JPH08130268A - Coating structure for electronic device - Google Patents

Coating structure for electronic device

Info

Publication number
JPH08130268A
JPH08130268A JP6293762A JP29376294A JPH08130268A JP H08130268 A JPH08130268 A JP H08130268A JP 6293762 A JP6293762 A JP 6293762A JP 29376294 A JP29376294 A JP 29376294A JP H08130268 A JPH08130268 A JP H08130268A
Authority
JP
Japan
Prior art keywords
case
porous film
electronic component
exterior structure
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6293762A
Other languages
Japanese (ja)
Other versions
JP2982631B2 (en
Inventor
Muneyuki Oshiro
代 宗 幸 大
Shigeo Oshima
島 茂 夫 尾
Koji Morita
田 晃 司 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP6293762A priority Critical patent/JP2982631B2/en
Publication of JPH08130268A publication Critical patent/JPH08130268A/en
Application granted granted Critical
Publication of JP2982631B2 publication Critical patent/JP2982631B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To obtain a coating structure for electronic device in which the case is not broken easily at the time of reflow soldering and the product is not damaged easily at the time of cleaning. CONSTITUTION: An electronic device 10 includes a case 12 having substantially U-shaped cross-section. Four ceramic elements 14 are arranged in the case 12, for example. The case 12 is provided, at the other end thereof, with a vent 24 for regulating the inner pressure. The vent 24 communicates between the inside and outside of the case 12 and covered with a heat resistant porous film 26 being bonded to the case 12 through a sealing material 22. The porous film 26 is preferably hydrophobic in viewpoint of waterproofness. Preferably, countless pores of the porous film 26 have diameters of 3μm or less since a larger diameter lowers the waterproof effect significantly.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は電子部品の外装構造に
関し、特にたとえば、表面実装用電子部品の外装構造に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exterior structure for electronic parts, and more particularly to an exterior structure for surface mounting electronic parts.

【０００２】[0002]

【従来の技術】図５ないし図７は、この発明の背景とな
る従来の電子部品の外装構造を示す断面図解図である。
これらの表面実装用電子部品の外装構造は、電子部品素
子１を収納するための空洞２を有するパッケージケース
３を含む。この電子部品の外装構造は、リフローはんだ
付け後のフラックス洗浄時に、洗浄液がパッケージケー
ス３の内部の空洞２に侵入することを防止するため、図
５ないし図７に示すような方法で、完全に密封されるの
が一般的である。すなわち、図５に示す電子部品の外装
構造は、シール材５によってケース本体４が密封され
る。また、図６に示す電子部品の外装構造は、蓋部材６
を接着剤７によってケース本体４に固着することにより
密封される。さらに、図７に示す電子部品の外装構造
は、蓋部材６をたとえば超音波溶接によってケース本体
４に固着することにより密封される。2. Description of the Related Art FIGS. 5 to 7 are sectional schematic views showing a conventional exterior structure of an electronic component which is a background of the present invention.
The exterior structure of these surface mounting electronic components includes a package case 3 having a cavity 2 for housing the electronic component element 1. In order to prevent the cleaning liquid from entering the cavity 2 inside the package case 3 at the time of flux cleaning after reflow soldering, the exterior structure of this electronic component is completely protected by the method shown in FIGS. It is generally sealed. That is, in the exterior structure of the electronic component shown in FIG. 5, the case body 4 is sealed by the sealing material 5. In addition, the exterior structure of the electronic component shown in FIG.
Is fixed to the case body 4 with an adhesive 7 to be hermetically sealed. Further, the exterior structure of the electronic component shown in FIG. 7 is sealed by fixing the lid member 6 to the case body 4 by, for example, ultrasonic welding.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、従来の
電子部品の外装構造では、リフローはんだ付け時に加熱
された際に、ケース内部の空気が膨張して逃げ場を失
い、ケースを変形させたり、シール材５や接着剤７を破
壊して、ケース本体４と蓋部材６との間にリーク孔を生
じさせる場合があった。この場合には、リフローはんだ
付け後のフラックス洗浄時に洗浄液がリーク孔からケー
ス内部に侵入し、製品不良を引き起こす原因となった。However, in the conventional exterior structure for electronic parts, when heated during reflow soldering, the air inside the case expands and loses the escape area, causing the case to deform and the sealing material. 5 and the adhesive 7 may be destroyed to form a leak hole between the case body 4 and the lid member 6. In this case, the cleaning liquid enters the inside of the case through the leak holes during the flux cleaning after the reflow soldering, which causes a defective product.

