JPH08138439A - Conductive composite material composition and conductive composite material to mold its composition - Google Patents
Conductive composite material composition and conductive composite material to mold its compositionInfo
- Publication number
- JPH08138439A JPH08138439A JP28158794A JP28158794A JPH08138439A JP H08138439 A JPH08138439 A JP H08138439A JP 28158794 A JP28158794 A JP 28158794A JP 28158794 A JP28158794 A JP 28158794A JP H08138439 A JPH08138439 A JP H08138439A
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- Prior art keywords
- conductive composite
- composite material
- reproducibility
- composition
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Thermistors And Varistors (AREA)
- Conductive Materials (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、導電性複合材料組成物
及び該組成物を成形した導電性複合材料に関する。TECHNICAL FIELD The present invention relates to a conductive composite material composition and a conductive composite material obtained by molding the composition.
【0002】[0002]
【従来の技術】従来、重合体及び導電性材料からなる導
電性複合材料としてのスイッチング素子は、ポリエチレ
ン及びカーボンブラックからなる複合体が用いられてい
る(米国特許第2,978,665号明細書、特開昭54−16697号
公報、特開昭55−78406号公報参照)。2. Description of the Related Art Conventionally, as a switching element as a conductive composite material composed of a polymer and a conductive material, a composite composed of polyethylene and carbon black has been used (US Pat. No. 2,978,665, Japanese Patent Laid-Open Publication No. Sho. 54-16697, JP-A-55-78406).
【0003】[0003]
【発明が解決しようとする課題】ポリエチレン及びカー
ボンブラックの複合体の粒子からなるスイッチング素子
は、80〜140℃にスイッチング温度(Ts)を持ち
(特開昭55−78406号公報)、実用上適当な温度である
が、ジュール熱により導通抵抗が経時変化したり(特開
昭55−78406号公報)、導通抵抗と素子の温度との関係
がヒステレシスを示す(特開平2−92960号公報、特開
平5−226113号公報)ために、再現性を更に改善するこ
とが必要になる。本発明の目的は、上記の欠点を改良
し、再現性に優れる導電性複合材料及び該導電性複合材
料を得るための組成物を提供することにある。A switching element composed of particles of a composite of polyethylene and carbon black has a switching temperature (Ts) of 80 to 140 ° C. (Japanese Patent Laid-Open No. 55-78406) and is suitable for practical use. However, the conduction resistance changes with time due to Joule heat (JP-A-55-78406), and the relationship between the conduction resistance and the temperature of the element shows hysteresis (JP-A-2-92960, Therefore, it is necessary to further improve the reproducibility. It is an object of the present invention to provide a conductive composite material which improves the above-mentioned drawbacks and is excellent in reproducibility, and a composition for obtaining the conductive composite material.
【0004】[0004]
【課題を解決するための手段】本発明は、エチレンとプ
ロピレンとのランダム共重合体とホモポリプロピレンと
が直接重合して得られる熱可塑性エラストマーの重合体
及び導電性材料を含む導電性複合材料組成物、並びに該
組成物を成形した導電性複合材料に関する。本発明にお
いて、エチレンとプロピレンとのランダム共重合体とホ
モポリプロピレン(以下、ホモPPと記載する)とが直
接重合して得られる熱可塑性エラストマーは、ホモPP
部分が1〜60重量%で、エチレン成分は10〜40重
量%の範囲の重合体であるが、特に限定するものではな
い。また、該重合体の主な特性としてMFR(Melt F
low Rate)、融点等が挙げられる。このうち、MFR
(JIS K7210)は好ましくは0.2〜50g/分で、よ
り好ましくは1.0〜20g/分である。一方、融点
(DSC)は、一般的には135〜170℃の範囲であ
り、好ましくは140〜155℃である。The present invention provides a conductive composite material composition containing a polymer of a thermoplastic elastomer obtained by directly polymerizing a random copolymer of ethylene and propylene and a homopolypropylene, and a conductive material. And an electrically conductive composite material obtained by molding the composition. In the present invention, a thermoplastic elastomer obtained by directly polymerizing a random copolymer of ethylene and propylene and homopolypropylene (hereinafter referred to as homoPP) is homoPP
The proportion of the polymer is in the range of 1 to 60% by weight and the ethylene component is in the range of 10 to 40% by weight, but it is not particularly limited. The main characteristic of the polymer is MFR (Melt F
low rate), melting point and the like. Of these, MFR
(JIS K7210) is preferably 0.2 to 50 g / min, more preferably 1.0 to 20 g / min. On the other hand, the melting point (DSC) is generally in the range of 135 to 170 ° C, preferably 140 to 155 ° C.
