JPH08124749A - Chip inductor and its manufacture - Google Patents

Abstract

PURPOSE: To provide an inexpensive chip inductor which can be used for various kinds of electronic equipment and has a large inductance value and small size. CONSTITUTION: A covered conductor 2 is wound around a core 1 and the end faces 3 of the conductor 2 are respectively flushed with both end faces 5 of the core 1. Then the core 1 is coated with a molding resin 4 except both end faces 5 in the shape of a rectangular parallelepiped. A high-performance small- sized chip inductor is obtained when external electrodes 6 are respectively formed on both end faces 5 of the core 1 and connected to the end sections of the conductor 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip inductor used in electronic devices such as personal computers, televisions, video devices, communication devices, etc., and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of various electronic equipment and communication equipment, miniaturization of parts used in these electronic equipment and communication equipment is required, and miniaturization of chip inductors is also progressing.

A conventional chip inductor will be described below. As a conventional chip inductor, for example, there is one disclosed in Japanese Patent Laid-Open No. 4-323809.

FIG. 18 is a plan view for explaining a conventional chip inductor. The conventional chip inductor is U
The coated conductive wire 2 is wound around the U-shaped chip 181, and the one-shaped chip 182 is bonded to the bonding surfaces at both ends of the U-shaped chip 181. A metal plate was used as the electrode 183, and the coated conductive wire 2 and the electrode 183 were joined at the side surface of the U-shaped chip 181. However, in the above-mentioned conventional chip inductor, since the electrodes are metal plates, the cost is high,
Further, there is a problem that miniaturization is difficult because there is a limit to miniaturization of metal plate processing.

As a countermeasure against this, the conventional method is Japanese Patent Laid-Open No. 57-482.
16, there is a chip inductor in which a thick film external electrode is formed on the surface of ferrite. FIG. 19 is a perspective view of another conventional chip inductor. In FIG. 19, 1 is a U-shaped core, 2 is a coated conductive wire, 3 is an end face of this coated conductive wire, and 191 is a thick film external electrode. A thick film external electrode 191 is formed on the groove-side surface of the core 1 excluding the groove, the coated conductive wire 2 is wound around the groove of the core 1, and the end portion 3 is formed by the thick film external electrode 1
Connect to 91.

[0006]

However, since the magnetic flux is shielded by the electrodes in this conventional chip inductor, a large inductance value cannot be obtained. When trying to obtain a large inductance value, the shape becomes large and it is difficult to reduce the size.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide an inexpensive and small chip inductor having a large inductance value and a manufacturing method thereof.

[0008]

In order to achieve this object, the chip inductor of the present invention has a core in which a coated wire is wound, and the end surfaces of the coated wire are arranged on the same plane as the opposite end surfaces of the core. However, only the side surfaces of the core other than the opposite end surfaces of the core are resin-molded in the substantially rectangular parallelepiped, and the thick film external electrodes connected to the end portions of the covered conductor at the opposite end portions are provided.

[0009]

With this structure, since the external electrode formed of a thick film and the end of the covered conductor are connected to each other, a metal plate for an electrode is not required and a fine electrode can be formed, which reduces the manufacturing cost. It is possible to reduce the size. Further, since the electrode is located on the surface perpendicular to the axial direction of the core, the magnetic flux is not shielded, and the size can be reduced with a large inductance value.

[0010]

【Example】

(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view of a chip inductor according to a first embodiment of the present invention, and FIG. 2 is a sectional view thereof.

1 and 2, 1 is a core, 2 is a coated conductor, 3 is an end face of the coated conductor, 4 is a mold resin, 5 is a core end face, and 6 is a thick film external electrode. A coated wire 2 is wound around a core 1, and thick film external electrodes 6 are formed on opposite end surfaces 5 of the core 1. The end surface 3 of the coated wire is the same as the opposite end surfaces 5 of the core 1. It is installed on a plane and is electrically connected to the thick film external electrode 6. In addition, the periphery of the core 1 around which the coated conductive wire 2 is wound is covered with the molding resin 4 on the side surfaces of the core 1 excluding the opposite side surfaces.

