JPH08116022A - Semiconductor device and semiconductor device unit - Google Patents

Abstract

PURPOSE: To improve the packaging capacity, the maintainability and heat radiating capacity in relation to the semiconductor device and semiconductor device unit packaged in almost vertical state to a package substrate. CONSTITUTION: The semiconductor device unit 50 is formed of semiconductor devices 10 formed of a stage 13 whereon upward extending parts 17 extending upward from the surface of resin packages 15, a holder 51 having an upper part aperture part 53 simultaneously containing semiconductor devices 10 in the juxtaposed state as well as a cap 52 in contact with the upward extending parts 17 formed on the semiconductor devices 10 in the open state of the upper part aperture part 53.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a semiconductor device unit, and more particularly to a semiconductor device and a semiconductor device unit mounted in a substantially vertical state on a mounting substrate. In recent years, a mounting structure in which a plurality of semiconductor devices are stacked has been attracting attention as a means for improving the mounting density of semiconductor devices.

On the other hand, there has been proposed a semiconductor device which employs a so-called vertical package in which the semiconductor device is mounted upright on a mounting substrate as a means for improving the mounting density. Therefore, it is possible to further improve the packaging density by stacking the semiconductor devices having the vertical package structure.

Further, the semiconductor device generates heat,
When the semiconductor devices, which are the heating elements, are stacked close to each other to form a semiconductor device unit, it is necessary to improve the heat dissipation characteristics.

[0004]

2. Description of the Related Art In recent years, there has been proposed a semiconductor device which employs a so-called vertical package structure in which a semiconductor device is mounted upright on a mounting substrate in order to improve mounting density. This vertical semiconductor device is configured to be mounted in a state where a resin package is erected on a mounting substrate.

FIG. 28 shows a semiconductor device 1 which is an example of a conventional vertical semiconductor device. In the figure,
A resin package 2 has a semiconductor chip 3 sealed inside. The semiconductor chip 3 is mounted on the stage 5 and embedded in the resin package 2. Reference numeral 4 denotes a plurality of leads, each having an inner lead portion 4a connected to the semiconductor chip 3 and an outer lead portion 4b extending outward from one side surface of the resin package 2. Further, a predetermined portion of the tip of each outer lead portion 4b is bent, so that the mountability on the mounting substrate 6 (shown in FIGS. 29 and 30) is improved.

The semiconductor device 1 having the above structure is mounted in a state where the resin package 2 is erected with respect to the mounting substrate 6 so that the outer lead portion 4b is connected to the mounting substrate during mounting. By mounting the resin package 2 on the mounting substrate in the upright state in this manner, the mounting space required for mounting the semiconductor device 1 on the mounting substrate 6 is a surface where the outer lead portion 4b of the resin package 2 extends. The area (indicated by reference numeral 2a) is sufficient.

Therefore, the vertical semiconductor device 1 has, for example, a Q
A mounting space can be made smaller than that of a semiconductor device in which a large area surface of a resin package such as a FP (Quad Flat package) is mounted so as to face a mounting substrate, and the mounting density of the semiconductor device 1 can be improved. it can. 29 and 30, in order to further improve the packaging density,
A plurality of vertical semiconductor devices 1 are arranged in parallel to form a unit (hereinafter, a plurality of semiconductor devices 1 arranged in parallel to form a unit is referred to as a semiconductor device unit). The semiconductor device unit 7 shown in each drawing is a unit in which six vertical semiconductor devices 1 are laterally stacked. In the conventional semiconductor device unit 7, the semiconductor device unit 7 is formed by mounting the individual semiconductor devices 1 close to each other and mounting them on the mounting board 6.

[0008]

However, in the conventional semiconductor device 1 shown in FIG. 28, since the semiconductor chip 3 and the stage 5 are entirely embedded in the resin package 2, the semiconductor chip 3 occurs. The heat is radiated to the outside via the resin package 2. The resin package 2 has a low thermal conductivity, and thus the conventional semiconductor device 1 has a problem that the heat dissipation efficiency is not good.

Further, as described above, since the conventional semiconductor device unit 7 has a structure in which the plurality of semiconductor devices 1 are individually mounted on the mounting substrate 6, as shown in FIG.
The height of each semiconductor device 1 with respect to the mounting substrate 6 may differ after mounting. As described above, when the semiconductor device units 7 in which the heights of the individual semiconductor devices 1 are different from each other are to be housed in the small electronic device housing, the semiconductor device 1 is projected beyond the predetermined size (FIG. 29). The semiconductor device 1a in 1 corresponds to this), and there is a problem that the semiconductor device unit 7 may not be able to be housed in the electronic device housing due to this.

On the contrary, when the semiconductor device 1 is lower than the predetermined size (the semiconductor device 1b in FIG. 29 corresponds to this), the lead 4 (specifically, the outer lead portion 4b) is crushed. There is a problem in that the electrical connection with the mounting substrate 6 may become defective due to the above-mentioned state. Further, as a result of the inspection of the semiconductor device unit 7, a defect may be found in any of the plurality of semiconductor devices 1 forming the semiconductor device unit 7. In such a case, as shown in FIG. 30, the defective semiconductor device 1c
Must be removed from the semiconductor device unit 7 and replaced with a good semiconductor device.

However, since the semiconductor devices 1 are closely arranged from the viewpoint of improving the mounting density, it is difficult to remove the defective semiconductor device 1c from the semiconductor devices 1 and the maintainability is poor. There are also points. Furthermore,
Since the semiconductor device unit 7 has a configuration in which a plurality of semiconductor devices 1 that generate heat are arranged in close proximity to each other, there is a problem that the generated heat escapes little and the heat dissipation efficiency is poor.

The present invention has been made in view of the above points, and an object thereof is to provide a vertical semiconductor device having improved heat dissipation efficiency. Another object of the present invention is to provide a semiconductor device unit having improved mountability, maintainability, and heat dissipation.

[0013]

In order to solve the above-mentioned problems, the present invention is characterized by the following means. According to the invention of claim 1, a semiconductor chip, a stage on which the semiconductor chip is mounted, a resin package for encapsulating the semiconductor chip, a resin package arranged in a line, one end of which is connected to the semiconductor chip, , A semiconductor device having the other end extending downward from the resin package and being mounted on a mounting substrate in a substantially upright state, the stage extending upward from the upper surface of the resin package. It is characterized in that an upward extending portion is formed.

Further, the invention of claim 2 is characterized in that the rear surface of the stage with respect to the surface on which the semiconductor chip is mounted is exposed to the outside from the resin package. Further, the invention of claim 3 is characterized in that a hole is formed in the upward extending portion provided on the stage.

Further, the invention of claim 4 is characterized in that the stage is formed with a laterally extending portion which laterally extends from a side surface of the resin package. Further, the invention of claim 5 is characterized in that the stage is provided with an adhesion improving portion for improving the adhesion with the resin package.

The invention of claim 6 is characterized in that a groove for heat dissipation is formed in the resin package. Further, in the invention of claim 7, a pair of upright portions is formed upright on both sides of the stage, and a positioning fitting portion is formed between the pair of upright portions. To do.

The invention of claim 8 is characterized in that a positioning hole is formed in the upright portion. The invention according to claim 9 is characterized in that the portion of the connection lead extending below the resin package is held by the resin package.

Further, the invention of claim 10 is characterized in that the shape of the portion of the connection lead extending below the resin package is substantially L-shaped. Further, the invention of claim 11 is characterized in that the shape of the portion of the connection lead extending below the resin package is linear.

According to a twelfth aspect of the present invention, a semiconductor device unit is the same as the semiconductor device according to any one of the first to eleventh aspects and has an opening at the top and a plurality of the semiconductor devices are arranged in parallel. It is characterized by being configured with a holder housed inside.

According to a thirteenth aspect of the present invention, the opening portion of the holder is closed, and a cap that comes into contact with an upward extending portion formed in the semiconductor device in the closed state is provided. Is. Further, the invention of claim 14 is characterized in that the holder and the cap are formed of a material having good thermal conductivity.

The invention according to claim 15 is characterized in that a holding mechanism for engaging with the semiconductor device and holding the semiconductor device is provided inside the holder.
The invention of claim 16 is characterized in that a radiation fin is provided on the outer wall portion of the holder.