【０００４】それゆえに、この発明の主たる目的は、リ
フローはんだ付け時に加熱されてもケースが破損しにく
く、洗浄時に製品不良が発生しにくい、電子部品の外装
構造を提供することである。Therefore, a main object of the present invention is to provide an exterior structure for electronic parts in which the case is less likely to be damaged even when heated during reflow soldering, and product defects are less likely to occur during cleaning.

【０００５】[0005]

【課題を解決するための手段】この発明にかかる電子部
品の外装構造は、ケースの一部に通気孔を形成し、通気
孔を多孔質膜で覆うことを特徴とする、電子部品の外装
構造である。また、多孔質膜の孔径は、３μｍ以下であ
ることが好ましい。さらに、多孔質膜は、耐熱性に優
れ、かつ疎水性の素材からなることが好ましい。The exterior structure of an electronic component according to the present invention is characterized in that a ventilation hole is formed in a part of a case and the ventilation hole is covered with a porous film. Is. The pore size of the porous membrane is preferably 3 μm or less. Furthermore, it is preferable that the porous membrane is made of a hydrophobic material having excellent heat resistance.

【０００６】[0006]

【作用】ケースの一部に形成される通気孔を通じて、空
気が流通する。したがって、リフロ−はんだ付け時に
も、ケース内部の圧力がほぼ一定に保たれる。また、通
気孔を覆う多孔質膜によって、空気のみが流通し、洗浄
液は流通しない。したがって、耐水性も損なわれない。The air flows through the ventilation hole formed in a part of the case. Therefore, the pressure inside the case is kept substantially constant even during reflow soldering. Further, due to the porous film covering the ventilation holes, only air flows and no cleaning liquid flows. Therefore, the water resistance is not impaired.

【０００７】[0007]

【発明の効果】この発明によれば、リフローはんだ付け
時にケースにリーク孔が生じにくく、フラックス洗浄に
よって製品不良が発生しにくい、電子部品の外装構造を
得ることができる。According to the present invention, it is possible to obtain an exterior structure for an electronic component in which a leak hole is unlikely to occur in a case during reflow soldering and a product defect is less likely to occur due to flux cleaning.

【０００８】この発明の上述の目的、その他の目的、特
徴および利点は、図面を参照して行う以下の実施例の詳
細な説明から一層明らかとなろう。The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of the embodiments with reference to the drawings.

【０００９】[0009]

【実施例】図１は、この発明の一実施例を示す断面図解
図であり、図２はその正面図解図である。また、図３
は、その内部状況を示すための図解図である。図１に示
す電子部品１０は、セラミックフィルタである。この電
子部品１０は、断面略コ字状のケース１２を含む。ケー
ス１２は、その内部に電子部品素子を収納するための空
洞を有する。ケース１２の開口部は、後述するようにシ
ール材により密封される。この実施例のケース１２は、
たとえば液晶ポリマーなどから形成される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic sectional view showing an embodiment of the present invention, and FIG. 2 is a front schematic view thereof. Also, FIG.
[Fig. 3] is an illustrative view showing its internal situation. The electronic component 10 shown in FIG. 1 is a ceramic filter. The electronic component 10 includes a case 12 having a substantially U-shaped cross section. The case 12 has a cavity for accommodating an electronic component element therein. The opening of the case 12 is sealed with a sealing material as described later. Case 12 of this embodiment is
For example, it is formed of a liquid crystal polymer or the like.

