CN113238400A - Alignment mark, display device, and method for determining alignment mark - Google Patents

Alignment mark, display device, and method for determining alignment mark Download PDF

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Publication number
CN113238400A
CN113238400A CN202110332577.2A CN202110332577A CN113238400A CN 113238400 A CN113238400 A CN 113238400A CN 202110332577 A CN202110332577 A CN 202110332577A CN 113238400 A CN113238400 A CN 113238400A
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China
Prior art keywords
mark
alignment
closed
substrate
chip
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CN202110332577.2A
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CN113238400B (en
Inventor
袁正辉
康报虹
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HKC Co Ltd
Mianyang HKC Optoelectronics Technology Co Ltd
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HKC Co Ltd
Mianyang HKC Optoelectronics Technology Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The application discloses an alignment mark, a display device and a method for judging the alignment mark; the method comprises the following steps: a first mark provided on an object; and a second mark provided on another object; wherein the first mark is different in shape from the second mark; when the first mark and the second mark are aligned accurately, the first mark and the second mark are projected to form a closed graph; to align accurately.

Description

Alignment mark, display device, and method for determining alignment mark
Technical Field
The present application relates to the field of display technologies, and in particular, to an alignment mark, a display device, and a method for determining an alignment mark.
Background
With the continuous development of science and technology, various electronic products are smaller, more precise, more complete and durable in the industries of displays and the like. Hard boards and Flexible boards are derived from integrated Circuit boards (PCB), wherein the FPC (Flexible Printed Circuit) is developed towards COF (Chip On Film), which is currently smaller, has more channels, and has smaller and more spaces between channels, and is more dense and precise. The panel is very suitable for the application of liquid crystal module products such as a panel, a mobile phone or a tablet personal computer and the like, and has the advantages of being lighter, thinner, smaller in size, capable of bending and the like.
In the conventional panel manufacturing process, alignment is usually reserved on a TFT glass substrate, and a square hole or a circular hole is generally selected as a positioning point after exposure, and alignment and attachment are performed on a COF uncut portion, and an PCBA (Printed Circuit Board Assembly) is attached to a lower end of the COF to realize signal input. The traditional alignment mode has low exposure precision, and causes the problems of long alignment time and low efficiency.
Disclosure of Invention
The application aims to provide an alignment mark, a display device and a judgment method of the alignment mark so as to accurately align.
The application discloses an alignment mark; the method comprises the following steps: a first mark provided on an object; and a second mark provided on another object; wherein the first mark is different in shape from the second mark; and when the first mark and the second mark are aligned accurately, the first mark and the second mark are projected to form a closed graph.
Optionally, the first mark and the second mark are respectively open graphics; in a closed graph formed by the first mark and the second mark in an alignment mode, the first mark and the second mark do not intersect; the closed figure is divided into two sub-closed figures with equal areas.
Optionally, the first mark and the second mark are respectively open graphics; in a closed graph formed by the first mark and the second mark in an alignment mode, the first mark and the second mark are crossed; and the closed figure is at least divided into two sub-closed figures with equal areas.
Optionally, the first mark is a closed graph, and the second mark is an open graph; in the closed graph formed by the first mark and the second mark in an alignment mode, the second mark divides the first mark into at least two sub-closed graphs with equal areas.
Optionally, the first mark and the second mark are in an axisymmetric pattern, or the first mark and the second mark are in an axisymmetric pattern.
Optionally, the first mark is a "I" shape; the second mark is in an H shape; in the closed graph formed by the first mark and the second mark in an alignment mode, the closed graph is divided into four sub-closed graphs with equal areas.
The present application also discloses a display device, including: the chip package comprises a first substrate, a second substrate, a chip on film and a printed circuit board; the second substrate is arranged corresponding to the first substrate; the chip on film is bound in the binding area of the first substrate; one side of the chip on film of the printed circuit board is bound on the first substrate, and the other side of the chip on film is bound with the printed circuit board; the first substrate and the flip chip film are respectively provided with the alignment mark; a second mark is arranged on the binding region of the first substrate; a first mark is arranged on the chip on film corresponding to the second mark of the first substrate; and when the first mark and the second mark are aligned, the first substrate and the chip on film are bonded in an aligned manner.