The core 1 of this embodiment has a mechanical strength capable of withstanding windings and is made of a magnetic material having a high magnetic permeability, for example, Ni--Zn based phyllite in order to realize a large-capacity inductor. The magnetic material may be oxide-based phyllite, iron-based metal or alloy-based material such as sendust alloy, permalloy alloy, or amorphous alloy.

The coated conductor wire 2 is, for example, a urethane-coated copper wire, and is wound around the core 1 by the number of turns that provides a desired inductance value.

The mold resin 4 is a thermosetting resin having excellent heat resistance, such as an epoxy resin. Molding gives a chip inductor in a substantially rectangular parallelepiped shape, which can be adsorbed by an automatic mounting machine.

Since the thick film external electrode 6 satisfies the mountability as a chip component and the terminal strength, it can be obtained by, for example, dipping a conductive resin or baking after printing. According to the manufacturing method described later, since the end face of the coated conductor and the end face of the core are exposed on the end face, an electrode is formed on the end face by dipping or printing, and at the same time, the coated conductor is electrically connected. As a result, the two steps of forming the electrodes and connecting the coated conductors can be reduced to one step, and the chip inductor can be manufactured at low cost.

The thick film external electrode 6 is a silver baking type electrode,
An electroplating electrode, an electroless plating electrode, or a thin film electrode may be used.

FIG. 3 shows a method of manufacturing the chip inductor of the first embodiment of the present invention. First, a punching hole (square) and a break groove (dotted line) are provided in the ferrite green sheet of FIG. 3A as shown in FIG. 3B, and the long core 61 of FIG. 3C is obtained by a break after firing. Figure 3 (d)
As shown in, winding the covered wire 2 around the long core 61,
As shown in FIG. 3 (e), the long core 61 wound with the coated conductive wire 2 is molded with the molding resin 4, cut at the cutting position 62, and the electrode 6 is attached to the cut surface as shown in FIG. 3 (f). Form. The electrodes 6 may be formed on a cut surface and a part of the four surfaces in contact with the cut surface, that is, a total of five surfaces.

Since ferrite green sheets are laminated, holes are punched by a punching machine, and a long break is formed after firing, there is an effect that the processing time is short and the manufacturing is inexpensive.

It is also possible to obtain the long core 61 of FIG. 3 (c) by using the sintered ferrite plate of FIG. 3 (a) and performing the square hole and cutting of FIG. 3 (b) with a laser.

Further, the end face 3 of the coated conductor wire may be an ellipse cut obliquely. The method of diagonal cutting is to wind the coated conductor around the core, install the end of the coated conductor diagonally to the end surface of the core,
After resin molding, cut at right angles to the core. The end surface 3 of the coated conductor and the thick film external electrode 5 which are cut in parallel with the end surface of the core have a large contact area, thereby increasing the reliability of connection.

As the chip inductor according to the first embodiment of the present invention, a U-shaped core having an outer size of 0.5 × 0.6 × 1.6 mm and a magnetic permeability of 650 is wound with 30 turns of a coated wire of 30 μm. By turning, a small inductance having an inductance value of 3 μH and a chip size of 1608 size defined by the Japan Electronic Machinery Manufacturers Association is obtained. Further, the magnetic flux is almost confined in the axial portion of the core, the core convex portion, the auxiliary core, and the other core convex portions.

(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings. FIG. 4 is a perspective view of a chip inductor according to the second embodiment of the present invention. 41 is a square bar-shaped magnetic core. The other components having the same configurations as those in the first embodiment are denoted by the same reference numerals. In the chip inductor whose outer shape is a substantially rectangular parallelepiped, since the core has a square rod shape in the second embodiment of the present invention, the shape of the core can be increased up to the vicinity of the outer surface of the chip inductor, and the cross-sectional area of the core increases, There is an effect that the inductance value can be increased.

