JPH0714347A - Ic substrate fitting structure for tape cassette - Google Patents

Abstract

PURPOSE:To prevent an IC substrate of a tape cassette from being destructed due to static electricity, etc., in virtue of an inadvertent touch by housing and equipping the IC substrate in a holder means having a grid-shaped contact point exposing part. CONSTITUTION:An IC substrate fitting part 19 is formed out of a lower shell 2a and an upper shell 2b, and a holder part 12 in which the IC substrate 8 is incorporated is housed into the fitting part 19 of the lower shell 2a from above, and the upper shell 2b is joined to the lower shell on its upper part. That is, the fitting part on the side of the lower shell 2a is provided with a lower notch 20 notched in order to made a lower outer side surface of a contact point exposing window 16 of the holder part 12 flush with the outer side surface of the lower shell 2a and a lower holder groove 21. The IC substrate fitting structure constituted in such a way is set up with the substrate 8 inserted into the holder part 12 from its side to be incorporated first and then engaged in the state of overlooking contact points 11a, 11b and 11c from the window 16. In this case, since the holder part 12 is formed with an electrostatic prevention member, harmful effect of a static electricity, etc., at the time of assembling the substrate 8 can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for a tape cassette having an IC memory mounted thereon, and more particularly to holder means for mounting an IC substrate.

[0002]

2. Description of the Related Art A conventional tape cassette is miniaturized, and in addition to recording / reproducing on / from a magnetic tape, it has various functions such as recorded information, the length of the magnetic tape, and erasure prevention means. For example, an IC with contact terminals facing predetermined positions of upper and lower shells corresponding to the upper and lower shells of the tape cassette.
It is a well-known technique to mount a substrate and connect the contact terminal to a connector of an external device such as a VTR (video tape recorder) to retrieve recorded information recorded in a tape cassette.

[0003]

However, due to the miniaturization of the tape cassette, there is a limit to the area where the IC substrate can be mounted. Due to the miniaturization and thinness, it is difficult to handle during assembly, and the direct handling is difficult. In addition, there is a problem that the contents of the memory are damaged by static electricity or the like by contacting the IC memory element and its terminals.

In addition, when an IC substrate equipped with an IC memory and provided with a contact terminal is arranged in a tape cassette, the contact terminal is exposed to the outside, that is, the user is exposed. It has also been pointed out that the tape cassette is easily touched when handling it.

Therefore, there is a problem to be solved in the mounting structure of the IC substrate at the time of assembling the contact terminals exposed to the outside of the tape cassette and after the assembly.

[0006]

In order to solve the above problems, an IC board mounting structure of a tape cassette according to the present invention is a tape cassette in which an upper shell and a lower shell are joined and an IC board is equipped. Then, the IC substrate is accommodated and equipped in a holder means having a grid-shaped contact exposed portion.

Further, the holder means is provided with an opening on one side so that the IC substrate can be laterally incorporated; the holder means is formed of an antistatic member; the holder means is a colored tape cassette. It is an IC board mounting structure.

[0008]

[Operation] The IC is placed at an appropriate position on the upper and lower shells of the tape cassette.
By providing the holder means for accommodating the substrate and providing the contact exposing portions in a grid pattern on the holder means, it becomes possible to replace the miniaturized IC substrate for each holder.

Further, by storing the IC board laterally with respect to the holder means, when the holder means is provided in the upper and lower shells, the IC board can be stored in a stable state. Become.

By forming this holder means with an antistatic member, it is possible to prevent damage to the IC and memory mounted on the IC substrate due to static electricity.

Further, by coloring the holder means, it is possible to easily distinguish the color of the upper and lower shells and the exposed portion of the contact of the IC substrate.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC board mounting structure of a tape cassette according to the present invention will be described with reference to the drawings.

The tape cassette 1 is, as shown in FIG.
A pair of tape reels 4 and 5 formed by an upper shell corresponding to a rectangular upper shell and a lower shell 2a corresponding to a lower shell, in which a tape 3 as a recording medium tape is wound. It is mounted structure.

The front side of the tape cassette 1 is provided with an opening / closing section 6 which opens and closes when the tape cassette 1 is mounted on a video device or the like to guide the tape 3 to a recording / playback mechanism of the device. Therefore, the structure is such that the erroneous erasure prevention plug 7 is arranged at that corner.

In FIG. 1, a holder means for mounting an IC board 8 at a position adjacent to the left side of the erroneous erasure prevention plug 7, that is, an IC board mounting section 1 for arranging a holder section 12 is provided.
It has a structure provided with 9.

