JPH08141558A - Cooling water feeder of water purifier - Google Patents

Cooling water feeder of water purifier

Info

Publication number
JPH08141558A
JPH08141558A JP31607094A JP31607094A JPH08141558A JP H08141558 A JPH08141558 A JP H08141558A JP 31607094 A JP31607094 A JP 31607094A JP 31607094 A JP31607094 A JP 31607094A JP H08141558 A JPH08141558 A JP H08141558A
Authority
JP
Japan
Prior art keywords
heat
water
cooling
cooling water
water storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31607094A
Other languages
Japanese (ja)
Inventor
Fui Ton Chung
フイ トン チュン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYUNHO NAISU INYUIPOREITSUSH
CHIYUNHO NAISU INYUIPOREITSUSHIYUN
Chung Ho NAIS Inc
Original Assignee
CHIYUNHO NAISU INYUIPOREITSUSH
CHIYUNHO NAISU INYUIPOREITSUSHIYUN
Chung Ho NAIS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYUNHO NAISU INYUIPOREITSUSH, CHIYUNHO NAISU INYUIPOREITSUSHIYUN, Chung Ho NAIS Inc filed Critical CHIYUNHO NAISU INYUIPOREITSUSH
Priority to JP31607094A priority Critical patent/JPH08141558A/en
Publication of JPH08141558A publication Critical patent/JPH08141558A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025Removal of heat
    • F25B2321/0251Removal of heat by a gas

Landscapes

  • Water Treatment By Sorption (AREA)

Abstract

PURPOSE: To make it possible to selectively use ordinary temp. water or cooling water by connecting a cooling water storage pail to an ordinary temp. water storage pail and mounting a heat transporting means tightly adhered with a heat releasing means at the prescribed point on the outside wall of the cooling water storage pail.
CONSTITUTION: The clean water subjected to a water purifying process is stored in the state of opening the same to the atm. air in the ordinary temp. water storage pail 10. The water flowing from the ordinary temp. water storage pail 10 is cooled in the cooling water storage pail 20, the outer flank of which is provided with a heat absorbing means 30. The heat transporting means 40 mounted between the heat absorbing means 30 and the heat releasing means 50 is constituted by a heat transfer cooling system using an Ni-P semiconductor. Heat radiating fins 51 are formed in the lower part of the heat releasing means 50 in order to rapidly radiate the heat transmitted by the heat transporting means 40 and further, a cooling fan 50 rotated by a motor 62 is installed to the heat releasing means 50 in order to rapidly desorb the heat from the heat releasing means 50. A thermally insulating wall 70 is provided with outer pails 71 alongside the cooling water storage pail 20 and in the lower part thereof. Thermally insulating materials 72 are packed in the spaces between the cooling water storage pail 20 and the outer pails 71.
COPYRIGHT: (C)1996,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は浄水器に関するもので、
詳しくは浄水された水を常温貯水と冷却貯水に二元化貯
水することにより使用者が任意に常温水又は冷却水を選
択的に飲用し得るようにした浄水器の冷却水供給装置に
関するものである。ここで、“常温水”というのは加熱
又は冷却しなかった、大気にそのまま露出された状態の
水を定義し、“冷却水”というのは常温水を人為的に冷
却させた水を定義する。
The present invention relates to a water purifier,
Specifically, it relates to a cooling water supply device of a water purifier that allows users to selectively drink normal temperature water or cooling water by dually storing purified water into normal temperature storage water and cooling storage water. is there. Here, "normal temperature water" means water that has not been heated or cooled and is exposed to the atmosphere as it is, and "cooling water" means water that is artificially cooled from normal temperature water. .

