JPH08138905A - Positive temperature coefficient(ptc) thermistor - Google Patents
Positive temperature coefficient(ptc) thermistorInfo
- Publication number
- JPH08138905A JPH08138905A JP27954794A JP27954794A JPH08138905A JP H08138905 A JPH08138905 A JP H08138905A JP 27954794 A JP27954794 A JP 27954794A JP 27954794 A JP27954794 A JP 27954794A JP H08138905 A JPH08138905 A JP H08138905A
- Authority
- JP
- Japan
- Prior art keywords
- temperature coefficient
- positive temperature
- main body
- ptc thermistor
- thermistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、過電流保護,温度セン
サー等の電子回路に使用されるチップ型の正特性サーミ
スタに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type positive temperature coefficient thermistor used in electronic circuits such as overcurrent protection and temperature sensors.
【0002】[0002]
【従来の技術】従来のチップ型の正特性サーミスタ1
は、図5に示すように、正の抵抗温度特性を有する略四
角板のセラミック素体2の両端部に電極3,3が形成さ
れたものである。一般にこの電極3,3の厚みは数〜1
0μmであって、設置底面になる電極3,3と正特性サ
ーミスタ素体2とはほぼ同一面になる。2. Description of the Related Art A conventional chip type positive temperature coefficient thermistor 1
As shown in FIG. 5, electrodes 3, 3 are formed on both ends of a substantially rectangular ceramic body 2 having a positive resistance temperature characteristic. Generally, the thickness of the electrodes 3 and 3 is several to one.
It is 0 μm, and the electrodes 3 and 3 serving as the installation bottom surface and the PTC thermistor element body 2 are substantially flush with each other.
【0003】この正特性サーミスタ1は回路基板(図示
せず)に電極3,3を例えば半田付けすることにより固
着されて回路構成の一部を成すものである。The positive temperature coefficient thermistor 1 is fixed to a circuit board (not shown) by, for example, soldering the electrodes 3 to form a part of the circuit configuration.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、正特性
サーミスタ素体2は下面が平面状であるために回路基板
の表面と正特性サーミスタ素体2の下面とはほとんど接
触状態にある。この結果、正特性サーミスタ1に過電流
が流れてセラミック素体2が発熱する熱、又は、外部か
ら正特性サーミスタ1に伝わる熱が、直接回路基板に伝
導する。However, since the lower surface of the PTC thermistor element body 2 is flat, the surface of the circuit board and the lower surface of the PTC thermistor element body 2 are almost in contact with each other. As a result, heat generated by the ceramic body 2 due to overcurrent flowing through the PTC thermistor 1 or heat transmitted from the outside to the PTC thermistor 1 is directly transmitted to the circuit board.
【0005】したがって、正特性サーミスタ1が過電流
保護素子として用いられる場合は減衰開始時間が長くな
り、回路基板の温度が上昇するという問題点を有してい
た。一方、温度センサーとして用いられる場合、温度セ
ンサーの熱容量が増大して熱応答性が悪くなる。又、温
度センサーを含む回路がショート等によって過電流が流
れると温度センサー自身が発熱して回路基板の温度が上
昇するという問題点を有していた。Therefore, when the PTC thermistor 1 is used as an overcurrent protection element, there is a problem that the decay start time becomes long and the temperature of the circuit board rises. On the other hand, when it is used as a temperature sensor, the heat capacity of the temperature sensor increases and the thermal response deteriorates. Further, when an overcurrent flows in a circuit including the temperature sensor due to a short circuit or the like, the temperature sensor itself generates heat to raise the temperature of the circuit board.
【0006】本発明の目的は、上述の問題点を解消すべ
くなされたもので、正特性サーミスタから発生した熱が
直接回路基板へ熱伝導することを防止させ、信頼性が高
い過電流保護回路素子,温度センサー素子等に用いられ
るチップ型の正特性サーミスタを提供することにある。The object of the present invention is to eliminate the above-mentioned problems, and prevents the heat generated from the positive temperature coefficient thermistor from being directly conducted to the circuit board, thereby providing a highly reliable overcurrent protection circuit. It is to provide a chip-type positive temperature coefficient thermistor used for devices, temperature sensor devices, etc.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の正特性サーミスタにおいては、正特性サー
ミスタ素体は本体と本体の両端部に設けられた脚部とを
有し、この正特性サーミスタ素体の両端面及び両端面近
傍、並びに、前記脚部及び脚部近傍の本体に電極が設け
られていることを特徴とする。In order to achieve the above object, in the positive temperature coefficient thermistor of the present invention, the positive temperature coefficient thermistor body has a main body and legs provided at both ends of the main body. Electrodes are provided on both end faces of the PTC thermistor element body, in the vicinity of both end faces, and on the legs and the main body near the legs.