According to a seventeenth aspect of the present invention, the holder is provided with an engaging claw portion for holding the semiconductor device by engaging with the lower surface of the resin package constituting the semiconductor device. Is. In addition, claim 18
In the invention, the heat radiation fins are provided on the upper surface of the cap.

According to a nineteenth aspect of the present invention, a semiconductor device unit has the semiconductor device according to the seventh aspect, an upper surface portion and side surface portions formed on both sides of the upper surface portion, and the upper surface portion is formed. A plurality of semiconductor devices are collectively positioned by being fitted into a positioning fitting portion formed in the semiconductor device, and a plurality of semiconductor devices are provided by sandwiching the side surface portions with the plurality of semiconductor devices arranged in parallel. The present invention is characterized in that a holder for unitizing the device is provided.

According to the invention of claim 20, the semiconductor device unit is fitted into the semiconductor device according to claim 8 and a positioning hole formed in an upright portion provided in the semiconductor device, whereby a plurality of semiconductors are provided. The device is characterized in that it is provided with a positioning shaft for collectively positioning the devices and fixing a plurality of the semiconductor devices in a juxtaposed state so as to unitize the plurality of semiconductor devices.

According to a twenty-first aspect of the invention, in the semiconductor device unit according to any one of the twelfth to twentieth aspects, a high thermal conductive adhesive is provided on the plurality of semiconductor devices arranged in parallel, It is characterized in that at least adjacent semiconductor devices are mutually held by a high heat conductive adhesive.

Further, the invention of claim 22 is characterized in that a member having thermoplasticity is used as the high thermal conductive adhesive. Furthermore, the invention of claim 23 is characterized in that a silicone-based grease is used as the high thermal conductive adhesive.

[0027]

The above-mentioned means operate as follows. According to the first aspect of the present invention, since the upper extension portion extending upward from the upper surface of the resin package is formed on the stage on which the heat-generating semiconductor chip is mounted, the heat generated by the semiconductor chip is generated by the stage. The heat is conducted through the resin package, and the heat is radiated from the upper extending portion exposed from the upper surface of the resin package. Therefore, the heat generated in the semiconductor chip can be efficiently dissipated.

Further, since the upper extending portion is extended from the upper surface of the resin package which is a surface different from the lead arrangement position, even if the upper extending portion is formed, the lead arrangement pitch is affected. Instead, the lead pitch can be maintained at a narrow pitch. According to the invention of claim 2,
Since a part of the stage on which the semiconductor chip is mounted is exposed to the outside from the resin package, the stage has a function similar to that of the heat dissipation fin, and the cooling efficiency of the semiconductor chip can be improved.

According to the third aspect of the invention, since the hole is formed in the extending portion provided on the stage, the extraction jig can be engaged with the hole. Therefore,
When a semiconductor device unit is formed by arranging a plurality of semiconductor devices in parallel, it is possible to easily pull out one of the semiconductor devices. Further, according to the invention of claim 4, the side extending portion extending laterally from the side surface of the resin package is formed on the stage, so that the heat generated in the semiconductor chip is also generated in the side extending portion. Since heat is dissipated, the cooling efficiency of the semiconductor chip can be improved.

Further, according to the invention of claim 5, by forming the adhesion improving portion for improving the adhesion with the resin package on the stage, it is possible to prevent the stage from being separated from the resin package. it can. According to the invention of claim 6, since the surface area of the resin package is increased by forming the heat dissipation groove in the resin package, the heat dissipation efficiency of the resin package can be improved.

Further, according to the invention of claim 7, since the positioning fitting portion is formed between the pair of upright portions, the semiconductor device is positioned by using this positioning fitting portion. You can Further, according to the invention of claim 8, since the positioning hole is formed in the upright portion, the semiconductor device can be positioned by using the positioning hole at the time of mounting.

Further, according to the invention of claim 9, since the portion of the connection lead extending below the resin package is held by the resin package, the deformation of the connection lead at the time of mounting or the like can be prevented. . According to the tenth aspect of the present invention, the shape of the portion of the connection lead that extends below the resin package is formed into a substantially L shape, so that the erection property of the semiconductor device with respect to the substrate can be improved.

According to the eleventh aspect of the present invention, since the shape of the portion of the connecting lead extending below the resin package is linear, the thickness of the connecting lead as a whole is the same as that of the resin package. Since the size can be made smaller than the size, it is possible to prevent the density of the connection lead from being hindered from being increased. According to the twelfth aspect of the invention, a plurality of semiconductor devices can be supported by the holder in a state of being arranged side by side, and the heat generated by the semiconductor chip that conducts heat through the resin package is the semiconductor device. Is stored in the holder, it conducts heat to the holder and is dissipated. Since the shape of the holder is larger than that of each semiconductor device, the holder has a large contact area with the outside air, so that heat can be efficiently radiated. Furthermore, the semiconductor device can also dissipate heat through the upper opening.

According to the thirteenth aspect of the present invention, the opening of the holder is closed by the cap, and the upper extending portion formed on the semiconductor device is in contact with the cap in the closed state. The heat generated in the semiconductor chip and thermally conducted to the upper extending portion of the stage is conducted to the cap when the upper extending portion comes into contact with the cap, and then is dissipated.

The cap has a relatively large area,
Therefore, even in a semiconductor device unit having a configuration in which semiconductor devices are arranged in close proximity to each other, the heat generated in the semiconductor chip is efficiently radiated through the upward extending portion and the cap. Therefore, the cooling efficiency of the semiconductor chip can be improved. Further, according to the invention of claim 14, by forming the holder and the cap with a material having good thermal conductivity,
The heat dissipation efficiency of the holder and the cap can be further increased, and the cooling efficiency of the semiconductor chip can be improved.

According to the fifteenth aspect of the present invention, the holding of the semiconductor device can be ensured by providing the holding mechanism inside the holder for holding the semiconductor device by engaging with the semiconductor device. In addition, it becomes possible to mount a plurality of semiconductor devices in a holder on a mounting board in a unit state, thereby improving mountability. Further, since the semiconductor devices can be reliably positioned inside the holder, the height positions of the respective semiconductor devices can be aligned.

According to the sixteenth aspect of the invention, the heat radiation efficiency of the holder can be further improved by providing the heat radiation fin on the outer wall portion of the holder. According to the seventeenth aspect of the present invention, the holder is provided with the engaging claw portion for holding the semiconductor device by engaging with the lower surface of the resin package, so that the height positions of the respective semiconductor devices are more accurately aligned. be able to.

According to the eighteenth aspect of the present invention, the heat radiation efficiency of the cap can be further improved by providing the heat radiation fin on the upper surface of the cap. In addition, claim 1
According to the invention of claim 9, a holder having an upper surface portion and side surface portions formed on both sides of the upper surface portion is used, and the upper surface portion is fitted into a positioning fitting portion formed in the semiconductor device, and a plurality of semiconductor devices are mounted. The semiconductor devices can be easily unitized by collectively positioning the semiconductor devices, and sandwiching the semiconductor devices side by side by the side portions to form a plurality of semiconductor devices as a unit. It is possible to reduce the cost.

According to the twentieth aspect of the present invention, the plurality of semiconductor devices are collectively positioned by fitting the positioning shaft into the positioning hole formed in the upright portion, and the plurality of semiconductor devices are arranged side by side. Since the semiconductor device is fixed and unitized in this state, the semiconductor device can be easily unitized, and the cost can be reduced because only the shaft can be unitized.

According to the twenty-first aspect of the invention, a plurality of semiconductor devices arranged in parallel are provided with a high thermal conductivity adhesive, and the high thermal conductivity adhesive holds at least adjacent semiconductor devices to each other. By doing so, the heat generated in the semiconductor device can be conducted to the holder and the cap through the high thermal conductive adhesive, and the heat dissipation of the semiconductor device can be improved. Further, it becomes possible to securely hold the semiconductor devices arranged in parallel.

According to the twenty-second aspect of the present invention, by using a member having thermoplasticity as the high thermal conductive adhesive, any one of the plurality of semiconductor devices housed in the semiconductor device unit can be used. Even if a failure occurs in the semiconductor device, the high thermal conductivity adhesive is softened by heating the high thermal conductivity adhesive to the thermoplastic temperature, and the defective semiconductor device can be replaced with a normal semiconductor device. Become. Further, at the thermoplastic temperature or lower, a plurality of high thermal conductive adhesives hold the semiconductor devices arranged in parallel.

