JPH0811167A - Injection mold - Google Patents
Injection moldInfo
- Publication number
- JPH0811167A JPH0811167A JP15084594A JP15084594A JPH0811167A JP H0811167 A JPH0811167 A JP H0811167A JP 15084594 A JP15084594 A JP 15084594A JP 15084594 A JP15084594 A JP 15084594A JP H0811167 A JPH0811167 A JP H0811167A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- injection
- mold
- nozzles
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002347 injection Methods 0.000 title claims abstract description 20
- 239000007924 injection Substances 0.000 title claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims abstract description 22
- 239000012778 molding material Substances 0.000 claims abstract description 16
- 238000001746 injection moulding Methods 0.000 claims description 24
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 238000005299 abrasion Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009760 electrical discharge machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 238000009694 cold isostatic pressing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000001513 hot isostatic pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C2045/272—Part of the nozzle, bushing or runner in contact with the injected material being made from ceramic material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂、セラミック粒子
と樹脂との混合材、あるいはガラスと樹脂との混合材な
どを型内に射出するためのノズルを備えた射出成形用金
型に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an injection molding die provided with a nozzle for injecting a resin, a mixed material of ceramic particles and resin, a mixed material of glass and resin, or the like into a mold. Is.
【０００２】[0002]
【従来の技術】従来より、樹脂、セラミック粒子と樹脂
との混合材、あるいはガラスと樹脂との混合材などを所
定形状に成形する方法の一つとして射出成形法が用いら
れ、様々な分野で広く使用されている。2. Description of the Related Art Conventionally, injection molding has been used as one of the methods for molding a resin, a mixed material of ceramic particles and resin, or a mixed material of glass and resin into a predetermined shape. Widely used.
【０００３】例えば、樹脂封止型半導体パッケージのモ
ールド工程においては、図１に示すように、複数の凹状
型６と、これに連通する噴射口１ａを備えたノズル１を
備えた射出成形用金型５が用いられており、上記金型５
に刻設された複数の凹状型６にそれぞれＩＣ８を搭載し
た基板７を配置したあと、熱可塑性樹脂中にガラスを含
有したモールド材を射出成形機（不図示）により加熱流
動化して上記ノズル１に供給し、該ノズル１の噴射口１
ａからモールド材を凹状型６内に射出することで、ＩＣ
８を封止していた。For example, in a molding process of a resin-sealed type semiconductor package, as shown in FIG. 1, an injection molding metal having a plurality of concave molds 6 and a nozzle 1 having an injection port 1a communicating therewith. The mold 5 is used, and the mold 5 is used.
After arranging the substrates 7 on which the ICs 8 are mounted respectively in a plurality of concave molds 6 engraved in the above, a molding material containing glass in a thermoplastic resin is heated and fluidized by an injection molding machine (not shown) to make the nozzle 1 To the injection port 1 of the nozzle 1.
By injecting the molding material into the concave mold 6 from a, the IC
8 was sealed.
【０００４】また、上記ノズル１は、効率良くモールド
材を金型５の凹状型６内に射出させるために、深溝のポ
ット部１ｃと、浅溝のランナー部１ｂから構成され、複
雑なノズル形状をしたものとなっていた。その為、前記
ノズル１はＷＣを主成分とする焼結合金である超硬合金
により形成され、放電加工によりランナー部１ｂ及びポ
ット部１ｃを加工していた。Further, the nozzle 1 is composed of a deep groove pot portion 1c and a shallow groove runner portion 1b in order to efficiently inject the molding material into the concave die 6 of the die 5, and has a complicated nozzle shape. It was supposed to be. Therefore, the nozzle 1 is formed of cemented carbide, which is a sintered alloy containing WC as a main component, and the runner portion 1b and the pot portion 1c are processed by electric discharge machining.
