JPH08111365A - Production of etching component - Google Patents

Abstract

PURPOSE: To make uniform the thermal expansion of a pattern mask by providing two mask patterns on the surface and rear, on the periphery of an alignment mark, with shade patterns having same shape as the image parts on the surface and rear. CONSTITUTION: When predetermined patterns are baked by proximity exposure onto the surface and rear of an etching component material metal plate 4 applied with a photosensitive resin layer onto the opposite sides thereof, pattern masks 2 on the surface and rear are provided, on the periphery of an alignment mark, with shading hole patterns 6 having same shape as the image parts 8 on the surface and rear at same pitch and density as the image part 8. Consequently, the light absorption rate per unit area can be made uniform at the peripheral part of the alignment mark 1 and the image part 8 at the time of baking a pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an etching component such as a shadow mask used for a color picture tube or a lead frame for a semiconductor device, and more particularly to a device for a pattern mask used for pattern printing.

[0002]

2. Description of the Related Art A photo-etching method is known as a method for manufacturing an etching part, particularly a shadow mask used for a color picture tube and a lead frame for a semiconductor device. One example of the photo-etching method is shown in FIG. Explained. First, a thin metal plate serving as a substrate material of a shadow mask is brought into contact with an alkaline degreasing liquid to perform a degreasing treatment for removing oil and organic dust adhering to the surface of the metal plate. Then, in the next step of applying the photosensitive resin, the metal plate is brought into contact with an acid treatment liquid in order to easily attach the photosensitive resin to the surface of the metal plate. To do.

Next, as shown in FIG. 3A, for example, a negative photosensitive resin 5 is applied to both surfaces of the metal plate 4. Next, as shown in FIG. 3 (b), using two types of pattern masks 2 of large holes and small holes in which the hole-shaped pattern portion serves as a light shielding portion,
The large hole pattern mask 2 is closely attached to one side of the metal plate,
The small hole pattern mask 2'is closely applied to the other side of the metal plate at a corresponding position, and at the same time, both sides are irradiated with ultraviolet light to perform pattern printing, and the photosensitive resin 5 in the area other than the hole pattern portion is exposed. Photocuring.

Next, for example, by developing with hot water spray to remove the unexposed and uncured photosensitive resin, the remaining photosensitive resin 5'is subjected to film hardening treatment and burning. Next, as shown in FIG. 3C, both surfaces of the metal plate 4 are subjected to primary etching, and both surfaces of the metal plate 4 are subjected to constant etching. Next, as shown in FIG. 3D, a varnish is applied to the small hole side to form the etching prevention layer 7. Next, as shown in FIG. 3E, secondary etching is performed on the large hole side to penetrate the small hole. Then, the etching prevention layer 7 and the photosensitive resin 5 ′ are removed using an alkaline solution, and unnecessary portions of the metal plate 4 are removed to form a shadow mask.

The shadow mask manufacturing method shown in FIG. 3 employs a two-step etching method in which the etching process is divided into two steps and an etching prevention layer is provided therebetween. However, in a general method for manufacturing an etched component, a one-step double-sided etching method is often used without providing an etching prevention layer.

Here, FIG. 2 shows an example of pattern printing during the above process. The two types of pattern masks 2 and 2'of large holes and small holes shown in FIG. 2 are usually placed in a mask holder 3 and a metal plate 4 coated with a photosensitive resin 5 on both sides.
It is installed on both sides of. The pattern masks 2 and 2'are separated from the metal plate 4 when the metal plate 4 is conveyed, and are brought into close contact with the metal plate 4 during pattern exposure. The image portion 8 in the pattern masks 2 and 2'indicates the screen portion of the shadow mask in which a large number of hole patterns are formed, and the skirt forming area 9 indicates the outer shape portion. Is a part to be molded by.

In the manufacture of etching parts, particularly a shadow mask used for a color picture tube, the pattern mask 2 of two kinds of large holes and small holes shown in FIG. 2 is used as described above, and a large hole pattern is formed on the surface of the metal plate 4. Touch the mask 2 closely,
The small hole pattern mask 2'must be applied to the other back surface of the metal plate in close contact with the corresponding position.

Conventionally, in order to bring two pattern masks into close contact with the metal plate 4 in correspondence with each other, alignment marks 1 and 1'for alignment are provided on the front and back pattern masks at opposite positions. The alignment marks 1 and 1 ′ for alignment are placed, for example, at the ends of the pattern masks 2 and 2 ′ as shown in FIG. 2 and at a position that does not touch the metal plate 4 when the metal plate 4 and the pattern mask are in close contact with each other. Has been.

That is, the alignment marks 1 and 1 ′ for alignment are inserted before the metal plate 4 coated with the photosensitive resin 5 is inserted between the pattern masks 2 and 2 ′ and brought into close contact with the metal plate 4. The positions of the two mask holders 3 are moved and adjusted so as to match the alignment marks on the front and back, and then the metal plates 4 are brought into close contact with each other to irradiate light from both sides to perform pattern exposure. After that, the pattern mask is separated from the metal plate 4, and the metal plate 4 is unloaded. As a result, at the time of pattern exposure, the positions of the large hole pattern and the small hole pattern on the two pattern masks are located at the positions facing each other with the metal plate inserted.

