JP3393233B2 - Substrate mounting structure for recording / playback cassette - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for a substrate having recorded information of a cassette, particularly an IC memory substrate, and more particularly to a structure for eliminating looseness of the IC memory substrate.

[0002]

2. Description of the Related Art A cassette for a recording medium in the prior art is miniaturized, and in addition to recording / reproducing on a recording medium tape, for example, a magnetic tape, recording information, the length of the magnetic tape, erasure prevention means, etc. It has various functions.

For example, an IC memory board having contact terminals facing a predetermined position of upper and lower shells corresponding to upper and lower shells constituting a recording / reproducing cassette is mounted, and the contact terminals and an electronic device such as a connector of a digital VTR are mounted. It is a well-known technique to connect and retrieve recorded information recorded in a recording medium cassette.

In order to assemble such an IC memory substrate into a recording / reproducing cassette, as shown in FIG. 5, a long thin strip is formed at a predetermined position of the recording / reproducing cassette 16, for example, a corner portion of a rectangular upper and lower shell. The structure is such that the IC substrate mounting portion 17 is provided in a so-called gap formed of regions.

The IC board mounting portion 17 is composed of two rooms, a terminal housing portion 18A for connecting to a connector of an electronic device or the like in a room on the right side when viewed from above in FIG. 5, and an IC portion of an IC memory board in the room on the left side. And an IC storage section 18B for storing

The terminal accommodating portion 18 has a structure in which a connection window portion 19 consisting of four windows facing the outside is provided.

On the other hand, as shown in FIGS. 8 and 9, the IC memory board 20 incorporated in the IC board mounting portion 17 has a board 20A formed in an elongated shape, and a memory mounting portion 21 is formed in one of its longitudinal directions. In this structure, the terminal portion 24 is provided on the other side in the longitudinal direction.

The memory mounting portion 21 is an IC memory 2 for recording the recording information of the recording / reproducing tape at a substantially central position.
2 is mounted, and the periphery thereof is covered with a protective layer 23. The IC memory 22 is connected to each terminal of the terminal portion 24.

The terminal portion 24 is formed by arranging four terminals in an aligned state, and each terminal is grounded from the outside.
A, a clock terminal 24B, a data terminal 24C, and a power supply terminal 24D.

An IC memory substrate 2 having such a structure
0 to the IC board mounting portion 17 of the lower shell 16B of the recording medium cassette 16 as shown in FIGS.
A, 24B, 24C and 24D are directed outward, and the memory mounting part 21 is inserted into the IC storage part from above. Then, as shown in FIG. 6, the IC memory substrate 2
The terminal portion 24 side of 0 is exposed to the outside through the connection window portion 19, and particularly the outermost ground terminal 24A can contact the lower shell 2B. Further, the memory mounting portion 21 side is arranged in a state of being stored in the IC storage portion 18B, the upper shell 16A is covered from the upper portion thereof, and the IC memory substrate 20 is engaged and assembled from the upper portion. That is, the upper and lower end surfaces of the IC memory substrate 20 are fixed by being sandwiched by the upper and lower shells 2A and 2B, and the assembly is completed.

In order to obtain the record information of the recording / reproducing cassette 16 assembled in this way, as shown in FIG. 7, a connector 25 provided on an external device, for example, a digital VTR or the like, is placed below the cassette 16. While sliding from the side, the terminal 24 (24A, 24B, 24C,
24D) to obtain a contact state.

[0012]

However, in the structure for assembling the IC memory substrate in the above-described conventional technique, the connector of the external device is installed in order to obtain the recorded information recorded in the IC memory by mounting the IC memory substrate on the external device. Since the structure is such that the terminals are connected from the lower side to obtain a contact state, there is a problem that even if the board is held down by the upper shell, the vertical play cannot be eliminated when the connection is made. It was

That is, the IC memory substrate 20 is loose in the upper and lower shells due to the clearance on the design tolerance and the draft of the mold. If this backlash is large, stable contact with the external connector is impaired, and the IC memory board 2
Since an extra moment is applied to the contact portion of 0, the durability of the connector on the electronic device side is reduced, and it is required to reduce the play as much as possible. Further, if the backlash is large, it can be seen that the IC memory substrate 20 is tilted from the connection window portion 11, and there is a problem that the precision feeling of the cassette is impaired in appearance and the commercial value is lowered.

Furthermore, in the structure in which the ground terminal of the terminals of the substrate is brought into contact with the shell to release static electricity to the outside to prevent electrostatic breakdown of the elements on the substrate 20, a structure that eliminates rattling is an essential requirement.

Therefore, even with the existing structure, there is a problem that an IC memory board must be mounted in the upper and lower shells without looseness.