(Embodiment 3) A third embodiment of the present invention will be described below. As shown in FIG. 5, by using the H-shaped magnetic body 51 having the H-shaped core, the winding position of the coated conductor is stabilized and the variation in the inductance value can be reduced. Further, since the magnetic flux is along the letter H, it is not shielded by the external thick film electrode. Therefore, the inductance value does not decrease.

(Embodiment 4) A fourth embodiment of the present invention will be described below. A square rod-shaped nonmagnetic material is used as the core.
In this embodiment, low dielectric constant alumina is used. As a result, the stray capacitance between lines can be reduced, and the upper limit of usable frequency can be expanded from several hundred MHz to several GHz, so that a high frequency inductor can be obtained.

(Fifth Embodiment) A fifth embodiment of the present invention will be described below. A U-shaped non-magnetic material is used as the core. In this embodiment, U-shaped alumina having a low dielectric constant is used. As a result, the stray capacitance between lines can be reduced, the upper limit of usable frequency can be expanded from several hundred MHz to several GHz, and the winding position can be stabilized, so that a high-frequency inductor with less variation can be obtained.

(Embodiment 6) A sixth embodiment of the present invention will be described below. In the sixth embodiment, an H-shaped non-magnetic material is used as the core. In this embodiment, an H-shaped alumina having a low dielectric constant is used. As a result, the stray capacitance between lines can be reduced, the upper limit of the usable frequency can be expanded from several hundred MHz to several GHz, and the winding position can be stabilized, so that a high-frequency inductor with less variation can be obtained.

(Embodiment 7) A seventh embodiment of the present invention will be described below. FIG. 6 is a perspective view of a chip inductor according to a seventh embodiment of the present invention. The end portion 7 of the coated conductor wire is arranged along the outer periphery of both end surfaces 5 of the core. As shown in the perspective view of FIG. 7, the core used in the seventh embodiment of the present invention has grooves 8 on the outer peripheral portions of the opposite end surfaces of the core,
A conductive portion 9 exists inside the groove 8.

FIG. 8 shows a method of manufacturing the chip inductor of the seventh embodiment of the present invention. A square hole 81 and a through hole 82 shown in FIG. 8B are formed in the ferrite green sheet of FIG. 8A, and a break groove is provided across the through hole. A conductive material such as silver is printed in the through hole 82 to form a conductive portion inside. After firing, a long ferrite core 83 including the groove 8 and the conductive portion 9 shown in FIG. 8C is obtained by breaking on the surface including the through hole 82. The coated conductive wire 2 is wound around the core 83. At that time, the coated wire 2 is wound so as to pass through the groove 8. The coating of the portion corresponding to the end 7 of the coated conductor is peeled off by laser irradiation or the like, and electrically connected to the conductive portion 9 by soldering or the like. After molding, the surface including the groove 8 is cut into individual pieces to form external electrodes. This external electrode formation is obtained, for example, by dipping a conductive resin. Since the cross section of the conductive portion 9 is exposed, the external electrode and the conductive portion 9 are connected by this dip. As a result, the contact area between the end portion 7 of the coated conductor 2 and the thick film external electrode 5 is increased, and the connection reliability is improved.

(Embodiment 8) An eighth embodiment of the present invention will be described below. FIG. 9 is a perspective view of the chip inductor of the eighth embodiment. 91 is an auxiliary core.

FIG. 10 shows a method of manufacturing a chip inductor according to the eighth embodiment of the present invention. The ferrite green sheet of FIG. 10 (a) is subjected to the square hole and break groove processing of FIG. 10 (b) and fired. By the break, a long ferrite core 61 is obtained as shown in FIG. At this time, a simple prismatic auxiliary core 71 is also obtained at the same time. Figure 10
As shown in (d), the coated conductor is wound around the long core 61, and the long auxiliary core 71 is attached to the long core as shown in FIG. 10 (e). Further resin mold,
The cutting is performed at the position of arrow 62 in FIG. A thick film electrode is formed on the cross section of the obtained individual piece. The long auxiliary core 71 is also formed by stacking green sheets.