【0008】また、前記正特性サーミスタ素体の本体と
前記脚部の基板設置面との段差は0.1mm以上である
ことを特徴とする。Further, the step between the main body of the PTC thermistor element body and the substrate installation surface of the leg portion is 0.1 mm or more.
【0009】また、前記電極は下層がニッケル、上層が
銀からなり、この上層は少なくとも前記脚部の基板設置
面に設けられるとともにこの上層の端部外側には前記下
層が露出していることを特徴とする。The lower layer of the electrode is made of nickel and the upper layer is made of silver. The upper layer is provided at least on the substrate mounting surface of the leg portion, and the lower layer is exposed outside the end portion of the upper layer. Characterize.
【0010】[0010]
【作用】本発明では、上述のように正特性サーミスタ素
体の本体の両端部に脚部を設けるとともに電極を脚部か
ら本体に跨がって設けることによって、両電極の間にあ
る本体の中央部が発熱部となり、脚部を含む電極が形成
された電極部は発熱しない非発熱部となる。この発熱部
と回路基板との間に隙間が形成され、回路基板への熱伝
導が少なくなる。In the present invention, the leg portions are provided at both ends of the main body of the positive temperature coefficient thermistor body and the electrodes are provided so as to extend from the leg portions to the main body as described above. The central portion serves as a heat generating portion, and the electrode portion having the electrodes including the legs is a non-heat generating portion that does not generate heat. A gap is formed between the heat generating portion and the circuit board, and heat conduction to the circuit board is reduced.
【0011】[0011]
【実施例】本発明による第1実施例について、図1及び
図2にもとづいて詳細に説明する。正特性サーミスタ1
1は正特性サーミスタ素体12とその両端部に設けられ
た電極13,13から構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment according to the present invention will be described in detail with reference to FIGS. Positive characteristic thermistor 1
Reference numeral 1 is composed of a positive temperature coefficient thermistor body 12 and electrodes 13 and 13 provided at both ends thereof.
【0012】図2において、正特性サーミスタ素体12
は、正の抵抗温度特性を有する単板型のセラミックであ
って、その本体15と両端部に設けられた脚部16,1
6からなる。In FIG. 2, the positive temperature coefficient thermistor body 12 is shown.
Is a single plate type ceramic having a positive resistance temperature characteristic, and has a main body 15 and leg portions 16 and 1 provided at both ends thereof.
It consists of 6.
【0013】電極13,13は、正特性サーミスタ素体
12の両端面及び両端面近傍、並びに、基板設置面を含
む脚部16及び脚部16近傍の本体15に跨がって互い
に接続されることなく設けられている。この電極13は
下層18が例えば無電解メッキによって設けられたニッ
ケル電極、上層19が例えばペーストの焼付けで設けら
れた銀電極の2層構造になっている。下層18は、正特
性サーミスタ素体12の本体の中央部を除いて、本体の
端部から脚部16を含めて両端面まで設けられている。
上層19は端面から脚部16の底面である基板設置面に
設けられ、且つ、図に示されるように、下層18の外側
端部は上層19で覆われることなく露出している。The electrodes 13, 13 are connected to each other across both the end faces of the PTC thermistor element body 12 and in the vicinity of the both end faces, and the legs 16 including the substrate mounting surface and the main body 15 near the legs 16. It is provided without any. The electrode 13 has a two-layer structure in which a lower layer 18 is, for example, a nickel electrode provided by electroless plating, and an upper layer 19 is, for example, a silver electrode provided by baking a paste. The lower layer 18 is provided from the end portion of the main body of the PTC thermistor element body 12 to the both end surfaces including the leg portions 16 except for the central portion of the main body.
The upper layer 19 is provided from the end surface to the substrate mounting surface which is the bottom surface of the leg portion 16, and as shown in the figure, the outer end portion of the lower layer 18 is exposed without being covered with the upper layer 19.
