JPH08139202A - Electronic circuit device - Google Patents

Abstract

PURPOSE: To absorb noises on a signal input line to reduce radiation of noises without generating delay in the signal on the signal input line. CONSTITUTION: In a hybrid integrated circuit device, a diode 2 is provided on the signal input line 11c connected to a semiconductor element 9 from an input terminal 1 to absorb noises on the signal input line 11c in order to reduce radiation of noises. Moreover, a noise to be inputted to the semiconductor element 9 is reduced in combination with reflection of noise by an input impedance of a current limiting resistor 3 provided before the semiconductor element 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device such as a hybrid integrated circuit device for reducing the influence of high frequency noise on an input signal line.

[0002]

MO in a hybrid integrated circuit device of this type.
A schematic electric circuit configuration of the input portion of the S-type semiconductor element is shown in FIG. An input signal from an input terminal 1 of a hybrid integrated circuit device (denoted by HIC in the figure) passes through a current limiting resistor 3 and an input section 4 of a semiconductor element (denoted by MIC in the figure) to n.
It joins the gates of the channel transistor 7 and the p-channel transistor 8. Positive and negative protection diodes 5 and 6 are provided inside the semiconductor element to protect the semiconductor element 9 against overvoltage.

[0003]

In the above configuration,
High-frequency noise (hereinafter, simply referred to as noise) may be mixed in the signal input line from the input terminal 1. When such noise is carried on the signal input line, the signal input line acts as a noise radiating antenna, and the noise propagates and radiates to affect other circuit elements and the like.

As a countermeasure against this kind of noise, a capacitor is usually provided on the signal input line to bypass the noise on the signal input line to prevent noise radiation. However, when such a capacitor is provided, the signal is delayed due to its integration function. In addition, it is necessary to select a capacitor having a capacitance that matches the noise frequency. This is because, in a hybrid integrated circuit having a large number of input terminals, since the time constant differs for each terminal, the processing speed of the input signal is limited by the speed of the slowest input terminal.

The present invention has been made in view of the above problems, and it is an object of the present invention to absorb noise on a signal input line and reduce noise radiation without delaying the signal on the signal input line.

[0006]

In order to achieve the above object, the present invention provides a circuit element (9) and a signal for inputting a signal to the circuit element (9). The input terminal (12f) and this signal input terminal (12
An electronic device including a signal input line (11c) electrically connecting the circuit element (9) and the circuit element (9) and a power supply line (11a, 11b) for supplying power to the circuit element (9). In the circuit device, a diode (2) having one end and the other end connected to the signal input line (11c) and the power supply line (11a, 11b) is provided, and the signal input line (11c is connected by the diode (2). ) The feature is that it absorbs the above noise.

In the second aspect of the invention, the semiconductor element (9), the signal input terminal (12f) for inputting a signal to the semiconductor element (9), the signal input terminal (12f) and the A signal input line (11c) for electrically connecting the semiconductor elements (9) and the semiconductor element (9).
Power supply lines (11a, 11b) for supplying power to the
In a hybrid integrated circuit device formed on a substrate (10), a diode (2) having one end and the other end connected to the signal input line (11c) and the power supply lines (11a, 11b), respectively. Are formed on the substrate (10), and the signal input line (11) is formed by the diode (2).
c) It is characterized in that the above noise is absorbed.

The invention according to claim 3 is characterized in that, in the invention according to claim 1 or 2, the power supply line is a conductor wiring (11b) for grounding. In the invention according to claim 4, in the invention according to claim 1 or 2, the power supply line is a conductor wiring (1
1a). According to a fifth aspect of the present invention, in the invention according to any one of the first to fourth aspects, a current limiting resistor (3) is inserted and formed in the signal input line (11c), and the diode (2 1) is connected to the signal input line (11c) between the signal input terminal (12f) and the current limiting resistor (3).

The reference numerals in parentheses of the above-mentioned means indicate the correspondence with the concrete means described in the embodiments described later.

