JPH08148250A - Thermal pressure connection machine - Google Patents

Abstract

PURPOSE: To improve the tape sticking position precision independently of unevenness of substrate setting by workers and of the precision of outer size of substrates by installing a rotary guide and a straight line guide for a table, a CCD camera, and a visual sensor. CONSTITUTION: When a pulse motor 8 movable in y-axis is driven, a table 6 moves in y-direction along a straight line guide 9. Also when a pulse motor 7 for rotary guide is driven, the table 6 rotates on a Θ rotary axis in the y-axis base 15. A rotary substrate 3 on the table 6 is conformed with an anisotropic conductive tape 1 by such movement in y-direction and on the Θ rotary axis. Meanwhile, a CCD camera 10 reads out a mark 4 for positioning marked in both ends of the substrate 3. As a result, it is sufficient that a worker sets the substrate 3 on the table 6 and the mark 4 comes in the visual field of the camera 10 and careful work needed in a conventional method becomes unnecessary and the workability is thus improved and the cost of the substrate 3 can be lowered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression bonding machine for sticking an anisotropic conductive tape on a substrate or the like.

[0002]

2. Description of the Related Art A conventional tape-bonding thermocompression bonding machine sets a circuit board on a table and advances the table to a tape-bonding position where the tape is pulled out along one side of the board while maintaining an appropriate tension. The tape is placed on the circuit board and the heating / pressurizing head is lowered at that position to thermo-compress the tape to the circuit board. The method of aligning the tape with the circuit board is provided on the table. Moreover, the positioning was performed only by moving the outer peripheral stopper of the substrate and the table back and forth.

[0003]

In the above conventional method, the positional accuracy of the tape attached to the circuit board placed on the table with respect to the circuit board depends on the variation in the position when the circuit board is set on the table ( Since the variation of the working method of the operator) and the accuracy of the outer peripheral dimension of the circuit board are inevitably included, the operator must be careful when setting the board on the table, and the outer peripheral dimension accuracy of the board is improved. Otherwise, the tape sticking position accuracy could not be improved. The present invention provides a thermocompression bonding machine that improves the tape sticking position accuracy irrespective of the operator's variation of the board set and the accuracy of the outer peripheral dimension of the board.

[0004]

According to the present invention, a table on which a circuit board is placed and fixed, a rotation guide for the table which can rotate in a horizontal plane and can be stopped at an arbitrary angle, and the table can be moved in the front-back direction. Then, the linear guide that can be stopped at any position, the CCD camera that reads the alignment mark attached to the circuit board, and the image of the mark captured by the CCD camera are recognized to set the mark position to a predetermined position. The present invention relates to a thermocompression bonding machine for attaching an anisotropic conductive film to a circuit board, which is equipped with a visual sensor for moving it to a position. In the present invention, a glass substrate, a board substrate or the like is used as the circuit board.

In the present invention, the movement of the Y-axis (front-back direction) of the table on which the circuit board is mounted and fixed is controlled by using a pulse motor so that the table can be stopped at an arbitrary position (linear guide). Further, the rotation of the θ axis (the rotation direction in the horizontal plane) is controlled on the base of the Y axis by using another pulse motor so that the rotation can be stopped at an arbitrary angle (rotation guide). Further, in order to recognize the position of the circuit board placed on the table, the CCD camera that projects the alignment marks attached to both ends of the circuit board and the image of the camera are recognized, and the recognized alignment mark is predetermined. The table is equipped with a visual sensor for controlling the Y movement amount and the θ movement amount so as to match the tape attachment position. Two CCD cameras may be installed to read the marks on both ends of the substrate, or one camera may be automatically moved in the X direction (horizontal direction) to sequentially recognize the left and right marks.

[0006]

[Function] The θ-axis rotation is such that the inclination of the substrate (rotational deviation from the tape position in the horizontal plane) determined by the alignment marks on the left and right sides of the substrate is rotationally moved to a position parallel to the tape (θ correction ). In the Y-axis movement, the Y coordinate of the mark after θ correction is moved to the reference position (the position where the tape and the alignment mark match) (Y correction).
The amounts of the θ correction and the Y correction are controlled by driving the pulse motors of the θ axis and the Y axis by instructing the movement amount by the image recognition of the mark by the visual sensor. The positions of the marks after the θ correction and the Y correction are deviated in the X direction (left and right), but the inclination and the front and rear positions are aligned with the tape position. Then, from the reference position (camera position) to the tape position (tape attachment position)
The Y-axis is moved to and the tape is pulled out and attached.