Optionally, a first mark is disposed on the first substrate, a second mark corresponding to the first mark is disposed on the second substrate, and when the first mark and the second mark are aligned accurately, the first substrate and the second substrate are aligned to form a box.
Optionally, a second mark is disposed on a side where the chip on film is bound to the printed circuit board, and the printed circuit board is provided with a first mark corresponding to the second mark.
The application also discloses a method for judging the alignment marks, wherein the alignment marks comprise a first mark and a second mark which are respectively positioned on the object to be aligned; the judging method comprises the following steps:
moving the first mark or the second mark so that the first mark and the second mark form a closed figure;
detecting the area of the closed graph;
if the area of the closed graph meets the preset condition, the alignment is successful;
and if the area of the closed graph does not accord with the preset condition, continuously moving the first mark or the second mark to enable the area of the closed graph to accord with the preset condition.
Compared with the technical scheme that the alignment marks are two same marks for alignment in the exemplary technology, the fool-proof effect is achieved by setting the first mark and the second mark into different shapes. Secondly, because between two objects, COF and the first mark and the second mark on the array substrate set up to different shapes, in the counterpoint process, can accurately distinguish whether COF or array substrate squints, convenient regulation, and when two mark centers squints can not appear, many times of adjustment probably counterpoint to below or top mark point, lead to wrong counterpoint and exposure problem. In addition, importantly, the projection of the alignment mark when the first mark and the second mark are superposed forms a closed graph, and whether the alignment is accurate or not can be fed back quickly only by calculating the area of the closed graph. The area of the closed figure can be recognized by checking the area size of the closed figure with a binarization function or an image size recognition function using an image recognition machine.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic diagram of an alignment mark according to an embodiment of the present application;
FIG. 2 is a schematic illustration of an alignment mark according to another embodiment of the present application;
FIG. 3 is a schematic illustration of an alignment mark according to another embodiment of the present application;
FIG. 4 is a schematic illustration of an alignment mark according to another embodiment of the present application;
FIG. 5 is a schematic illustration of an alignment mark according to another embodiment of the present application;
FIG. 6 is a schematic illustration of alignment marks according to another embodiment of the present application;
FIG. 7 is a schematic illustration of an alignment mark according to another embodiment of the present application;
FIG. 8 is a schematic illustration of an alignment mark according to another embodiment of the present application;
fig. 9 is a schematic diagram illustrating a step of a method for determining alignment marks according to an embodiment of the present application;
FIG. 10 is a schematic view of a display device according to an embodiment of the present application;
FIG. 11 is a schematic view of another display device according to an embodiment of the present application;
FIG. 12 is a schematic cross-sectional view of another display device of an embodiment of the present application;
fig. 13 is a schematic view of a TFT substrate, a COF, and a printed circuit board according to an embodiment of the present application;
fig. 14 is a schematic view of a TFT substrate, a COF, a printed circuit board of another embodiment of the present application;
fig. 15 is a schematic view of a TFT substrate, a COF, a printed circuit board of another embodiment of the present application;
fig. 16 is a schematic of a COF of another embodiment of the present application.