【0005】本発明では、上記の熱可塑性エラストマー
に他の重合体を混合することが出来る。例えば、ポリエ
チレン(LDPE、MDPE、HDPE、LLDP
E)、α−オレフィンと極性モノマーとの共重合体(E
VA、EA、EEA)等を挙げることが出来る。熱可塑
性エラストマーと他の重合体との混合比は、特に限定す
るものではないが、熱可塑性エラストマーが10〜80
重量部で、他の重合体が90〜20重量部が好ましい。
上記の重合体を用いることにより、本発明では、導通抵
抗が大きく変る温度即ちTsが、組成物中の重合体の融
点付近で認められる。In the present invention, the above thermoplastic elastomer may be mixed with another polymer. For example, polyethylene (LDPE, MDPE, HDPE, LLDP
E), a copolymer of α-olefin and a polar monomer (E
VA, EA, EEA) and the like. The mixing ratio of the thermoplastic elastomer and the other polymer is not particularly limited, but the thermoplastic elastomer has a mixing ratio of 10 to 80.
90 to 20 parts by weight of the other polymer is preferable.
By using the above-mentioned polymer, in the present invention, the temperature at which the conduction resistance greatly changes, that is, Ts, is recognized near the melting point of the polymer in the composition.
【0006】本発明における導電性材料は、ファーネス
ブラック、ケッチェンブラック等のカーボンブラック、
これらの極性モノマーによるグラフト物、金属めっきカ
ーボンブラック、グラファイトなどを挙げることが出来
るが、更に、ニッケル、コバルト、銀、銅等の金属やこ
れらに代表される金属の合金を用いることが出来る。以
上の材料の形態は、特に制限はないが一般的には粒状体
が用いられ、例えばカーボンブラックの場合には、10
〜100nm径の粒状体が用いられる。導電性材料の重
合体に対する添加量は、一般的には、重合体100重量
部に対して1〜100重量部であるが、特に限定するも
のではない。The conductive material in the present invention is carbon black such as furnace black or Ketjen black,
Examples thereof include graft products of these polar monomers, metal-plated carbon black, graphite, and the like, and further, metals such as nickel, cobalt, silver, copper, and alloys of metals represented by these can be used. The form of the above material is not particularly limited, but a granular material is generally used. For example, in the case of carbon black, 10
Granules with a diameter of -100 nm are used. The amount of the conductive material added to the polymer is generally 1 to 100 parts by weight with respect to 100 parts by weight of the polymer, but is not particularly limited.
【0007】本発明においては、導電性材料のほかに他
の添加剤、例えば無機充填剤、酸化防止剤、帯電防止
剤、シランカップリング剤等を添加することが出来る。
重合体、導電性材料等の組成物の混合は、ロール、バン
バリーミキサー、ヘンシェルミキサー、ブラベンダープ
ラストグラフ、押出し機(単軸、多軸)等の混練装置を
用いて行うことが出来る。更に、本発明においては、通
常、圧縮成形、押出し成形、射出成形等の成形法を用い
てプレート、シート、フィルム状の導電性複合材料を作
製することが出来る。In the present invention, in addition to the conductive material, other additives such as an inorganic filler, an antioxidant, an antistatic agent and a silane coupling agent can be added.
The composition of the polymer, the conductive material and the like can be mixed by using a kneading device such as a roll, a Banbury mixer, a Henschel mixer, a Brabender plastograph, an extruder (single screw, multi screw). Further, in the present invention, a plate, sheet, or film-shaped conductive composite material can be usually produced by using a molding method such as compression molding, extrusion molding, or injection molding.
【0008】導電性複合材料中の重合体は、一般的には
架橋されるが、t−ブチルクミルパーオキサイド、2,
5ジメチル−ジ(t−ブチルパーオキシ)ヘキサン、
2,5ジメチル−ジ(t−ブチルパーオキシ)ヘキシン
−3等の有機過酸化物を用いる化学架橋法、ポリオレフ
ィンにビニルシランをグラフトした後、水分の存在下で
シロキサン縮合反応により架橋を行うシラン架橋法、更
には、電子線等を用いる放射線架橋法の何れも用いるこ
とが出来る。なお、架橋は原材料、成形時、成形後等の
何れの段階でなされてもよい。本発明において、導電性
複合材料はニッケル、銅等の電極材に熱圧着等の方法に
より接続されるが、更に、成形歪の緩和、内部構造の安
定化の目的で熱処理を施すのが一般的である。なお、こ
の熱処理は、導電性複合材料と電極材との接続前又は接
続中に行っても良い。The polymer in the conductive composite is generally crosslinked, but with t-butylcumyl peroxide, 2,
5 dimethyl-di (t-butylperoxy) hexane,
Chemical cross-linking method using an organic peroxide such as 2,5 dimethyl-di (t-butylperoxy) hexyne-3, or silane cross-linking in which polyolefin is grafted with vinylsilane and then cross-linked by siloxane condensation reaction in the presence of water. Any of the methods, and further, a radiation crosslinking method using an electron beam or the like can be used. The cross-linking may be performed at any stage such as raw material, molding, and after molding. In the present invention, the conductive composite material is connected to an electrode material such as nickel or copper by a method such as thermocompression bonding, and further, heat treatment is generally performed for the purpose of relaxing molding strain and stabilizing the internal structure. Is. The heat treatment may be performed before or during the connection between the conductive composite material and the electrode material.