According to the twenty-third aspect of the present invention, since the grease of silicon type is used as the high thermal conductive adhesive, the semiconductor device which has failed without applying a heat load to the semiconductor device unit can be used as a normal semiconductor device. Can be exchanged for. Even if the connection leads of the semiconductor device have variations in manufacturing, by displacing the semiconductor device up and down in the silicon-based grease, the connection leads can be reliably brought into contact with the mounting board. It is possible to prevent the occurrence of connection failure due to the above variations.

[0043]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a semiconductor device 10 according to a first embodiment of the present invention.
Is shown. The semiconductor device 10 is a vertical semiconductor device that is provided upright on a mounting substrate 11, and is composed of a semiconductor chip 12, a stage 13, leads 14, a resin package 15, and the like.

The semiconductor chip 12 generates heat by operating, and is sealed in the resin package 15 while being mounted on a predetermined surface of the stage 13. Further, the electrode pad 16 is provided at a substantially central position of the semiconductor chip 12.
The electrode pad 16 is connected to the lead 14 by a wire 17. The lead 14 is made of a lead material such as 42 alloy, for example, and the inner lead portion 14 a embedded in the resin package 15 and the outer lead portion 14 b extending to the outside of the resin package 15.
It is composed of The wire 17 is wire-bonded to the end portion of the inner lead portion 14a. At this time, the inner lead portion 14a extends to a position facing the semiconductor chip 12 to form a so-called lead-on-chip structure.

The outer lead portion 1 of each lead 14
4b is configured to be bent in a substantially L shape.
As described above, by bending the distal end portion of the outer lead portion 14b into a substantially L-shape, the stability (standing property) when the semiconductor device 10 is erected can be improved, as will be described later. When the semiconductor devices 10 are arranged side by side, this arrangement work can be easily performed.

The resin package 15 is made of, for example, epoxy resin by transfer molding, and seals the semiconductor chip 12, the stage 13, and the inner lead portions 14a of the leads 14 inside. The resin package 15 protects the semiconductor chip 12 and the like from the outside. The leads 14 extend downward from the lower surface 15a (the surface facing the mounting board 11) of the resin package 15, and the tip ends thereof are bent to improve the mountability with the mounting board 11. It has been configured.

Since the lower surface 15a has a smaller area than the side surfaces 15c and 15d, when the semiconductor device 10 is erected on the mounting substrate 11, the mounting substrate 11 is erected.
The mounting space for the semiconductor device 10 above is the lower surface 15a.
Therefore, the mounting efficiency can be improved. Here, the stage 13, which is a main part of this embodiment, will be described.

The stage 13 is made of a metal having a good thermal conductivity (for example, a copper alloy), and its upper portion extends upward from the upper surface 15b of the resin package 15 to form an upward extending portion 17. There is. A predetermined position of the upper end of the upward extending portion 17 is bent to form a bent portion 17a. A surface 13b, which is a back surface of the mounting surface 13a on which the semiconductor chip 12 of the stage 13 is mounted, is exposed from the resin package 15 to the outside (hereinafter, referred to as a structure).
This surface is called exposed surface 13b).

The semiconductor chip 12 generates heat by operating as described above, and the generated heat is conducted as heat through the stage 13 on which the semiconductor chip 12 is mounted as the first heat conduction path. Then, heat is conducted through the resin package 15 as the second heat conduction path. Since the stage 13 is formed of a metal having good thermal conductivity as described above, most of the generated heat is conducted through the stage 13.

Since the exposed surface 13b of the stage 13 is exposed to the outside of the resin package 15, heat is radiated from the exposed surface 13b. Also,
Since the upper extending portion 17 formed on the upper portion of the stage 13 also extends upward from the upper surface 15b of the resin package 15, the upper extending portion 17 has a function similar to that of the heat radiation fin. Therefore, heat is also radiated in the upper extension portion 17. In this way, the heat generated in the semiconductor chip 12 is dissipated in the exposed surface 13b and the upward extending portion 17 in the process of conducting heat to the stage 13, so that the semiconductor chip 12 can be cooled efficiently.

In addition, the upper extending portion 17 is the upper surface 15b of the resin package 15 which is a surface different from the arrangement position of the lead 14.
Since the upper extending portion 17 is formed, the arrangement pitch of the leads 14 is not affected by the extension from the above.
The lead pitch can be maintained at a narrow pitch. FIG. 2 shows a semiconductor device 20 which is a second embodiment of the present invention. In the semiconductor device according to each of the embodiments described below, the same components as those of the semiconductor device 10 according to the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The semiconductor device 20 according to the second embodiment is characterized in that the hole 21 is formed in the upward extension 17 provided on the stage 13. In this embodiment, the stage 13 is configured to be embedded inside the resin package 15 except for the upward extending portion 17. As described above, even in the configuration in which only the upper extending portion 17 is exposed to the outside of the resin package 15, the heat dissipation can be improved as compared with the conventional semiconductor device 1 shown in FIG.

Since the hole 21 is formed in the upward extending portion 17 in this manner, it becomes possible to engage the drawing jig with the hole 21. This will be described with reference to FIG. The figure shows a plurality (five in the example shown in the figure).
The semiconductor devices 20 are arranged in close proximity to each other to form a unit. In this way, when a plurality of semiconductor devices 20 are unitized close to each other, if a defect is found in any of the semiconductor devices as a result of the inspection, the defective semiconductor device (the semiconductor device 20a in FIG. 16 is defective). It is necessary to replace a semiconductor device) with a non-defective semiconductor device.

As described above, in the prior art, since only the leads were exposed to the outside of the resin package, it was difficult to extract the defective semiconductor device from a plurality of unitized semiconductor devices. However, in the semiconductor device 20 according to the present embodiment, the upper extending portion 17 extends from the upper surface 15b of the resin package 15, and the upper extending portion 17 has the hole 21 formed therein. Therefore, the pull-out jig 22 can be engaged with the hole 21, and the pull-out jig 22 can be used to easily pull out the defective semiconductor device 20a from a plurality of unitized semiconductor devices. Can be improved. Further, this hole portion 21 can be collectively formed when the stage 13 is molded.
The provision of the step does not complicate the manufacturing process of the stage 13.

FIG. 3 shows a semiconductor device 30 which is a third embodiment of the present invention. Semiconductor device 30 according to the present embodiment
Are plural (3 in this embodiment) on the surface of the resin package 15.
The present invention is characterized in that a heat dissipation groove 31) is formed. As described above, the heat generated in the semiconductor chip 12 is radiated through the stage 13 and
The heat is also transferred to the resin package 15 and the resin package 15
Heat is dissipated at the surface of the.

Therefore, by forming a plurality of heat dissipation grooves 31 on the surface of the resin package 15 as in this embodiment, the surface area of the resin package 15 is increased,
The heat dissipation efficiency of the resin package 15 can be improved. Therefore, it is possible to satisfactorily dissipate the heat generated in the semiconductor chip 12 using the resin package 15 as a heat conduction path, and it is possible to improve the cooling efficiency of the semiconductor chip 12.

FIG. 4 shows a semiconductor device 40 which is a fourth embodiment of the present invention. Semiconductor device 40 according to the present embodiment
Is the side surfaces 15e and 15f of the resin package 15 which stand upright.
The present invention is characterized in that side extending portions 41, 42 extending further to the side are provided. This lateral extension 41, 4
Similarly to the upward extending portion 17, the reference numeral 2 is formed integrally with the stage 13 and is exposed to the outside of the resin package 15, respectively.

As described above, by providing the laterally extending portions 41 and 42 in addition to the upwardly extending portion 17 so as to be exposed to the outside of the resin package 15, the semiconductor chip 12 is also provided at the laterally extending portions 41 and 42. Since the heat generated in 1 is radiated, the cooling efficiency of the semiconductor chip 12 can be improved. Also, the lead pitch of the leads 14 on the lower surface 15a of the resin package 15 can be maintained at a narrow pitch, as in the first embodiment.

FIG. 5 and FIG. 6 show a semiconductor device unit 50 which is a fifth embodiment of the present invention. The semiconductor device unit 50 has a structure in which a plurality of semiconductor devices are arranged in close proximity to each other, and includes a plurality of semiconductor devices, a holder 51, a cap 52, and the like. still,
As the semiconductor device, each of the semiconductor devices 10, 20, 30, and 40 according to the above-described first to fourth embodiments can be used. In this embodiment, the semiconductor device 10 according to the first embodiment is used. An example will be described.

