by the rotation of the Y-axis motor 2, and 3 is a result that results from moving in the X direction on the Y table 1 by the rotation of the X-axis motor 4. An XY table that moves in the XY directions, and a printed circuit board 6 on which a chip-shaped electronic component 5 (hereinafter referred to as a chip component or a component) is mounted is fixedly mounted on a fixing unit (not shown).

Reference numeral 7 denotes a supply table, on which a large number of component supply devices 8 for supplying the chip components 5 are arranged. Reference numeral 9 denotes a supply base drive motor, which rotates the ball screw 10 so that the supply screw 7 is fitted to the linear guide 1 via a nut (not shown) fixed to the supply base 7.
It is guided by 2 and moves in the X direction. Reference numeral 13 is a rotary table that rotates intermittently, and mounting heads 15 having a plurality of suction nozzles 14 are arranged at equal intervals on the outer edge of the table 13 in accordance with the intermittent pitch, as described later.

The mounting head 15 at which the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 (the position marked with a black circle in the upper part of FIG. 2) is the suction station I, and the suction station I is used for mounting. When the head 15 descends, the suction nozzle 14 sucks the component 5. Reference numeral II denotes a recognition station in which the mounting head 15 that has picked up the component 5 stops due to intermittent rotation of the rotary table 13, and an image is taken by the component recognition camera 16 for recognizing the positional deviation of the component 5 with respect to the suction nozzle 14.

Reference numeral III denotes a mounting station (a position marked with a black circle in the lower part of FIG. 2) at which the mounting head 15 stops to mount the component 5 suction-held by the suction nozzle 14 on the printed circuit board 6. The component 5 is mounted on the printed circuit board 6 stopped at a predetermined position by the movement of the XY table 3 due to the lowering of the mounting head 15 mounted on the elevating shaft 17 penetrating the table 13.

The mounting head 15 will be described below with reference to FIG. Reference numeral 21 denotes a mounting plate provided on the lower portion of the elevating shaft 17, and a pulse motor 22 as a rotation drive source and a drive motor is mounted on the mounting plate 21. The motor 22 comprises a rotor 23 as an output shaft and a stator 24, and the rotor 23 is rotatable in the stator 24 about a vertical axis. Hereinafter, this rotation direction is referred to as the θ direction. A mounting arm 26 is formed so as to extend below the rotor 23. The arm 2
A motor 28 as a nozzle position switching means is attached to 6, and the extended other end of the rotor 29 of the motor 28 is rotatably supported by the other end of the arm 26.
Further, the rotor 30 is fixed to the rotor 29, and the rotor 29 is rotated together with the rotor 29 by the rotation of the rotor 29 extending in the horizontal direction. A plurality of suction nozzles 14 are erected on the rotating body 30 at predetermined angular intervals in the rotating direction thereof in a direction orthogonal to the axial direction of the rotor 29. The respective suction nozzles 14 have different diameters or shapes so that different components 5 can be suctioned. The mounting head 26 is constituted by the mounting arm 26, the motor 28, the rotating body 30, and the like.

A vacuum suction passage 32 is connected to the inside of the rotating body 30 from each of the suction nozzles 14. A vacuum passage 33 is provided inside the arm 26, and the vacuum suction passage 32 of the suction nozzle 14 which is positioned vertically downward by the rotation of the rotating body 30 communicates with the nozzle 14 at other positions. The position is referred to as a use position so as not to communicate with each other. When the nozzle 14 is in the use position, the axial center of the nozzle 14 coincides with the rotation center of the rotor 23. That is, the lower end surface of the nozzle 14 is often circular, but if it is circular, its center coincides with the center of rotation.

Since the vacuum passage 33 communicates with the vacuum tube 36 at the upper end of the rotor 23 via the rotary joint 35, the vacuum tube 36 is not twisted by the rotation of the rotor 23. The vacuum tube 36 communicates with a vacuum source (not shown) via a valve (not shown). The drive cable 34 to the motor 28 is connected to the rotor 2
3 and the stator 24 provided with a slip ring 37
Is connected to the motor 28 via the inside of the rotor 23.

Next, the control block of the electronic component automatic mounting apparatus of this embodiment will be described with reference to FIG. Reference numeral 39 denotes a CPU, which controls various operations relating to mounting of the chip component 5 in accordance with programs stored in the ROM 41 based on various data stored in the RAM 40. Further, the Y-axis motor 2, the X-axis motor 4, the pulse motor 22 and the motor 28, which are the control targets of the CPU 39, CPU 39 via the interface 43 and the drive circuit 44.
It is connected to the.