【0002】[0002]

【従来の技術】従来の浄水器として、米国特許番号第
5,000,845号に開示されたオートマチックサイ
クルブースタポンプを採用した逆滲透圧式浄水器と、日
本国特開平4−326927に開示された膜分離装置に
おいて、固体/液体分離膜の微細流路が原水中の異物質
により塞がることを予め検出し異物質を簡単に洗浄除去
することにより長期間にわたって安定な性能を維持しな
がら膜分離装置を運転するようにした浄水器と、日本国
特開平3−86217に開示された透過気化モジュール
及び吸着モジュールを用いて、又は気液接触モジュール
及び吸着モジュールを用いて構成された浄水装置などが
挙げられる。
2. Description of the Related Art As a conventional water purifier, a reverse osmosis water purifier using an automatic cycle booster pump disclosed in U.S. Pat. No. 5,000,845 and a Japanese Patent Laid-Open No. 4-326927 are disclosed. In a membrane separation device, it is detected in advance that the fine channel of the solid / liquid separation membrane is clogged with a foreign substance in the raw water, and the foreign substance is easily washed and removed to maintain stable performance for a long period of time. And a water purifier configured by using a pervaporation module and an adsorption module disclosed in Japanese Patent Laid-Open No. 3-86217, or using a gas-liquid contact module and an adsorption module. To be

【0003】[0003]

【発明が解決しようとする課題】しかしながら、前述し
たような浄水器は全て浄水機能の向上に開発の力点を置
いたもので、浄水処理された水を冷たく飲めるように冷
却させる機能がなかった。従って、このような浄水器は
暑い地方、夏季、室内温度が高い時、又は運動直後等に
涼しい水を飲みたい時にこれを満足させることができな
く、たって冷たい水を飲みたければ浄水器で浄水された
水を他の容器に入れ冷蔵庫に入れて冷やしてから飲まな
ければならないので使用者にとって色々と面倒であると
いう問題点があった。
However, all of the above-mentioned water purifiers are focused on the improvement of the water purification function, and do not have a function of cooling the purified water so that it can be drunk cold. Therefore, such a water purifier cannot satisfy this requirement when it is necessary to drink cool water in hot regions, summer, when the room temperature is high, or immediately after exercise, and if you just want to drink cold water, the water purifier can be used. There is a problem in that it is troublesome for the user because the water must be put in another container and put in a refrigerator to cool before drinking.

【0004】本発明は前記のような問題点を解決するた
めに、浄水器自体に既存の常温水桶とは別に冷却水桶を
備え、これに浄水された水の一部を常に冷却させ得る機
能を有する冷却装置を付設することにより、使用者が必
要によって冷却されなかった常温水又は冷却された冷却
水を選択して飲用し得るようにした浄水器の冷却水供給
装置を提供することにその目的がある。
In order to solve the above-mentioned problems, the present invention provides the water purifier itself with a cooling water tub in addition to the existing room temperature water tub, and has a function of constantly cooling a part of the purified water. An object of the present invention is to provide a cooling water supply device for a water purifier that allows a user to select and drink normal temperature water that has not been cooled or cooled cooling water by attaching a cooling device that the user has. There is.

【0005】[0005]

【課題を解決するための手段】前記のような目的を達成
するための本発明の特徴は、浄水器の常温貯水桶の下方
に第2水路により浄水が供給されるように冷却貯水桶を
備え、前記冷却水桶の外壁の所定箇所に熱運搬手段を装
着し、この熱運搬手段には熱放出手段を密着設置したも
のである。
The feature of the present invention for achieving the above-mentioned object is to provide a cooling sump below the room temperature sump of the water purifier so that the purified water is supplied by the second water passage. The heat transfer means is attached to a predetermined location on the outer wall of the cooling water tub, and the heat release means is closely attached to the heat transfer means.

【0006】本発明の他の特徴は前記熱運搬手段がN−
P半導体で構成されたものである。
Another feature of the present invention is that the heat transfer means is N-
It is composed of P semiconductor.

【0007】本発明のさらに他の特徴は前記冷却貯水桶
と熱運搬手段との間に熱吸収手段が備えられたものであ
る。
Still another feature of the present invention is that a heat absorbing means is provided between the cooling water trough and the heat carrying means.