[0007]

Next, embodiments of the present invention will be described. 1 is a plan view of a table portion of a thermocompression bonding machine according to an embodiment of the present invention, and FIG. 2 is a side view of FIG. In the figure, reference numeral 1 is an anisotropic conductive tape, which is pulled out from a tape reel 2 by a tape pull-out grip 12, held by a tape holding grip 13, and thermocompression-bonded to a circuit board 3 by a heating / pressurizing head 11 and then cuts the tape. It is cut by the cutter 14. Tape 1
Is pulled out to the same position every time. The circuit board 3 is manually set along the outer peripheral stopper 5 provided on the table 6 and fixed to the table 6 by vacuum suction. When the Y-axis moving pulse motor 8 is driven, the table 6 moves in the Y direction along the linear guide 9. When the rotation guide pulse motor 7 is driven, the table 6 is moved to the Y-axis base 1
Rotate on the rotation axis of 5 above θ. in this way,
By moving Y and θ, the circuit board 3 on the table 6 is aligned with the tape 1. On the other hand, the CCD camera 10 has a circuit board 3
Read the alignment marks 4 attached to both ends of. As a result, the mark can be aligned with the tape instead of aligning the outer periphery of the substrate with the tape as in the conventional case.

Temporary crimping machine AC-S manufactured by Hitachi Chemical Co., Ltd.
An example implemented based on I300 will be described. A Megatorque motor EM type manufactured by NSK Ltd. was used for the θ-axis rotation. Y-axis movement is Oriental pulse motor EM569
NA and driver UDX-5114 were used. HV / R-3 manufactured by Hitachi, Ltd. was used as a visual sensor, and two CS3130L manufactured by Tokyo Denshi Kogyo were used as CCD cameras.
The CCD camera is installed above the glass circuit board,
The coaxial epi-illumination allows you to observe the marks on the board simultaneously on the left and right. If the board size changes, adjust the camera interval to handle it. The magnification on a 9-inch monitor is 40 times. After the left and right marks are image-recognized and θ correction and Y correction are performed, the marks are aligned with the reference position, and then a certain distance is moved from the reference position to the tape attachment position in the Y direction to attach the marks.

[0009]

By applying the θ-axis rotation to the table, the inclination of the substrate can be made parallel to the tape with reference to the alignment mark of the substrate. In addition, by performing Y-axis correction, it is possible to align the positions of the parallel substrates with the tape. As a result, when the operator sets the substrate on the table, it is only necessary to put a mark in the field of view of the camera, so that it is not necessary to perform careful work as in the conventional case. Further, since the outer peripheral dimension accuracy of the substrate is not important, workability is improved and the cost of the substrate can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view of a table portion of a thermocompression bonding machine showing an embodiment of the present invention.

FIG. 2 is a side view of FIG.

[Explanation of symbols]

1 ... Anisotropic conductive tape, 2 ... Tape reel, 3 ... Circuit board, 4 ... Alignment mark, 5 ... Perimeter stopper, 6 ...
Table, 7 ... Pulse motor, 8 ... Pulse motor, 9 ...
Linear guide, 10 ... CCD camera, 11 ... Heating / pressing head, 12 ... Tape pull-out grip, 13 ... Tape holding grip, 14 ... Tape cutting cutter, 15 ... Y-axis base

Claims (1)

[Claims] 1. A table on which a circuit board is placed and fixed, a rotation guide for the table that is rotatable in a horizontal plane and can be stopped at an arbitrary angle, and the table is moved in the front-rear direction.
The linear guide that can be stopped at any position, the CCD camera that reads the alignment mark attached to the circuit board, and the image of the mark captured by the CCD camera are recognized to set the mark position to a predetermined position. A thermocompression bonding machine equipped with a moving visual sensor to attach an anisotropic conductive film to a circuit board.