The holder 51 is made of a material having good thermal conductivity (eg, aluminum, high thermal conductive resin, etc.) and has a rectangular tubular shape as shown in an enlarged view in FIG. Therefore, in the upper part of the holder 51, the upper opening 53
Are formed. The holder 51 is configured to accommodate a plurality of semiconductor devices 10 arranged in parallel inside the holder 51. Further, as shown in FIG. 5, the semiconductor devices 10 are arranged in the holder 51 so as to be aligned and housed in the same direction.

As shown in FIGS. 5 and 6, a cap 52 is attached to the upper part of the holder 51, and the upper opening 53 formed in the holder 51 by the cap 52 is closed. There is. The cap 52 is also the holder 5
Like No. 1, it is made of a material having good thermal conductivity (for example, aluminum, high thermal conductive resin, etc.). In addition, the cap 52, as shown in FIG.
2a and a collar portion 5 formed so as to surround the outer peripheral edge portion thereof.
2b is integrally formed.

When the cap 52 is mounted on the holder 51, the cap 52 is in contact with the upward extending portions 17 formed on the plurality of semiconductor devices 10 housed in the holder 51. Specifically, the upper extension 17 provided in the semiconductor device 10 is thermally connected to the cap 52 when the cap 52 is attached. Further, in the state where the cap 52 is attached to the holder 51, the flange portion 52b is fitted to the holder 51. FIG. 6 is a schematic configuration diagram showing a state in which the cap 52 is attached to the holder 51.

In this closed state, the upper extension portion 17 formed on the semiconductor device 10 is brought into contact with the cap 52, so that the semiconductor chip 12 generates the upper extension portion 17 through the stage 13 to reach the upper extension portion 17. The heat conducted is conducted to the cap 52 via the upward extending portion 17. At this time, since the bent portion 17a is formed at the tip of the upper extending portion 17, the contact area between the upper extending portion 17 and the cap 52 is wide, and therefore, the upper extending portion 17 extends from the cap 52 to the cap 52. Good heat conduction can be achieved.

Further, since the cap 52 has a relatively large area, in other words, the contact area with the outside air is large, the semiconductor device unit 50 in which a plurality of semiconductor devices 10 are arranged in close proximity to each other is used. Even if each semiconductor chip 12
The heat generated in step 2 can be efficiently dissipated in the cap 52. Therefore, the cooling efficiency of the semiconductor chip 12 can be improved.

On the other hand, the heat generated in the semiconductor chip 12 is also conducted through the resin package 15. In the semiconductor device unit 50 according to the present embodiment, since the semiconductor device 10 is housed in the holder 51, the heat conducted through the resin package 15 is conducted to the holder 51. Since the holder 51 has a larger shape than the individual semiconductor devices 10, the holder 51 has a large contact area with the outside air, and thus has a large contact area with the outside air. Therefore, the heat conducted through the resin package 15 can be efficiently dissipated in the holder 51.

Further, even if the semiconductor devices 10 are accommodated in the holder 51 and the heights of the semiconductor devices 10 vary, the upper portion of the holder 51 accommodating the plurality of semiconductor devices 10 is closed by the cap 52. As a result, the heights of the semiconductor device units 50 can be made uniform. Therefore, if the semiconductor device unit 50 is to be mounted in an electronic device housing having a predetermined storage space, it is possible to reliably prevent the semiconductor device unit 50 from being disabled due to variations in the height of the semiconductor device. it can.

FIG. 8 shows the semiconductor device unit 50 described above.
The holder 55 which is the 1st modification of the holder 51 which comprises is shown. The holder 55 according to the first modified example is characterized in that a cap mounting groove 56 is formed in the outer wall portion. Further, FIG. 15 shows a cap 57 attached to the holder 55. The cap 57 is the top plate portion 7.
5a, slide pawls 58 are formed on the lower ends of the flanges 57b formed on both side edges in the longitudinal direction of 5a, respectively. The slide claw 58 is configured to engage with the cap mounting groove 56 formed in the holder 55.

By using the holder 55 and the cap 57 configured as described above, the cap 57 can be mounted on the holder 55 by aligning the slide claw 58 with the cap mounting groove 56 and then sliding the cap 57. It can be attached to the holder 55, and the attachment of the cap 57 can be improved. Further, even when the cap 57 is removed from the holder 55 for maintenance or the like, the cap 57 can be easily removed from the holder 55.

FIG. 9 shows the semiconductor device unit 50 described above.
The holder 60 which is the 2nd modification of the holder 51 which comprises is shown. The holder 60 according to the present modification is characterized in that a large number of heat radiation fins 61 are formed on the outer wall portion. In this way, the holder 60 has a large number of heat radiation fins 61.
By forming the above, the area of the holder 60 in contact with the outside air is increased, the heat conducted through the resin package 15 can be radiated more efficiently, and the cooling efficiency of the semiconductor chip 12 can be improved. it can.

FIG. 10 shows the semiconductor device unit 5 described above.
Holder 65 that is a third modified example of the holder 51 that configures 0.
Is shown. The holder 65 according to the present modification is characterized in that a holding groove 66 is formed therein as a holding mechanism that engages with the semiconductor device 10 and holds the semiconductor device 10. The holding groove 66 is shaped so that the resin package 15 of the semiconductor device 10 can be slid and mounted.

By forming the holding groove 66 in the holder 65, the semiconductor device 10 can be securely held in the holder 65, and a plurality of semiconductor devices 10 can be held in the holder 65.
The mounting process can be performed on the mounting substrate 11 in a unit state in which the mounting is performed, and the mountability can be improved. Further, by forming the holding groove 66, the holder 6
The semiconductor device 10 can be positioned reliably inside the semiconductor device 5, the height positions of the semiconductor devices 10 can be aligned, and the semiconductor device 1 in the holder 65 can be positioned.
It is possible to prevent zero rattling.

FIG. 11 shows the semiconductor device unit 5 described above.
Holder 70 that is a fourth modified example of the holder 51 that configures 0.
Is shown. The present modification is characterized in that the holder 70 is composed of a pair of holder halves 71, 72. A holding groove 7 that engages with and holds the semiconductor device 10 is provided on each of the facing surfaces of the pair of holder halves 71, 72.
3, 74 are formed respectively.

The holder 70 is replaced by a pair of holder halves 71, 72.
With this structure, the holding grooves 73 and 74 can be easily formed. In addition, the material cost can be reduced as compared with a rectangular tubular holder having four side pieces. Even if the holder halves 71 and 72 which are separated from each other are used, the holder halves 7 and 72 can be housed between the holder halves 71 and 72 by mounting the cap 57.
Since 1 and 72 are integrated, there is no inconvenience even if the holder 70 is divided into a pair of holder halves 71 and 72.

FIG. 12 shows the semiconductor device unit 5 described above.
Holder 75 which is a fifth modified example of the holder 51 forming 0.
Is shown. The holder 75 according to the present modification has a side wall 76.
The engaging claw 77 protruding inward is formed at the lower end of the. The engagement claw 77 is provided on the lower surface 1 of the resin package 15 with the semiconductor device 10 mounted.
It is configured to engage with 5a. Therefore, by mounting the semiconductor device 10 in the holder 75 and bringing the lower surface 15a of the resin package 15 into contact with the engagement claw 77, the height positions of the plurality of semiconductor devices 10 can be accurately aligned.

FIG. 13 shows the semiconductor device unit 5 described above.
Holder 80 which is a sixth modified example of the holder 51 constituting 0.
Is shown. The holder 80 according to this modification is characterized in that the holder 80 is collectively formed by pressing one plate. The holder 80 can be manufactured easily and at low cost by forming the holder 80 by pressing one plate.

FIG. 17 shows a semiconductor device 90 according to the sixth embodiment of the present invention. Semiconductor device 9 according to the present embodiment
In the case of 0, the upper extending portion 91 extending from the upper portion of the resin package 15 formed on the stage 13 has the vertical portions 92, 93.
And a positioning fitting portion 94. The upright portions 92 and 93 are upwardly extending portions 9
It is formed on both side portions of No. 1 and extends vertically upward from the upper surface 15b of the resin package 15. Positioning holes 95 and 9 are formed in the upright portions 92 and 93, respectively.
6 are formed respectively. Further, the portion sandwiched between the upright portions 92 and 93 is bent to form a positioning fitting portion 94. The length of the positioning fitting portion 94 with respect to the longitudinal direction of the resin package 15 (that is, the distance between the upright portions 92 and 93, which is indicated by an arrow L in the figure) is
It is processed with high precision to a predetermined length. Also,
Positioning holes 95 and 96 formed in the upright portions 92 and 93, respectively.
The formation position of is also accurately formed at a predetermined position.