【００１０】ケース１２の内部には、たとえば４枚のセ
ラミック素子１４が配置される。各セラミック素子１４
間には、金属端子１６，１８および２０が配置される。
金属端子１６，１８および２０は、各セラミック素子１
４の電極にそれぞれ接続される。金属端子１６および１
８の一端は、それぞれケース１２の一端部から外部に引
き出される。そして、金属端子１６および１８の引き出
されたケース１２の一端部は、たとえばエポキシ樹脂な
どからなるシール材２２により密封される。また、金属
端子２０の一端は、ケース１２の他端部から外部に引き
出される。そして、金属端子２０の引き出されたケース
１２の他端部も、シール材２２により密封される。Inside the case 12, for example, four ceramic elements 14 are arranged. Each ceramic element 14
Metal terminals 16, 18 and 20 are arranged in between.
The metal terminals 16, 18 and 20 correspond to each ceramic element 1.
4 electrodes, respectively. Metal terminals 16 and 1
One end of each 8 is drawn out from one end of the case 12. Then, one end of the case 12 from which the metal terminals 16 and 18 are pulled out is sealed with a sealing material 22 made of, for example, an epoxy resin. Further, one end of the metal terminal 20 is drawn out from the other end of the case 12. The other end of the case 12 from which the metal terminal 20 is pulled out is also sealed by the sealing material 22.

【００１１】ケース１２の他端部には、内部の圧力を調
整するための通気孔２４が形成される。通気孔２４は、
ケース１２の内部から外部へ貫通して形成される。この
通気孔２４は、耐熱性および通気性を有する多孔質膜２
６で覆われる。この多孔質膜２６は、シール材２２によ
ってケース１２に固着される。多孔質膜２６は、リフロ
ーはんだ付けの際の加熱に耐え得る耐熱性を有する材料
が選択される。また、多孔質膜２６は、疎水性であるこ
とが耐水性の点から望ましい。さらに、多孔質膜２６に
は、無数の孔が開いているが、それらの孔の孔径が０．
１μｍより小さいと十分な通気性が得られず、３μｍよ
り大きいと、防水効果が著しく低下するので、０．１μ
ｍ以上３μｍ以下であることが望ましい。これらの条件
を満たす材料として、たとえば四ふっ化エチレン樹脂な
どを選択することができ、たとえばＮＴＦ１１２１，Ｎ
ＴＦ１１２２，ＮＴＦ１１２５，ＮＴＦ１１２８，ＮＴ
Ｆ１１３１，ＮＴＦ１１３３（登録商標ＭＩＣＲＯ−Ｔ
ＥＸ；日東電工株式会社製）などを用いることができ
る。この実施例では、ＮＴＦ１１２１を使用した。A vent hole 24 for adjusting the internal pressure is formed at the other end of the case 12. The ventilation holes 24 are
The case 12 is formed so as to penetrate from the inside to the outside. The vent hole 24 is a porous film 2 having heat resistance and air permeability.
Covered with 6. The porous film 26 is fixed to the case 12 by the sealing material 22. For the porous film 26, a material having heat resistance that can withstand heating during reflow soldering is selected. In addition, it is desirable that the porous film 26 be hydrophobic in terms of water resistance. Further, the porous film 26 has innumerable holes, but the pore diameters of those holes are 0.
If it is smaller than 1 μm, sufficient air permeability cannot be obtained, and if it is larger than 3 μm, the waterproof effect is remarkably reduced.
It is desirable that it is m or more and 3 μm or less. As a material satisfying these conditions, for example, tetrafluoroethylene resin can be selected. For example, NTF1121, N
TF1122, NTF1125, NTF1128, NT
F1131, NTF1133 (registered trademark MICRO-T
EX; manufactured by Nitto Denko Corporation) or the like can be used. In this example, NTF1121 was used.