[0010]

According to the invention described in claim 1 or 2, the signal input line and the power supply line are provided with diodes, and the diodes absorb noise on the signal input lines. Therefore, unlike the case of using a capacitor, it is possible to reduce noise radiation from the signal input line without causing a delay in the signal of the signal input line.

With respect to the invention described in claim 1 or 2,
According to the invention described in claim 3, since the other end of the diode is connected to the conductor wiring for grounding, it is possible to absorb a noise component at a level lower than grounding. In addition, claim 4
According to the invention described in (1), since the other end of the diode is connected to the conductor wiring for the power supply voltage, it is possible to absorb the noise component at a level higher than the power supply voltage.

Further, according to the invention of claim 5,
Since the current limiting resistor is inserted and formed in the signal input line,
Since the input impedance of the current limiting resistor bounces noise on the signal input line, noise input to circuit elements such as semiconductor elements can be reduced in combination with noise absorption by the diode.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a hybrid integrated circuit device showing an embodiment of the present invention. In FIG. 1, clips 12a to 12i connected to an external circuit, a semiconductor element 9, a printed current limiting resistor 3 and various mounting components (not shown) are arranged on a substrate 10, and a conductor formed by printing them. The wirings 11a to 11c are connected. Although FIG. 1 shows only the components for the semiconductor element 9, a plurality of other semiconductor elements are similarly formed on the substrate 10. The clip 12a has a power supply voltage (VD
D), the clip 12i is for grounding (GND), and the clips 12b to 12h are clips for input / output signals. The conductor wiring 11a is for VDD, and the conductor wiring 11b is
Is for GND, and the conductor wiring 11c is for signal input.

In the above structure, the clips 12a-12
The noise propagated from the external wiring, the noise radiated directly from the space, or the like is input to i. Further, noise is input to the semiconductor element from a signal input terminal through a signal input conductor wiring. For example, in the semiconductor element 9,
Noise is input from the input signal clip 12f through the conductor wiring 11c.

In this case, the current limiting resistor 3 for limiting the current to the semiconductor element 9 is
The noise that has entered from the input terminal (clip 12f) is repelled. Here, if the input impedance of the current limiting resistor 3 is sufficiently high, noise can be sufficiently suppressed from entering the semiconductor element 9. However, the current limiting resistor 3 used for the semiconductor element 9 usually has a high input impedance because of its function restriction. Therefore, it is impossible to sufficiently prevent the above noise from entering.

Since the conductor wiring itself functions as an antenna, it radiates noise to other conductor wiring.
This scattered noise goes out of the hybrid integrated circuit device from another clip, and further scatters the noise. Therefore, the diode 2 is provided between the current limiting resistor 3 and the clip 12f for signal input (one end of the diode 2 is connected to the conductor wiring 11c for input signal and the other end is connected to the conductor wiring 11b for GND). ing. In this case, the diode 2, the current limiting resistor 3 and the semiconductor element 9 have a schematic configuration as shown in FIG. 2, and specifically have an electric circuit configuration shown in FIG. 3 in comparison with the conventional one shown in FIG. . The input terminal 1 in the figure is a clip 1
It corresponds to the 2f portion.

By providing the diode 2, it is possible to absorb noise in the conductor wiring 11c and reduce noise intrusion into the semiconductor element 9 and noise radiation from the conductor wiring 11c. That is, clip 1 for signal input
The noise coming from 2f is absorbed by the diode 2 for a voltage component lower than GND. The voltage component that is not absorbed is repelled by the input impedance of the current limiting resistor 3. Therefore, the noise that enters the semiconductor element 9 is considerably reduced. Also, regarding noise radiation by the conductor wiring 11c between the signal input clip 12f and the semiconductor element 9, noise on the conductor wiring 11c is absorbed by the diode 2, so that the generation of the radiation noise should be sufficiently reduced. You can

The diode 2 is provided before the current limiting resistor 3.
By providing, the noise bounced by the current limiting resistor 3 is also absorbed by the diode 2. Therefore, it is possible to reduce noise radiation due to the bounce noise. The diode 2 is mounted as close to the clip 12f as possible. This is because the conductor wiring 11c itself functions as an antenna as described above.
This is because it is necessary to shorten the conductor wiring 11c itself in the portion where noise is transmitted as much as possible. Furthermore, the conductor wiring 11
It is desirable that the shape of c is also linear.