【0014】かかる構成の正特性サーミスタ11は、正
特性サーミスタ素体12の本体15と脚部16,16の
基板設置面とに段差Sを有し、正特性サーミスタ11を
回路基板(図示せず)に半田等によって取付けた場合、
その本体15と回路基板の設置面との間に脚部16,1
6によって隙間が生じる。一方、脚部16,16の底面
である基板設置面と本体15の一部に電極18,18が
形成されているため、正特性サーミスタ11に電流が流
れると、電極18,18の最短間である本体15の中央
部が発熱部Hとなり、基板設置面がある脚部16,16
を含む電極13,13が形成された正特性サーミスタの
両端部が非発熱部になる。The PTC thermistor 11 having such a structure has a step S between the main body 15 of the PTC thermistor element body 12 and the substrate installation surface of the legs 16 and 16, and the PTC thermistor 11 is provided on a circuit board (not shown). ) With solder etc.,
Between the main body 15 and the installation surface of the circuit board, the legs 16, 1
6 creates a gap. On the other hand, since the electrodes 18, 18 are formed on the substrate installation surface which is the bottom surface of the legs 16, 16 and a part of the main body 15, when a current flows through the positive temperature coefficient thermistor 11, the shortest distance between the electrodes 18, 18 occurs. The central part of a certain main body 15 becomes the heat generating part H, and the legs 16, 16 having the board mounting surface
Both ends of the positive temperature coefficient thermistor on which the electrodes 13, 13 including the are formed are non-heat generating parts.
【0015】したがって、正特性サーミスタ11が発熱
しても、発熱部Hと回路基板との間に段差Sが存在する
ためにその熱が回路基板に伝わりにくくなる。また、正
特性サーミスタ11の基板設置面は非発熱部であり、回
路基板が高温にならない。このため、回路基板に取付け
た正特性サーミスタ11の半田部が溶けて、正特性サー
ミスタ11が位置ずれするということが減少する。Therefore, even if the positive temperature coefficient thermistor 11 generates heat, since the step S exists between the heat generating portion H and the circuit board, the heat is not easily transferred to the circuit board. In addition, the board mounting surface of the positive temperature coefficient thermistor 11 is a non-heat generating portion, and the circuit board does not become hot. Therefore, it is possible to reduce the possibility that the solder portion of the PTC thermistor 11 attached to the circuit board is melted and the PTC thermistor 11 is displaced.
【0016】尚、上層19と正特性サーミスタ素体12
の露出部との間に露出した下層18が介在するため、シ
ルバーマイグレーションが発生しない。また、回路基板
に正特性サーミスタ11を半田付けする場合、上層19
が形成されていない脚部16から本体12への半田流れ
込みを防止することができる。The upper layer 19 and the positive temperature coefficient thermistor element body 12
Since the exposed lower layer 18 is interposed between the exposed portion and the exposed portion, silver migration does not occur. When soldering the PTC thermistor 11 to the circuit board, the upper layer 19
It is possible to prevent the solder from flowing into the main body 12 from the leg portion 16 in which the solder is not formed.
【0017】次に、本願発明による第2実施例を図3を
参照して詳細に説明する。但し、前述の第1実施例と同
一部分には同一の符号を付して詳細な説明を省略する。
なお、当実施例は正特性サーミスタ素体の形状が異なる
ものである。Next, a second embodiment according to the present invention will be described in detail with reference to FIG. However, the same parts as those in the first embodiment described above are designated by the same reference numerals and detailed description thereof will be omitted.
In this embodiment, the shape of the PTC thermistor element body is different.
【0018】正特性サーミスタ21は正特性サーミスタ
素体22とその両端部に設けられた電極13,13から
構成されている。正特性サーミスタ素体22は、本体2
5の両端部の基板設置面の反対側にも脚部26,26が
設けられたものである。この正特性サーミスタ素体22
の両端部に下層18,上層19の2層からなる電極13
が形成されている。この構造であれば、正特性サーミス
タ21の上下の方向性がなく回路基板への取付けが簡便
になる。さらに、図示しないが、正特性サーミスタ素体
22の本体25の両端部の基板設置面の左右の側面にも
脚部26,26が設けられたものであってもよい。The PTC thermistor 21 is composed of a PTC thermistor element body 22 and electrodes 13, 13 provided at both ends thereof. The PTC thermistor element body 22 is the main body 2
The leg portions 26, 26 are provided on the opposite sides of the substrate installation surface at both ends of 5. This positive temperature coefficient thermistor body 22
An electrode 13 composed of a lower layer 18 and an upper layer 19 at both ends of the electrode 13
Are formed. With this structure, the positive temperature coefficient thermistor 21 does not have the vertical direction and the mounting on the circuit board is simple. Further, although not shown, the leg portions 26, 26 may be provided on the left and right side surfaces of the substrate mounting surface at both ends of the main body 25 of the PTC thermistor element body 22.