【００１２】次に、この実施例の電子部品１０の洗浄試
験結果を説明する。まず、電子部品１０について、リフ
ローはんだ付けをした。このリフローはんだ付けのピー
ク温度は、２５０°Ｃに設定した。その後、１００°Ｃ
に加熱された電子部品を直ちに６０°Ｃの水系洗浄液
（パインアルファＳＴ−１００Ｓ；荒川化学工業株式会
社製）に浸漬し、５分間保持した。そして、電子部品を
取り出し、分解して、内部に洗浄液が侵入しているかど
うかを確認した。その結果、実施例の電子部品１０の場
合、不良発生率は０％であった。一方、通気孔２４の無
い従来品では、不良発生率が２５％であった。Next, the cleaning test result of the electronic component 10 of this embodiment will be described. First, the electronic component 10 was reflow-soldered. The peak temperature of this reflow soldering was set to 250 ° C. After that, 100 ° C
Immediately, the electronic component heated to 60 ° C. was immersed in an aqueous cleaning solution (Pine Alpha ST-100S; manufactured by Arakawa Chemical Industry Co., Ltd.) and held for 5 minutes. Then, the electronic component was taken out, disassembled, and it was confirmed whether or not the cleaning liquid had entered the inside. As a result, in the case of the electronic component 10 of the example, the defect occurrence rate was 0%. On the other hand, in the conventional product having no ventilation hole 24, the defect occurrence rate was 25%.

【００１３】このように、この実施例の電子部品１０の
外装構造によれば、リフローはんだ付け時に加熱されて
も通気孔２４および多孔質膜２６を通じて空気が流通
し、内部の圧力が調整されるので、ケース１２にリーク
孔が生じにくい。また、多孔質膜２６は、無数の孔を有
しているが、それらの孔径が３μｍ以下であり、材質自
体が疎水性であるので、防水効果を有する。したがっ
て、通気孔２４を多孔質膜２６で覆うことにより、洗浄
液が通気孔２４から電子部品１０内部に侵入することが
ない。また、多孔質膜２６は、耐熱性に優れているの
で、電子部品１０のリフロ−はんだ付けの際にも損傷す
ることがない。したがって、リフローはんだ付け後のフ
ラックス洗浄時に、洗浄液がリーク孔からケース１２内
部に侵入せず、製品不良が起こりにくい。As described above, according to the exterior structure of the electronic component 10 of this embodiment, even when heated during reflow soldering, air circulates through the vent hole 24 and the porous film 26, and the internal pressure is adjusted. Therefore, the case 12 is less likely to have a leak hole. Further, the porous membrane 26 has innumerable pores, but the pore diameter thereof is 3 μm or less, and the material itself is hydrophobic, so that it has a waterproof effect. Therefore, by covering the vent holes 24 with the porous film 26, the cleaning liquid does not enter the inside of the electronic component 10 through the vent holes 24. Further, since the porous film 26 has excellent heat resistance, it is not damaged even when the electronic component 10 is reflow-soldered. Therefore, at the time of flux cleaning after reflow soldering, the cleaning liquid does not enter the inside of the case 12 through the leak holes, and product defects are less likely to occur.

【００１４】図４は、この発明の他の実施例を示す断面
図解図である。図４に示す電子部品１０は、セラミック
発振子である。この電子部品１０は、断面略コ字状のケ
ース本体１２ａを含む。ケース本体１２ａの開口部に
は、断面略Ｔ字状の蓋部材１２ｂがたとえば接着剤など
により固着され、密封される。こうしてケース１２は、
その内部に電子部品素子を収納するための空洞を有して
形成される。FIG. 4 is a schematic sectional view showing another embodiment of the present invention. The electronic component 10 shown in FIG. 4 is a ceramic oscillator. The electronic component 10 includes a case body 12a having a substantially U-shaped cross section. A lid member 12b having a substantially T-shaped cross section is fixed to the opening of the case body 12a with, for example, an adhesive agent and sealed. In this way, the case 12
It is formed to have a cavity for accommodating an electronic component element therein.