However, since this alignment mark 1 for alignment is used only for alignment and has nothing to do with the pattern of the shadow mask, it is usually outside the pattern area to be the shadow mask, for example, outside the skirt molding area 9. It is placed alone at the end of the mask 2. Therefore, if pattern printing is performed to continuously manufacture shadow masks, the following problems may occur.

That is, since the image density of the image portion 8 of the shadow mask is different from that of the alignment mark 1 for alignment, the amount of thermal expansion on the pattern mask 2 is partially increased by irradiating the pattern mask 2 with light such as ultraviolet light. The problem is that the pattern alignment is misaligned due to the difference between the two.

That is, the image portion 8 of the pattern mask has dense hole patterns. Since this hole pattern is, for example, a light-shielding pattern, that is, a black portion in the above-described step of FIG. 3, it is easy to absorb light energy and accumulate heat during light irradiation. Therefore, for example, it can be said that the screen portion 8 in which the hole patterns are densely present on the pattern mask 2 made of glass is likely to be thermally expanded due to the temperature rise.

On the other hand, since the alignment mark 1 for alignment is placed alone in a place where there is almost no pattern such as the end of the pattern mask 2, absorption of light energy in the vicinity of the alignment mark 1 for alignment is small and thermal expansion is caused. It can be said that the degree of is much smaller than that of the screen portion 8 of the pattern mask 2.

Therefore, by repeating the light irradiation for the pattern exposure, the positional relationship between the alignment mark 1 for alignment and the image portion 8 becomes different from that before the light irradiation due to the difference in thermal expansion. That is, after the pattern exposure is performed several times, even if the front and back pattern masks are aligned using the alignment mark 1 for alignment, the pattern shift occurs in the image portion 8, and as a result, the shadow mask The problem is that it causes quality deterioration.

[0015]

SUMMARY OF THE INVENTION An object of the present invention relates to a method for manufacturing an etching component, particularly a shadow mask used for a color picture tube or a lead frame for a semiconductor device, and more particularly to a pattern mask used for pattern exposure. An object of the present invention is to provide a pattern mask that does not have the above problems.

[0016]

That is, according to the present invention, in a method of manufacturing an etching component using a photo-etching method, a metal plate of an etching component material having a photosensitive resin layer formed on both surfaces is used as a pattern mask having two front and back surfaces. Inserted between
A predetermined pattern is baked on both the front and back sides by the contact exposure method and developed to form a resist film with a predetermined pattern, and then double-sided etching is performed from the exposed metal surface not covered with the resist film to open a desired shape. When forming on a metal plate, two pattern masks used for the contact exposure method are provided around the alignment mark for alignment,
The above problem is solved by providing a method for manufacturing an etching component, which has a light-shielding pattern having the same shape as the front and back image portions, respectively.

The present invention will be described in detail below with reference to the drawings. FIG. 1 shows an example in which the present invention is applied to a pattern mask 2 of a shadow mask, and the peripheral portion of the alignment mark 1 for alignment shown in FIG. 2 is enlarged. Thus, in the present invention, the hole patterns 6 having the same shape as the front and back image portions are formed around the front and back alignment marks 1 for alignment.
Are provided with the same pattern pitch and pattern density as the image portion.

By providing the hole pattern 6 having the same shape as the image portion 8 around the alignment mark 1 for alignment, the rate of light absorption per unit area at the time of pattern printing is the same as that around the alignment mark 1 for alignment. It becomes possible to make them substantially uniform with the portion 8. As a result, the heat generated by light absorption becomes substantially equal in the peripheral portion of the alignment mark 1 for alignment and the image portion 8, and therefore the degree of thermal expansion becomes substantially equal in the peripheral portion of the alignment mark 1 for alignment and the image portion 8. . Therefore, even if light irradiation is continuously repeated for pattern exposure, the difference in the positional relationship due to the difference in thermal expansion amount between the alignment mark 1 for alignment and the image portion 8 can be suppressed to a slight extent.

Next, the pattern provided around the alignment mark 1 for alignment will be described. The present invention is characterized in that the pattern 6 is provided in the peripheral portion of the alignment mark 1 for alignment to increase light absorption in the peripheral portion of the alignment mark, for example. However, as described above, the pattern 6 provided around the alignment mark needs to have a light absorption rate per unit area substantially equal to that of the image portion 8. For this reason, it is easier to provide the same shape as the hole pattern of the image portion 8 as it is in the peripheral portion of the alignment mark, rather than calculating the light absorptance per unit area by considering various pattern shapes. It can be said that it is desirable to provide the hole pattern 6 having the same shape as the image portion 8 around the alignment mark 1 for use with the same pattern pitch and pattern density as the image portion.

Next, the place where the pattern is provided according to the present invention will be described. Since it is an object of the present invention to eliminate the partial difference in thermal expansion due to the absorption of light on the pattern mask 2, it is only necessary to put an additional pattern on the entire blank area other than the skirt molding area 9 including the image area 8. You may have an idea. However, in that case, the following inconveniences are considered.

