JPH08116179A - Container for electronic circuit - Google Patents

Abstract

PURPOSE: To provide a container for electronic circuits of which the man-hour can be reduced, of which a hole filled with insulating resin can be easily sealed, and excellent sealability can be provided. CONSTITUTION: A container 101 assembled to a board section 130 having electronic circuits has a connector housing 112 opened toward a direction along the wall surface of a box body 111. Near an opening 112a of a connector housing 112, a through-hole 114 used for filling up the circuit chamber with an insulating resin is made in a wall of the box body 111. After injecting silicon gel, an adhesive sheet 117 is stuck to seal the through-hole 114. At the time of using the electronic product 100, mating connectors 171 and 172 are fitted to the connector housing 112, and the through-hole 114 and the adhesive sheet 117 are hidden below the mating connectors 171 and 172 so that the peeling-off of the adhesive sheet 117 can be prevented. Moreover, it is possible to omit the use of the adhesive sheet 117.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an electronic circuit container,
For example, the present invention relates to an electronic circuit container used in an on-vehicle electronic device.

[0002]

2. Description of the Related Art Conventionally, in a vehicle-mounted electronic product manufactured by assembling an electronic circuit container on a thick film substrate on which circuit components are mounted,
In order to prevent corrosion of the circuit part, a silicone oil-based gel-like substance is filled as an insulating resin into the circuit chamber, which is the internal space of the electronic circuit container.

[0003]

The filling of the gel-like substance is
For example, it is performed as follows. As shown in FIG. 10, the board portion 5 in which the circuit component 532 is mounted on the board 531
After assembling the container 501 having the connector portion 516 to 30, the circuit chamber is filled with silicon gel to a height at which the circuit component 532 is hidden. After the silicon gel is filled, a resin plate 500 serving as a lid of the electronic product is bonded to the upper portion of the container 501 with an adhesive.

However, the above method has a problem that it is difficult to reduce the manufacturing cost because a step of curing the adhesive used for bonding the resin plate 500 is required. An object of the present invention is to provide an electronic circuit container in which the number of steps is reduced, the insulating resin injection portion can be easily sealed, and the sealing property is good.

[0005]

In order to solve the above-mentioned problems, in the electronic circuit container according to claim 1 of the present invention, the connector housing is opened in the direction along the wall surface of the box body, A hole communicating with the inside of the box body is formed on the wall surface near the opening of the connector housing.

An electronic circuit container according to a second aspect of the present invention is the electronic circuit container according to the first aspect, wherein the hole is located above the insulating resin with which the inside of the box body is filled. It is characterized by Further, an electronic circuit container according to claim 3 of the present invention is the electronic circuit container according to claim 1 or 2, characterized in that it is provided with a sealing material for closing the hole.

[0007]

According to the electronic circuit container according to the first aspect of the present invention, a hole is provided in the wall surface of the box near the opening of the connector housing that opens in the direction along the wall surface of the box. Therefore, the hole is hidden below the mating connector that is fitted into the connector housing. Therefore,
It is possible to prevent the entry of water or foreign matter into the inside of the hole to some extent by sealing the hole by the mating connector without providing a member for sealing the hole on the electronic circuit container side. Further, when a sealing material that seals the hole is used, there is an effect that the sealing material is protected by the mating connector.

Further, according to the electronic circuit container of the second aspect of the present invention, since the hole is located above the insulating resin, the operation of filling the insulating resin through the hole is easy. Further, according to the electronic circuit container of the third aspect of the present invention, since the hole is sealed by the sealing material, it is possible to prevent water or foreign matter from entering the inside of the hole. Further, since the mating connector protects the sealing material from external force, it has an effect of preventing the sealing material from being removed from the hole.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIGS. 1 to 5 show a first embodiment of the present invention. As shown in FIG. 1, an electronic product 100 is a container 1 having a connector unit 116 on a substrate unit 130 having an electronic circuit.
01 is assembled and manufactured.