【００１５】ケース１２の内部には、セラミック素子１
４が配置される。セラミック素子１４は、金属端子１６
および１８に厚み方向両側から挟持されるとともに電気
的に接続される。金属端子１６および１８は、ケース１
２の長手方向の一端側から引き出される。金属端子１６
および１８の引き出されたケース１２の一端部は、たと
えばエポキシ樹脂などからなるシール材２２により密封
される。Inside the case 12, inside the ceramic element 1
4 are arranged. The ceramic element 14 has a metal terminal 16
And 18 from both sides in the thickness direction and are electrically connected. The metal terminals 16 and 18 are the case 1
2 is pulled out from one end side in the longitudinal direction. Metal terminal 16
One end of the drawn case 12 of 18 and 18 is sealed by a sealing material 22 made of, for example, an epoxy resin.

【００１６】ケース１２の他端部には、内部の圧力を調
整するための通気孔２４が形成される。通気孔２４は、
ケース１２の内部から外部へ貫通して形成される。この
通気孔２４の内部側の開口部は、図１に示す実施例と同
様の多孔質膜２６で覆われる。この実施例においては、
多孔質膜２６はその周縁部において接着材で強固に固着
される。A vent hole 24 for adjusting the internal pressure is formed at the other end of the case 12. The ventilation holes 24 are
The case 12 is formed so as to penetrate from the inside to the outside. The inside opening of the vent hole 24 is covered with a porous film 26 similar to that of the embodiment shown in FIG. In this example,
The porous film 26 is firmly fixed to the peripheral portion by an adhesive.

【００１７】図４に示す実施例によっても図１に示す実
施例と同様の効果を得ることができる。The same effect as the embodiment shown in FIG. 1 can be obtained by the embodiment shown in FIG.

【００１８】なお、ケース１２の材質は、耐熱性のある
ものであればよく、プラスチック、セラミックス、金属
などの材料を用いることができる。また、シール材２２
としては、上述のものに限らず、ウレタン樹脂、シリコ
ーン、およびＵＶ硬化型樹脂などを用いることができ
る。The material of the case 12 may be any material having heat resistance, and plastic, ceramics, metal or the like can be used. In addition, the sealing material 22
Not limited to the above, urethane resin, silicone, UV curable resin and the like can be used.

【００１９】また、多孔質膜２６の固着は、上述の方法
に限らず、たとえば接着剤による接着、熱融着、超音波
ウエルドなどの方法によって固着してもよい。Further, the fixing of the porous film 26 is not limited to the above-mentioned method, and it may be fixed by a method such as adhesion with an adhesive, heat fusion, ultrasonic welding, or the like.

【００２０】さらに、この実施例の電子部品の外装構造
は上述のものに限らず、他の電子部品、たとえば、フィ
ルタ，発振子，センサ，リレー，スイッチ，ハイブリッ
ドＩＣなどにも適用することができる。Further, the exterior structure of the electronic component of this embodiment is not limited to the above-mentioned one, but can be applied to other electronic components such as a filter, an oscillator, a sensor, a relay, a switch, a hybrid IC and the like. .

【図面の簡単な説明】[Brief description of drawings]

【図１】この発明の一実施例を示す断面図解図である。FIG. 1 is a schematic sectional view showing an embodiment of the present invention.

【図２】図１に示す実施例の正面図解図である。FIG. 2 is a front view solution diagram of the embodiment shown in FIG.

【図３】図１に示す実施例の内部状況を示す図解図であ
る。FIG. 3 is an illustrative view showing an internal situation of the embodiment shown in FIG.

【図４】この発明の他の実施例を示す断面図解図であ
る。FIG. 4 is a schematic sectional view showing another embodiment of the present invention.

【図５】この発明の背景となる従来の電子部品の外装構
造の一例を示す図解図である。FIG. 5 is an illustrative view showing an example of a conventional exterior structure of an electronic component, which is a background of the present invention.