That is, there is a problem that the pattern added on the pattern mask 2 is rubbed against the metal plate 4 to be peeled off and adhered to the metal plate 4, thereby causing a defective shape of the shadow mask. Further, providing an additional pattern, especially a fine pattern having the same shape as the image portion 8, on the pattern mask 2 is very troublesome in forming the pattern mask. Therefore, it can be said that it is desirable that the area in which the additional pattern is provided is as small as possible, because it does not take time and effort when creating the pattern mask.

In view of the above circumstances, the present inventors have enclosed the alignment mark 1 for alignment only in the peripheral portion of the alignment mark 1 for alignment so as not to hinder the alignment of the pattern mask 2, that is, the shape of a square character. The fact that the problem of the present invention can be sufficiently solved by providing the additional pattern 6 has been empirically obtained from the examples shown below.

Alignment mark 1 for alignment
Since the region where the additional pattern 6 is provided in the peripheral portion varies depending on the conditions such as the coefficient of thermal expansion of the pattern mask 2 used and the area occupied by the image portion 8, it can be said that it is desirable to appropriately set it according to the manufacturing conditions.

[0024]

According to the present invention, a light-shielding pattern having the same shape as the front and back image portions is provided around the alignment marks for alignment on the front and back pattern masks. The thermal expansion amount of the pattern mask in the area is approximated, and the alignment accuracy of the front and back patterns during pattern printing is improved.

[0025]

EXAMPLES Examples of the present invention are shown below. <Example> An alloy material (amber material) having a thickness of 0.13 mm and having iron and nickel as main components is used as a material, and the plate thickness is 0.
By using a 19-inch pattern mask and irradiating it with 2000 mJ / cm ² of ultraviolet light, the size of
A 30.0 × 37.6 cm shadow mask was produced. At that time, according to the present invention, as shown in FIG. 1, 5 mm square and 3 cm outside the alignment marks for pattern mask alignment on the front and back sides.
A pattern mask was used in which a hole pattern having the same shape as the image portions on the front and back sides was provided in a square shape in the area on the inner side of the four sides at the same pattern pitch and pattern density as the image portion.

<Comparative Example> Next, for comparison with the present invention, a conventional pattern mask in which a hole pattern is not provided around the alignment mark for alignment is used, and the above <
Example> Similar manufacturing conditions and manufacturing process to
A 30.0 × 37.6 cm shadow mask was produced.

Next, in the shadow masks manufactured in the above <Example> and <Comparative example>, the image portion pattern of the image portion pattern caused by the movement of the alignment mark portion for alignment due to the thermal expansion due to the above-mentioned light irradiation. The position shift value was examined.

The positional deviation value of the image part pattern is defined as follows. That is, the distance between the centers of the large hole and small hole patterns punched on the front and back of the shadow mask was taken as the positional deviation value of the image portion pattern. Originally, it is desirable that the centers of the large hole and small hole patterns punched on the front and back of the shadow mask coincide with each other, and the smaller the positional deviation value, the better the pattern alignment accuracy and the better the quality of the shadow mask.

The positional deviation values of the shadow masks manufactured in the above <Example> and <Comparative example> are shown in Table 1 below.
The following positional deviation values indicate the average value of the positional deviation values at the four corners and the central portion of the shadow mask image area at a total of five locations.

[0030]

[Table 1]

As shown in Table 1 above, in the <Example> according to the present invention, the alignment accuracy is improved by about 50% as compared with the conventional <Comparative Example>, and the positional deviation value of <Example> is shown. Was well within the permissible range of positional deviation as a shadow mask.

[0032]

According to the present invention, a light-shielding pattern having the same shape as the front and back image portions is provided around the alignment mark for alignment on the front and back pattern masks, so that the periphery of the alignment mark for alignment by light absorption during pattern printing is provided. The thermal expansion of the pattern mask in the image area becomes uniform, and the alignment accuracy of the front and back patterns during pattern printing is improved. Therefore, it can be said that the present invention is practically excellent in obtaining etching components such as high-definition shadow masks and lead frames for semiconductor devices.

[0033]

[Brief description of drawings]

FIG. 1 is a plan view showing a main part of an embodiment of a pattern mask used in a method for manufacturing an etched component of the present invention.

FIG. 2 is an explanatory diagram showing a main part of a method for manufacturing an etched component according to the present invention.

3A to 3E are explanatory views showing an example of a method of manufacturing a shadow mask in the order of steps.

[Explanation of symbols]

 1 Alignment mark for alignment 2 Mask 3 Mask holder 4 Metal plate 5 Photosensitive resin 6 Pattern 7 Etching prevention layer 8 Image area 9 Skirt molding area

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display H01J 9/14 G

Claims (1)

[Claims] 1. A method for producing an etched component using a photo-etching method, which is used when a predetermined pattern is printed on a front surface and a back surface of a metal plate for an etching component material having photosensitive resin layers formed on both sides by a contact exposure method. A method of manufacturing an etching component, wherein two pattern masks on the front and back sides have light-shielding patterns having the same shape as the image portions on the front and back sides, respectively, around the alignment mark for alignment.