The auxiliary core 91 of FIG. 9 constitutes a closed magnetic circuit with the core 1. Therefore, there is an effect that the inductance value becomes large. Further, by providing a gap between the core 1 and the auxiliary core 6, it is possible to relax the magnetic saturation and increase the DC current at which the inductance value starts to decrease.

In order to produce a long core, ferrite green sheets are laminated, holes are punched by a punching machine, and after firing, breaks into a long shape.
There is an effect that it can be manufactured at low cost. Further, the auxiliary core can be formed simultaneously in the green sheet for the long core, and can be separated from the long core by the break.

(Embodiment 9) A ninth embodiment of the present invention is shown in FIG.
1 will be described with reference to the perspective view of FIG. Reference numeral 92 is a rod-shaped core, and 93 is a U-shaped auxiliary core. The coated conductor wire 2 is wound around the rod-shaped core 92. When the core is rod-shaped, the coated conductors can be continuously wound around the long core at the same pitch, so that the manufacturing cost can be reduced. Further, since the auxiliary core is U-shaped, a closed magnetic circuit can be formed by combining with the rod-shaped core, and the inductance value can be increased.

(Embodiment 10) A tenth embodiment of the present invention will be described with reference to the perspective view of FIG. 1 is a U-shaped core,
Reference numeral 121 is a U-shaped auxiliary core. The core is U-shaped,
When the auxiliary core is also U-shaped, a closed magnetic circuit close to a circle can be formed by combining the two, so that the magnetic resistance is low and the inductance is large.

(Embodiment 11) An eleventh embodiment of the present invention will be described below. In the configuration shown in FIG. 9, the core 1 and the auxiliary core 91 are made of Ni—Zn based ferrite. Since Ni-Zn ferrite has high insulation resistance,
Even if the external electrodes are formed on both end faces of the ferrite, the problem of short circuit between the electrodes does not occur. Since the cost of forming the external electrodes can be reduced, the chip inductor can be mass-produced at low cost.

(Embodiment 12) A twelfth embodiment of the present invention will be described below. In the configuration shown in FIG. 9, the core 1 and the auxiliary core 91 are magnetic bodies having different magnetic permeability, for example, the core 1 is a Ni—Zn ferrite having a magnetic permeability of 600, and the auxiliary core 91.
Is composed of Mn—Zn ferrite having a magnetic permeability of 2400. Since the core 1 is made of Ni-Zn ferrite, the insulation resistance is high. Therefore, external electrodes can be directly formed on both end surfaces of the core 1. On the other hand, since the auxiliary core is made of Mn-Zn-based ferrite, it has a low insulation resistance and the external electrode cannot be directly formed on the surface, but it can be used as the auxiliary core. The magnetic resistance of the magnetic circuit of the inductor according to the twelfth embodiment of the present invention constituted by the core 1 and the auxiliary core 91 is smaller than the magnetic resistance of the inductor constituted only by the Ni—Zn ferrite. Therefore, there is an effect that the inductance value becomes large.

(Thirteenth Embodiment) The thirteenth embodiment of the present invention will be described below. A resin filled with ferrite powder, for example, an epoxy resin filled with 80% ferrite powder is used as the molding resin having the configuration shown in FIG.

The chip size of the structure of FIG. 9 is 2.0 × 1.
Permeability of 650 in a 25 mm chip inductor
When the core and the auxiliary core are used, the distance between the core and the auxiliary core is 250 μm in total, and the coated conductor wire having a wire diameter of 70 μm is wound 40 turns around the core, and the ferrite filling rate is used in a molding resin filled with ferrite. FIG. 13 shows a graph of the relationship between the inductance value and the inductance value.