FIG. 25 shows a semiconductor device 90A which is a modified example of the semiconductor device 90 according to the sixth embodiment. 25A is a rear view of the semiconductor device 90, and FIG. 25B is a cross-sectional view taken along the line AA in FIG. 25A. As described above, the stage 13 is configured to be exposed to the outside from the resin package 15 in terms of improving heat dissipation. However, since the stage 13 is made of a metal material, the adhesiveness (bondability) with the resin package 15 is high.
Is bad. Therefore, the stage 13 may be separated from the resin package 15.

Therefore, the present modification is characterized in that the stage 13 is provided with an adhesion improving portion for improving the adhesion with the resin package 15. In this modified example, a resin engagement hole 150 and a resin engagement recess 151 are formed in the stage 13 as the adhesion improving portion. By providing the resin engagement hole 150 and the resin engagement recess 151 on the stage 13, the contact area between the stage 13 and the resin package 15 can be increased. In addition, the resin forming the resin package 15 enters into the resin engagement hole 150 and the resin engagement recess 151 to generate a so-called anchor effect. Therefore, the adhesion between the stage 13 and the resin package 15 is improved, and the stage 13 can be reliably prevented from peeling off from the resin package 15.

It should be noted that the adhesion improving portion is the resin engaging hole 1 described above.
The configuration is not limited to 50 and the resin engagement recess 151, and a configuration may be employed in which a protrusion is formed on the stage 13 or a groove or the like is formed on the stage 13. FIG. 18 shows a semiconductor device unit 100 which is a seventh embodiment of the present invention. Semiconductor device unit 100 according to the present embodiment
Is characterized in that a plurality of semiconductor devices 90 according to the above-described sixth embodiment are arranged in a row and are sandwiched by a U-shaped holder 101 when viewed from the side to form a unit.

The holder 101 has a structure in which an upper surface portion 102 and a pair of side surface portions 103 and 104 are integrally formed. The upper surface portion 102 is configured such that its width dimension accurately matches the distance L between the pair of upright portions 92, 93 provided in the semiconductor device 90. Further, the distance between the pair of side surface portions 103 and 104 (that is, the length of the positioning fitting portion 94) is equal to the plurality of semiconductor devices 90 housed inside.
Is selected to be the same as or slightly smaller than the total width dimension of.

At the time of mounting, the upper surface portion 102 of the holder 101
In the positioning fitting portion 94 (that is, the pair of upright portions 92,
93)) and a pair of side surface portions 103, 104.
Are mounted so as to sandwich the semiconductor devices 90 arranged in a plurality of rows from both sides. The plurality of semiconductor devices 90 include the pair of side surfaces 10.
It is united by being sandwiched by 3,104. Further, the upper surface portion 102 of the holder 101 has the positioning fitting portion 9
The plurality of semiconductor devices 90 are positioned by being fitted into the semiconductor device 4.

Now, looking at the semiconductor device unit 50 described above with reference to FIGS. 5 and 6, in the semiconductor device unit 50, the positioning of each semiconductor device 10 in the holder 51 is performed by the resin package of each semiconductor device 10. 15 (specifically, the side surface of the resin package 15) is brought into contact with the inner wall of the holder 51. However, when molding deviation of the resin package 15 with respect to the lead 14 occurs in the resin molding process of the resin package 15, the resin package 1 deviated from the normal position.
5, the semiconductor devices 10 are aligned in the holder 51, and the plurality of leads 14 arranged at a fine pitch.
The position accuracy of is deteriorated.

However, the semiconductor device unit 100 according to the present embodiment is configured to position the plurality of semiconductor devices 90 by fitting the upper surface portion 102 into the positioning fitting portion 94. As described above, the upper surface portion 102
The width dimension of is accurately configured to match the separation distance L of the positioning fitting portion 94 provided in the semiconductor device 90. In addition, since the stage 13 and the lead 14 are integrally formed by pressing a single lead material substrate at the time of manufacturing, the positional accuracy of the stage 13 and the lead 14 is high. Therefore, the upper surface portion 1
02 is inserted into the positioning insertion portion 94 and each semiconductor device 9 is inserted.
By positioning the stage 13 of 0, the leads 14 can be positioned at the same time.

As described above, the semiconductor device unit 100 according to the present embodiment positions each semiconductor device 90 by positioning not the resin package 15 but the stage 13, so that the positions where the leads 14 are arranged vary. Does not occur, and the mountability at the time of mounting can be improved. Further, in the semiconductor device unit 100 according to the present embodiment, unlike the semiconductor device unit 50 shown in FIGS. 5 and 6, it is not necessary to dispose a holder so as to surround the semiconductor devices 90 arranged in a plurality of rows. Since it is not necessary to provide a cap, the holder 101 can be downsized and the cost can be reduced, and further, the semiconductor device unit 100 can be downsized and the cost can be reduced.

FIG. 19 shows a semiconductor device unit 110 which is an eighth embodiment of the present invention. In the semiconductor device unit 110 according to the present embodiment, a plurality of semiconductor devices 90 according to the sixth embodiment described above are arranged in a row, and positioning holes formed in the upright portions 92, 93 provided in each semiconductor device 90. The semiconductor device 90 is unitized by inserting the positioning shafts 111 and 112 (only one of the positioning shafts 111 is shown in the figure) into the members 95 and 96.

The positioning shafts 111 and 112 are
The diameter dimension is such that it can be fitted into the positioning holes 95 and 96 formed in the upright portions 92 and 93. Further, as described above, the positioning accuracy of the positioning holes 95 and 96 formed in the upright portions 92 and 93 is high, and the positional accuracy of the stage 13 and the lead 14 is also high. Therefore, a plurality of semiconductor devices 90 are arranged in a line, and the positioning shafts 111, 111 are positioned in the positioning holes 95, 96 formed in each semiconductor device 90.
By inserting 112, the plurality of semiconductor devices 90 can be positioned and fixed to form a unit by fixing the plurality of semiconductor devices 90.

The semiconductor device unit 110 according to this embodiment.
Simply inserts the positioning shaft 11 into the positioning holes 95 and 96.
Since the positioning and unitization of each semiconductor device 90 can be performed only by inserting 1,112, the manufacturing process of the semiconductor device unit 110 can be greatly simplified. Further, since the semiconductor device unit 110 can be configured only with the two positioning shafts 111 and 112, the cost can be reduced.

FIG. 20 shows a semiconductor device unit 120 which is a ninth embodiment of the present invention. The semiconductor device unit 120 according to this embodiment has a structure in which a plurality of semiconductor devices 90 shown in FIG. 17 are arranged in parallel in a holder 51 used in the semiconductor device unit 50 shown in FIG. Further, since the semiconductor device 90 has the upright portions 92 and 93, the upright portion 9 is attached to the cap 52 mounted on the upper portion of the holder 51.
Insertion holes for inserting 2, 3 and 9 are provided, and thus the upright portions 92, 93 are configured to project above the cap 52 through the insertion holes.

In addition, the plurality of semiconductor devices 90 arranged side by side have the adhesive 1 having a high thermal conductivity, which is an essential part of this embodiment.
21 are provided. The adhesive 121 is provided in a space formed between the semiconductor device 90 and the cap 52, and a space between adjacent semiconductor devices 90. Therefore, at least adjacent semiconductor devices 90 are mutually held by the adhesive 121, and this holding relationship acts on each of the plurality of semiconductor devices 90 arranged in parallel, so that the strength of the entire semiconductor device can be increased. it can.

A resin having thermoplasticity is selected as the adhesive 121. Therefore, heat treatment is applied to the adhesive 1
When the temperature of 21 is raised to the thermoplastic temperature or higher, the adhesive 121 becomes softened, and thus each semiconductor device 90 can be made movable. In the semiconductor device unit 120 configured as described above, the adhesive 121 having a high thermal conductivity is arranged in the space formed between the adjacent semiconductor devices 90 and between the semiconductor device 90 and the cap 52. The heat generated in the semiconductor device 90 is highly heat conductive adhesive 1
Since heat is conducted to the holder 51 and the cap 52 via 21, the heat dissipation of the semiconductor device 90 can be improved.

