JPH0814847A - Lead inspection device and method therefor - Google Patents

Abstract

PURPOSE:To provide a lead inspection device capable of performing highly accurate inspection with a semiconductor device package housed in a tray, regarding semiconductor device inspection. CONSTITUTION:This device has a tray 1 with a window 2 to allow the irradiation of light from a lower position toward a lead, when a semiconductor device package is housed, as well as a scanner 8 to detect the position of the lead via the irradiation of light from a position under the tray 1 toward the lead surrounding area of the housed package via the window 2.

Description

Detailed Description of the Invention

[0001]

[Industrial application] In the inspection of semiconductor devices,
The present invention relates to lead inspection of semiconductor device packages.

[0002]

2. Description of the Related Art When manufacturing a semiconductor device, inspection is performed at the final stage. One of the inspection processes is a lead inspection of a semiconductor device package.

FIG. 4 shows an example of inspection items for conducting a lead inspection. FIG. 4A shows a floating (COP) inspection. IC
The package 5 includes a package body 6 and a large number of leads 3.
It consists of 1. Since each lead 31 is arranged on a predetermined plane and is attached to the package body 6 without floating, it is possible to perform good soldering or the like on the wiring board.

On the other hand, since the lead 32 is attached to the package body 6 while being floated from the above-mentioned plane, it cannot be brought into good contact with the substrate. this is,
Since it causes soldering failure, it is rejected (NG) in the inspection process.

FIG. 4B shows a bend (BENT) inspection. If the leads are attached to the package body 6 without bending, the tips of the leads are arranged at substantially equal intervals. However, since the leads 33 are bent and attached to the package body 6, the ends of the leads are not evenly spaced. When placed on a wiring board, these leads are easily separated from predetermined positions such as islands on the board. This also causes defective soldering, so it is rejected in the inspection process.

FIG. 4C is an inspection of the pitch (PIT) indicating the lead interval. A plurality of leads 7 are attached to the package body 6. The pitch 34 is an interval between the leads, and for example, the pitch has a specification of 0.5 mm. At this time, if the pitch is in the range of 0.45 to 0.55 mm, the inspection is passed, and if it is out of the range, it is rejected.

FIG. 4D shows a standoff (STAND).
-OFF) inspection. Standoff is essentially the difference in height between the bottom surface of the package body and the bottom surface of the lead, but the relative positional relationship between the lead and the package body is almost fixed, so the standoff can be measured even at the root and tip of the lead. Can be estimated. Therefore, in this specification, an amount indirectly indicating a standoff is called a temporary standoff.

The leads 7 are attached to the package body 6. The temporary standoff 37 is, for example, the lead 7
It is measured by irradiating laser beams 41 and 42 from a scanner provided above the.

The laser light 41 is applied to the vicinity of the root of the lead 7, and the reflected light is again received by the scanner and measured, whereby the distance from the scanner to the shoulder 35 of the package can be calculated. The laser light 42 is applied to the vicinity of the tip of the lead 7, and the reflected light is measured, so that the distance from the scanner to the upper end 36 of the footprint can be calculated.

A temporary standoff 37 is obtained by obtaining the difference between the distance to the upper end 36 of the footprint and the distance to the shoulder 35. That is, the temporary standoff 37
Is the distance between the shoulder 35 and the upper end 36 of the footprint. In the inspection, if the temporary standoff 37 is equal to or less than the predetermined distance, it is rejected.

Usually, a plurality of packages are stored in one tray, and each package is taken out from the tray and transferred to an inspection table, and then the above-mentioned inspection is performed. However, when transferring the package from the tray to the inspection table, it may cause damage such as deforming the package, or the alignment (positioning) when placing the package on the inspection table is difficult, so special alignment Equipment is required.

Therefore, there is also known an inspection apparatus which can inspect the package while it is stored in the tray. If the inspection can be performed while the package is stored in the tray, it is not necessary to transfer the package and the above-mentioned drawbacks are eliminated.

FIG. 5 is a schematic view showing a lead inspection method which is performed while the package remains on the tray. The package 56 includes a package body 57 and leads 58 attached to the package body 57, and is housed on the tray 55. The scanner 51 has a light emitting unit 52 and a light receiving unit 53. The light emitting unit 52 emits a laser beam toward the object to be measured, and the light receiving unit 53 receives the reflected light from the object and calculates the distance to the object by the triangulation method. The scanner 51
By irradiating the lead 58 with laser light from above and measuring the distance, inspections such as floating, bending, pitch, and standoff are performed.

If the package 56 is still stored in the tray 55, the condition (position) of the surface of the lead 58 can be inspected by measuring the distance from above with the scanner 51. The condition (position) cannot be inspected.