【0008】本発明のさらに他の特徴は前記熱放出手段
に放熱フィンを形成して放熱効果を向上させたものであ
る。
Still another feature of the present invention is to improve the heat radiation effect by forming a heat radiation fin in the heat radiation means.

【0009】本発明のさらに他の特徴は前記冷却貯水桶
の外郭全体が断熱壁と断熱蓋により取り囲まれるように
構成したものである。
Still another feature of the present invention is that the entire outer shell of the cooling water tub is surrounded by a heat insulating wall and a heat insulating lid.

【0010】本発明のさらに他の特徴は前記冷却ファン
に吸入空気をフィルターリングし得るフィルターを設置
したものである。
Yet another feature of the present invention is that the cooling fan is provided with a filter capable of filtering intake air.

【0011】本発明のその他の特徴は前記冷却貯水桶と
熱吸収手段を熱伝導が良好なアルミニウムで製作し、熱
吸収手段と冷却貯水桶を一体的に構成し、前記断熱壁は
外桶と断熱材で形成し、前記蓋の内部には断熱材を充填
させたものである。
Another feature of the present invention is that the cooling water storage tub and the heat absorbing means are made of aluminum having good heat conduction, the heat absorbing means and the cooling water storage tub are integrally formed, and the heat insulating wall is an outer tub. It is formed of a heat insulating material, and the inside of the lid is filled with a heat insulating material.

【0012】[0012]

【作用】本発明のうち請求項1の浄水器の冷却水供給装
置は、常温貯水桶に第2水路により連結される冷却貯水
桶を備え、前記冷却貯水桶の外壁の所定箇所に熱運搬手
段を装着し、前記熱運搬手段に熱放出手段を密着設置
し、別の冷却ファンにより熱放出手段の熱の大気中への
放熱が促進されるようにしたので、常温貯水桶から冷却
貯水桶に水を入れれば、その水は冷却貯水桶内で冷却さ
れる。
The cooling water supply device for a water purifier according to claim 1 of the present invention comprises a cooling water tub connected to the room temperature water tub by the second water passage, and heat transfer means is provided at a predetermined position on the outer wall of the cooling water tub. The heat-discharging means is closely attached to the heat-carrying means, so that the heat of the heat-discharging means is dissipated into the atmosphere by another cooling fan. If water is added, the water will be cooled in the cooling sump.

【0013】本発明のうち請求項2の浄水器の冷却水供
給装置は、前記熱運搬手段がN−P半導体で構成されて
いるので、熱運搬手段の構成が簡潔で小型になり、その
熱運搬手段を組込んでも冷却水供給装置が格別大型化す
ることがない。
In the cooling water supply apparatus for a water purifier according to claim 2 of the present invention, since the heat carrier is composed of N-P semiconductor, the structure of the heat carrier is simple and compact, and the heat Even if the transportation means is incorporated, the cooling water supply device does not become particularly large.

【0014】本発明のうち請求項3の浄水器の冷却水供
給装置は、冷却貯水桶の外郭が断熱壁と断熱性能が良好
な蓋により取り囲まれているので冷却貯水桶内が外気か
ら遮断され、更に、前記冷却貯水桶の底面に熱吸収手段
を備え、冷却貯水桶の材質は伝熱効果が良好なアルミニ
ウムで製作されてなるので冷却貯水桶の熱熱性が良く、
冷却貯水桶の冷却効率が向上し、冷却貯水桶内の水が効
率よく冷却される。
In the cooling water supply apparatus for a water purifier according to claim 3 of the present invention, the outer wall of the cooling water storage tub is surrounded by the heat insulating wall and the lid having good heat insulating performance, so that the inside of the cooling water storage tub is shielded from the outside air. Further, the bottom of the cooling water tub is provided with heat absorbing means, and the material of the cooling water tub is made of aluminum having a good heat transfer effect, so that the cooling water tub has good heat heatability,
The cooling efficiency of the cooling storage tub is improved, and the water in the cooling storage tub is efficiently cooled.