【0009】[0009]
【作用】本発明の導電性複合材料は、エチレンとプロピ
レンとのランダム共重合体とホモPPとが直接重合して
得られる熱可塑性エラストマーの重合体及び導電性材料
を含む組成物を成形して得られるものであり、Tsは従
来のポリエチレン系樹脂とほぼ同等で、温度と導通抵抗
との関係でヒステレシスが少なく、再現性に優れる。こ
の理由としては、ホモPP部分が一種の固定点の役割を
することにより、エチレン/プロピレン共重合体部の熱
膨張に伴う導電性材料間の間隔変化の再現性が良くな
り、その結果、従来のポリエチレン系樹脂マトリックス
の場合とTsは概ね同等でありながら、より再現性に優
れた特性を示すものと考えられる。The conductive composite material of the present invention is obtained by molding a composition containing a polymer of a thermoplastic elastomer obtained by directly polymerizing a random copolymer of ethylene and propylene and homo PP and a conductive material. The obtained Ts is almost the same as that of the conventional polyethylene-based resin, has less hysteresis due to the relationship between temperature and conduction resistance, and has excellent reproducibility. The reason for this is that the homo PP part plays a role of a kind of fixed point, which improves the reproducibility of the spacing change between the conductive materials due to the thermal expansion of the ethylene / propylene copolymer part, and as a result, It is considered that the Ts is almost the same as that of the polyethylene-based resin matrix of 1), but exhibits more excellent reproducibility.
【0010】[0010]
【実施例】次に本発明の実施例を説明する。材料は次の
ものを使用した。即ち、熱可塑性エラストマーとして
は、トクヤマP.E.R.R410E(MFR;1.8
g/分、融点;143℃、比重;0.88)、他の重合
体としては、ポリエチレン樹脂(住友化学、LDPE、
MFR;10g/分、融点点;118℃、比重;0.9
35)、導電性材料としてはファーネスブラック(平均
粒径;50nm)、酸化防止剤としてはチバガイギーの
イルガノックス1010である。また、成形は単軸押出
機を用い、その押出し成形条件は、スクリューがφ20
のフルフライト型(L/D;24)、シリンダー温度が
C1;150℃、C2;165℃、C3;170℃、ダ
イス温度Dが175℃、スクリュー回転数が50rpm
である。EXAMPLES Examples of the present invention will be described below. The following materials were used. That is, as the thermoplastic elastomer, Tokuyama P.I. E. FIG. R. R410E (MFR; 1.8
g / min, melting point; 143 ° C., specific gravity; 0.88), and other polymers include polyethylene resin (Sumitomo Chemical, LDPE,
MFR: 10 g / min, melting point: 118 ° C., specific gravity: 0.9
35), furnace black (average particle size; 50 nm) as the conductive material, and Ciba-Geigy Irganox 1010 as the antioxidant. A single-screw extruder was used for molding, and the extrusion molding conditions were such that the screw was φ20.
Full flight type (L / D; 24), cylinder temperature is C1; 150 ° C, C2; 165 ° C, C3; 170 ° C, die temperature D is 175 ° C, screw rotation speed is 50 rpm.
Is.
【0011】実施例1 重量で熱可塑性エラストマー60部、ポリエチレン樹脂
40部、ファーネスブラック70部及び酸化防止剤0.
5部を配合した組成物を、8インチロールを用いて16
0℃で10分間混練後室温でペレット化し、押出し機に
供し、厚みが約0.5mmのシートを成形した。上記によ
り得られた導電性複合体を1cm×2cmの大きさに切り出
し、5Mradの電子線放射を行って架橋した後、両面に
金属電極(Ni箔、厚み300nm)を165℃で熱圧
着し、温度と導通抵抗との関係を測定した。また、降温
後の復帰性を確認するために室温での導通抵抗を再測定
した。表1に、室温での導通抵抗(R25)、110℃
の導通抵抗(R110)、両者の比R25/R110、
降温後の導通抵抗(R25*)及びTsを示す。Example 1 60 parts by weight of thermoplastic elastomer, 40 parts of polyethylene resin, 70 parts of furnace black and 0.5 parts by weight of antioxidant.