In the standoff inspection shown in FIG. 4D, the temporary standoff 37 can be measured by scanning the lead 7 with the laser beams 41 and 42 from above. However, the measurement of the temporary standoff 37 is performed under the assumption that the plate thickness of the lead is constant from the root to the tip. Therefore, if the plate thickness and the shape of the lead are different, the value of the temporary standoff 37 cannot be used as a judgment material as it is, which is not preferable.

Originally, the lower end 38 of the footprint is
However, since it becomes the contact surface with the substrate, the bottom end of the footprint 3
It is desirable to measure 8 positions. Temporary standoff 3
7 does not consider the thickness of the lead thickness 39 between the upper end 36 and the lower end 38 of the footprint, so that the reliability in inspection is low.

[0017]

When the lead inspection is performed while the package is housed in the tray, only the position of the lead surface can be measured, so that the lower end of the footprint (lead contact surface) cannot be measured. Further, the thickness of the lead affects the inspection such as floating. The measurement of the standoff must be the distance between the shoulder and the top of the footprint. If the IC package is inspected while being housed in the tray in this way, the inspection accuracy will be low.

An object of the present invention is to provide a lead inspection apparatus capable of performing a highly accurate lead inspection while the package is stored in the tray.

[0019]

SUMMARY OF THE INVENTION A lead inspection apparatus of the present invention comprises a tray having a window through which a lead can be irradiated with light when a semiconductor device package is accommodated, and a tray which passes through the window from below the tray. And a scanner for detecting the position of the lead by irradiating the periphery of the lead of the accommodated package with light.

[0020]

[Operation] By providing the tray with a light-transmittable window,
Since it is possible to illuminate the leads of the package from below through the window, it is possible to inspect the lead contact surface.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a schematic view showing a lead inspection method according to an embodiment of the present invention. The package 5 includes a package body 6 and leads 7 attached to the package body 6. For example, the package 5 includes a SOP (small outline line).
CQage), QFP (quad flat pack)
age), PLCC (plastic leded)
chip carrier), TCP (tape-ca)
It is a package type such as a packager.

The SOP is a surface mount package, and has gull wing-shaped leads on the package body 2.
It is a type that is attached to the side. The QFP is a type in which gull wing-shaped leads are attached to four side surfaces of the package body.

PLCC is a type in which J-shaped leads are attached to four side surfaces of the package body. T
CP is a package type that connects the chip and the inner lead of the TAB tape using TAB technology.
Suitable for thin packages and high pin count. TAB is a connection method in which inner lead bonding is performed using a Cu thin film pattern formed on a tape.

The package 5 is stored on the tray 1. The lead 7 is guided to the convex portion 4 of the tray 1. The lead 7 and the package body 6 are scanned by the scanner 8 from below with the tray 1 interposed therebetween. The laser light emitted from the scanner 8 is reflected by the mirror surface 9, passes through the slit 2 of the tray 1, and reaches the back surface of the lead 7. Further, the laser light emitted from the scanner 8 passes through the circular hole 3 provided in the tray 1 and reaches the back surface of the package body 6.

The light reflected from the lead 7 or the package body 6 is reflected by the mirror surface 9 and reaches the scanner 8.
The scanner 8 receives the reflected light to calculate the distance to the lead 7 or the package body 6 by triangulation calculation.

The scanner 8 is mounted on the scanner base 10. Since the scanner base 10 can freely move on a plane, it is possible to measure the distance to a desired lead or package body.

FIG. 1B shows a standoff measurement method performed by the lead inspection of this embodiment. The lower end 11 of the footprint is scanned by the laser beam 14 from below, and the position is detected. Similarly, the lower end 12 of the package body is also scanned from below by the laser beam 15 to detect the position.

The standoff 13 is obtained by calculating the distance between the detected lower end 11 of the footprint and the lower end 12 of the package body. The conventional temporary standoff 37 of FIG. 4D depends on the thickness and shape of the lead because of the distance between the shoulder 35 and the upper end 36 of the footprint. Since the measured standoff 13 is obtained by laser scanning from below, highly reliable inspection can be performed without affecting the lead plate thickness or the lead shape.

Similarly, the floating, bending, and pitch inspections shown in FIGS. 4A to 4C can be inspected without affecting the lead plate thickness or the lead shape by laser scanning from below. .

FIG. 2 is a plan view showing an example of the surface structure of a tray on which a package is placed. The tray 1 is a tray for mounting a package in which leads are attached to four side surfaces or two side surfaces of the package body.

The tray 1 has a punched slit 2 and a circular hole 3. Slit 2 is 4 on the package body
The lower end of the footprint of the lead protruding from the side surface is punched out at four places so that the laser scanning can be performed from below.
The circular hole 3 is punched out in a circular shape so that the lower end of the package body can be laser-scanned from below.