【0019】次に、本願発明による第3実施例を図4を
参照して詳細に説明する。但し、前述の第1実施例と同
一部分には同一の符号を付して詳細な説明を省略する。
なお、当実施例は電極が異なるものである。Next, a third embodiment according to the present invention will be described in detail with reference to FIG. However, the same parts as those in the first embodiment described above are designated by the same reference numerals and detailed description thereof will be omitted.
In this example, the electrodes are different.
【0020】正特性サーミスタ31は正特性サーミスタ
素体12とその両端部に設けられた電極33,33から
構成されている。電極33は下層18と上層39の2層
から構成されている。上層39は脚部16の底面である
基板設置面の一部である端面側及び両端面に設けられる
ものである。従って、下層18は基板設置面の一部で露
出している。The PTC thermistor 31 is composed of the PTC thermistor body 12 and electrodes 33, 33 provided at both ends thereof. The electrode 33 is composed of two layers, a lower layer 18 and an upper layer 39. The upper layer 39 is provided on the end face side and both end faces that are a part of the substrate installation face that is the bottom face of the leg portion 16. Therefore, the lower layer 18 is exposed on a part of the substrate mounting surface.
【0021】また、図示しないが、前述の第2実施例に
示した基板設置面の反対側にも脚部26,26が設けら
れた正特性サーミスタ素体22の両端部に、第3実施例
で示した下層18と上層39の2層からなる電極33が
形成されたものであってもよい。Although not shown, the third embodiment is also provided at both ends of the positive temperature coefficient thermistor element body 22 in which legs 26, 26 are provided on the opposite side of the substrate mounting surface shown in the second embodiment. The electrode 33 including the two layers of the lower layer 18 and the upper layer 39 shown in FIG.
【0022】尚、上述の正特性サーミスタ素体の本体1
2,22と、この本体の両端に設けられた脚部16,1
6,26,26の基板設置面との段差Sは0.1mm以
上あれば、正特性サーミスタ11及び基板の凹凸やたわ
みによる正特性サーミスタ11の発熱部Hと回路基板と
の接触を防ぐことができる。The main body 1 of the above-mentioned positive temperature coefficient thermistor element body
2,22 and leg parts 16,1 provided at both ends of the main body
If the step S between the substrate mounting surface of 6, 26, 26 is 0.1 mm or more, it is possible to prevent the contact between the heat generating portion H of the PTC thermistor 11 and the PTC thermistor 11 due to the unevenness or the deflection of the substrate and the circuit board. it can.
【0023】さらに、上述の上層19,39は正特性サ
ーミスタ素体12,22の端部に形成した例を示した
が、回路基板に半田付けするためのものであり、少なく
とも基板設置面に形成されていてもよい。Further, although the above-mentioned upper layers 19 and 39 are formed on the ends of the positive temperature coefficient thermistor elements 12 and 22, they are for soldering to the circuit board and are formed at least on the board mounting surface. It may have been done.
【0024】[0024]
【発明の効果】以上述べたように、本発明による正特性
サーミスタでは、正特性サーミスタ素体の本体の両端部
に脚部を設けているため、基板設置面と正特性サーミス
タ素子の発熱部との間に段差を有する。したがって、正
特性サーミスタが取付けられる回路基板にその熱が直接
伝導することを防げる。As described above, in the positive temperature coefficient thermistor according to the present invention, since the legs are provided at both ends of the main body of the positive temperature coefficient thermistor body, the substrate mounting surface and the heat generating portion of the positive temperature coefficient thermistor element are There is a step between. Therefore, the heat can be prevented from being directly conducted to the circuit board to which the positive temperature coefficient thermistor is attached.