[0016]

In order to solve the above-mentioned problems, a substrate mounting structure of a recording / reproducing cassette according to the present invention comprises (1) an IC memory substrate provided with a memory and a plurality of external connector contact terminals. And a mounting portion of the IC memory substrate is formed of a terminal storing portion and an IC storing portion provided at a corner which is a side surface on the back side of the lower shell, and the IC storing portion is A structure is provided in which a step portion is provided on the side surface on the back surface side at a position where the reinforcing rib and the side wall intersect with each other, and an inclined portion formed inside the side wall and having a thickness increasing toward the step portion side. .

Further, the inclined portion has a lower shell and an upper shell.
Taper from the joint surface to the back side;
One ground terminal of the plurality of external connector contact terminals
Contacting the lower shell;
Both ends of the C memory board are supported by the stepped portion, and the substantially middle portion is projected.
Being supported by the department.

[0018]

The substrate mounting structure of the recording / reproducing cassette of the present invention having the above-described structure has the following actions.

(1) The IC memory board can be mounted on the shell in a state of being slightly bent along the inclined surface, and the backlash of the board itself can be eliminated.

(2) Since the inner wall surface of the lower shell is provided with the inclined surface in contact with the IC memory board, the IC memory board can be easily assembled in a slightly bent state.

(3) Since the inclined surface is formed in a tapered shape, the IC memory substrate can be easily engaged even when the IC memory substrate is slightly bent.

(4) Of the plurality of terminals, the ground terminal is always brought into contact with the lower shell by the elastic force of the substrate, so that the harmful effect of static electricity can be prevented.

(5) The bending strength of the IC memory substrate in a curved state can be increased by adopting a structure in which both end portions of the IC memory substrate are supported by the step portion and the substantially middle portion is supported by the projecting portion. .

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate positioning structure for a recording / reproducing cassette according to the present invention will be described below in detail with reference to the structure of a recording / reproducing cassette, for example, a magnetic tape cassette. The same parts as those in the prior art are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 1, the recording / reproducing cassette 1 is composed of an upper shell corresponding to a quadrangular upper shell and a lower shell 2B corresponding to a lower shell. It has a structure in which a pair of tape reels 4A and 4B around which a certain magnetic tape 3 is wound are mounted.

The front side of the recording / reproducing cassette 1 is opened / closed when the recording / reproducing cassette 1 is attached to an electronic device such as a digital video device to open / close the tape 3 to guide the recording / reproducing mechanism of the device. Although not shown, an erroneous erasure prevention plug is arranged on the side surface of the back surface on the upper shell side of the corner where the reinforcing rib is formed.

An IC board mounting portion 6 on which an IC memory board can be mounted is provided at the corner where the reinforcing rib of the lower shell 2B is formed, which is substantially the same as the position where the erroneous erasure prevention plug is arranged. ing.

Here, the IC memory substrate 20 is the same as the conventional technique described with reference to FIGS. 5 and 6, and therefore its explanation is omitted.

As shown in FIGS. 1 and 2, the IC board mounting portion 6 is between the side wall 8 on the rear side of the lower shell 2B and the side wall 8 between the reinforcing rib 7 provided at the corner.
It consists of two chambers that are long and thin along the longitudinal direction of
It is formed from the terminal storage portion 10 and the IC storage portion 13 at the boundary.

The terminal accommodating portion 10 is provided with four connection openings 11 that are open to the outside in an aligned state and are connected to a connector of an electronic device such as a digital VTR. The structure is such that a step portion 12 for locking the end portion is provided near the corner side. This terminal housing 1
The terminal portion 24 side of the IC memory board 20 is engaged with 0.

The IC storage portion 13 is provided inside the side wall 8 with a step portion 14 provided on the rear side surface at a position where it crosses the reinforcing rib 7 and the side wall 8, that is, at the end of the room formed in the longitudinal shape. The structure is such that an inclined portion 15 formed to have a thicker wall is provided toward the step portion 14 side.

Further, as shown in FIGS. 3 and 4, the inclined portion 15 has a structure in which it is formed in a tapered shape 15a from the joining surface of the lower shell 2B and the upper shell 2A toward the inner side. .

The IC board mounting portion 6 having such a structure
The IC memory board 20 is inserted into and engaged with, the upper shell 2A is covered from above, and the IC memory board 20 is engaged between the lower shell 2B and the upper shell 2A to complete the assembly.

That is, the IC memory substrate 20 is attached to the lower shell 2B.
2 and 3, first, the terminal portion 24 side is engaged and supported by the step portion 12 and the projecting portion 9 and the memory mounting portion 21 side is inclined by the slant portion 15 toward the inside of the cassette. Engage in a slightly bent state. At the time of engagement, since the inclined portion 15 is formed in the tapered shape 15a, it has a structure in which it is easily engaged in a slightly bent state.