The board portion 130 comprises a circuit board 131 on which a circuit component 132 is mounted, and a metal base 134 that supports the circuit board 131 and forms a part of the outer wall of the electronic product 100. On the circuit board 131, the solder paste is applied on the land and the terminal leads 12
A connection pad 133 for connecting the two is formed.

The container 1 assembled above the substrate 130
As shown in FIG. 2, 01 includes a box body 111 and a connector block 120 in which a connector housing 112 and a terminal lead 122 are integrally molded. The center portion of the terminal lead 122 has a connector block 120.
It is included on the wall surface of. One end 123 of the terminal lead 122 projects from the lower portion of the connector block 120 and is bent toward the substrate 130 so as to be connectable to the connection pad 133. In addition, the other end of the terminal lead 122 has the opening 1 inside the connector housing 112.
Connector pin 124 protruding in the direction of 12a and capable of being fitted to the mating connectors 171 and 172 on the wire harness side.
Is formed. Box 111 near the opening 112a
A through hole 114 for injecting silicon gel is provided on the upper surface of the. The through hole 114 is formed by fitting the mating connectors 171 and 172 to the connector pin 124.
When the electronic product 100 is used, the mating connector 171, 1
The through hole 114 is provided at a position hidden under 72 so that it cannot be seen from the outside.

When manufacturing the electronic product 100, first, the circuit board 1
The connector block 120 is assembled to 31. Circuit board 1
One end 123 of the terminal lead 122 is soldered onto the connection pad 133 of 31 and then the circuit board 1
A base 134 is attached below 31. Next, as shown in FIG. 3, the substrate unit 130 and the connector block 120
The box body 111 is covered from above, and the lower end of the box body 111 and the outer peripheral portion of the base 134 are bonded by the adhesive 152. At this time, if there is a gap between the lower end of the box body 111 and the outer peripheral portion of the base 134, or if air bubbles are present in the adhesive portion, the silicon gel will leak in a subsequent step, so be careful. In the first embodiment of the present invention, since the circuit chamber 160 is open to the atmosphere due to the through hole 114 when the box 111 is bonded, the bonding is prevented from being incomplete due to the pressure change in the circuit chamber.

Next, as shown in FIG. 4, the nozzle 1 at the tip of the dispenser 181 for supplying the silicon gel 161.
82 is inserted into the through hole 114, and the silicon gel 161 is injected into the circuit chamber 160. As shown in FIG. 5, after the silicon gel 161 is injected until the circuit component 132 is completely immersed, the whole is heated to cure the silicon gel 161. Further, a pressure sensitive adhesive sheet 117 having a pressure sensitive adhesive on one surface is attached as a sealing material for sealing the through holes 114.

When the mating connectors 171 and 172 are fitted in the connector housing 112, as shown in FIG.
The through hole 114 and the adhesive sheet 117 are located below the mating connectors 171 and 172. Mating connector 17
Since it is possible to prevent the adhesive sheet 117 from peeling off by pressing the adhesive sheet 117 with 1, 172, the adhesive force of the adhesive sheet 117 may be as weak as temporary fixing. Here, if a sealing material made of a material that is impermeable to moisture but permeable to air is used, it is possible to prevent moisture from entering the circuit chamber and buffer the pressure change in the circuit chamber.

Furthermore, the hole may be left open when the electronic product is completed, without using a sealing material for sealing the hole. Since the hole is hidden by the mating connector fitted in the connector housing when the electronic product is used, mixing of water or foreign matter into the circuit chamber can be prevented to some extent even without providing a sealing material. As a result, the work of sealing the holes becomes unnecessary, and the manufacturing process of electronic products is simplified.

The larger the diameter of the through hole 114, the better the workability of injecting the silicon gel 161. However, if the through hole 114 is too large, the mating connectors 171 and 172 may not be able to cover the through hole 114. On the other hand, if the difference between the diameter of the through hole 114 and the diameter of the nozzle 182 is too small, it may be difficult to position the dispenser 181 and air leakage in the circuit chamber 160 due to the injection of the silicon gel 161 may deteriorate. is there. For the above reason, the through hole 114
The hole diameter is preferably about twice the diameter of the nozzle 182.