【0015】[0015]

【実施例】以下、本発明の一実施例を添付図面に基づい
て詳細に説明する。図面符号(10)は常温貯水桶で、
浄水過程を経た上水が大気に解放された状態に貯蔵され
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the accompanying drawings. Reference numeral (10) is a room temperature storage tub,
The clean water that has undergone the water purification process is stored in the state of being released to the atmosphere.

【0016】(20)は冷却貯水桶で、前記常温貯水桶
からここに流入された水が冷却され、冷却貯水桶(2
0)の材質は伝熱効率が良好なアルミニウム等で成形さ
れ、冷却貯水桶(20)の外側面(好ましくは下面)に
熱吸収手段(30)が備えられている。
Reference numeral (20) is a cooling storage tub, in which the water flowing from the room temperature storage tub is cooled, and the cooling storage basin (2
The material of (0) is formed of aluminum or the like having good heat transfer efficiency, and the heat absorbing means (30) is provided on the outer side surface (preferably the lower surface) of the cooling water tub (20).

【0017】(40)は熱運搬手段で特に熱を一方にだ
け運搬させるN−P半導体を用いることが好ましい。こ
こで前記N−P半導体を用いた熱運搬手段により具体的
に説明する。N−P半導体を用いる熱電冷却(thermoel
ectric refrigeration)方式はペルチェ(peltier effe
ct)による吸熱を利用した冷却法をいうもので、ペルチ
ェ効果というのは異種の導体(又は半導体)の接点に電
流を通じた時に接点からジュール熱以外の熱の発生また
は吸収が起こる現象をいう。このような熱運搬手段の具
体的構成は図4の図示説明により易しく理解される。
(40) is a heat transfer means, and it is particularly preferable to use an N-P semiconductor which transfers heat to only one side. Here, the heat transfer means using the N-P semiconductor will be specifically described. Thermoelectric cooling using N-P semiconductors (thermoel
ectric refrigeration method is Peltier (peltier effe
ct) refers to a cooling method utilizing heat absorption, and the Peltier effect is a phenomenon in which heat other than Joule heat is generated or absorbed from a contact when a current is passed through the contact of different types of conductors (or semiconductors). The specific structure of such a heat transfer means can be easily understood by referring to FIG.

【0018】即ち、熱吸収手段(30)と熱放出手段
(50)間に装着される熱運搬手段(40)をN−P半
導体を用いた熱電冷却方式で構成するためには中央に複
数のN型半導体(N)とP型半導体(P)を交互に配置
し、これらのN−P半導体(N)・(P)の上下端に電
気伝導体(41)、(42)をジグザグ形態に配設して
全体を単一ラインに構成し、前記上部電気伝導体(4
1)と熱吸収手段(30)間と前記下部電気伝導体(4
2)と熱放出手段(50)間にそれぞれ電気絶縁体(4
3)、(44)を介在する。そして、前記下部電気伝導
体(42)の左側端と右側端にはDC電源(DC)が連
結される。
That is, in order to construct the heat transfer means (40) mounted between the heat absorption means (30) and the heat release means (50) by a thermoelectric cooling method using an N-P semiconductor, a plurality of heat transfer means are provided at the center. N-type semiconductors (N) and P-type semiconductors (P) are alternately arranged, and electric conductors (41) and (42) are arranged in a zigzag pattern at the upper and lower ends of these N-P semiconductors (N) and (P). The upper electric conductor (4
1) between the heat absorbing means (30) and the lower electric conductor (4)
2) and the heat dissipating means (50) between the electric insulator (4)
3) and (44) are interposed. A DC power source (DC) is connected to the left and right ends of the lower electric conductor (42).