Here, as shown in FIGS. 2 and 3, the IC substrate 8 has an IC 1 on the back surface side of a substrate 9 having a vertical rectangular shape.
0 is mounted, and on the front surface side of the substrate 9, a contact portion 11 having a plurality of contacts 11a, 11b, 11c connected to the IC 10 is provided.
Reference numerals b and 11c are used for connecting terminals of an external device such as a video tape recorder, that is, for signals and power connected to an external connector. The IC 10, the wiring group, and the like arranged on the IC substrate 8 can be appropriately changed.

As shown in FIGS. 2 and 3, the holder portion 12 is made of a static electricity preventing member such as rubber or plastic, and the place where the tape cassette 1 is arranged is colored so that it can be seen at a glance. Is formed in a vertical quadrangular shape capable of accommodating the IC substrate 8, and an opening 13 provided on one lateral surface so that the IC substrate 8 can be incorporated from the lateral direction, and an opening 13. An upper groove 14 and a lower groove 15 which are provided from the inside of the upper and lower ends toward the inside,
A contact exposure window 16 formed in a lattice shape with the contacts 11a, 11b, 11c of the C board 8 exposed; an IC exposure window 17 into which the IC 10 mounted on the IC board 8 is fitted;
It is composed of a substrate supporting portion 18 that supports the back surface side of the IC substrate 8. The antistatic member is not limited to rubber or plastic, and the coloring color is not limited to red or the like and can be appropriately changed.

The upper and lower grooves 14 and 15 support the upper and lower ends of the IC substrate 8 which is inserted laterally, and are formed to be substantially wider than the plate thickness of the IC substrate 8.

The contact exposure window 16 is a window formed in a lattice shape so as to cover the contact interval of the IC substrate 8. When the contact exposure window 16 is mounted on the tape cassette 1 facing the outside, the contacts 11a, 11b, It has a structure that can prevent an accident such as a short circuit between 11c. The outer surface is arranged so as to be flush with the side surface of the tape cassette 1 when the tape cassette 1 is assembled.

The IC exposure window 17 is exposed from the opening 13 side to the IC.
When the board 8 is inserted, the IC 10 has a cut-out shape so as to be substantially housed therein.
Elements other than b and 11c are formed so as to project to the outside, and there is no need to be limited to the IC 10 in particular, and a wiring group and the like can be housed in each case.

The IC board supporting portion 18 supports the IC board 8 against pressure from an external connector such as a video tape recorder when the IC board 8 is housed and engaged with the tape cassette 1. The IC substrate 8 supported by the upper groove 14 and the lower groove 15 is supported in a reinforced state.

On the other hand, the IC substrate mounting portion 19 provided on the tape cassette 1 is formed of a lower shell 2a and an upper shell 2b, as shown in FIGS.
The holder portion 12 in which the IC substrate 8 is incorporated in the IC substrate mounting portion 19 is housed from above, and the upper shell 2b is joined from above.

That is, the IC board mounting portion 1 on the lower shell 2a side
Reference numeral 9 denotes a lower notch 20 which is formed by cutting out an outer side surface of the lower side of the contact exposure window 16 of the holder portion 12 so as to be flush with an outer side surface of the lower shell 2a, and a lower holder capable of fitting the lower side of the holder portion 12 to each other. The groove 21 is provided, and the lower holder support portion 22 that supports the back side of the holder portion 12 is provided inside the groove 21.

The IC board mounting portion 19 on the upper shell 2b side
Is an upper notch 23 formed by notching the outer side surface of the upper side of the contact exposure window 16 of the holder portion 12 so as to be flush with the outer side surface of the upper shell 2b, and an upper holder groove 24 into which the upper side of the holder portion 12 can be fitted. And in succession to this upper holder groove 24,
In addition, a structure is provided in which an upper holder supporting portion 25 having a length shorter than that of the lower holder supporting portion 22 is provided.

In the IC board mounting structure thus constructed, as shown in FIGS. 4 and 5, first, the IC board 8 is laterally inserted into the holder portion 12 to be incorporated therein, and then the contact 11 is formed.
The a, 11b, and 11c are engaged with the contact exposure window 16 facing outward. At this time, since the holder portion 12 is formed of a static electricity prevention member, it has a structure capable of preventing harmful effects such as static electricity when the IC board 8 is assembled.