【図６】この発明の背景となる従来の電子部品の外装構
造の他の例を示す図解図である。FIG. 6 is an illustrative view showing another example of a conventional exterior structure of an electronic component which is a background of the present invention.

【図７】この発明の背景となる従来の電子部品の外装構
造のさらに他の例を示す図解図である。FIG. 7 is an illustrative view showing still another example of the conventional exterior structure of an electronic component, which is the background of the present invention.

【符号の説明】[Explanation of symbols]

１０ 電子部品 １２ ケース １４ セラミック素子 １６，１８，２０ 金属端子 ２２ シール材 ２４ 通気孔 ２６ 多孔質膜 10 Electronic Components 12 Case 14 Ceramic Element 16, 18, 20 Metal Terminal 22 Sealing Material 24 Vent Hole 26 Porous Membrane

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 ケースの一部に通気孔を形成し、前記通
気孔を多孔質膜で覆うことを特徴とする、電子部品の外
装構造。1. An exterior structure for an electronic component, wherein a ventilation hole is formed in a part of a case, and the ventilation hole is covered with a porous film. 【請求項２】 前記多孔質膜の孔径が３μｍ以下である
ことを特徴とする、請求項１に記載の電子部品の外装構
造。2. The exterior structure of an electronic component according to claim 1, wherein the pore size of the porous film is 3 μm or less. 【請求項３】 前記多孔質膜は、耐熱性に優れ、かつ疎
水性の材料からなることを特徴とする、請求項１または
請求項２に記載の電子部品の外装構造。3. The exterior structure of an electronic component according to claim 1, wherein the porous film is made of a material having excellent heat resistance and hydrophobicity.
JP6293762A 1994-11-01 1994-11-01 Exterior structure of electronic components Expired - Fee Related JP2982631B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6293762A JP2982631B2 (en) 1994-11-01 1994-11-01 Exterior structure of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6293762A JP2982631B2 (en) 1994-11-01 1994-11-01 Exterior structure of electronic components

Publications (2)

Publication Number Publication Date
JPH08130268A true JPH08130268A (en) 1996-05-21
JP2982631B2 JP2982631B2 (en) 1999-11-29

Family

ID=17798895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6293762A Expired - Fee Related JP2982631B2 (en) 1994-11-01 1994-11-01 Exterior structure of electronic components

Country Status (1)

Country Link
JP (1) JP2982631B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100323644B1 (en) * 1997-10-24 2002-03-08 가네꼬 히사시 Semiconductor device
JP2009010591A (en) * 2007-06-27 2009-01-15 Fujitsu Media Device Kk Function device having package structure and manufacturing method thereof
JP2010103647A (en) * 2008-10-21 2010-05-06 Fujitsu Media Device Kk Surface acoustic wave device
CN103732026A (en) * 2013-12-24 2014-04-16 深圳市宝尔爱迪科技有限公司 Waterproof structure and electronic device with same
US9074778B2 (en) 2009-11-04 2015-07-07 Ssw Holding Company, Inc. Cooking appliance surfaces having spill containment pattern

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100323644B1 (en) * 1997-10-24 2002-03-08 가네꼬 히사시 Semiconductor device
US6410981B2 (en) 1997-10-24 2002-06-25 Nec Corporation Vented semiconductor device package having separate substrate, strengthening ring and cap structures
JP2009010591A (en) * 2007-06-27 2009-01-15 Fujitsu Media Device Kk Function device having package structure and manufacturing method thereof
JP2010103647A (en) * 2008-10-21 2010-05-06 Fujitsu Media Device Kk Surface acoustic wave device
US9074778B2 (en) 2009-11-04 2015-07-07 Ssw Holding Company, Inc. Cooking appliance surfaces having spill containment pattern
CN103732026A (en) * 2013-12-24 2014-04-16 深圳市宝尔爱迪科技有限公司 Waterproof structure and electronic device with same

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