According to the first embodiment of the present invention, since the connector portion 116 is provided above the substrate portion 130, the electronic product 10 is provided.
0 can be miniaturized. Further, since the opening of the connector housing 112 is in the direction along the wall surface of the box body 111, the height of the electronic product 100 can be reduced, and the mating connectors 171 and 172 and the connector pin 124 can be connected to each other. When mated, a part of the wall of the box body 111 is hidden below the mating connectors 171 and 172. Therefore, the through hole 114 is provided in a portion hidden below the mating connectors 171, 1727, and the mating connector 1
71 and 172, the adhesive sheet 117 of the through hole 114
Can be protected.

(Second Embodiment) A second embodiment of the present invention is shown in FIG.
~ Shown in FIG. The second embodiment is an example in which the container in the first embodiment is constructed by assembling a connector block having a terminal lead in a connector housing from the inside of a case in which a box body and a connector housing are integrally molded.

As shown in FIG. 7, the container 201 is a box body 2.
The case 210 includes a connector housing 212 that opens in a direction along the upper surface of the connector 11, and a connector block 220 that is mounted from inside the case 210 into the connector housing 212. The electronic product 200 is manufactured by attaching the container 201 to the substrate portion 230.

The board portion 230 includes a circuit board 231 on which the circuit component 232 is mounted, and a metal base 234 that supports the circuit board 231 and forms a part of the outer wall of the electronic product 200. Connection pads 233 for connecting the terminal leads 222 are provided on the circuit board 231. The connector block 220 disposed above the substrate portion 230 is a resin member integrally molded with the plurality of terminal leads 222, and includes the pedestal 225 and the pedestal 2
25, and a holding plate 226 formed perpendicularly to 25. The connection wire 223, which is one end of the terminal lead 222, protrudes from the outer peripheral end of the pedestal 226 and protrudes from the board portion 2.
It is bent to the 30 side. Meanwhile, the terminal lead 22
The connector pin 224, which is the other end of the holding plate 2,
From the side surface of 26, it protrudes in parallel with the pedestal 225 so that the mating connector can be fitted. The connector block 220 prevents the plurality of terminal leads 222 from electrically short-circuiting each other, and also provides the positional accuracy for correctly fitting the connector pin 224 to a mating connector (not shown).

A case 210 having a connector housing 212 that opens in a direction along the upper surface of the box body 211 is assembled from above the connector block 220 to form outer walls of the upper and side surfaces of the electronic product 200. Box 211
The upper surface of the connector housing 212 has an opening 212
A through hole 214 for injecting silicon gel is provided near a.

When assembling the electronic product 200, as shown in FIG. 8A, first, the circuit component 232 is placed on the solder paste 244 applied on the circuit board 231, and the solder paste 244 is applied on the land. Formed connection pad 2
The connection line 223 of the connector block 220 is placed on 33. The whole is heated to melt the solder paste 244,
The circuit component 232 and the connection line 223 are soldered on the circuit board 231. Then, as shown in FIG.
The circuit board 231 to which the connector block 220 is joined is adhered and fixed onto the base 234 with the adhesive 251 and the case 210 is covered from above the connector block 220, and the box body 211 of the case 210 is covered with the adhesive 252.
The concave portion 211a provided at the lower end of the base and the outer periphery of the base 234 are adhesively fixed. The connector block holding plate 2 is provided inside the connector housing 212 formed in the case 210.
26 is located, and the upper end of the holding plate 226 is fitted in the groove portion 215 provided on the upper inner wall surface of the connector housing 212.

Next, as shown in FIG. 8C, the through hole 2
Silicon gel 261 is injected into the circuit chamber 260 from 14 and cured by heating. Further, an adhesive sheet 217 having an adhesive on one surface is attached as a sealing material for sealing the through hole 214. According to the second embodiment of the present invention, the adhesive sheet 217 in the through hole 214 can be protected by the mating connector as in the first embodiment.