Further, the adjacent semiconductor devices 9 as described above
0 is mutually held by the adhesive 121, and this holding relationship works in each of the semiconductor devices 90 arranged in parallel,
The strength of the entire semiconductor device can be increased, and thus the reliability of the semiconductor device unit 120 can be improved. Further, since the adhesive 121 is a resin having thermoplasticity, for example, when a failure is found in one of the semiconductor devices 90 after the plurality of semiconductor devices 90 are arranged in the holder 51 and held by the adhesive. Also in the above, the adhesive 121 is softened by heating the adhesive 121 to a temperature not lower than the thermoplastic temperature, and the defective semiconductor device 90A is taken out from the semiconductor device unit 120 as shown in FIG. Can be exchanged for. Therefore, the maintainability and reliability of the semiconductor device unit 120 can be improved.

FIG. 22 shows a semiconductor device unit 130 which is a tenth embodiment of the present invention. The semiconductor device unit 130 according to the present embodiment has substantially the same configuration as the semiconductor device unit 120 according to the ninth embodiment shown in FIGS. 20 and 21, but instead of the adhesive 121, a silicon-based grease. It is characterized in that 131 is provided. The silicon-based grease 131 has a high viscosity at room temperature and a relatively high thermal conductivity.

By the way, when manufacturing the semiconductor device 90, it is known that some manufacturing variations occur, and this manufacturing variation may cause the leads 14 to have different heights. In FIG. 22, an arrow h indicates a height error of the lead 14 caused by manufacturing variations. Therefore, when the semiconductor device unit 130 is mounted (soldered) on the mounting board 11 with the height error h of the leads 14 still occurring, a connection failure may occur between the leads 14 and the mounting board 11.

However, in the structure of the semiconductor device unit 130 according to this embodiment, the semiconductor device 90 and the cap 52 are included.
And a semiconductor device 9 adjacent to the space formed between
A silicone-based grease 131 having a high viscosity at room temperature is arranged in the zero-spaced portion. Therefore, even when the semiconductor device 90 is mounted in the semiconductor device unit 130, it is possible to move the semiconductor device 90 in the holder 51 (movement in the vertical direction) by urging strongly.

Therefore, as shown in FIG. 22, the upright portions 92 and 93 projecting upward from the cap 52 are pressed downward to move the semiconductor device 90 downward in the holder 51. The height error h can be corrected. As a result, the leads 1 of all the semiconductor devices 90 are
4 can be brought into contact with the mounting substrate 11, and the electrical connection between the lead 14 and the mounting substrate 11 can be surely made. In this embodiment as well, it is needless to say that the defective semiconductor device can be replaced even after being attached to the holder 51.

FIG. 24 shows a semiconductor device 140 which is the eleventh embodiment of the present invention. In the figure, for convenience of explanation, the vicinity of the connection position between the semiconductor device 140 and the mounting substrate 141 is shown enlarged. Further, a plurality of semiconductor devices 140 are arranged in the holder 51 side by side to form a semiconductor device unit 145. In this embodiment, the holding portion 1 is attached to the resin package 15 that constitutes the semiconductor device 140.
42 is formed, and the holding portion 142 holds the portion of the lead 143 extending downward.

With the above structure, unlike the semiconductor device shown in the other embodiments, the downwardly extending portion of the lead 143 is not bent in an L-shape but has a linear shape. Also,
By forming the holding portion 142 on the resin package 15, a convex portion is formed on the lower portion of the resin package 15. Further, the lead 143 is configured to be exposed on the inner surface of the holding portion 142.

On the other hand, on the mounting substrate 141 on which the semiconductor device unit 145 having the above structure is mounted, the holding portion 14 formed below the semiconductor device unit 145 described above.
2, a recess 146 having a shape corresponding to 2 is formed, and a substrate side electrode 147 is formed at a predetermined position on the inner surface of the recess 146. In the above configuration, when mounting the semiconductor device unit 145 on the mounting substrate 141, the holding portion 142 formed on the lower portion of the semiconductor device unit 145 is fitted into the recess 146 formed on the mounting substrate 141.
In this fitted state, the lead 143 provided in the holding portion 142 and the substrate-side electrode 147 provided in the recess 146 are electrically connected. In addition, the holding portion 142 and the concave portion 14
The semiconductor device unit 145 is fixed to the mounting substrate 141 by the fitting force with respect to 6.

When the semiconductor device unit 145 is mounted on the mounting board 141, the leads 143 and the board-side electrodes 147.
However, since the lead 143 is held by the holding portion 142 and the substrate-side electrode 147 is held by the inner wall of the recess 146, the lead 143 and the substrate-side electrode 1 are mounted at the time of mounting.
47 is not deformed. Further, since the lead 143 is held by the holding portion 142 as described above,
It is possible to prevent the deformation of the lead 143 even when the semiconductor device 140 is attached to the holder 51.

Further, as described above, the semiconductor device unit 1
The connection between 45 and the mounting substrate 141 is performed by fitting the holding portion 142 and the recess 146 and slidingly contacting the lead 143 and the substrate-side electrode 147, and fixing processing such as soldering is not performed. Therefore, the semiconductor device unit 145 is configured to be attachable / detachable to / from the mounting board 141, which makes it possible to improve maintainability and at the same time, mounting board 14
Semiconductor device unit 14 having different functions for one
It is also possible to selectively wear the No. 5 device.

FIG. 26 shows a semiconductor device 160 which is a twelfth embodiment of the present invention. By arranging a plurality of the semiconductor devices 160 in parallel, the semiconductor device unit 165 is provided.
It is what constitutes. Semiconductor device 16 according to the present embodiment
No. 0 is characterized in that the lead 166 has a linear shape. By using the semiconductor device 160 having this configuration, the size of the semiconductor device unit 165 can be reduced. The reason will be described below.

It is effective to reduce the thickness of the resin package 15 in order to reduce the size of the semiconductor device 160, particularly to reduce the thickness thereof. In recent years, a semiconductor device in which the size of the resin package 15, which is a so-called chip size package, is substantially the same as the size of the semiconductor chip 12, has also begun to be provided. When the resin packages 15 are thinned in this way, interference occurs between the resin packages 15 when the semiconductor devices are arranged side by side in the configuration in which the tips of the leads 14 are bent as in each of the above-described embodiments. Despite this, it is conceivable that the bent portions of the leads 14 interfere with each other to prevent high-density mounting.

That is, as shown in FIG. 27, when the thickness dimension H1 of the resin package 15 is smaller than the length H2 of the bent portion of the lead 14 (H1 <H2), the lead 1
The four bent portions 14c collide with each other, and the semiconductor devices cannot be arranged close to each other. However, by making the shape of the lead 166 linear as in the present embodiment, the thickness dimension of the lead 166 as a whole can be made smaller than the thickness dimension of the resin package 15. It is possible to prevent the oxidization from being inhibited. Therefore, it is possible to reduce the size of the semiconductor device unit 165 formed by arranging the above-configured semiconductor devices 160 in parallel.

[0104]

As described above, according to the present invention, the following various effects can be realized. According to the invention of claim 1, the heat generated in the semiconductor chip is conducted through the stage, and is radiated in the upper extension portion exposed from the upper surface of the resin package. Therefore, the heat generated in the semiconductor chip is efficiently radiated. can do.

Further, by extending the upper extending portion from the upper surface of the resin package, which is a surface different from the lead arrangement position, even if the upper extending portion is formed, the lead arrangement pitch is affected. Instead, the lead pitch can be maintained at a narrow pitch. According to the invention of claim 2,
Since a part of the stage on which the semiconductor chip is mounted is exposed to the outside from the resin package, the stage has a function similar to that of the heat dissipation fin, and the cooling efficiency of the semiconductor chip can be improved.

According to the third aspect of the present invention, the extraction jig can be engaged with the hole, and when a plurality of semiconductor devices are arranged in parallel, a semiconductor device unit is constructed. The work of pulling out the semiconductor device can be easily performed. Further, according to the invention of claim 4, the heat generated in the semiconductor chip is also radiated in the lateral extension portion, so that the cooling efficiency of the semiconductor chip can be improved.

According to the fifth aspect of the present invention, the stage is prevented from being separated from the resin package by forming the adhesiveness improving portion for improving the adhesiveness with the resin package on the stage. it can. Further, according to the invention of claim 6, since the surface area of the resin package is increased, the heat radiation efficiency of the resin package can be improved.