It can be seen from FIG. 13 that increasing the filling rate of ferrite is effective in increasing the inductance value. However, if the filling rate is too high, the fluidity of the mold resin will decrease, so it is necessary to select the filling rate within the range in which the fluidity can be secured.

(Fourteenth Embodiment) A fourteenth embodiment of the present invention will be described below. The long core and the long auxiliary core are positioned in the molding die and resin-molded. As a result, the step of bonding can be omitted, so that the bonding equipment and man-hours can be reduced, and the manufacturing cost can be reduced.

(Fifteenth Embodiment) A fifteenth embodiment of the present invention will be described below. FIG. 14 is an explanatory diagram of the fifteenth embodiment of the present invention. In the manufacturing process, as shown in FIG. 14A, a strip-shaped spacer 142 is inserted between the elongated core 141 and the elongated auxiliary core 143. The resulting chip inductor has core 1 as shown in FIG.
And the auxiliary core 91 are in contact with each other via the spacer 144.

By using the spacer, the distance between the core and the auxiliary core becomes constant, and variations in the inductance value and DC superposition characteristics depending on the distance can be reduced.

(Embodiment 16) A sixteenth embodiment of the present invention will be described below. FIG. 15 is an explanatory diagram of the sixteenth embodiment of the present invention. As shown in FIG. 15A, the nonmagnetic film 151 is provided on the surface of the long auxiliary core 143 on the long core 141 side in the manufacturing process. In the resulting chip inductor, as shown in FIG. 15B, the core 1 and the auxiliary core 91 are in contact with each other via the non-magnetic film 152. Since the non-magnetic film 152 is on the surface of the auxiliary core 91, the core 1 and the auxiliary core 9 are
Since the interval of 1 is narrow and constant, it becomes close to the characteristics of the toroidal coil, and the inductance value can be large and the variation can be small.

(Embodiment 17) A seventeenth embodiment of the present invention will be described below. FIG. 16 is a perspective view for explaining the 17th embodiment of the present invention. A conductive portion is formed in advance on the surface of the portion of the long core 141 indicated by the arrow 161. A portion of the coated conductor 2 indicated by an arrow 161 is irradiated with a laser to peel off the coating of the coated conductor, and at the same time, the peeled coated conductor is welded to the conductive portion. Further, it is cut at the position of arrow 161 to form an external electrode on the cut surface. As a result, the external electrode is electrically connected to the conductive portion and is connected to the conductive portion covered conductive wire, so that the external electrode and the coated conductive wire are connected. Therefore, there is an effect that the electrical connection between the external electrode on the surface of the core and the covered conductor is ensured and the reliability is increased.

(Embodiment 18) An eighteenth embodiment of the present invention will be described below. FIG. 17 is an explanatory diagram of the manufacturing method according to the eighteenth embodiment of the present invention. In FIG. 17A, the groove 8 is provided in the long core 83, and the conductive portion 9 is provided inside the groove 8. Next, as shown in FIG. 17B, the coated conductive wire 2 is wound around the elongated core 83 so that a part thereof is along the groove 8. Copper is melted and sprayed on the position of the arrow 171 of the coated conductor along the groove 8 to remove the coating of the coated conductor 2 and connect it to the conductive portion 9 at the same time.

Thereafter, as shown in FIG. 17C, the resin is molded and then cut at a position of an arrow 172. External electrodes are formed on the cut surface, and the chip inductor of FIG. 17D is obtained.

As a result, the electric connection between the covered conductor and the external electrode is ensured, and the connection reliability is improved.

Although a thick film is used as the external electrode, the effect of miniaturization and simple manufacture is the same even if a thin film electrode of a type that is printed and baked is used.