The convex portion 4 projects upward on the tray 1 and supports the root portion of the lead when the package is stored. The above describes the case where the distance between the lead and the package body is measured by the triangulation method using a scanner that has both a light emitting unit and a light receiving unit. When measuring off, a measurement method using transmitted light can be used.

FIG. 3 is a schematic view showing an inspection method using transmitted light. Since the tray 1 has the slits 2,
The laser light emitted from the light emitting portion 21 above the lead 7 can reach the light receiving portion 22 through the slit 2. The laser light does not reach the light receiving portion 22 if it is shielded by the lead 7, and reaches the light receiving portion 22 if it is not shielded by the lead 7, so that the in-plane position of the lead 7 can be detected. As a result, it is possible to inspect the bending of the leads and the pitch. In addition, the floating of the leads can be inspected by tilting the incident light.

By providing the slits in the tray, it becomes possible to perform an inspection utilizing transmitted light. The type that uses transmitted light has a higher utility value because it can measure with higher accuracy than the type that uses reflected light such as triangulation.

The positions of the light emitting portion and the light receiving portion are not limited, and the light emitting portion may be provided below the lead 7 and the light receiving portion may be provided above the lead 7. As described above, by providing the slit in the tray, laser scanning can be performed from below the lead, and the lower end of the footprint (lead contact surface) can be measured. Further, in the standoff measurement, highly reliable measurement values can be obtained regardless of the lead plate thickness and the lead shape.

The slit or circular hole provided in the tray has been described as a punched type, but the slit or circular hole may be any window that allows light to pass through, and may be made of a transparent resin such as polystyrene. Good.

The present invention has been described above with reference to the embodiments.
The present invention is not limited to these. For example, it will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

[0038]

As described above, according to the present invention,
By providing the tray with a light-transmissive window, it is possible to irradiate the package leads from below with the package stored in the tray, so that the lead plate thickness and lead shape are not affected. Lead inspection can be performed.

[Brief description of drawings]

FIG. 1A is a schematic diagram showing a lead inspection method according to an embodiment of the present invention, and FIG. 1B shows a standoff measurement method performed by the lead inspection of the present embodiment. It is a schematic diagram showing.

FIG. 2 is a plan view showing an example of a surface configuration of a tray on which a package is placed.

FIG. 3 is a schematic diagram showing a method of lead inspection using transmitted light.

FIG. 4 shows an example of inspection items for performing a lead inspection. FIG.
(A) is an inspection of floating (COP), FIG. 4 (B) is an inspection of bending (BENT), FIG. 4 (C) is an inspection of pitch (PIT) indicating a lead interval, and FIG. 4 (D) is a standoff. It is the schematic which shows the inspection of (STAND-OFF).

FIG. 5 is a schematic view showing a conventional lead inspection method which is performed with a package placed on a tray.

[Explanation of symbols]

1 tray, 2 slits, 3 circular holes,
4 convex parts, 5 package, 6 package body, 7 lead, 8 scanner, 9 mirror surface,
10 Scanner Stand, 11 Footprint Lower End, 12 Package Body Lower End, 13 Standoff, 14, 15 Laser Light, 21 Light Emitting Section, 22 Light Receiving Section, 34 Pitch, 35
Shoulder, 36 top of footprint, 37
Temporary standoff, 38 foot print bottom,
39 lead thickness, 41, 42 laser light, 51
Scanner, 52 light emitting part, 53 light receiving part,
55 trays, 56 packages, 57 package bodies, 58 leads

Claims (6)

[Claims] 1. A tray for accommodating a semiconductor device package, which has a window (2) through which a lead can be irradiated with light when the semiconductor device package is accommodated. 2. The lead inspection tray according to claim 1, further comprising a window (3) capable of irradiating the package body with light from below when the semiconductor device package is stored. 3. A tray (1) having a window (2) through which a lead can be irradiated with light when a semiconductor device package is accommodated, and a package accommodated through the window from below the tray. A lead inspection apparatus having a scanner (8) for detecting the position of the lead by irradiating the periphery of the lead with light. 4. The tray includes a window (3) capable of irradiating a package body with light from below when a semiconductor device package is stored therein, and the scanner passes from the bottom of the tray through the two windows. The lead inspection apparatus according to claim 3, wherein the standoff is measured by irradiating the leads and the package body of the housed package with light. 5. A lead inspection method using a tray (1) having a window (2) capable of irradiating a lead with light from the lower side when a semiconductor device package is housed therein. And a lead inspection method including a step of detecting the position of the lead by irradiating the periphery of the lead of the accommodated package with light. 6. A tray (1) having a lead window (2) capable of irradiating a lead with light from below when a semiconductor device package is housed and a body window (3) capable of irradiating a package body with light. A lead inspection method used, comprising: measuring the standoff by irradiating the leads and the package body of the housed package with light from below the tray through the lead window and the body window. Item 5. The lead inspection method according to item 5.