【0025】そこで、正特性サーミスタが過電流保護素
子として用いられる場合は減衰開始時間が短くなる。ま
た、温度センサーとして用いられる場合は、熱容量が正
特性サーミスタの大きさで決まるため熱応答性がよくな
る。また、温度センサーを含む回路がショート等によっ
て過電流が流れる際に、温度センサー自身が発熱しても
回路基板の温度上昇を防止できる。Therefore, when the positive temperature coefficient thermistor is used as an overcurrent protection element, the attenuation start time becomes short. When used as a temperature sensor, the heat capacity is determined by the size of the positive temperature coefficient thermistor, so that the thermal response is improved. Further, when an overcurrent flows in a circuit including the temperature sensor due to a short circuit or the like, even if the temperature sensor itself generates heat, the temperature rise of the circuit board can be prevented.
【図1】本発明に係る正特性サーミスタの第1実施例を
示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of a positive temperature coefficient thermistor according to the present invention.
【図2】図1のA−A断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図3】本発明に係る正特性サーミスタの第2実施例を
示す側面斜視図である。FIG. 3 is a side perspective view showing a second embodiment of the positive temperature coefficient thermistor according to the present invention.
【図4】本発明に係る正特性サーミスタの第3実施例を
示す側面断面図である。FIG. 4 is a side sectional view showing a third embodiment of the positive temperature coefficient thermistor according to the present invention.
【図5】従来の斜視図である。FIG. 5 is a conventional perspective view.
11,21,31 正特性サーミスタ 12,22 正特性サーミスタ素体 13,33 電極 15,25 本体 16,26 脚部 18 下層 19,39 上層 11,21,31 Positive characteristic thermistor 12,22 Positive characteristic thermistor body 13,33 Electrode 15,25 Main body 16,26 Leg 18 Lower layer 19,39 Upper layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 並河 康訓 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasunori Namikawa 2 26-10 Tenjin Tenjin, Nagaokakyo City, Kyoto Murata Manufacturing Co., Ltd.
Claims (3)
端部に設けられた脚部とを有し、この正特性サーミスタ
素体の両端面及び両端面近傍、並びに、前記脚部及び脚
部近傍の本体に電極が設けられていることを特徴とする
正特性サーミスタ。1. A PTC thermistor element body has a main body and legs provided at both ends of the main body. The positive characteristic thermistor element body has both end faces and the vicinity of both end faces, and the leg portions and the leg parts. A positive temperature coefficient thermistor, which is characterized in that an electrode is provided on a main body in the vicinity.
脚部の基板設置面との段差は0.1mm以上であること
を特徴とする請求項1に記載の正特性サーミスタ。2. The positive temperature coefficient thermistor according to claim 1, wherein the step between the main body of the positive temperature coefficient thermistor body and the substrate mounting surface of the leg is 0.1 mm or more.
らなり、この上層は少なくとも前記脚部の基板設置面に
設けられるとともにこの上層の端部外側には前記下層が
露出していることを特徴とする請求項1又は2に記載の
正特性サーミスタ。3. The electrode comprises a lower layer made of nickel and an upper layer made of silver, and the upper layer is provided at least on a substrate mounting surface of the leg portion, and the lower layer is exposed outside an end portion of the upper layer. The positive temperature coefficient thermistor according to claim 1 or 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27954794A JPH08138905A (en) | 1994-11-14 | 1994-11-14 | Positive temperature coefficient(ptc) thermistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27954794A JPH08138905A (en) | 1994-11-14 | 1994-11-14 | Positive temperature coefficient(ptc) thermistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08138905A true JPH08138905A (en) | 1996-05-31 |
Family
ID=17612503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27954794A Pending JPH08138905A (en) | 1994-11-14 | 1994-11-14 | Positive temperature coefficient(ptc) thermistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08138905A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100507457B1 (en) * | 1997-07-07 | 2005-08-10 | 마츠시타 덴끼 산교 가부시키가이샤 | Ptc thermistor chip and method for manufacturing the same |
JP2011014698A (en) * | 2009-07-01 | 2011-01-20 | Murata Mfg Co Ltd | Electronic component |
-
1994
- 1994-11-14 JP JP27954794A patent/JPH08138905A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100507457B1 (en) * | 1997-07-07 | 2005-08-10 | 마츠시타 덴끼 산교 가부시키가이샤 | Ptc thermistor chip and method for manufacturing the same |
JP2011014698A (en) * | 2009-07-01 | 2011-01-20 | Murata Mfg Co Ltd | Electronic component |
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