JPH08111582A - Surface roughening method of adherend - Google Patents

Abstract

PURPOSE: To enhance the surface of an adherent which is bonded to adhesive agent in contact area between them by a method wherein large irregularities are formed on the surface of the adherent with abrasive material large in particle size through a first surface-roughening operation, and then fine irregularities are formed on the roughened surface of the adherent by the use of abrasive material fine in particle size through a second surface-roughening operation. CONSTITUTION: When a copper material 1 is bonded by prepreg, a first surface- roughening operation is performed onto the bond surface of the copper material 1 for one second by the use of alumina abrasive material of grain size #60 with a discharge pressure of 2.5g/cm<2> to make the bond surface 1a of the copper material 1 much roughened and corrugated. Then, a second surface-roughening operation is performed for one second by the use of alumina abrasive material of grain size #220 with a discharge pressure of 2.2kg/cm<2> , and a discharge pressure and a processing time are controlled, whereby fine irregularities are formed on large irregularities 22μm in maximum roughness and 83/5mm in number of troughs and ridges. The bond surface of an adherent is enhanced in contact area with adhesive agent by a two-step surface-roughening operation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a roughening treatment method for an adherend suitable for roughening the surface of a copper foil in a copper clad laminate.

[0002]

2. Description of the Related Art Conventionally, when two objects are adhered to each other with an adhesive, a roughening treatment is often performed to roughen both or one of the adherends.

For example, when a bicycle tire is punctured, the holes used in the rubber tube inside the tire are repaired by attaching an adhesive sheet. At this time, the adhesive surface on the rubber tube side is rubbed with a wire brush. A typical example is the case where the surface is roughened.

Similarly, when a copper-clad laminate used for a printed wiring board is manufactured, the adhesion side of the copper foil is roughened because the adhesion of the copper foil to the resin is extremely poor. For metal adherends, an alumina-based or other polygonal abrasive material is sprayed on the adhesive surface to form an irregular uneven surface, thereby expanding the contact area and The reality is that the adhesive strength is increased.

In order to increase the adhesive force, it is common to increase the size of the unevenness or increase the number of peaks and valleys of the unevenness in order to increase the bonding area.

[0006]

However, in the conventional roughening treatment method for the adherend, the method of increasing the size of the unevenness and the method of increasing the number of peaks and valleys of the unevenness are
It is difficult to achieve both.

The reason therefor is that it is advantageous to use an abrasive material having a fine grain size in order to increase the number of peaks and valleys of the unevenness. However, with an abrasive material having a fine grain size, the size of the unevenness should be increased. Is difficult.

On the contrary, it is possible to increase the size of the unevenness with an abrasive having a large grain size, but it is not possible to increase the number of peaks and valleys.

[0009] In addition, the size of the abrasive material, JIS R6
As defined in 001-1987 (grain size of abrasives), grain size # 220 is the limit on the fine side, and it is difficult to obtain abrasives with finer grain sizes.

The present invention has been made in view of such circumstances, and makes use of the advantages of both the fine-grained abrasive and the large-grained abrasive to obtain a strong adhesive force to the adhesive. It is an object of the present invention to provide a roughening treatment method for an adherend.

[0011]

In order to achieve the above object, a method for roughening a surface of an adherend according to the present invention comprises a first step of roughening an abrasive material having a large grain size on an adhesive surface of the adherend. The present invention is characterized in that after the surface-roughening treatment is performed to form large unevenness on the adhesive surface, the second roughening treatment is performed on the uneven surface with an abrasive material having a fine grain size.

[0012]

As is clear from the above construction, the first step of roughening treatment is performed on the adhesive surface of the adherend by using an abrasive material having a large grain size to form large irregularities on the adhesive surface, By performing the second-step roughening treatment with an abrasive having a fine grain size, it is possible to form a finer uneven surface on the uneven surface. Therefore, as compared with the case where only one treatment is performed, a large contact area for adhering to the adhesive can be secured.

[0013]

EXAMPLES As an example of the surface roughening treatment method for adherends according to the present invention, the case where copper materials are adhered to each other by a prepreg will be described below.

FIG. 1 is an explanatory view showing a state in which copper materials as adherends are adhered to each other through a prepreg, FIGS. 2 and 3.
[Fig. 3] is a schematic view showing a cross-sectional shape after a roughening treatment is performed on an adhesive surface of a copper material.