【0019】このように構成された熱電冷却手段は熱吸
収手段(30)の熱を熱放出手段(50)に運搬する作
用をするため、熱吸収手段(30)の方が冷却される。
The thermoelectric cooling means having such a structure serves to convey the heat of the heat absorbing means (30) to the heat releasing means (50), so that the heat absorbing means (30) is cooled.

【0020】前記熱放出手段(50)は熱運搬手段によ
り伝達された熱を迅速に放熱させるために下方に複数の
放熱フィン(51)が形成されている。
The heat radiating means (50) has a plurality of heat radiating fins (51) formed below in order to quickly radiate the heat transferred by the heat transporting means.

【0021】(60)はモーター(62)により回転さ
れる冷却ファンで、前記熱放出手段(50)から熱が迅
速に離脱されるようにするため設置され、必要によって
は冷却ファンに供給される空気をフィルター手段(6
1)等によりフィルターリングすることが好ましい。
Reference numeral (60) is a cooling fan rotated by a motor (62), which is installed so that heat can be quickly released from the heat releasing means (50) and is supplied to the cooling fan if necessary. Filter means for air (6
It is preferable to filter by 1) or the like.

【0022】(70)は断熱壁で、前記冷却貯水桶(2
0)の側方と下方に一定間隔が維持される外桶(71)
が備えられ、前記冷却貯水桶(20)と外桶(71)間
の空間に断熱材(72)が充填されている。
Reference numeral (70) is a heat insulating wall, which is the cooling water tank (2).
Outer basin (71) that maintains a constant space to the side and downward of (0)
The space between the cooling water tub (20) and the outer tub (71) is filled with a heat insulating material (72).

【0023】(80)は前記冷却貯水桶(20)の上部
蓋で、冷却貯水桶(20)の上部開口部を密閉させ、内
部には断熱材(81)を充填して構成される。
Reference numeral (80) is an upper lid of the cooling water tub (20), which is constructed by sealing the upper opening of the cooling water tub (20) and filling the inside with a heat insulating material (81).

【0024】(90A)は第1水路で、冷却貯水桶(2
0)の株から蓋(80)の上面に配置されたコック(9
1A)まで連結されている。
(90A) is the first channel, which is a cooling sump (2
0) stock and cook (9) placed on top of lid (80)
1A) are connected.

【0025】(90B)は第2水路で、冷却貯水桶(2
0)の下部と常温貯水桶(10)の下部と蓋(80)の
正面に配置された他のコック(91B)とを連結するよ
うに配管されている。
(90B) is a second channel, which is a cooling sump (2
The lower part of 0), the lower part of the room temperature water tub (10) and the other cock (91B) arranged in front of the lid (80) are connected to each other.

【0026】未説明符号(100)は冷却貯水桶(2
0)の上端と蓋(80)の底面間の対接部分の密閉状態
を維持するためのシール部材であり、(101)は蓋
(80)を外桶(71)と連結するための締結ネジであ
る。
An unexplained reference numeral (100) is a cooling sump (2
0) is a seal member for maintaining a sealed state of the contact portion between the upper end of the lid (80) and the bottom surface of the lid (80), and (101) is a fastening screw for connecting the lid (80) with the outer tub (71). Is.