【０００５】[0005]
【発明が解決しようとする課題】ところが、上記モール
ド材は、熱可塑性樹脂中にガラスを混合したものである
ことから、上記超硬合金からなるノズル１であっても、
硬度が不充分であった。その為、ノズル１のランナー部
１ｂ及び噴射口１ａが短期間で摩耗し、頻繁に交換しな
ければならなかった。しかも、噴射口１ａ等が摩耗した
ノズル１をそのまま使用するとモールド成形体にバリを
生じてしまうことから、バリ取りをしなければならず、
作業工程が増えて作業効率が非常に悪く、また、モール
ド成形体のバリ取りをせずにいると、搬送時や位置決め
時に支障をきたすなどの不都合を生じていた。However, since the molding material is a mixture of glass in the thermoplastic resin, even the nozzle 1 made of the above cemented carbide,
The hardness was insufficient. Therefore, the runner portion 1b and the injection port 1a of the nozzle 1 were worn in a short period of time and had to be replaced frequently. Moreover, if the nozzle 1 in which the injection port 1a or the like is worn is used as it is, burrs are generated in the molded body, and therefore burrs must be removed.
The number of working steps is increased and the working efficiency is very poor. Further, if the demolding of the molded body is not carried out, there are inconveniences such as troubles during transportation and positioning.
【０００６】さらに、金型５は一般的に鋼材で形成され
ており、超硬合金（ＷＣ）製のノズル１は金型５よりも
熱伝導率が高いため、ノズル１の熱が金型５に奪われて
しまうという問題があった。その為、成形中にノズル１
の温度が低下し、ノズル１内に溜まっている樹脂が凝固
し、モールド材を円滑に射出できないばかりか、凝固し
た、あるいは凝固し始めたモールド材が無理に金型５の
凹状型６に射出されるとフローマークが発生し、歩留り
が上がらないといった問題もあった。Further, since the die 5 is generally made of steel and the nozzle 1 made of cemented carbide (WC) has a higher thermal conductivity than the die 5, the heat of the nozzle 1 is generated by the die 5. There was a problem of being robbed by. Therefore, the nozzle 1
Temperature decreases, the resin accumulated in the nozzle 1 solidifies, and the molding material cannot be injected smoothly. In addition, the solidified or starting solidified molding material is forcedly injected into the concave mold 6 of the mold 5. Then, flow marks are generated, and there is a problem that the yield does not increase.
【０００７】本発明の目的は、放電加工が可能で、耐摩
耗性に優れるとともに、高い蓄熱性を有するノズルを備
えた射出成形用金型を提供することにある。An object of the present invention is to provide an injection molding die which is capable of electric discharge machining, has excellent wear resistance, and has a nozzle having a high heat storage property.
【０００８】[0008]
【課題を解決するための手段】そこで、本発明では上記
問題に鑑み、射出成形用金型に備えるノズルの少なくと
も先端部をＡｌ2 Ｏ3 −ＴｉＣ系セラミックスにより形
成したものである。In view of the above problems, therefore, in the present invention, at least the tip of the nozzle provided in the injection molding die is formed of Al 2 O 3 --TiC ceramics.
【０００９】[0009]
【実施例】以下、本発明実施例を樹脂封止型半導体パッ
ケージのモールド工程に使用する射出成形用金型を例に
とって説明する。Embodiments of the present invention will be described below with reference to an injection molding die used in a molding process of a resin-sealed semiconductor package.
【００１０】図１は本発明に係る射出成形用金型５を示
す斜視図であり、図２は図１のノズル１のみを拡大した
斜視図である。FIG. 1 is a perspective view showing an injection molding die 5 according to the present invention, and FIG. 2 is an enlarged perspective view of only the nozzle 1 of FIG.