Therefore, the terminal portion 24 of the IC memory substrate 20
Side 2 is always urged outward, that is, the substrate 2
Due to the repulsive force of the elastic force of 0, the respective terminals are constantly in pressure contact with the side wall surface of the connection window portion 11, and in particular, the grounding terminal 24A provided on the outermost side of the substrate 20 is constantly and stably pressed against the lower shell 2B. Then, they are brought into contact with each other, and static electricity generated in the substrate 20 can be released to prevent electrostatic breakdown. Further, since both ends of the IC memory board 6 are supported by the step portions 12 and 14, and the substantially middle portion is supported by the projecting portion 9, the terminal portion 24
Even if pressure is applied to the terminal portion 24 of the substrate 6 due to the protrusion 9.
Since the structure is supported from the opposite side, it does not easily bend.

Since the IC memory substrate 20 is engaged in this manner, as shown in FIG. 6 described in the section of the prior art,
In the structure in which the connector 25 of the electronic device abuts from below and slides upward to obtain the connected state, the terminal side,
That is, the IC memory substrate 20 has a structure that does not move up and down. Therefore, a structure without backlash can be realized.

[0037]

The substrate mounting structure of the recording / reproducing cassette according to the present invention having the above-described structure has the following effects.

(1) Since the IC memory board can be mounted on the shell in a state of being slightly bent along the inclined surface, the terminals facing the outside are constantly pressed against the side wall of the shell by the repulsive force due to the elastic force of the board. It is possible to eliminate the backlash of the substrate itself, and it is possible to obtain a very excellent effect that a stable connection state can be obtained even if it is slidably connected to a connector of an electronic device such as a digital VTR.

(2) Since the inner wall surface of the lower shell is provided with the inclined surface which is in contact with the IC memory board, it is easy to engage the IC memory board in a slightly bent state, and the IC is not required to have a complicated structure separately. This has an extremely excellent effect that the backlash of the memory substrate can be eliminated.

(3) Since the inclined surface is formed in a tapered shape, it can be easily engaged even when the IC memory substrate is slightly bent, and it can be assembled accurately without complicating the assembly process. Has an extremely excellent effect.

(4) The ground terminal which constitutes a plurality of terminals,
Since the lower shell can be constantly brought into pressure contact with the lower shell, a harmful effect due to static electricity can be prevented without adding a separate structure.

(5) The terminal portion side of the IC memory board mounted in a curved state is formed by the structure in which both ends of the IC memory board are supported by the step portion and the substantially middle portion is supported by the projecting portion. Even if a pressure is applied to, it is not easily bent, so-called strength can be increased, and a very excellent effect that a stable connection state with an external connector can be obtained is exerted.

[Brief description of drawings]

FIG. 1 is an overall view of a lower shell of a cassette having a structure for mounting an IC substrate according to the present invention.

FIG. 2 is an explanatory view showing an enlarged main part of the IC board mounting portion.

3 is a sectional view taken along line AA of FIG.

FIG. 4 is an enlarged perspective view of a schematic main part showing an inclined portion of the board mounting portion.

FIG. 5 is an overall view of a lower shell provided with an IC board attachment portion in a conventional technique.

FIG. 6 is an enlarged explanatory view of a main part of an IC substrate mounting portion of a recording medium cassette according to a conventional technique.

FIG. 7 is an explanatory diagram showing a BB cross section of FIG. 2 and a cross section of FIG. 7;

FIG. 8 is a plan view of the IC memory substrate as seen from the back side.

FIG. 9 is a side view of an IC memory board.

[Explanation of symbols]

1 Recording / playback cassette 2A upper shell 2B lower shell 3 tapes 4A, 4B reel 5 Opening and closing part 6 IC board mounting part 7 Reinforcing rib 8 side walls 9 protrusion 10 terminal compartment 11 Connection window 12 steps 13 IC storage 14 steps 15 Inclined part 15a tapered 20 IC memory board 21 Memory loading part 22 memory 23 Protective layer 24 terminals 24A grounding terminal 24B clock terminal 24C data terminal 24D power supply terminal

Claims (4)

(57) [Claims] 1. A recording / reproducing cassette equipped with an IC memory board having a memory and a plurality of terminals for contacting an external connector, wherein the mounting portion of the IC memory board is a side surface on the back side of the lower shell.
From the terminal storage and the IC storage provided in the corner
The IC storage portion is formed on the side surface on the rear surface side and is a reinforcing rib.
And a step is provided at a position intersecting the side wall, and inside the side wall.
The slanted part formed thicker toward the step side
A structure for mounting a substrate for a recording / reproducing cassette, which is characterized in that 2. The inclined portion is composed of a lower shell and an upper shell.
The substrate mounting structure for a recording / reproducing cassette according to claim 1, wherein the substrate mounting structure is formed in a taper shape from the joining surface toward the inner side . 3. One of the plurality of external connector contact terminals.
The two ground terminals are brought into contact with the lower shell.
The substrate mounting structure for a recording / reproducing cassette according to claim 1 , wherein: 4. Both ends of the IC memory substrate are supported by steps.
It is held, and the middle part is supported by the protrusion
The substrate mounting structure for the recording / reproducing cassette according to claim 1 .