【0027】前記のように実施される本発明は、別の貯
水装置から浄水された水が常温貯水桶(10)に一旦流
入されると、常温貯水桶(10)内の水の一部が第2水
路(90B)を経て冷却貯水桶(20)に流入され、こ
のように流入された水は電熱機能が良好な冷却貯水桶
(20)と熱吸収手段(30)に水の温度が伝達され、
熱吸収手段(30)の熱は再び熱運搬手段(40)の作
用により、その下部に密着されている熱放出手段(5
0)に伝達され、この熱放出手段(50)に伝達された
熱は放熱フィン(51)により大気中に放熱され、冷却
ファン(60)の風により放熱効果が向上される。この
ような一連の作用により冷却貯水桶(20)の水温は4
℃程度を維持することができ、このような水温の維持は
外部からの熱を遮断する断熱壁(70)と蓋(80)の
補助役割によってより容易に達成される。
In the present invention implemented as described above, once the purified water from another water storage device flows into the room temperature storage tub (10), a part of the water in the room temperature storage tub (10) is removed. The water flows into the cooling storage tub (20) through the second water channel (90B), and the temperature of the inflowing water is transferred to the cooling storage tub (20) and the heat absorbing means (30) having a good electric heating function. Is
The heat of the heat absorbing means (30) is again brought into close contact with the heat releasing means (5) by the action of the heat carrying means (40).
The heat transmitted to the heat dissipation means (50) is dissipated to the atmosphere by the heat dissipating fins (51), and the heat dissipating effect is improved by the wind of the cooling fan (60). Due to such a series of actions, the water temperature of the cooling storage tub (20) is 4
C. can be maintained, and such water temperature maintenance is more easily achieved by the auxiliary roles of the heat insulating wall (70) and the lid (80) that block heat from the outside.

【0028】[0028]

【発明の効果】本発明のうち請求項1の浄水器の冷却水
供給装置では、常温貯水桶から常温水を取り出して飲む
ことも、季節にかかわらず常に冷却貯水桶から冷たい水
(冷蔵庫で冷却された程度の温度の水)を取り出して飲
むこともできる。
According to the cooling water supply device for a water purifier according to claim 1 of the present invention, the normal temperature water can be taken out from the normal temperature storage tub for drinking, and the cold water can always be drawn from the cooling storage tub regardless of the season (cooling in the refrigerator). It is also possible to take out the water of a certain temperature) and drink it.

【0029】本発明のうち請求項2の浄水器の冷却水供
給装置は熱運搬手段がN−P半導体で構成されているの
で、小型で冷却効率の良い冷却水供給装置となる。
In the cooling water supply device of the water purifier according to the second aspect of the present invention, the heat carrier is composed of the N-P semiconductor, so that the cooling water supply device is compact and has a high cooling efficiency.

【0030】本発明のうち請求項3の浄水器の冷却水供
給装置は、断熱性に優れ、冷却効率が良く、冷却貯水桶
内で水が効率よく冷却され、常に冷却貯水桶から冷たい
水を取り出して飲むことができる。
The cooling water supply device for a water purifier according to claim 3 of the present invention has excellent heat insulating properties and good cooling efficiency, and the water is efficiently cooled in the cooling storage tub, and cold water is always supplied from the cooling storage tub. You can take it out and drink.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す浄水器の外形斜視図で
ある。
FIG. 1 is an external perspective view of a water purifier showing an embodiment of the present invention.

【図2】本発明の冷却水供給ラインを中心とした縦断面
図である。
FIG. 2 is a vertical cross-sectional view centering on the cooling water supply line of the present invention.

【図3】本発明の常温水供給ラインを中心として縦断面
図である。
FIG. 3 is a vertical cross-sectional view centering on a room temperature water supply line of the present invention.

【図4】本発明の一実施例に採用されたN−P半導体を
用いた熱電冷却方式による熱運搬手段の概略構成図であ
る。
FIG. 4 is a schematic configuration diagram of a heat transfer means by a thermoelectric cooling method using an N—P semiconductor adopted in an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

10は常温貯水桶 20は冷却貯水桶 30は熱吸収手段 40は熱運搬手段 50は熱放出手段 60は冷却ファン 70は断熱壁 71は外桶 72は断熱材 80は蓋 81は断熱材 90Aは第1水路 90Bは第2水路 10 is a room temperature storage tub 20 is a cooling storage tub 30 is heat absorption means 40 is heat transfer means 50 is heat release means 60 is a cooling fan 70 is a heat insulation wall 71 is an outer tub 72 is a heat insulation material 80 is a lid 81 is a heat insulation material 90A First channel 90B is the second channel

