JPH08124342A - Substrate fitting structure for recording and reproducing cassette - Google Patents

Abstract

PURPOSE: To eliminate wobble of an IC memory substrate and hence to enhance performance of a recording and reproducing cassette by folding and fitting a separate member around both end parts of the IC memory substrate. CONSTITUTION: End parts in the longitudinal direction of the separate member 28 are bent to wrap both end peripheries in the longitudinal direction of the IC memory substrate 6. Then, the wrapped parts of the separate member 28 are inserted by press-fitting into groove parts 34 and 36 of a lower shell 22. By this constitution, the separate member 28 is deformed by its elasticity in the thicknesswise direction, and then by flexture of a side wall 30 of the lower shell 22, the separate member 28, the substrate 6 and the lower shell 22 are fixed in their partial close contact state. Consequently, backlash in the thickness direction and in the right and left direction of the substrate 6 is eliminated by the separate member 28, and vertical movement of the substrate 6 is also eliminated, thus fixing up the substrate 6 by the separate member 26. For the separate member 6, it is preferable that the separate member 6 is an electrically conductive sheet, and this electrically conductive sheet is a carbon filled plastic sheet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for a substrate having recorded information of a cassette, particularly an IC memory substrate, and more particularly to a structure for eliminating play when mounting the IC memory substrate.

[0002]

2. Description of the Related Art A cassette for a recording medium in the prior art is miniaturized, and in addition to recording / reproducing on a recording medium tape, for example, a magnetic tape, recording information, the length of the magnetic tape, erasure prevention means, etc. It has various functions.

For example, an IC memory board having contact terminals facing the upper and lower shells corresponding to the upper and lower shells of the recording / reproducing cassette is mounted. It is a well-known technique to connect and retrieve recorded information recorded in a recording medium cassette.

In order to assemble such an IC memory substrate into a recording / reproducing cassette, as shown in FIG. 7, a thin strip is formed at a predetermined position of the recording / reproducing cassette, for example, a corner portion of the rectangular lower shell 1. The IC substrate mounting portion 2 is provided in a so-called gap formed by a region.

The IC board mounting portion 2 is composed of two chambers, and a terminal housing portion 3 for connecting to a connector of an electronic device or the like is provided in a room on the right side of FIG. It is composed of an IC storage portion 4 for storing the portion.

The terminal accommodating portion 3 has a structure in which a connection window portion 5 having four windows facing the outside is provided.

On the other hand, the IC memory board 6 incorporated in the IC board mounting portion 2 is made of epoxy resin or other engineering plastic (POM or the like),
It is made of the same plastic material as the upper and lower shells made of plastic such as ABS. Further, as shown in FIGS. 9 and 10, the structure is such that the substrate 6A is formed in an elongated shape, the memory mounting portion 7 is provided on one side in the longitudinal direction, and the terminal portion 9 is provided on the other side.

The memory mounting portion 7 has a structure in which an IC memory 8 for recording the recording information of the recording / reproducing tape and the like is mounted at a substantially central position, and the periphery thereof is covered with a protective layer 9. . The IC memory 8 is connected to each terminal of the terminal section 9.

The terminal portion 9 is formed by arranging four terminals in an aligned state, and each terminal is a ground terminal 10A from the outside.
It is composed of a clock terminal 10B, a data terminal 10C, and a power supply terminal 10D. Needless to say, the structure of the memory IC substrate having the terminals 10A, 10B, 10C, and 10D may be adopted without mounting the IC memory.

An IC memory substrate 6 having such a structure
As shown in FIG. 7 and mainly in FIG. 8, the terminal 10A is attached to the IC board mounting portion 2 of the lower shell 1 of the recording medium cassette,
10B, 10C, and 10D are directed outward, and the memory mounting portion 7 is inserted from above so that the memory mounting portion 7 fits in the IC storage portion 4. Then, as shown in FIG. 11, the IC memory substrate 6
The terminals 10A, 10B, 10C, and 10D of the terminal portion 9 are exposed to the outside through the connection window portion 5. Further, the memory mounting portion 7 side is disposed in a state of being stored in the IC storage portion 4, and the upper shell 1A is covered from above and the IC memory substrate 6 is engaged and assembled from above. That is, the upper and lower shells 1,
The upper and lower end surfaces of the IC memory board 6 are fixed by 1A so that the IC memory board 6 is fixed and the assembly is completed.