Further, the case 210 and the connector block 2
Since 20 and 20 are separately molded and the two parts are combined to form the container 201, there is an effect that the structure of the molding die is simplified. Further, since the connector block 220 and the case 210 are not airtight, the silicone gel 2
Even if the gel injection hole 214 is sealed after the injection of 61, the circuit chamber 2
60 is not hermetically sealed, and the stress generation due to the volume change of the gas in the circuit chamber 260 is prevented.

(Third Embodiment) A third embodiment of the present invention is shown in FIG.
Shown in The third embodiment differs from the second embodiment in the method of connecting the terminal leads to the circuit board. The container 301 has a case 310 having a connector housing 312 that opens in a direction along the upper surface of the box body 311.
And the connector housing 312 from the inside of the case 310.
The connector block 320 is mounted inside. On the upper surface of the box 311, a through hole 314 for injecting silicon gel is provided near the opening 312a of the connector housing 312. The electronic product 300 is manufactured by attaching the container 301 to the board portion 330 including the circuit board 331 and the base 334.

The connector block 320 is a resin member integrally molded with the plurality of terminal leads 322. A spring portion 323 capable of holding the circuit board 330 is formed at one end of the terminal lead 322.
On the other hand, the other end of the terminal lead 222 projects from the connector block 320 into the connector housing 312 so as to be able to fit with the mating connector, and the connector pin 324.
Is formed.

When assembling an electronic product, first, the connector block 320 is attached to the circuit board 330. By sandwiching the circuit board 330 in the spring portion 323 of the terminal lead 322, the circuit board 330 and the terminal lead 322 are electrically connected. At this time, if reliability of the connection part is required due to the environment in which the electronic product is used, the spring part 323 is formed by soldering or heat welding with laser light.
To reinforce the connection between the circuit board 330 and the circuit board 330. The subsequent steps are the same as those in the second embodiment.

According to the third embodiment of the present invention, similarly to the first and second embodiments, the through hole 31 is provided below the mating connector.
4 can be hidden and the sealing material of the through hole 314 can be protected. In the first to third embodiments of the present invention, the connector housing is provided on the upper surface of the box body and the connector block is mounted above the circuit board. However, the connector housing is provided on the side of the circuit board, that is, in the box. The present invention can also be applied to the case where it is provided on the side surface of the body.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an electronic product using an electronic circuit container according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing positions of through holes in an electronic product using the electronic circuit container according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a method of manufacturing an electronic product using the electronic circuit container according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a method of manufacturing an electronic product using the electronic circuit container according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a method of manufacturing an electronic product using the electronic circuit container according to the first embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a usage state of an electronic product using the electronic circuit container according to the first embodiment of the present invention.

FIG. 7 is an exploded perspective view showing an electronic product using the electronic circuit container according to the second embodiment of the present invention.

8A to 8C are cross-sectional views showing a method for manufacturing an electronic product using the electronic circuit container according to the second embodiment of the present invention.

FIG. 9 is a sectional view showing an electronic product using the electronic circuit container according to the third embodiment of the present invention.

FIG. 10 is an exploded perspective view showing an electronic product using a conventional electronic circuit container.

[Explanation of symbols]

 101 Container (Electronic Circuit Container) 111 Box Body 112 Connector Housing 112a Opening 114 Through Hole (Hole) 116 Connector Part 117 Adhesive Sheet (Sealing Material) 120 Connector Block 122 Terminal Lead 124 Connector Pin 130 Board Part 131 Circuit Board 132 Circuit Parts 133 Connection pad 134 Base 141 Solder paste 152 Adhesive 160 Circuit room 161 Silicon gel 171 and 172 Counterpart connector 181 Dispenser 182 Nozzle 201 Container (electronic circuit container) 210 Case 214 Through hole (hole) 215 Groove 244 Solder paste 323 Spring Department

Claims (3)

[Claims] 1. A connector housing is opened toward a direction along a wall surface of a box body, and a hole communicating with the inside of the box body is formed on the wall surface near an opening portion of the connector housing. And electronic circuit container. 2. The electronic circuit container according to claim 1, wherein the hole is located above the insulating resin with which the inside of the box body is filled. 3. The electronic circuit device according to claim 1, further comprising a sealing material that closes the hole.