Further, according to the invention of claim 7, since the positioning fitting portion is formed between the pair of upright portions, the positioning device is used to position the semiconductor device during mounting. You can Further, according to the invention of claim 8, since the positioning hole is formed in the upright portion, the semiconductor device can be positioned by using the positioning hole at the time of mounting.

According to the ninth aspect of the invention, since the portion of the connecting lead extending below the resin package is held by the resin package, it is possible to prevent the connecting lead from being deformed during mounting or the like. . According to the tenth aspect of the present invention, the shape of the portion of the connection lead that extends below the resin package is formed into a substantially L shape, so that the erection property of the semiconductor device with respect to the substrate can be improved.

According to the eleventh aspect of the present invention, since the shape of the portion of the connection lead extending below the resin package is linear, the overall thickness of the connection lead is the thickness of the resin package. Since the size can be made smaller than the size, it is possible to prevent the density of the connection lead from being hindered from being increased. According to the twelfth aspect of the invention, a plurality of semiconductor devices can be supported by the holder in a state of being arranged side by side, and the heat generated by the semiconductor chip that conducts heat through the resin package is the semiconductor device. Is stored in the holder, it conducts heat to the holder and is dissipated. Since the shape of the holder is larger than that of each semiconductor device, the holder has a large contact area with the outside air, so that heat can be efficiently dissipated. Furthermore, the semiconductor device can also dissipate heat through the upper opening.

According to the thirteenth aspect of the present invention, the heat generated in the semiconductor chip and thermally conducted to the upper extension of the stage is conducted to the cap when the upper extension contacts the cap. Dissipate heat. Since the cap has a relatively large area, the heat generated in the semiconductor chip is efficiently radiated through the upward extending portion and the cap even in the semiconductor device unit in which the semiconductor devices are arranged in close proximity to each other. Therefore, the cooling efficiency of the semiconductor chip can be improved.

According to the fourteenth aspect of the present invention, by forming the holder and the cap with a material having good thermal conductivity, the heat dissipation efficiency of the holder and the cap can be further improved, and the cooling efficiency of the semiconductor chip can be improved. Can be improved. According to the fifteenth aspect of the invention, by providing the holding mechanism for engaging the semiconductor device and holding the semiconductor device inside the holder, the semiconductor device can be reliably held, and the holder can be securely held. It becomes possible to mount a plurality of semiconductor devices on a mounting board in a unit state, and it is possible to improve mountability. Further, since the semiconductor devices can be reliably positioned inside the holder, the height positions of the respective semiconductor devices can be aligned.

According to the sixteenth aspect of the present invention, the heat radiation efficiency of the holder can be further improved by providing the heat radiation fin on the outer wall portion of the holder. According to the seventeenth aspect of the present invention, the holder is provided with the engaging claw portion for holding the semiconductor device by engaging with the lower surface of the resin package, so that the height positions of the respective semiconductor devices are more accurately aligned. be able to.

According to the eighteenth aspect of the present invention, the heat radiation efficiency of the cap can be further improved by providing the heat radiation fin on the upper surface of the cap. In addition, claim 1
According to the ninth aspect of the invention, the upper surface portion is fitted into the positioning fitting portion formed in the semiconductor device to collectively position the plurality of semiconductor devices, and the side surface portion holds the plurality of semiconductor devices in a juxtaposed state. By unitizing the plurality of semiconductor devices, the semiconductor device can be easily unitized, and the cost of the holder can be reduced.

According to the twentieth aspect of the present invention, a plurality of semiconductor devices are collectively positioned by fitting the positioning shaft into the positioning hole formed in the upright portion, and a plurality of semiconductor devices are arranged in parallel. Since the semiconductor device is fixed and unitized in this state, the semiconductor device can be easily unitized, and the cost can be reduced because only the shaft can be unitized.

According to the twenty-first aspect of the present invention, a plurality of semiconductor devices arranged in parallel are provided with a high thermal conductivity adhesive, and the high thermal conductivity adhesive holds at least adjacent semiconductor devices to each other. By doing so, the heat generated in the semiconductor device can be conducted to the holder and the cap through the high thermal conductive adhesive, and the heat dissipation of the semiconductor device can be improved. Further, it becomes possible to securely hold the semiconductor devices arranged in parallel.

According to the twenty-second aspect of the present invention, by using a member having thermoplasticity as the high thermal conductive adhesive, one of a plurality of semiconductor devices housed in the semiconductor device unit can be used. Even if a failure occurs in the semiconductor device, the high thermal conductivity adhesive is softened by heating the high thermal conductivity adhesive to the thermoplastic temperature, and the defective semiconductor device can be replaced with a normal semiconductor device. Become. Further, at the thermoplastic temperature or lower, a plurality of high thermal conductive adhesives hold the semiconductor devices arranged in parallel.

According to the twenty-third aspect of the present invention, since the grease of silicon type is used as the high thermal conductive adhesive, the semiconductor device which has failed without applying a heat load to the semiconductor device unit can be used as a normal semiconductor device. Can be exchanged for. Even if the connection leads of the semiconductor device have variations in manufacturing, by displacing the semiconductor device up and down in the silicon-based grease, the connection leads can be reliably brought into contact with the mounting board. It is possible to prevent the occurrence of connection failure due to the above variations.

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a perspective view for explaining a semiconductor device that is a second embodiment of the present invention.

FIG. 3 is a perspective view for explaining a semiconductor device that is a third embodiment of the present invention.

FIG. 4 is a perspective view for explaining a semiconductor device that is a fourth embodiment of the present invention.

FIG. 5 is a sectional view illustrating a semiconductor device unit according to a fifth embodiment of the present invention.

FIG. 6 is a schematic configuration diagram for explaining a semiconductor device unit that is a fifth embodiment of the present invention.

FIG. 7 is an enlarged perspective view showing a holder used in a semiconductor device unit according to a fifth embodiment of the present invention.

FIG. 8 is a perspective view showing a holder which is a first modified example of the holder used in the semiconductor device unit which is the fifth embodiment of the present invention.

FIG. 9 is a perspective view showing a holder which is a second modification of the holder used in the semiconductor device unit which is the fifth embodiment of the present invention.

FIG. 10 is a perspective view showing a holder which is a third modification of the holder used in the semiconductor device unit which is the fifth embodiment of the present invention.

FIG. 11 is a perspective view showing a holder which is a fourth modified example of the holder used in the semiconductor device unit which is the fifth embodiment of the present invention.

FIG. 12 is a perspective view showing a holder which is a fifth modification of the holder used in the semiconductor device unit which is the fifth embodiment of the present invention.

FIG. 13 is a perspective view showing a holder which is a sixth modification of the holder used in the semiconductor device unit which is the fifth embodiment of the present invention.

FIG. 14 is an enlarged perspective view showing a cap used in a semiconductor device unit according to a fifth embodiment of the present invention.

FIG. 15 is an enlarged perspective view showing a cap attached to a holder according to a first modification.

FIG. 16 is a diagram for explaining the function of the holes provided in the semiconductor device according to the second embodiment of the present invention.

FIG. 17 is a sectional view illustrating a semiconductor device according to a sixth embodiment of the present invention.

FIG. 18 is a schematic configuration diagram for explaining a semiconductor device unit that is a seventh embodiment of the present invention.

FIG. 19 is a schematic configuration diagram for explaining a semiconductor device unit that is an eighth embodiment of the present invention.

FIG. 20 is a schematic configuration diagram for explaining a semiconductor device unit that is a ninth embodiment of the present invention.

FIG. 21 is a diagram showing a state in which a defective semiconductor device is replaced in the semiconductor device unit according to the ninth embodiment of the present invention.

FIG. 22 is a schematic configuration diagram for explaining a semiconductor device unit that is a tenth embodiment of the present invention.

FIG. 23 is a diagram for explaining a method of correcting a height error in a semiconductor device unit which is a tenth embodiment of the present invention.

FIG. 24 is a schematic configuration diagram for explaining a semiconductor device and a semiconductor device unit that are an eleventh embodiment of the present invention.

FIG. 25 is a diagram showing a semiconductor device which is a modification of the semiconductor device according to the sixth embodiment.

FIG. 26 is a diagram for explaining a semiconductor device according to a twelfth embodiment of the present invention.