The RAM 40 further stores mounting data as shown in FIG. 4 for each type of the printed circuit board 6, and supplies components at positions on the supply base 7 indicated by reel numbers in the order of the steps of the data. The component 5 is taken out from the device 8 and mounted on the coordinate position of the printed circuit board 6 indicated by “X” and “Y” at the angular position indicated by “θ” which is the mounting angle data. If the mounting head 15, that is, the suction nozzle 14 rotates in the θ direction by the rotation of the rotor 23, the chip component 5 taken out from the component supply device 8 by the mounting angle data becomes the angular position to be mounted if the suctioned posture is correct. It is done like this.

The operation of the above configuration will be described below. First, an operation unit (not shown) is operated to start automatic operation of the electronic component automatic mounting device. First, suppose that the component 5 to be mounted in the initial step of the mounting data is mounted on the substrate 6 as shown in FIG. 5, that is, the component 5 has polarity and is adjacent to each other in the mounting order. Part 5
Is directed in the opposite direction, the nozzles 14 of the mounting head 15 for sucking these components 5 to be used before the mounting head 15 reaches the suction station I by the rotation of the rotary table 13. By the rotation of the motor 28, the motor 28 is positioned in a downward position, which is a use position. This nozzle 14 is selected by the nozzle 1 for each type of component 5 to be mounted.
The four types are stored in the RAM 40 and are selected and selected.

Next, the head 15 is moved to the adsorption station I.
In accordance with step 1 of the mounting data stored in the RAM 40, the supply table 7 moves and the chip parts 5 to be supplied are supplied.
The component supply device 8 stops at the suction position of the suction nozzle 14 at the use position of the suction station I, and the head 15 is lowered to lower the nozzle 14, so that the chip component 5 is sucked and taken out.

Next, the rotary table 13 intermittently rotates through an index mechanism (not shown), the head 15 holding the chip component 5 moves to the next station and stops, and further rotates to go and recognize. -Move to Section II. Next, the suction nozzle 1 is picked up by the component recognition camera 16.
The chip component 5 adsorbed by 4 is recognized.

When the displacement of the component 5 with respect to the center of rotation of the nozzle 14 is recognized, correction is performed based on the recognition result, and the pulse motor 22 is operated so that the component 5 faces the direction shown in step 1 of the mounting data. The rotor 23 is driven to rotate. Since the nozzle 14 is located at the center of rotation, the angular positioning is performed with almost no positional deviation of the component 5 with respect to the mounting head 15.

During this time, the rotary table 13 intermittently rotates to reach the mounting station III, and the chip component 5 whose angular positioning has been completed is placed on the printed board 6 positioned by the movement of the XY table 3 at the left end in FIG. Wear as shown. Similarly, the recognition station I for the component 5 in step 2 of the mounting data that is attracted to the next head 15 is also recognized.
It is recognized by I and is rotated to the angular position of 180 degrees which is the angular position shown in step 2. Parts feeder 8
Since the component 5 taken out from is always facing the same direction, it is necessary to rotate it by 180 degrees. Further, since all the components 5 in FIG. 5 are supplied from the same component supply device 8, the supply base 7 is stopped during this period,
Does not reduce the mounting speed. In this case, since the component 5 is located substantially at the rotation center position of the rotor 23 even when rotated by 180 degrees, the mounting station III
Then, the XY table 3 is moved and positioned by the distance between the components shown in FIG. 5, and the component 5 is mounted.

Hereinafter, even after the next step 3 or later, the mounting step is performed.
In section III, the XY table 3 need only move by the distance between the components 5, and can move in a short time, and therefore the rotary table 13 can be intermittently rotated at high speed to mount the components. Next, when sucking different types of components 5, the rotating body 30 is rotated by the motor 28 before the suction station I is reached and the desired suction nozzle 14 is positioned at the use position. The component 5 is taken out from the supply device 8, and thereafter the component 5 is mounted on the substrate 6 in the same manner.