100, a display device; 110. a first substrate; 111. an array substrate; 120. a second substrate; 130. a chip on film; 140. a printed circuit board; 150. a golden finger; 200. aligning and marking; 210. a first mark; 211. a body marker; 212. a boundary marker; 220. a second mark; 221. a body marker; 222. a boundary marker; 230. sealing the graph;
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1, as an embodiment of the present application, an alignment mark is disclosed, and an alignment mark 200 includes a first mark 210 and a second mark 220, where the first mark 210 is disposed on an object; a second mark 220 provided on another object; in the present application, the flip chip film 130 (fig. 1 is not labeled, and fig. 11 or 12 may be referred to) is taken as an object, the array substrate 111 (fig. 1 is not labeled, and fig. 11 or 12 may be referred to) is taken as another object, and the flip chip film 130 is bonded on the array substrate 111 by using the alignment mark 200 as an example; wherein the first marker 210 is shaped differently from the second marker 220; when the first mark 210 and the second mark 220 are aligned accurately, the first mark 210 and the second mark 220 are projected to form a closed figure 230.
Compared with the technical scheme that the alignment mark 200 is aligned by two identical marks in the exemplary technology, the fool-proof effect is achieved by setting the first mark 210 and the second mark 220 to be different shapes. Secondly, since the first mark 210 and the second mark 220 on the chip on film 130 and the array substrate 111 are different in shape, in the alignment process, the chip on film 130 or the array substrate 111 can be accurately distinguished from each other, which is convenient for adjustment, and when the centers of the two marks are shifted, the alignment may be performed to the lower or upper mark point by adjusting for many times, which may cause the problems of wrong alignment and exposure. Moreover, it is important that the projection of the alignment mark 200 when the first mark 210 and the second mark 220 are overlapped forms a closed pattern, and whether the alignment is accurate can be quickly fed back only by calculating the area of the closed pattern. The area of the closed figure can be recognized by checking the area size of the closed figure with a binarization function or an image size recognition function using an image recognition machine.
As shown in fig. 1, in this embodiment, the first mark 210 and the second mark 220 are respectively open patterns, and in the closed pattern 230 formed by aligning the first mark 210 and the second mark 220, the first mark 210 and the second mark 220 do not intersect; the closed figure 230 is divided into two sub-closed figures of equal area. When the first mark 210 and the second mark 220 are aligned correctly, the first mark 210 and the second mark 220 do not intersect. Specifically, in the present embodiment, the first mark 210 and the second mark 220 are respectively semi-closed graphs, the closed graph in which the first mark 210 and the second mark 220 are exactly aligned is an axisymmetric graph, the first mark 210 and the second mark 220 respectively include at least two end points, and a continuous graph is formed between the two end points; in the closed pattern formed by the first mark 210 and the second mark 220 in an aligned manner, two end points of the first mark 210 and the second mark 220 are respectively located on a symmetry axis of the closed pattern. The first mark 210 and the second mark 220 are asymmetric about the symmetry axis of the closed figure. The image recognition machine confirms the area size of the closed graph through binarization or an image size recognition function, and compares the left area and the right area to the same value so as to realize left-right adjustment alignment and more superior and accurate alignment.
As shown in fig. 2, the first mark 210 and the second mark 220 respectively include a body mark and a boundary mark, and in the closed pattern 230 formed by aligning the first mark 210 and the second mark 220, the boundary mark 212 of the first mark 210 and the boundary mark 222 of the second mark 220 form a boundary of the closed pattern 230; the body mark 211 of the first mark 210 is located on the symmetry axis, the body mark 221 of the second mark 220 is located on the symmetry axis, and the body mark 211 of the first mark 210 and the body mark 221 of the second mark 220 divide the closed figure 230 into two figures with equal areas. Specifically, the body mark 211 of the first mark 210 is not coincident with the body mark 221 of the second mark 220.
As shown in fig. 1, the first mark 210 and the second mark 220 are symmetrically patterned. As shown in fig. 2, the first mark 210 and the second mark 220 are centrosymmetric. In the embodiments of fig. 1 and fig. 2, the first mark 210 and the second mark 220 do not have a crossing position, i.e. in the alignment process, the crossing condition is easy to distinguish that the alignment is not accurate, so the alignment mark 200 of the present embodiment is simple and reliable.