[0049]

As described above, according to the present invention, the coated conductive wire is wound around the core, the end surfaces of the coated conductive wire are arranged on the same plane as the opposite end surfaces of the core, and the side surface of the substantially rectangular parallelepiped is resin-molded. By including thick film external electrodes connected to the ends of the covered conductor at the opposite ends,
It is possible to realize a small and inexpensive chip inductor.

[Brief description of drawings]

FIG. 1 is a perspective view of a chip inductor according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the chip inductor according to the first embodiment of the present invention.

FIG. 3 is an explanatory diagram of a method of manufacturing the chip inductor according to the first embodiment of the present invention.

FIG. 4 is a perspective view of a chip inductor according to a second embodiment of the present invention.

FIG. 5 is a perspective view of a chip inductor according to a third embodiment of the present invention.

FIG. 6 is a perspective view of a chip inductor according to a seventh embodiment of the present invention.

FIG. 7 is a perspective view of a core used in a chip inductor according to a seventh embodiment of the present invention.

FIG. 8 is an explanatory view of a method of manufacturing a chip inductor according to a seventh embodiment of the present invention.

FIG. 9 is a perspective view of a chip inductor according to an eighth embodiment of the present invention.

FIG. 10 is an explanatory diagram of a method of manufacturing a chip inductor according to an eighth embodiment of the present invention.

FIG. 11 is a perspective view of a chip inductor according to a ninth embodiment of the present invention.

FIG. 12 is a perspective view of a chip inductor according to a tenth embodiment of the present invention.

FIG. 13 is a diagram showing a relationship between a ferrite filling rate and an inductance value of a chip inductor according to a thirteenth embodiment of the present invention.

FIG. 14 is an explanatory diagram of a method of manufacturing a chip inductor according to a fifteenth embodiment of the present invention.

FIG. 15 is an explanatory diagram of a method of manufacturing a chip inductor according to a sixteenth embodiment of the present invention.

FIG. 16 is an explanatory diagram of a method of manufacturing a chip inductor according to a seventeenth embodiment of the present invention.

FIG. 17 is an explanatory diagram of a method of manufacturing a chip inductor according to an eighteenth embodiment of the present invention.

FIG. 18 is a structural diagram of a conventional chip inductor having a metal terminal electrode.

FIG. 19 is a structural diagram of a conventional chip inductor having a thick film external terminal.

[Explanation of symbols]

 1 Core 2 Coated Conductive Wire 3 End Surface of Coated Conductive Wire 4 Mold Resin 5 Core End Surface 6 Thick Film External Electrode

Continued Front Page (72) Hajime Kawamata Hajime Kawamata 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (28)