【００１１】図１に示す射出成形用金型５は、ブロック
体の表面に刻設した複数の凹状型６と、これに連通する
噴射口１ａを備えたノズル１とから構成してあり、上記
ノズル１は脱着可能としてある。そして、上記金型５の
凹状型６にそれぞれＩＣ８を搭載した基板７を配置した
あと、熱可塑性樹脂中にガラスを含有したモールド材を
射出成形機（不図示）により加熱流動化して上記ノズル
１に供給し、該ノズル１の噴射口１ａからモールド材を
凹状型６内に射出することで、ＩＣ８を封止するように
なっている。The injection molding die 5 shown in FIG. 1 is composed of a plurality of concave molds 6 engraved on the surface of the block body and a nozzle 1 having an injection port 1a communicating therewith. The nozzle 1 is removable. Then, after disposing the substrates 7 on which the ICs 8 are mounted in the concave molds 6 of the mold 5, the molding material containing glass in the thermoplastic resin is heated and fluidized by an injection molding machine (not shown) to make the nozzle 1 And the molding material is injected into the concave mold 6 from the ejection port 1a of the nozzle 1 to seal the IC 8.
【００１２】また、前記ノズル１は、全体を耐摩耗性に
優れ、導電性を有するＡｌ2 Ｏ3 −ＴｉＣ系セラミック
スにより形成するとともに、その表面に深溝のポット部
１ｃと、該ポット部１ｃに連通する浅溝のランナー部１
ｂからなるノズル溝を形成してあり、前記射出成形機
（不図示）より供給されたモールド材をノズル１のポッ
ト部１ｃで一旦溜め、ランナー部１ｂで射出量を調整し
て噴射口１ａより射出するようにしてあるため、モール
ド材を効率良く射出できる。The nozzle 1 is entirely made of Al 2 O 3 -TiC ceramics having excellent wear resistance and conductivity, and has a deep groove pot portion 1c on the surface thereof and the pot portion 1c. Shallow groove runner part 1 communicating
b, a nozzle groove is formed, and the molding material supplied from the injection molding machine (not shown) is temporarily stored in the pot portion 1c of the nozzle 1 and the injection amount is adjusted by the runner portion 1b to adjust the injection amount from the injection port 1a. Since injection is performed, the molding material can be injected efficiently.
【００１３】なお、図１に示す射出成形用金型５はノズ
ル１を脱着可能としてあるが、一体構造としても良く、
また、ノズル１は、全体をＡｌ2 Ｏ3 −ＴｉＣ系セラミ
ックスにより形成してあるが、少なくとも先端部を構成
する噴射口１ａ及びランナー部１ｂをＡｌ2 Ｏ3 −Ｔｉ
Ｃ系セラミックスにより形成してあれば良い。Although the injection molding die 5 shown in FIG. 1 has the nozzle 1 detachable, it may have an integral structure.
Further, the nozzle 1 is entirely formed of Al 2 O 3 —TiC ceramics, but at least the injection port 1 a and the runner part 1 b forming the tip portion are made of Al 2 O 3 —Ti.
It may be made of C-based ceramics.
【００１４】ところで、上記ノズル１を構成するＡｌ2
Ｏ3 −ＴｉＣ系セラミックスとは、Ａｌ2 Ｏ3 及びＴｉ
Ｃを主成分とし、焼結助剤としてＴｉＯ2 、ＭｇＯ、Ｓ
ｉＯ2 、ＣａＯ、ＺｒＯ2 、Ｙｂ2 Ｏ3 のうち少なくと
も一種以上を含有したものである。By the way, Al 2 constituting the nozzle 1 is
O 3 The -TiC ceramics, Al 2 O 3 and Ti
C as a main component and TiO 2 , MgO, S as a sintering aid
It contains at least one or more of iO 2 , CaO, ZrO 2 , and Yb 2 O 3 .