As a result of confirming the noise removing effect by the above-mentioned structure, the noise at the input section 4 and the output section of the semiconductor element 9 could be reduced as shown in FIGS. 4 (a) and 4 (b). FIG. 4A shows the FM band (76 to 1) in the input unit 4.
08MHz) and VHF band (170 to 220MHz), the noise level fluctuation values from the conventional one shown in FIG. 8 are shown.
B and VHF band improved by 3 dB. Further, FIG. 4B shows a similar noise level fluctuation value in the output section,
As shown by the arrow in the figure, it was improved by 1.6 dB in the FM band.

In the above embodiment, the diode 2 is connected to the signal input conductor wiring 11c and the GND conductor wiring 11b.
Although it is shown that it is provided between them, it may be provided between the conductor wiring 11c and VDD (that is, the conductor wiring 11a) as shown in FIG. In this case, the diode 2
Noise can be removed by absorbing a voltage component higher than D. In addition, as shown in FIG.
The first and second diodes 2 may be provided between both D and VDD.

The semiconductor element 9 is not limited to the MOS type, but the bipolar transistor 1 shown in FIG.
3 may be used. In that case, N shown in the figure
Not limited to the PN type, the PNP type may be used. Reference numeral 14 in the figure is a constant current source. Although the present invention has been described in the above embodiment as being applied to the hybrid integrated circuit device, the present invention may be applied to other electronic circuit devices.

[Brief description of drawings]

FIG. 1 is a plan view of a hybrid integrated circuit device showing an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a diode 2, a current limiting resistor 3 and a semiconductor element 9 shown in FIG.

FIG. 3 is a specific electric circuit diagram of the portion shown in FIG.

FIG. 4 is a diagram showing a noise removal effect, in which FIG.
2B shows the noise level fluctuation value with respect to the conventional one in FIG. 5B shows the same noise level fluctuation value in the output section.

FIG. 5 is an electric circuit diagram showing another embodiment of the present invention.

FIG. 6 is an electric circuit diagram showing still another embodiment of the present invention.

FIG. 7 is an electric circuit diagram showing still another embodiment of the present invention.

FIG. 8 is a schematic electric circuit diagram of an input portion of a MOS type semiconductor element in a conventional hybrid integrated circuit device.

[Explanation of symbols]

 2 diode 3 current limiting resistance 9 semiconductor element 10 substrate 11a to 11c conductor wiring 12a to 12i clip

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical display location H01L 21/822 H05K 9/00 K (72) Inventor Mitsuhiro Saito 1-1, Showa-cho, Kariya city, Aichi prefecture Address: Nippon Denso Co., Ltd.

Claims (5)

[Claims] 1. A circuit element, a signal input terminal for inputting a signal to the circuit element, a signal input line electrically connecting the signal input terminal and the circuit element, and power supply to the circuit element. In the electronic circuit device having a power supply line for performing the above, a diode whose one end and the other end are respectively connected to the signal input line and the power supply line is provided, and the diode absorbs noise on the signal input line. An electronic circuit device characterized in that. 2. A semiconductor element, a signal input terminal for inputting a signal to the semiconductor element, a signal input line electrically connecting the signal input terminal and the semiconductor element, and power supply to the semiconductor element. The power supply line for performing the, in the electronic circuit device applied to the hybrid integrated circuit device formed on the substrate, a diode whose one end and the other end are connected to the signal input line and the power supply line, respectively. Formed on the substrate,
An electronic circuit device characterized in that noise on the signal input line is absorbed by the diode. 3. The electronic circuit device according to claim 1, wherein the power supply line is a conductor wiring for grounding. 4. The electronic circuit device according to claim 1, wherein the power supply line is a conductor wiring for a power supply voltage. 5. A current limiting resistor is inserted and formed in the signal input line, and the one end of the diode is connected to the signal input line between the signal input terminal and the current limiting resistor. The electronic circuit device according to any one of claims 1 to 4.