As another embodiment of the present application, as shown in fig. 3, another alignment mark is disclosed, the first mark 210 and the second mark 220 are crossed; the first mark 210 and the second mark 220 are respectively open figures; in the closed pattern 230 formed by the alignment of the first mark 210 and the second mark 220, the first mark 210 and the second mark 220 intersect; and the closed figure 230 is divided into at least two sub-closed figures having equal areas. As shown in fig. 3, when the first mark 210 and the second mark 220 are aligned correctly, the closed graph 230 is a square rotated by 90 degrees, wherein two diagonal lines of the square are the body mark of the first mark 210 and the body mark of the second mark 220, respectively. And the two opposite sides of the square are in one group, and the two groups are respectively the boundary marks of the first mark 210 and the second mark 220. Through the image recognition machine, the upper area and the lower area are compared by a group of functions, the upper automatic alignment and the lower automatic alignment are completed, the left area and the right area are compared to the same value, the left area and the right area are adjusted and aligned, and the alignment is realized more optimally and accurately.
In another embodiment, as shown in FIG. 4, the first mark 210 is in the shape of an I-shape; the second mark 220 is in an H shape; in the closed graph formed by the alignment of the first mark 210 and the second mark 220, the closed graph is divided into four sub-closed graphs with equal areas; when the first mark 210 and the second mark 220 are aligned correctly, the closed pattern forms a "tian" shape pattern.
In another embodiment, when the closed figure is a "tian" shaped figure, as shown in fig. 5, the first mark 210 is three parallel line segments, the length of the line segment is D, and the distance between two line segments is D/2. The second mark 220 is a figure obtained by rotating the first mark 210 by 90 degrees.
As another embodiment of the present application, as shown in fig. 6, the first mark 210 is a closed figure, and the second mark 220 is an open figure; in the closed pattern formed by the first mark 210 and the second mark 220 being aligned, the second mark 220 divides the first mark 210 into at least two sub-closed patterns with equal areas. Specifically, the first mark 210 is a square, and the second mark 220 is a cross-shaped mark rotated by 45 degrees; of course, as shown in fig. 7, the second mark 220 may also be a cross shape, and the closed figure is divided into 4 sub-closed figures with equal areas.
As shown in fig. 8, as another embodiment of the variation of the embodiment of fig. 7, the first mark 210 may be an open figure, and the second mark 220 may be a cross-shaped mark. The closed graph is shaped like a Chinese character 'tian'. In this embodiment, the pattern of the first mark 210 has a certain width. It should be noted that the alignment mark 200 in the embodiment of the present application may have a certain line width.
As shown in fig. 9, the present application further discloses a method for determining alignment marks, where the alignment marks include a first mark and a second mark, and the first mark and the second mark are respectively located on an object to be aligned; the judging method comprises the following steps:
s1: moving the first mark or the second mark so that the first mark and the second mark form a closed figure;
s2: detecting the area of the closed graph;
s3: if the area of the closed graph meets the preset condition, the alignment is successful;
s4: and if the area of the closed graph does not accord with the preset condition, continuously moving the first mark or the second mark to enable the area of the closed graph to accord with the preset condition.
The method for determining alignment marks of the present application is applied to the alignment marks 200 of the above embodiments. The difference is that when the area of the closed graph is divided into two or four sub-closed graphs, the areas of the two or four sub-closed graphs are respectively identified; and if the preset condition is that the areas of the two or four sub-closed graphs are equal, judging that the alignment is successful.
As shown in fig. 10, as an embodiment of applying the alignment mark 200 to the display panel, a display device 100 is disclosed, which includes: a first substrate 110 and a second substrate 120, wherein the second substrate 120 is arranged corresponding to the first substrate 110; the first substrate 110 and the second substrate 120 are respectively provided with the alignment mark 200; wherein a first mark 210 is disposed on the first substrate 110; a second mark 220 is disposed on the second substrate 120; when the first mark 210 and the second mark 220 are aligned, the first substrate 110 and the second substrate 120 are aligned to form a cassette. In this embodiment, the first substrate 110 and the second substrate 120 may be aligned into a cassette by the alignment of the first mark 210 and the second mark 220.