【００１５】上記主成分であるＡｌ2 Ｏ3 及びＴｉＣ
は、合計１００重量％のうちＡｌ2 Ｏ3 を２０〜８０重
量％の範囲で、且つＴｉＣを８０〜２０重量％の範囲で
含有してある。これは、Ａｌ2 Ｏ3 の含有量が２０重量
％より少ないと焼結性が悪化するためであり、逆にＡｌ
2 Ｏ3 の含有量が８０重量％より多くなると高硬度、及
び導電性などの特性が得られなくなるためである。Al 2 O 3 and TiC which are the main components
Contains 100% by weight of Al 2 O 3 in the range of 20 to 80% by weight and TiC in the range of 80 to 20% by weight. This is because if the content of Al 2 O 3 is less than 20% by weight, the sinterability deteriorates.
This is because when the content of 2 O 3 exceeds 80% by weight, characteristics such as high hardness and conductivity cannot be obtained.
【００１６】また、上記焼結助剤は、主成分１００重量
％に対し７重量％以下の範囲で含有することが重要であ
り、この範囲で上記焼結助剤を添加すれば焼結性を高め
ることができる。特に、ＺｒＯ2 は粒子抑制作用がある
とともに、靱性を高める作用があるため、高強度で、且
つ高靱性を有するＡｌ2 Ｏ3 −ＴｉＣ系セラミックスを
得ることができる。It is important that the sintering aid is contained in the range of 7% by weight or less based on 100% by weight of the main component. If the sintering aid is added in this range, the sinterability is improved. Can be increased. In particular, ZrO 2 has an effect of suppressing particles and an effect of increasing toughness, so that an Al 2 O 3 —TiC based ceramics having high strength and high toughness can be obtained.
【００１７】なお、本発明のＡｌ2 Ｏ3 −ＴｉＣ系セラ
ミックスには、上記主成分及び焼結助剤の他に希土類酸
化物や不可避不純物を合計３重量％以下の範囲で含有し
ていても良い。The Al 2 O 3 —TiC ceramics of the present invention may contain rare earth oxides and inevitable impurities in a total amount of 3% by weight or less in addition to the above main component and sintering aid. good.
【００１８】このような組成を有するＡｌ2 Ｏ3 −Ｔｉ
Ｃ系セラミックスは、ビッカース硬度が１７〜２１ＧＰ
ａで、且つ曲げ強度が５２０〜８５０ＭＰａと非常に優
れた機械的強度を有するとともに、体積固有抵抗値が１
０-2〜１０-6Ω・ｃｍと導電性を有しているため、放電
加工を施すことができる。その為、図２に示すような複
雑なノズル形状を有するノズル１でも容易に加工するこ
とができる。Al 2 O 3 --Ti having such a composition
C-based ceramics have Vickers hardness of 17-21 GP
a, the bending strength is 520 to 850 MPa and the mechanical strength is very excellent, and the volume resistivity value is 1
Since it has a conductivity of 0 −2 to 10 −6 Ω · cm, it can be subjected to electrical discharge machining. Therefore, even the nozzle 1 having a complicated nozzle shape as shown in FIG. 2 can be easily processed.
【００１９】また、上記組成を有するＡｌ2 Ｏ3 −Ｔｉ
Ｃ系セラミックスの熱伝導率は２０〜２５Ｗ／ｍ・ｋで
あり、鋼材に比べ熱伝導率が低いことから、加熱流動化
されたモールド材の熱を蓄熱しておくことができ、上記
熱が金型５に奪われることもないため、ノズル１の溝内
に溜まっている樹脂を凝固させることがなく、また、モ
ールド成形体にフローマークを生じることもない。Al 2 O 3 --Ti having the above composition
Since the thermal conductivity of C-based ceramics is 20 to 25 W / m · k, which is lower than that of steel material, the heat of the heat-fluidized molding material can be stored. Since it is not taken away by the mold 5, the resin accumulated in the groove of the nozzle 1 is not solidified, and no flow mark is generated in the molded body.