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】常温貯水桶(10)を備える浄水器におい
て、前記常温貯水桶(10)に第2水路(90B)によ
り連結される冷却貯水桶(20)を備え、前記冷却貯水
桶(20)の外壁の所定箇所に熱運搬手段(40)を装
着し、前記熱運搬手段(40)に熱放出手段(50)を
密着設置し、別の冷却ファン(60)により熱放出手段
(50)の熱の大気中への放熱が促進されるようにする
ことを特徴とする浄水器の冷却水供給装置。
1. A water purifier equipped with a room temperature water tub (10), comprising a cooling water tank (20) connected to the room temperature water tank (10) by a second water channel (90B), and the cooling water tank (20). ), A heat transfer means (40) is attached to a predetermined location on the outer wall, the heat release means (50) is closely attached to the heat transfer means (40), and the heat release means (50) is provided by another cooling fan (60). A cooling water supply device for a water purifier, characterized in that the heat of the heat is released to the atmosphere.
【請求項2】前記熱運搬手段(40)はN−P半導体で
構成されることを特徴とする請求項1記載の浄水器の冷
却水供給装置。
2. The cooling water supply apparatus for a water purifier according to claim 1, wherein the heat transfer means (40) is made of an N-P semiconductor.
【請求項3】前記冷却貯水桶(20)の底面に熱吸収手
段(30)を備え、冷却貯水桶(20)の外郭が断熱壁
(70)と断熱性能が良好な蓋(80)により取り囲ま
れ、内部には冷却水を供給する第1水路(90A)が設
置され、冷却貯水桶(20)の材質は伝熱効果が良好な
アルミニウムで製作されることを特徴とする請求項1記
載の浄水器の冷却水供給装置。
3. A heat absorbing means (30) is provided on a bottom surface of the cooling water tub (20), and an outer wall of the cooling water tub (20) is surrounded by a heat insulating wall (70) and a lid (80) having a good heat insulating property. The first water channel (90A) for supplying cooling water is installed inside, and the material of the cooling water tub (20) is made of aluminum having a good heat transfer effect. Cooling water supply device for water purifier.
JP31607094A 1994-11-28 1994-11-28 Cooling water feeder of water purifier Pending JPH08141558A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31607094A JPH08141558A (en) 1994-11-28 1994-11-28 Cooling water feeder of water purifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31607094A JPH08141558A (en) 1994-11-28 1994-11-28 Cooling water feeder of water purifier

Publications (1)

Publication Number Publication Date
JPH08141558A true JPH08141558A (en) 1996-06-04

Family

ID=18072934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31607094A Pending JPH08141558A (en) 1994-11-28 1994-11-28 Cooling water feeder of water purifier

Country Status (1)

Country Link
JP (1) JPH08141558A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04118011A (en) * 1990-09-06 1992-04-20 Matsushita Electric Ind Co Ltd Water purifying device provided with cooling function
JPH04363191A (en) * 1991-02-28 1992-12-16 Matsushita Electric Works Ltd Water purifying device
JPH0576862A (en) * 1991-09-25 1993-03-30 Matsushita Electric Works Ltd Water purifier with water cooling apparatus
JPH05312457A (en) * 1992-05-08 1993-11-22 Aisin Seiki Co Ltd Cooling device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04118011A (en) * 1990-09-06 1992-04-20 Matsushita Electric Ind Co Ltd Water purifying device provided with cooling function
JPH04363191A (en) * 1991-02-28 1992-12-16 Matsushita Electric Works Ltd Water purifying device
JPH0576862A (en) * 1991-09-25 1993-03-30 Matsushita Electric Works Ltd Water purifier with water cooling apparatus
JPH05312457A (en) * 1992-05-08 1993-11-22 Aisin Seiki Co Ltd Cooling device

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