First, as shown in FIG. 1, a copper material 1 and a copper material 5 having a thickness of 5 mm are prepreg (thermosetting epoxy resin) 3
The case of adhering with will be described.

First, as the first step, the bonding surface 1 of the copper material 1
For a, an alumina-based abrasive having a grain size of # 60 is used, and the first stage roughening treatment is performed at a discharge pressure of 2.5 kg / cm ² and a treatment time of 1 second.

In this case, if the discharge pressure or the processing time becomes larger than the above range, the peak portion of the unevenness once formed is scraped and the unevenness becomes small. Therefore, the above range is preferable,
By adjusting the discharge pressure and processing time, the maximum roughness is 2
5 μm can be obtained.

The number of peaks and valleys of the unevenness at this stage is calculated from the cross-sectional shape, and the number of peaks and valleys of 1 μm or more is 36/5 mm. The cross-sectional shape of the bonding surface 1a of the copper material 1 at this time is schematically shown in FIG. Shown in.

As described above, in the roughening treatment in the first step, the bonding surface 1a of the copper material 1 has a large uneven surface, that is,
It can be easily understood that a large swell is formed.

Then, a second-stage roughening treatment is performed using an alumina-based abrasive having a grain size of # 220, a discharge pressure of 2.2 kg / cm ² , and a treatment time of 1 second.

If the discharge pressure and the processing time are further increased, the peaks and depressions of the irregularities formed in the first stage are scraped and the irregularities become smaller, so the above range is preferable.

In this second-stage roughening treatment, the discharge pressure and the treatment time can be adjusted to obtain the maximum roughness of 22 μm and the number of peaks and valleys of the unevenness of 83 pieces / 5 mm. In Fig. 3, a cross-sectional shape of the bonding surface 1a of the copper material 1 is schematically shown.

Therefore, if a two-step roughening treatment is performed as in the method of the present invention, a large contact area can be secured as shown in FIG. 3, so that the prepreg 3 is firmly attached to the copper materials 1 and 2. Can be glued to.

Next, a concrete example will be described.

<Example> A thermosetting polyimide resin prepreg (GIA-671N (N)) is used as an adhesive material by using copper materials having a thickness of 5 mm, a size of 10 mm and a contact area of 100 mm ^2.
Adhesive using Hitachi Chemical Co., Ltd. product name).

The roughening treatment of the copper material is carried out in the first stage with an alumina-based abrasive # 60, a discharge pressure of 2.5 kg / cm ² , and a treatment time of 1 second. #
220 alumina abrasive is used and the discharge pressure is 2.2kg /
cm ² and the processing time was 1 second.

After that, the adhesive is sandwiched between the copper materials to be adhered, and a predetermined pressure and temperature are applied.

<Comparative Example> Two kinds of objects to be adhered, which are the case where only the first step of the example is performed and the case where only the second step is performed, are adhered by the same adhering method as in the example.

The embodiment and two types of comparative examples, totaling 3
The results of comparing the adhesive strengths of the types are shown in Table 1.

[0030]

[Table 1]

As is clear from Table 1, it can be easily understood that the adhesive strength of the example according to the present invention is stronger than that of the two types of comparative examples.

[0032]

As described above, the method for roughening a surface of an adherend according to the present invention uses an abrasive having a large grain size,
First stage roughening treatment to form large irregularities on the adhesion surface of the adherend, and then roughening treatment with fine-grained abrasive on the irregular surface formed by the first stage roughening treatment By performing a two-step roughening treatment, it is possible to surely significantly increase the adhesive force by processing the adherend itself, and to improve the adhesive strength between the copper material and the prepreg in the copper-clad laminate. Not only adhesion between each other, in each field,
It can be applied to a wide range and has an extremely high practical value.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state in which a copper material and a prepreg are bonded together.

FIG. 2 is a schematic diagram of a cross-sectional shape of an adhesive surface of an adherend that has been subjected to a first-stage roughening treatment according to the present invention.

FIG. 3 is a schematic diagram of a cross-sectional shape of an adhesion surface of an adherend that has been subjected to a second-stage roughening treatment according to the present invention.

[Explanation of symbols]

 1, 2 copper material 3 prepreg

Claims (1)

[Claims] 1. An abrasive material having a large grain size is applied to the adhesive surface of an adherend to perform a first step of roughening treatment to form large irregularities on the adhesive surface, and then the abrasive surface having a fine grain size is applied to the irregular surface. On the other hand, a roughening treatment method for an adherend, which comprises performing a second-stage roughening treatment.