【００２０】さらに、ノズル１の噴射口１ａ近傍に摩耗
やチッピングを生じるとモールド成形体にバリを生じて
しまうことから、耐摩耗性及び耐チッピング性を高める
ために、上記Ａｌ2 Ｏ3 −ＴｉＣ系セラミックスの気孔
率は０．５％以下、好ましくは０．１％以下とする。Further, if wear or chipping occurs in the vicinity of the injection port 1a of the nozzle 1, burr will be generated in the molded body. Therefore, in order to improve wear resistance and chipping resistance, the above Al 2 O 3 --TiC is used. The porosity of the ceramics is 0.5% or less, preferably 0.1% or less.
【００２１】次に、図２に示すノズル１の製造方法を説
明する。Next, a method of manufacturing the nozzle 1 shown in FIG. 2 will be described.
【００２２】まず、平均粒子径が１０μｍ以下で、且つ
純度が９０％以上のＡｌ2 Ｏ3 粉末とＴｉＣ粉末とをそ
れぞれ用意し、さらに焼結助剤としてＴｉＯ2 、Ｍｇ
Ｏ、ＳｉＯ2 、ＣａＯ、ＺｒＯ2 、Ｙｂ2 Ｏ3 のうち少
なくとも一種以上を添加したあと、高純度のＡｌ2 Ｏ3
やＺｒＯ2 、あるいはＳｉＣからなる粉砕ボールを用い
て、原料粉末が均一で粒度が１０μｍ以下、平均粒子径
１μｍ以下になるまで粉砕して２次原料を作製する。得
られた２次原料は黒鉛製の金型内に充填し、真空中また
はアルゴン、ヘリウム、一酸化炭素などの中性あるいは
還元性雰囲気下にてホットプレスを行うか、あるいは上
記２次原料を冷間静水圧プレス（ＣＩＰ）により成形し
たあと、常圧または減圧下において焼成温度１３００〜
２０００℃で１〜５時間程度焼成することにより直方体
をしたセラミック体を成形する。なお、一度焼成したあ
と、さらに熱間静水圧プレス（ＨＩＰ）処理を施しても
良い。次に、上記セラミック体に放電加工を施してポッ
ト部１ｃとランナー部１ｂからなるノズル溝を形成すれ
ば図２に示すノズル１を形成することができる。First, Al 2 O 3 powder and TiC powder having an average particle diameter of 10 μm or less and a purity of 90% or more are prepared, and TiO 2 and Mg as sintering aids are prepared.
After adding at least one of O, SiO 2 , CaO, ZrO 2 , and Yb 2 O 3 , high-purity Al 2 O 3
Using a crushing ball made of ZrO 2 or SiC, the raw material powder is crushed to a uniform particle size of 10 μm or less and an average particle size of 1 μm or less to produce a secondary raw material. The obtained secondary raw material is filled in a graphite mold and hot-pressed in vacuum or in a neutral or reducing atmosphere such as argon, helium, carbon monoxide, or the above-mentioned secondary raw material is used. After molding by cold isostatic pressing (CIP), the firing temperature is 1300 to 300 at normal pressure or reduced pressure.
A ceramic body having a rectangular parallelepiped shape is formed by firing at 2000 ° C. for about 1 to 5 hours. It should be noted that, after firing once, hot isostatic pressing (HIP) may be further performed. Next, the above-mentioned ceramic body is subjected to electric discharge machining to form a nozzle groove consisting of the pot portion 1c and the runner portion 1b, whereby the nozzle 1 shown in FIG. 2 can be formed.
【００２３】なお、以上の実施例では、樹脂封止型半導
体パッケージのモールド工程に使用する射出成形用金型
５のノズル１について示したが、この他に先端に噴射口
を備えた円筒状のノズルなどにも本発明を適用すること
ができ、この場合、先端が閉じた円筒体を形成したあ
と、先端部に放電加工を施して噴射口を穿設すれば良
い。In the above embodiment, the nozzle 1 of the injection molding die 5 used in the molding process of the resin-sealed semiconductor package is shown, but in addition to this, the nozzle 1 has a cylindrical shape having an injection port at its tip. The present invention can also be applied to a nozzle or the like. In this case, after forming a cylindrical body with a closed tip, electrical discharge machining may be performed on the tip to form an injection port.