To obtain the record information of the recording / reproducing cassette thus assembled, as shown in FIG.
A connector 12 provided on an external device, such as a digital VTR, is connected to the terminals 10A (10B, 10C, 10D) while sliding from the lower side to the upper side with respect to the cassette to obtain a contact state. There is.

[0012]

However, in the structure for assembling the IC memory substrate 6 in the above-mentioned conventional technique, the connector of the external device is mounted in order to obtain the recorded information recorded in the IC memory by mounting it on the external device. A structure in which 12 is connected from the lower side of the terminal to obtain a contact state (Fig. 1).
Therefore, even if the substrate is pressed by the upper shell 1A, a clearance is always generated between the upper and lower shells 1 and 1A and the IC memory substrate 6 due to the dimension intersection. The clearances are located above, below, to the left and right of the IC memory board 6, and the IC memory board 6 is slightly loose in the cassette. For this reason, the upper and lower shells 1 and 1A and the IC memory substrate 6 are easily rubbed by vibration during transportation or the like, which creates an environment in which static electricity is easily generated. Further, it may be considered that the upper and lower shells 1 and 1A or the IC memory substrate 6 are made of a material that is difficult to be charged, but this is not practical because it increases the cost. That is, the IC memory substrate 6 is not limited to any material as long as it can be plated with gold. Therefore, there is a problem in that the IC memory substrate 6 is inevitably rattling due to its structure, static electricity is generated, and the IC memory is electrostatically destroyed, so that it cannot perform a predetermined function.

Further, due to design tolerances, draft of the mold, and the like, a clearance is generated between the IC memory board 6 and the upper and lower shells 1 and 1A, which causes rattling in the upper and lower shells 1 and 1A. If this backlash is large, stable contact with the external connector 12 is impaired, and an extra moment is applied to the contact portion of the IC memory board 6, so that the connector 1 on the electronic device side is provided.
The durability of No. 2 decreases. Therefore, it is required to reduce play as much as possible. Further, if the backlash is large, it can be seen that the IC memory substrate 6 is tilted from the connection window portion 5, and the precision of the cassette is impaired in appearance and the commercial value is lowered.

Further, the looseness of the IC memory substrate 6 deteriorates the contact state with the upper and lower shells 1 and 1A, and static electricity or the like is generated on the substrate.

Therefore, even with the existing structure, there is a problem that the IC memory board 6 must be mounted to the upper and lower shells 1 and 1A without looseness.

[0016]

In order to solve the above problems, a substrate mounting structure for a recording medium cassette according to the present invention has a memory and a plurality of external units in a cassette formed by upper and lower shells having a substantially rectangular shape. A recording / reproducing cassette equipped with an IC memory board having a connector contact terminal, wherein another member is sandwiched between at least both ends of the IC memory board so as to prevent backlash.

Further, the separate member is arranged so as to cover the side of the IC memory substrate where the external connector contact terminal is not provided; the separate member is a conductive sheet; and the conductive sheet. Is a carbon-containing plastic sheet; the conductive plastic sheet is a substrate mounting structure for a recording / reproducing cassette, which covers at least the memory portion of the IC memory substrate.

[0018]

The substrate mounting structure of the recording / reproducing cassette of the present invention having the above-described structure has the following actions.

A recording / reproducing cassette in which an IC memory substrate is installed in the cassette, and when assembling the IC memory substrate, another member such as a conductive sheet or a conductive sheet is provided at both ends in the longitudinal direction of the IC memory substrate. By attaching a flexible plastic sheet so as to prevent it from rattling, it is possible to perform stable positioning and fixing and to eliminate static electricity generated in the memory portion.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate positioning structure for a recording / reproducing cassette according to the present invention will be described below in detail with reference to the structure of a recording / reproducing cassette, for example, a magnetic tape cassette. The same parts as those in the prior art are designated by the same reference numerals and the description thereof will be omitted.

The recording / reproducing cassette 20 is shown in FIGS.
As shown in FIG. 2, a pair of tapes, each of which is composed of an upper shell 21 corresponding to a rectangular upper shell and a lower shell 22 corresponding to a lower shell, in which a magnetic tape as a recording medium tape is wound. It has a structure in which the reel 23 is mounted.