FIG. 27 is a diagram for explaining effects of the semiconductor device according to the twelfth embodiment of the present invention.

FIG. 28 is a perspective view showing an example of a conventional semiconductor device.

FIG. 29 is a diagram for explaining a semiconductor device unit which is an example of the related art.

FIG. 30 is a diagram for explaining a semiconductor device unit which is an example of the related art.

[Explanation of symbols]

10, 20, 30, 40, 90, 140, 160 Semiconductor device 11, 141 Mounting board 12 Semiconductor chip 13 Stage 13a Mounting surface 13b Exposed surface 14, 143, 166 Lead 15 Resin package 15a Lower surface 15b Upper surface 15c to 15f Side surface 17, 91 Upper extension part 17a Bent part 21 Hole part 22 Extraction jig 31 Heat dissipation groove 41,42 Side extension part 50,100,110,120,130,145,16
5 Semiconductor device units 51, 55, 60, 65, 70, 75, 80, 101
Holder 52,57 Cap 53 Upper opening 56 Cap mounting groove 58 Sliding claw 61 Radiating fins 66,73,74 Holding groove 71,72 Holder half body 77 Engaging claw 92,93 Upright part 94 Positioning insertion part 95,96 Positioning Hole 102 Upper surface part 111, 112 Positioning shaft 121 Adhesive 131 Grease 142 Holding part 146 Recess 147 Board side electrode 150 Resin engagement hole 151 Resin engagement recess

[Procedure amendment]

[Submission date] September 28, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 11

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Change

[Correction content]

Further, the invention of claim 10 is characterized in that the shape of the portion of the connection lead extending below the resin package is substantially L-shaped. Further, in the invention of claim 11, it is characterized in that it has a linear shape shape of the connection lead.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0033

[Correction method] Change

[Correction content]

Further, according to the invention of claim 11, by which a straight line shape shape of the connecting leads, for the thickness of the entire connecting leads can be made smaller than the thickness of the resin package, It is possible to prevent the density of the connection leads from being hindered by the shape of the connection leads. Well
In addition, the connection lead can be easily formed. According to the twelfth aspect of the invention, a plurality of semiconductor devices can be supported by the holder in a state of being arranged side by side, and the heat generated by the semiconductor chip that conducts heat through the resin package is the semiconductor device. Is stored in the holder, it conducts heat to the holder and is dissipated. Since the shape of the holder is larger than that of each semiconductor device, the holder has a large contact area with the outside air, so that heat can be efficiently radiated. Furthermore, the semiconductor device can also dissipate heat through the upper opening.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0103

[Correction method] Change

[Correction content]

That is, as shown in FIG. 27, when the thickness dimension H1 of the resin package 15 is smaller than the length H2 of the bent portion of the lead 14 (H1 <H2), the lead 1
The four bent portions 14c collide with each other, and the semiconductor devices cannot be arranged close to each other. However, by making the shape of the lead 166 linear as in the present embodiment, the thickness dimension of the lead 166 as a whole can be made smaller than the thickness dimension of the resin package 15. It is possible to prevent the oxidization from being inhibited. Therefore, it is possible to reduce the size of the semiconductor device unit 165 formed by arranging the above-configured semiconductor devices 160 in parallel. Change
In addition, since the lead 166 has a linear shape,
The formation of 166 can be performed easily.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0110

[Correction method] Change

[Correction content]

According to the eleventh aspect of the present invention, since the shape of the portion of the connection lead extending below the resin package is linear, the overall thickness of the connection lead is the thickness of the resin package. Since the size can be made smaller than the size, it is possible to prevent the density of the connection lead from being hindered from being increased. Also, the connection lead
It can be easily formed. According to the twelfth aspect of the invention, a plurality of semiconductor devices can be supported by the holder in a state of being arranged side by side, and the heat generated by the semiconductor chip that conducts heat through the resin package is the semiconductor device. Is stored in the holder, it conducts heat to the holder and is dissipated. Since the shape of the holder is larger than that of each semiconductor device, the holder has a large contact area with the outside air, so that heat can be efficiently radiated. Furthermore, the semiconductor device can also dissipate heat through the upper opening.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsuhiro Hayashida 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor, Kosuke Okita, 1015 Kamitadanaka, Nakahara-ku, Kawasaki, Kanagawa Prefecture Fujitsu Limited (72) Inventor Tetsuya Fujisawa 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited

Claims (23)

[Claims] 1. A semiconductor chip, a stage on which the semiconductor chip is mounted, a resin package for encapsulating the semiconductor chip, a resin package arranged in a line, one end of which is connected to the semiconductor chip, and the other. What is claimed is: 1. A semiconductor device comprising a plurality of connection leads whose ends extend below the resin package, and which is mounted on a mounting substrate in a substantially upright state. A semiconductor device, comprising: an upwardly extending portion that extends. 2. The semiconductor device according to claim 1, wherein a rear surface of the stage with respect to a surface on which the semiconductor chip is mounted is exposed to the outside from the resin package. 3. The method according to claim 1, wherein a hole is formed in the upward extending portion provided on the stage.
13. The semiconductor device according to claim 1. 4. The semiconductor device according to claim 1, wherein the stage is formed with a laterally extending portion that laterally extends from a side surface of the resin package. . 5. The semiconductor device according to claim 1, wherein an adhesiveness improving portion for improving adhesiveness with the resin package is formed on the stage. 6. The semiconductor device according to claim 1, wherein a groove for heat dissipation is formed in the resin package. 7. A pair of upright portions are formed upright on both sides of the stage, and a positioning fitting portion is formed between the pair of upright portions. 7. The semiconductor device according to any one of items 6 to 6. 8. The semiconductor device according to claim 7, wherein a positioning hole is formed in the upright portion. 9. The semiconductor device according to claim 1, wherein a portion of the connection lead, which extends below the resin package, is held by the resin package. 10. The semiconductor device according to claim 1, wherein the shape of the portion of the connection lead extending below the resin package is substantially L-shaped. 11. The semiconductor device according to claim 1, wherein the shape of a portion of the connection lead extending below the resin package is a linear shape. 12. A structure comprising: the semiconductor device according to claim 1; and a holder having an opening in an upper portion and accommodating therein a plurality of the semiconductor devices arranged in parallel. A semiconductor device unit characterized by the above. 13. The semiconductor device according to claim 12, further comprising a cap that closes the opening of the holder and that is in contact with an upward extending portion formed in the semiconductor device in the closed state. Equipment unit. 14. The semiconductor device unit according to claim 12, wherein the holder and the cap are formed by using a material having a good thermal conductivity. 15. The semiconductor device unit according to claim 12, wherein a holding mechanism that engages with the semiconductor device and holds the semiconductor device is provided inside the holder. 16. The semiconductor device unit according to claim 12, wherein a radiation fin is provided on an outer wall portion of the holder. 17. The holder is formed with an engaging claw portion which holds the semiconductor device by engaging with a lower surface of a resin package which constitutes the semiconductor device. The semiconductor device unit according to any one of 1. 18. The semiconductor device unit according to claim 13, further comprising a radiation fin provided on an upper surface of the cap. 19. A semiconductor device according to claim 7, a top surface portion, and side surface portions formed on both sides of the top surface portion, the top surface portion being a positioning fitting portion formed in the semiconductor device. A plurality of the semiconductor devices are collectively positioned by being fitted in the holder, and the holder is formed by uniting the plurality of the semiconductor devices by sandwiching the plurality of the semiconductor devices arranged in parallel by the side surface portion. A semiconductor device unit having the above structure. 20. The semiconductor device according to claim 8, and a plurality of the semiconductor devices are collectively positioned by being fitted in a positioning hole formed in an upright portion provided in the semiconductor device, and the semiconductor device is also mounted. A semiconductor device unit, comprising: a positioning shaft for unitizing a plurality of the semiconductor devices by fixing the plurality of devices arranged in parallel. 21. The semiconductor device unit according to claim 12, wherein a plurality of the semiconductor devices arranged in parallel are provided with a high thermal conductive adhesive, and at least the high thermal conductive adhesive is used to make at least the two adjacent semiconductor devices. A semiconductor device unit having a structure in which the semiconductor devices are held together. 22. The semiconductor device unit according to claim 21, wherein a member having thermoplasticity is used as the high thermal conductive adhesive. 23. The semiconductor device unit according to claim 21, wherein silicon-based grease is used as the high thermal conductive adhesive.