【００２４】このように、ノズル１をＡｌ2 Ｏ3 −Ｔｉ
Ｃ系セラミックスにより形成すれば、どのような複雑な
形状をしたノズル１でも容易に製造することができ、こ
のノズル１を金型に組み込めば、長期にわたり使用でき
る射出成形用金型５を得ることができる。In this way, the nozzle 1 is set to Al 2 O 3 --Ti.
If it is made of C-based ceramics, it is possible to easily manufacture a nozzle 1 having any complicated shape, and if this nozzle 1 is incorporated into a mold, it is possible to obtain an injection molding mold 5 that can be used for a long period of time. You can
【００２５】（実験例）本発明に係るＡｌ2 Ｏ3 −Ｔｉ
Ｃ系セラミック製のノズル１と、比較例として超硬合
金、及びＴｉＣを主成分とするサーメットからなるノズ
ル１をそれぞれ１０個ずつ用意し、図２に示す射出成形
用金型５を用いてモールド成形体を成形した時のバリ発
生回数を確認した。(Experimental example) Al 2 O 3 --Ti according to the present invention
10 nozzles 1 each made of C ceramics and 10 nozzles 1 made of cermet mainly composed of cemented carbide and TiC as a comparative example were prepared and molded using the injection molding die 5 shown in FIG. The number of burrs generated when the molded body was molded was confirmed.
【００２６】なお、各試料の組成及び特性は表１に示す
通りである。The composition and characteristics of each sample are shown in Table 1.
【００２７】また、測定条件としては成形圧１４０ｋｇ
／ｃｍ2 、射出温度２５０℃の条件で行い、モールド材
としてエポキシ樹脂を主成分とし、溶融シリカを含有し
た熱可塑性樹脂を用いた。そして、それぞれのノズル１
を用いて連続射出成形を行い、モールド成形体のバリの
発生状況を調べた。As the measurement conditions, the molding pressure is 140 kg.
/ Cm 2 and the injection temperature was 250 ° C., and a thermoplastic resin containing epoxy resin as a main component and fused silica was used as a molding material. And each nozzle 1
Was used for continuous injection molding to examine the occurrence of burrs on the molded body.
【００２８】結果は表２に示す通りである。The results are shown in Table 2.
【００２９】[0029]
【表１】 [Table 1]
【００３０】[0030]
【表２】 [Table 2]
【００３１】これらの結果より判るように、試料Ｎｏ．
５の超硬合金製ノズル１を備えた射出成形用金型５は、
ノズル１の硬度が低いために４万ショット後にモールド
成形体にバリを生じた。また、試料Ｎｏ．４のサーメッ
ト製ノズル１を備えた射出成形用金型５は、５万ショッ
ト程度でバリを生じた。なお、一般的に６万ショットで
もバリを生じないものが求められているが、これらの比
較例では上記基準値を満足しなかった。As can be seen from these results, the sample No.
The injection molding die 5 having the cemented carbide nozzle 1 of 5 is
Due to the low hardness of the nozzle 1, burrs were formed on the molded body after 40,000 shots. In addition, the sample No. The injection molding die 5 having the cermet nozzle 1 of No. 4 produced burrs after about 50,000 shots. Incidentally, although it is generally required that burrs do not occur even after 60,000 shots, the above reference values were not satisfied in these comparative examples.
【００３２】これに対し、本発明実施例である試料Ｎ
ｏ．１〜３のＡｌ2 Ｏ3 −ＴｉＣ系セラミック製のノズ
ル１を備えた射出成形用金型５は、ノズル１の硬度が１
８．５ＧＰａ以上と非常に高い硬度を有しているため、
基準値を大きく満足し、９万ショット程度までモールド
成形体にバリの発生がなかった。On the other hand, sample N which is an example of the present invention
o. The injection molding die 5 including the nozzles 1 made of Al 2 O 3 —TiC ceramics 1 to 3 has a hardness of 1 for the nozzles 1.