It should be noted that the alignment mark 200 of the present application can be applied to the alignment of the first substrate 110 and the second substrate 120, respectively; the alignment of the first substrate 110 and the flip-chip film 130, and the alignment of the flip-chip film 130 and the printed circuit board 140 can also be applied in combination, as follows:
as shown in fig. 11-13, the display device 100 further includes a chip on film 130(COF), the COF 130 is bonded to the bonding region of the first substrate 110; the bonding area of the first substrate 110 is provided with a second mark 220, and the flip-chip film 130 is provided with a first mark 210 corresponding to the second mark 220 of the first substrate 110. Here, the first substrate 110 is an array substrate 111. The display device 100 further includes a printed circuit board 140, one side of the flip-chip film 130 is bonded to the first substrate 110, and the other side of the flip-chip film 130 is bonded to the printed circuit board 140; a second mark 220 is disposed on one side of the chip on film 130, which is bonded to the printed circuit board 140, and the printed circuit board 140 has a first mark 210 corresponding to the second mark 220.
Specifically, in the above embodiment, the first mark 210 and the second mark 220 may be any alignment mark 200 shown in fig. 1-8, the first mark 210 and the second mark 220 are respectively disposed on the flip chip film 130, and the first mark 210 is used for aligning with the second mark 220 on the printed circuit board 140; the second mark 220 on the flip-chip film 130 is aligned with the first mark 210 on the first substrate 110, so that the side of the flip-chip film 130 bound to the first substrate 110 can be distinguished.
Of course, in another embodiment, different alignment marks 200 can be selected on the first substrate 110, the flip chip film 130, and the printed circuit board 140, as shown in fig. 14, the alignment mark 200 disposed on the flip chip film 130 is taken as an example; the alignment of the first substrate 110 and the flip-chip film 130 is selected from the alignment mark 200 shown in fig. 4, and the alignment of the flip-chip film 130 and the printed circuit board 140 is selected from the alignment mark 200 shown in fig. 5. In the embodiment, different alignment marks 200 are used when the flip chip film 130 is aligned with the array substrate 111 and the printed circuit board 140, so that the flip chip film 130 is prevented from being aligned to one side of the array substrate 111 and one side of the printed circuit board 140 during actual alignment.
In another embodiment, as shown in fig. 15, the different first mark 210 and the second mark 220 can be applied to an object for alignment, where the flip-chip film 130 is taken as an example, the flip-chip film 130 is bonded to the bonding area of the first substrate 110, and the first mark 210 as shown in fig. 4 and the first mark 210 as shown in fig. 5 are respectively disposed on the same side of the flip-chip film 130 corresponding to the bonding area of the flip-chip film 130; the second marks 220 shown in fig. 4 and 5 are correspondingly disposed on the first substrate 110, i.e. when the array substrate 111 or the printed circuit board 140 is aligned on the same side of the chip on film 130, different alignment marks 200 are disposed, which are different from each other in different sets of alignment marks 200 (i.e. the first marks 210 and the corresponding second marks 220 are divided into a set of alignment marks 200). Therefore, the mark has the fool-proof function, and the situation that the mark points below or above can be aligned by adjusting for many times when the centers of the two marks deviate can be prevented.