5 parts of the composition was mixed with an 8-inch roll to 16
The mixture was kneaded at 0 ° C. for 10 minutes, pelletized at room temperature, and subjected to an extruder to form a sheet having a thickness of about 0.5 mm. The conductive composite obtained above was cut into a size of 1 cm × 2 cm, cross-linked by performing electron beam radiation of 5 Mrad, and then metal electrodes (Ni foil, thickness 300 nm) were thermocompression bonded at 165 ° C. on both surfaces. The relationship between temperature and conduction resistance was measured. In addition, the conduction resistance at room temperature was measured again in order to confirm the recoverability after cooling. Table 1 shows the conduction resistance (R25) at room temperature, 110 ° C.
Conduction resistance (R110), ratio of both R25 / R110,
The conduction resistance (R25 *) and Ts after cooling are shown.
【0012】実施例2 導電性複合体として実施例1のファーネスブラック70
重量部に代えてニッケル粒子(約80nm)20重量部
とした以外は実施例1と同様にして導電性複合体を得、
また、温度と導通抵抗との関係を測定した。結果を表1
に示す。 実施例3 導電性複合体として実施例2のニッケル粒子に代えてポ
リスチレン粒子に金めっきをした粒子(約100nm)
を用いた以外は実施例2と同様にして導電性複合体を
得、更に、温度と導通抵抗との関係を測定した。結果を
表1に示す。 比較例 重量で実施例1と同じポリエチレン100部、ファーネ
スブラック70部、酸化防止剤0.5部を配合した組成
物を実施例1と同様にして1cm×2cmの導電性複合体を
作製し、温度と導通抵抗との関係を測定した。その結果
を表1に示す。Example 2 Furnace Black 70 of Example 1 as a conductive composite
A conductive composite was obtained in the same manner as in Example 1 except that 20 parts by weight of nickel particles (about 80 nm) was used instead of the parts by weight.
Also, the relationship between temperature and conduction resistance was measured. The results are shown in Table 1.
Shown in Example 3 Particles (about 100 nm) obtained by plating polystyrene particles with gold instead of the nickel particles of Example 2 as a conductive composite.
A conductive composite was obtained in the same manner as in Example 2 except that was used, and the relationship between temperature and conduction resistance was measured. The results are shown in Table 1. Comparative Example A composition containing 100 parts by weight of the same polyethylene as in Example 1, 70 parts of furnace black and 0.5 part of an antioxidant was prepared in the same manner as in Example 1 to prepare a 1 cm × 2 cm conductive composite. The relationship between temperature and conduction resistance was measured. Table 1 shows the results.
【0013】[0013]
【表1】 [Table 1]
【0014】表1から、実施例のものは比較例のものに
比べてR110、R25/R110が大きく良好であ
り、また、復元性も良いことが示される。Tsは比較例
とほぼ同じ値を示している。From Table 1, it is shown that R110 and R25 / R110 of the example are much better than those of the comparative example, and that the recoverability is also good. Ts shows almost the same value as the comparative example.
【0015】[0015]
【発明の効果】本発明によれば、Tsはポリエチレン系
樹脂を用いた従来の導電性複合材料とほぼ同じで、導通
抵抗の自己復元性に優れた特性を有し、再現性に優れた
導電性複合材料が得られる。EFFECTS OF THE INVENTION According to the present invention, Ts is almost the same as the conventional conductive composite material using a polyethylene resin, has a characteristic of excellent self-restoration of conduction resistance, and has excellent reproducibility. A composite material is obtained.
Claims (3)
合体とホモポリプロピレンとが直接重合して得られる熱
可塑性エラストマーの重合体及び導電性材料を含む導電
性複合材料組成物。1. A conductive composite material composition comprising a polymer of a thermoplastic elastomer obtained by directly polymerizing a random copolymer of ethylene and propylene and homopolypropylene, and a conductive material.
材料。2. A conductive composite material obtained by molding the composition of claim 1.
する請求項2記載の導電性複合材料。3. The conductive composite material according to claim 2, having at least one switching temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28158794A JPH08138439A (en) | 1994-11-16 | 1994-11-16 | Conductive composite material composition and conductive composite material to mold its composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28158794A JPH08138439A (en) | 1994-11-16 | 1994-11-16 | Conductive composite material composition and conductive composite material to mold its composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08138439A true JPH08138439A (en) | 1996-05-31 |
Family
ID=17641236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28158794A Pending JPH08138439A (en) | 1994-11-16 | 1994-11-16 | Conductive composite material composition and conductive composite material to mold its composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08138439A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6607679B2 (en) | 2001-01-12 | 2003-08-19 | Tdk Corporation | Organic PTC thermistor |
-
1994
- 1994-11-16 JP JP28158794A patent/JPH08138439A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6607679B2 (en) | 2001-01-12 | 2003-08-19 | Tdk Corporation | Organic PTC thermistor |
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