Then, when the holder portion 12 which accommodates the IC substrate 8 is accommodated in the IC substrate mounting portion 19 of the lower shell 2a, it is accommodated so as to fit into the lower cutout 20 and the lower holder groove 21, and at that time, the contact exposed portion. 16 sides and lower shell 2
The side surface of a is flush.

When the upper shell 2b is joined from above,
When the upper notch 23 and the upper holder groove 24 are fitted and joined to each other, the holder portion 12 is disposed in a state of being engaged with the upper and lower holder grooves 21 and 24. Then, the external connector 26 of the external electronic device such as the video tape recorder is connected to the contact 1
When the contact state with 1a, 11b, and 11c is obtained, the lower holder supporting portion 22 can support the IC substrate 8 via the IC substrate mounting portion 18 of the holder portion 12.

Further, since the holder portion 12 is given a unique color different from that of the tape cassette 1, the assembly is completed in a state where the location of the contact can be visually recognized at a glance.

On the other hand, when the IC substrate 8 is engaged with the tape cassette 1 to be assembled, the tape cassette 1 can be assembled without directly touching the IC substrate 8.

Further, the holder portion 12 is colored with a unique color different from that of the tape cassette 1, so that the contact points 11a, 11 are formed at any positions of the assembled tape cassette 1.
It is possible to easily identify whether or not the b and 11c are facing outward, and it is possible to prevent the contacts 11a, 11b and 11c from being inadvertently touched when the tape cassette 1 is used. .

[0031]

EFFECTS OF THE INVENTION ICs are provided at appropriate positions on the upper shell and the lower shell.
By providing the holder means for accommodating the substrate and providing the contact means with the contact-like exposed portions in a grid pattern, even if the IC substrate is thin and miniaturized, it is possible to prevent the damage due to static electricity etc. by touching carelessly. It has an extremely excellent effect that it can be assembled in a stable and secure manner.

Further, by storing the IC substrate laterally in the holder means, even if the IC substrate is not directly arranged in the tape cassette, it can be easily pulled out from the holder means at the time of assembly or the like. It has an extremely excellent effect that stable assembling can be carried out.

Since the holder means is formed of a static electricity preventing member, it is possible to prevent the destruction of the IC due to static electricity when the IC substrate is incorporated in the holder means, and it is extremely excellent in that the quality can be improved. Produce an effect.

Further, since the holder means is colored, the holder means can be easily distinguished from the tape cassette, the assembling work is improved, and the surface side of the contact exposure window is flush with the side surface of the tape cassette after assembling. Since it is arranged in such a state, the position of the contact portion can be easily visually recognized by the user, and an extremely excellent effect that, for example, it can be prevented from being touched by a hand or pinching an object is exerted.

[Brief description of drawings]

FIG. 1 is a plan view of an IC substrate mounting structure of a tape cassette according to the present invention with an upper shell removed.

FIG. 2 is a schematic perspective view of a main part of a state in which an IC substrate is incorporated in the holder part as viewed from the back side.

FIG. 3 is a schematic perspective view of an essential part of a state in which an IC substrate is incorporated in the holder part as viewed from the front surface side.

FIG. 4 is a side view of an essential part showing a state where holder means is incorporated in the tape cassette.

5 is a sectional view taken along line AA of FIG.

[Explanation of symbols]

 1 Tape Cassette 2a Lower Shell 2b Upper Shell 3 Tape 4, 5 Tape Reel 6 Opening / Closing Part 7 Erroneous Erasure Prevention Plug 8 IC Board 9 Board 10 IC 11 Contact Parts 11a, 11b, 11c Contact 12 Holder Part 13 Opening 14 Upper Groove 15 Lower Groove 16 Contact Exposure Window 17 IC Exposure Window 18 Board Support 19 IC Board Mounting 20 Lower Notch 21 Lower Holder Groove 22 Lower Holder Support 23 Upper Notch 24 Upper Holder Groove 25 Upper Holder Support 26 External Connector

Claims (4)

[Claims] 1. A tape cassette having an upper substrate and a lower shell joined together and equipped with an IC substrate, wherein the IC substrate is accommodated and mounted in a holder means having a grid-shaped contact exposing portion. Characteristic tape cassette IC board mounting structure. 2. The IC substrate mounting structure for a tape cassette according to claim 1, wherein the holder means is provided with an opening on one side surface so that the IC substrate can be laterally incorporated. 3. The IC substrate mounting structure for a tape cassette according to claim 1, wherein the holder means is formed of an antistatic member. 4. The IC substrate mounting structure for a tape cassette according to claim 1, wherein the holder means is colored.