Since it has a very high hardness of 8.5 GPa or more,
The standard value was largely satisfied, and no burr was generated on the molded body up to about 90,000 shots.
【００３３】[0033]
【発明の効果】以上のように、本発明は、射出成形用金
型に備えるノズルの少なくとも先端部をＡｌ2 Ｏ3 −Ｔ
ｉＣ系セラミックスにより形成したことにより、長期使
用においても、ノズルの噴射口に摩耗やチッピングを生
じることがないため、モールド成形体にバリを生じるこ
とがない。しかも、金型を構成する材質に比べ熱伝導率
が小さいため、金型に熱を奪われることがない。その
為、ノズル内に溜めてあるモールド材を凝固させること
がなく、モールド成形体にフローマークを生じることも
ない。その為、上記ノズルを備えた本発明の射出成形用
金型を用いれば、長期間にわたって良好にモールド成形
を行うことができる。As described above, according to the present invention, at least the tip of the nozzle provided in the injection molding die is made of Al 2 O 3 -T.
Since the iC ceramics is used, even if it is used for a long period of time, the injection port of the nozzle is not worn or chipped, so that the molded body is not burred. Moreover, since the thermal conductivity is smaller than that of the material forming the mold, heat is not taken by the mold. Therefore, the molding material accumulated in the nozzle is not solidified, and flow marks are not generated in the molded body. Therefore, by using the injection-molding die of the present invention having the above-mentioned nozzle, it is possible to perform favorable molding for a long period of time.
【図１】本発明に係る射出成形用金型の一例を示す斜視
図である。FIG. 1 is a perspective view showing an example of an injection molding die according to the present invention.
【図２】図１に示すノズルのみを拡大した斜視図であ
る。FIG. 2 is an enlarged perspective view of only the nozzle shown in FIG.
１ ：ノズル １ａ：噴射口 １ｂ：ランナー部 １ｃ：ポット部 ５ ：射出成形用金型 ６ ：凹状型 1: Nozzle 1a: Injection port 1b: Runner part 1c: Pot part 5: Mold for injection molding 6: Concave mold
Claims (1)
混合材、あるいはガラスと樹脂との混合材などからなる
モールド材を射出するためのノズルを備えた射出成形用
金型において、上記ノズルの少なくとも先端部をＡｌ2
Ｏ3 −ＴｉＣ系セラミックスにより形成したことを特徴
とする射出成形用金型。1. A mold for injection molding comprising a nozzle for injecting a molding material made of a resin, a mixed material of ceramic particles and resin, a mixed material of glass and resin, or the like in a mold. At least the tip of the nozzle is Al 2
O 3 injection mold, characterized in that formed by -TiC ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15084594A JP3405598B2 (en) | 1994-07-01 | 1994-07-01 | Injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15084594A JP3405598B2 (en) | 1994-07-01 | 1994-07-01 | Injection mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0811167A true JPH0811167A (en) | 1996-01-16 |
| JP3405598B2 JP3405598B2 (en) | 2003-05-12 |
Family
ID=15505641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15084594A Expired - Fee Related JP3405598B2 (en) | 1994-07-01 | 1994-07-01 | Injection mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3405598B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108724620A (en) * | 2017-04-14 | 2018-11-02 | 芬可乐父子公司 | Economy plastic processing tool core for mold and die set |
-
1994
- 1994-07-01 JP JP15084594A patent/JP3405598B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108724620A (en) * | 2017-04-14 | 2018-11-02 | 芬可乐父子公司 | Economy plastic processing tool core for mold and die set |
| CN108724620B (en) * | 2017-04-14 | 2022-09-16 | 芬可乐父子公司 | Economical plastic tooling core for mold and die sets |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3405598B2 (en) | 2003-05-12 |
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