The front side of the recording / reproducing cassette 20 is
The recording / reproducing cassette 20 is provided with an opening / closing part 24 that opens and closes when the cassette 20 is attached to an electronic device such as a digital video device to guide the tape to a recording / reproducing mechanism of the device. An erroneous erasure prevention plug 26 is arranged on the upper shell 21 side of the formed corner.

An IC memory substrate in which a plastic sheet 28 is interposed at a corner (see FIG. 2) at a position where the reinforcing rib 27 of the lower shell 22 is formed is substantially the same as the position where the erroneous erasure prevention plug 26 is arranged. IC that can be equipped with 6
The structure is such that a board mounting portion 29 is provided.

The IC memory board 6 is shown in FIG.
Also, the description is omitted because it is the same as the conventional technique described with reference to FIG.

The plastic sheet 28 is shown in FIG.
Is formed of a conductive material and substantially encapsulates the IC memory substrate 6.
And the size of the IC memory substrate 6
Formed in a rectangular shape, and the width in the longitudinal direction of the IC memory substrate 6
Is also made slightly larger, and both ends of the IC memory substrate 6 in the longitudinal direction are
Put it in a wrapped state and intervene. This (some) conductivity
The material of the held plastic sheet 28 is the upper and lower shells.
Surface resistivity of antistatic resin used for 21, 22
Value level (1 x 10 ¹³Ω / cm or less)
It is desirable to use P. P
(Polypropylene) sheet. Also, ordinary plastis
An antistatic sheet may be used.

As shown in FIGS. 1 and 2 and mainly in FIG. 3, the IC board attaching portion 29 has the same structure as that described in the prior art, and is provided at the corner on the side surface on the back side of the lower shell 22. The side wall 30 is provided between the reinforcing rib 27 and the side wall 30.
It is composed of two elongated chambers along the longitudinal direction, and is formed of a terminal accommodating part 32 and an IC accommodating part 35 with the partition part 31 as a boundary.

As shown in FIG. 3, in particular, the terminal accommodating portion 32 has four connection window portions 33 which are opened in the side wall 30 in an aligned state.
Is provided. The connection window portion 33 has a structure for connecting to a connector of an electronic device, for example, a digital VTR (see FIG. 11), and has a groove portion 34 for locking the end portion of the IC memory board 6 at the end portion in the longitudinal direction. The structure is provided near the corner. This terminal storage 32
The terminal portion 9 side of the IC memory board 6 is engaged with the.

The IC storage portion 35 has a structure in which a groove portion 36 is provided on the side surface on the back surface side where the reinforcing rib 27 and the side wall 30 intersect, that is, at the end of the chamber formed in the longitudinal shape.

The IC board mounting portion 2 having such a structure
The IC memory substrate 6 is inserted into and engaged with the plastic sheet 28 via the plastic sheet 28, the upper shell 22 is covered from above, and the IC memory substrate 6 is engaged between the lower shell 22 and the upper shell 21. Assembly is complete. The details will be described below.

First, in order to engage and lock the grooves 34 and 36 with the plastic sheet 28 interposed in the IC memory board 6, as shown in FIG. 4, the IC memory board 6 is wrapped around both longitudinal edges. The longitudinal end of the plastic sheet 28 is bent. Then, the wrapped portion of the plastic sheet 28 is inserted into the groove 34 (36) of the lower shell 22 while press-fitting it. Then, FIG. 5 and FIG.
As shown in FIG. 3, the conductive plastic sheet 28 covers the memory portion of the IC memory substrate 6, and the plastic sheet 28 is pushed into both ends of the IC memory substrate 6 in the longitudinal direction. It has a structure that can be positioned and fixed.

Therefore, the plastic sheet 28 makes it possible to eliminate backlash in the thickness direction and the left-right direction of the IC memory substrate 6 and to fix the IC memory substrate 6 without any vertical movement. There is. That is, since the plastic sheet 28 has elasticity in the thickness direction, when the plastic sheet 28 is sandwiched in the gap with the lower shell 22, the plastic sheet 28 itself deforms, and the side wall 30 of the lower shell 22 also bends. The IC memory board 6 and the lower shell 22 are fixed in a state of being partially in close contact with each other.

Further, by making the plastic sheet 28 slightly longer than the IC memory substrate 6, when the IC memory substrate 6 is inserted and fixed, the plastic sheet 28 can be fixed at a portion in close contact with the plastic sheet 28.
The sheet can be manufactured with a moderate outer dimension accuracy.