In the present embodiment, the parts having polarity are close to each other at each step, but they are close to each other regardless of the presence / absence of polarity, and the mounting angle data is large at each step ( Even if they are different (for example, about 90 degrees), the nozzle 14 is located at the center of rotation, so there is no loss of movement of the XY table 3. Further, in this embodiment, the arm 26 is formed on the rotor 29 as the output shaft, that is, the mounting head 15 is fixedly formed on the lower end portion of the rotor 29, and the mounting head 15 is directly rotated by the rotor 29. Although it was a thing, the rotor 2 can be directly rotated.
9 and the arm 26 may not be integrally formed as in the present embodiment, but the portion corresponding to the arm 26 may be attached to the rotor with a bolt or the like. Further, instead of directly rotating the mounting head 15 on the rotor 29, a structure in which a motor is mounted on a rotary table and the mounting head is rotated via a belt or a gear between the output shaft of the motor and the mounting head. Although it is good to rotate directly on the output shaft, the overall weight will be lighter and more compact, and the rotation of the rotor will be transmitted with less loss such as backlash, and accurate and accurate angular positioning will be achieved. Is done.

[0029]

As described above, according to the present invention, the nozzle switching means switches the suction nozzle to the center of rotation of the head while making its axis coincide with each other, and the rotary drive source moves the mounting head while the rotary table is moving. Also, since the suction nozzle can be rotated and the position of the suction nozzle with respect to the head does not change, it is possible to prevent time loss due to rotation of the head for positioning the printed circuit board.

If the mounting head is directly rotated by the output shaft of the drive motor, the loss can be reduced and the components can be angularly positioned with high accuracy. Further, since the nozzle switching means is provided in the head, the suction nozzle can be switched even while the rotary table is moving.

[Brief description of drawings]

FIG. 1 is a partially cutaway side view showing a mounting head.

FIG. 2 is a plan view of an electronic component automatic mounting device.

FIG. 3 is a control block diagram of an electronic component automatic mounting device.

FIG. 4 is a diagram showing mounting data.

[Explanation of symbols]

 3 XY Table 5 Chip Electronic Parts (Electronic Parts) 6 Printed Circuit Board 13 Rotary Table 14 Adsorption Nozzle 15 Mounting Head 22 Pulse Motor (Rotation Drive Source, Drive Motor) 28 Motor (Nozzle Position Switching Means)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location B65G 47/86 H 47/91 B H05K 13/02 F

Claims (4)

[Claims] 1. An electronic component is sucked by using one suction nozzle of a plurality of suction nozzles provided in a plurality of mounting heads provided on the periphery of a rotary table, and the table is intermittently rotated by the intermittent rotation. In an electronic component automatic mounting apparatus that conveys the component and positions the component at a predetermined angular position by rotating the suction nozzle about a vertical axis and then mounts the component at a predetermined position on the printed circuit board, A nozzle position in which a rotary drive source for rotating around a vertical axis is mounted on a rotary table, and a shaft center of a desired suction nozzle among the suction nozzles is aligned with a rotation center of a head by the rotary drive source. An electronic component automatic mounting device, characterized in that switching means is provided. 2. An electronic component is sucked by using one suction nozzle of a plurality of suction nozzles provided in a plurality of mounting heads provided at the periphery of the rotary table, and the table is intermittently rotated by the intermittent rotation. The component is conveyed and the suction nozzle is rotated about the vertical axis to position the component at a predetermined angular position, and then the XY table for mounting the substrate on the predetermined position of the printed circuit board is moved. In an automatic electronic component mounting apparatus that positions and mounts the component, a rotary drive source that rotates a mounting head about a vertical axis is mounted on a rotary table, and the plurality of suction nozzles rotate about a horizontal axis. The electronic component is characterized in that a nozzle position switching means is provided for arranging the suction nozzle desired to be switched so that the axis center thereof coincides with the rotation center position of the head by the rotation drive source. Automatic mounting device. 3. An electronic component is sucked by using one suction nozzle of a plurality of suction nozzles provided in a plurality of mounting heads provided at the periphery of the rotary table, and the table is intermittently rotated by the intermittent rotation. In the electronic component automatic mounting apparatus, which conveys the component and positions the component at a predetermined angular position by rotating the suction nozzle about a vertical axis, and then mounts the component at a predetermined position on a printed circuit board, the rotary table. And a position where a shaft center of a desired suction nozzle of the suction nozzles coincides with a center of rotation of the head driven by the drive motor and a driving motor that directly rotates the mounting head on its output shaft. An electronic component automatic mounting device, characterized in that a nozzle position switching means is provided. 4. The electronic component automatic mounting apparatus according to claim 1, wherein the nozzle position switching means is provided on a mounting head.