Specifically, the bonding area of the first substrate 110 is provided with a plurality of gold fingers 150, as shown in fig. 16, taking the gold finger 150 on the chip on film 130 as an example, the first mark 210 of the first substrate 110 is disposed on one gold finger 150 near the edge, and the second mark 220 on the chip on film 130 is disposed on the gold finger 150 corresponding to the first mark 210. In order to ensure more stable alignment, the alignment mark 200 is designed on the first gold finger 150 of the printed circuit board 140(PCB), the printed circuit board 140(PCB) is configured to transmit various signals and voltages, and the printed circuit board 140(PCB) is configured to image information, a plurality of gating control signals and a plurality of verification signals; and a Chip On Film (COF) 130, the COF 130 is configured with control of a plurality of gating control signals and a plurality of verification signals of image information and increases the number of channels; marking the left lower and right lower portions of the first chip on film 130 corresponding to the left upper and right upper portions of the first printed circuit board 140 (PCB); the alignment mark 200 is aligned to ensure close connection of the alignment mark and the chip on film 130, so that signal processing can be stably transmitted to the TFT glass substrate, and the TFT glass substrate comprises all image information of a chip on film (the chip on film 130), a plurality of gating control signals and a plurality of verification signals, and the gating control signals and the verification signals are received and transmitted to the switches of the pixels corresponding to the TFT switches to be switched on and off.
It should be noted that, the limitations of each step in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all the steps should be considered as belonging to the protection scope of the present application.
The technical solution of the present application can be widely applied to various display panels, such as TN (Twisted Nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panel, and the above solution can be applied thereto.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.

Claims (10)

1. An alignment mark; it is characterized by comprising:
a first mark provided on an object; and
a second mark provided on another object;
wherein the first mark is different in shape from the second mark;
when the first mark and the second mark are aligned accurately, the first mark and the second mark are projected to form a closed graph.
2. The alignment mark according to claim 1, wherein the first mark and the second mark are each an open figure;
in a closed graph formed by the first mark and the second mark in an alignment mode, the first mark and the second mark do not intersect;
the closed figure is divided into two sub-closed figures with equal areas.
3. The alignment mark according to claim 1, wherein the first mark and the second mark are each an open figure;
in a closed graph formed by the first mark and the second mark in an alignment mode, the first mark and the second mark are crossed; and the closed figure is at least divided into two sub-closed figures with equal areas.
4. The alignment mark according to claim 1, wherein the first mark is a closed figure and the second mark is an open figure; in a closed pattern formed by the first mark and the second mark in an alignment manner, the second mark divides the first mark into at least two sub-closed patterns with equal areas.
5. The alignment mark according to claim 1, wherein the first mark and the second mark are axisymmetric patterns or are axisymmetric.
6. The alignment mark of claim 1, wherein the first mark is a "I" shape; the second mark is in an H shape; in the closed graph formed by the first mark and the second mark in an alignment mode, the closed graph is divided into four sub-closed graphs with equal areas.
7. A display device, comprising:
a first substrate;
the second substrate is arranged corresponding to the first substrate;
the chip on film is bound in the binding area of the first substrate; and
one side of the chip on film is bound on the first substrate, and the other side of the chip on film is bound with the printed circuit board;
the first substrate and the flip chip on film are respectively provided with the alignment mark according to any one of claims 1 to 5;
a second mark is arranged on the binding region of the first substrate;
a first mark is arranged on the chip on film corresponding to the second mark of the first substrate;
and when the first mark and the second mark are aligned, the first substrate and the chip on film are bonded in an aligned manner.
8. The display device according to claim 7, wherein a first mark is provided on the first substrate, a second mark corresponding to the first mark is provided on the second substrate, and when the first mark and the second mark are aligned accurately, the first substrate and the second substrate are aligned and boxed.
9. The display device according to claim 7, wherein a second mark is disposed on a side of the chip on film bonded to the printed circuit board, and the printed circuit board has a first mark corresponding to the second mark.
10. A judgment method for alignment marks comprises the steps that the alignment marks comprise a first mark and a second mark, and the first mark and the second mark are respectively positioned on an object to be aligned; the method is characterized by comprising the following steps:
moving the first mark or the second mark so that the first mark and the second mark form a closed figure;
detecting the area of the closed graph;
if the area of the closed graph meets the preset condition, the alignment is successful;
and if the area of the closed graph does not accord with the preset condition, continuously moving the first mark or the second mark to enable the area of the closed graph to accord with the preset condition.
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