In the IC memory substrate 6 assembled in this way, the memory portion is made of a conductive plastic sheet 28.
Since the structure is covered with, the so-called static electricity can be prevented from occurring and the device can be prevented from electrostatic breakdown.
In addition, the lower shell 2 with the plastic sheet 28 interposed
Since the structure is such that it is inserted into the groove portions 34 and 36 of No. 1, stable positioning and fixing can be performed, and as shown in FIG. 11 of the prior art, the terminals 10A, 10B, 1 of the IC memory substrate 6 can be fixed.
0C, 10D and the connector of the external device can be contacted without rattling, the durability of the external connector can be improved, and the external appearance is not impaired.

Furthermore, by eliminating backlash and adding an antistatic function, static electricity is generated by rubbing between the IC memory substrate 6 and the upper and lower shells 21 and 22 even while the cassette is being transported, for example. It becomes the structure which can prevent.

Further, when the IC memory board 6 is structured such that separate members (plastic sheets) are positioned and fixed at both ends in the longitudinal direction, even if the board forming the IC memory board 6 is thinned, the separate member is provided. Adjust (plastic sheet). This can reduce the dimensional accuracy of the IC memory substrate and reduce the manufacturing cost.

[0036]

The substrate mounting structure of the recording / reproducing cassette according to the present invention, which has the above-described structure, has the following structure.
A recording / reproducing cassette equipped with an IC memory board, wherein when assembling the IC memory board, another member such as a conductive sheet or a conductive plastic sheet is sandwiched between both ends in the longitudinal direction of the IC memory board. By mounting so as not to cause backlash, stable positioning and fixing can be performed, and static electricity generated in the memory portion can be removed, and an extremely excellent effect that the reliability of the IC memory substrate can be improved is achieved. .

Further, by eliminating the backlash, the connection terminal and the external connector can be connected in a stable state, and the connection terminal can be maintained in a state of being kept aesthetically. It has an extremely excellent effect.

[0038]

[Brief description of drawings]

FIG. 1 is an overall perspective view from the back side of a cassette to which an IC substrate according to the present invention is attached.

FIG. 2 is a plan view of the lower shell.

FIG. 3 is an enlarged perspective view of a schematic main part showing a relationship between a board mounting portion of the lower shell, an IC memory board, and a sheet.

FIG. 4 is an enlarged perspective view of an essential part showing a state in which a plastic sheet is wrapped in an IC memory substrate and disposed in a groove portion of a lower shell.

FIG. 5 is a schematic explanatory view showing an IC memory substrate in which a plastic sheet is interposed in the lower shell.

6 is a cross-sectional view taken along the line AA of FIG.

FIG. 7 is a plan view of a lower shell in the related art.

FIG. 8 is a schematic explanatory view showing a state in which an IC memory substrate according to a conventional technique is arranged.

FIG. 9 is a plan view of the IC memory substrate as viewed from the back side.

FIG. 10 is a side view of an IC memory board.

FIG. 11 is an explanatory diagram showing a state in which an IC memory board is connected to an external connection terminal.

[Explanation of symbols]

 20 Recording / Playback Cassette 21 Upper Shell 22 Lower Shell 23 Tape Reel 24 Opening / Closing Section 25 Reinforcing Rib 26 Erroneous Erasing Prevention Plug 27 Reinforcing Rib 28 Plastic Sheet 29 IC Board Mounting Section 30 Side Wall 31 Partition Section 32 Terminal Storage Section 33 Connection Window Section 34 Groove 35 IC storage 36 Groove

Claims (5)

[Claims] 1. A recording / reproducing cassette equipped with an IC memory board having a memory and a plurality of external connector contact terminals in a cassette formed of substantially rectangular upper and lower shells. On at least both ends of
A substrate mounting structure for a recording / reproducing cassette, characterized in that another member is sandwiched and mounted so that there is no backlash. 2. The substrate mounting structure for a recording / reproducing cassette according to claim 1, wherein the separate member is arranged so as to cover a side of the IC memory substrate where an external connector contact terminal is not provided. 3. The substrate mounting structure for a recording / reproducing cassette according to claim 1, wherein the separate member is a conductive sheet. 4. The substrate mounting structure for a recording / reproducing cassette according to claim 3, wherein the conductive sheet is a carbon-containing plastic sheet. 5. The substrate mounting structure for a recording / reproducing cassette according to claim 4, wherein the conductive plastic sheet covers at least a memory portion of the IC memory substrate.