[Claims] 1. A coated wire is wound around a core, and the end surfaces of the coated wire are arranged on the same planes as the opposite end surfaces of the core, respectively, and only the side surfaces of the substantially rectangular parallelepiped excluding the opposite end surfaces of the core. A resin-molded chip inductor having thick film external electrodes connected to the ends of the covered conductor at opposite ends thereof. 2. The chip inductor according to claim 1, wherein the core is a rectangular rod-shaped magnetic body. 3. The chip inductor according to claim 1, wherein the core is a U-shaped magnetic body. 4. The chip inductor according to claim 1, wherein the core is an H-shaped magnetic body. 5. The chip inductor according to claim 1, wherein the core is a rectangular rod-shaped nonmagnetic material. 6. The core is a U-shaped non-magnetic material.
The listed chip inductor. 7. The core is an H-shaped non-magnetic body.
The listed chip inductor. 8. The chip inductor according to claim 1, wherein an end surface of the coated conductive wire connected to the thick film external electrode is an ellipse cut obliquely. 9. The chip inductor according to claim 1, wherein an end portion of the coated conductive wire connected to the thick film external electrode has portions along outer peripheral portions of opposite end surfaces of the core. 10. The chip inductor according to claim 1, wherein an end portion of the coated conductive wire connected to the thick film external electrode has a portion along a groove provided on an outer peripheral portion of both end surfaces of the core facing each other. 11. An end portion of a coated conductor wire connected to a thick film external electrode has a portion along a groove provided on outer peripheral portions of opposite end surfaces of a core, and the groove has a conductive portion on an inner surface. The chip inductor according to claim 1, wherein a part of the coated conductor wire is electrically connected to the conductive portion. 12. A coated wire is wound around a core made of a magnetic material, the end faces of the coated wire are positioned on opposite end surfaces of the core, and an auxiliary core made of a magnetic material is contacted with the core at two positions to close the magnetic field. A chip inductor, which is arranged so as to form a path, is provided with a thick film external electrode connected to an end of a covered conductive wire at opposite ends of the core, the side surface being molded in a substantially rectangular parallelepiped with a molding resin. 13. The chip inductor according to claim 12, wherein the core is rod-shaped and the auxiliary core is U-shaped. 14. The chip inductor according to claim 12, wherein the core is U-shaped and the auxiliary core is rod-shaped. 15. The chip inductor according to claim 12, wherein the core is U-shaped and the auxiliary core is U-shaped. 16. The chip inductor according to claim 12, wherein the magnetic material used for the core and the magnetic material used for the auxiliary core are made of Ni—Zn based ferrite. 17. The chip inductor according to claim 12, wherein the core and the auxiliary core are made of magnetic materials having different magnetic permeability. 18. The chip inductor according to claim 12, wherein a resin filled with ferrite powder is used as the molding resin. 19. A method of manufacturing a chip inductor, wherein a coated conductor is wound around a long core, resin-molded, cut into slices, and a thick film electrode connected to the coated conductor is formed on the cut surface. 20. The method of manufacturing a chip inductor according to claim 19, wherein a long magnetic core is formed by a green sheet laminating method. 21. A coated conductive wire is wound around a long magnetic core, and a long magnetic auxiliary core is attached to the core.
A method for manufacturing a chip inductor, comprising resin-molding the entire bonded body, cutting into slices, and forming a thick film electrode connected to the coated conductor on the cut surface. 22. The method of manufacturing a chip inductor according to claim 21, wherein there is no bonding and the resin mold also functions as bonding. 23. The method of manufacturing a chip inductor according to claim 21, wherein the long magnetic core and the long magnetic auxiliary core are formed by a green sheet laminating method. 24. A coated conductor is wound around a long magnetic core, and a long magnetic auxiliary core is attached via a strip-shaped non-magnetic spacer, resin-molded, cut into slices, and cut. A method of manufacturing a chip inductor, wherein a thick film external electrode connected to the coated conductor is formed on a surface thereof. 25. A coated magnetic wire is wound around a core of a long magnetic material, and an auxiliary core of a long magnetic material having a non-magnetic film on the surface is attached, resin-molded, cut into slices, and cut surfaces are cut. A method of manufacturing a chip inductor, comprising forming a thick film external electrode connected to the coated conductive wire. 26. The chip inductor according to claim 19 or 21, wherein a thick film external electrode is formed by dipping or printing a cut surface with a conductive resin, and the exposed conductor cross section is connected at the same time when the external electrode is formed. Manufacturing method. 27. A step of forming a conductive portion on a part of a side surface of a long core, a step of winding a coated conductive wire on the long core, a step of resin molding, and a step of cutting into a ring. A method of manufacturing a chip inductor, comprising the step of forming a thick film electrode connected to the coated conductor on a cut surface, and the step of selectively irradiating a portion of the coated conductor to be sliced when the coated conductor is wound. . 28. A groove is provided on a side surface of a long core corresponding to a cut portion of a ring cut, and a conductive portion is provided in the groove, and when the coated wire is wound around the long core, the groove is aligned with the groove. A part of the coated conductor is wound around, and a part of the coated conductor is electrically connected to the conductive part of the groove by thermal spraying, resin-molded, and cut into rings.
A method of manufacturing a chip inductor, comprising forming a thick film electrode electrically connected to the coated conductor on a cut surface.