JPH08110436A - Optical transmission module - Google Patents

Abstract

PURPOSE: To provide such a structure that a semiconductor laser chip, lens, optical fiber, electric circuit to drive the laser are tightly sealed from air in an optical transmission module and the countermeasure against electromagnetic waves can be done. CONSTITUTION: The exit port of the laser light of a semiconductor laser chip, and moreover, the semiconductor laser chip 1 itself are covered with a resin and tightly sealed. The end face 6 of an optical fiber 5 which receives the laser light from the semiconductor laser chip is also covered with the resin 2. Further, a lens for optical coupling is covered with the resin 2. Thus, the optical coupling part from the semiconductor laser chip to the optical fiber in the optical transmission module is tightly sealed with the resin and protected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical transmitter module which uses a semiconductor laser chip and an optical fiber in an optical communication to reduce the cost, and to improve the productivity without lowering the reliability. Concerning the structure of.

[0002]

2. Description of the Related Art Optical transmission modules for optical communication are mainly used in which an electric signal is replaced with laser light by a semiconductor laser chip, and the laser light is put into an optical fiber through a lens system or the like to output light. In order to reduce the cost and improve the reliability of the optical transmission module, there have been problems of how to optically couple the semiconductor laser chip and the optical fiber and how to hermetically seal the semiconductor laser chip. As a conventional method, the characteristics of an optical coupling system using an inert liquid (1
993 IEICE Autumn Meeting Proceedings C-194)
As shown in (1), there has been studied a method in which a lens for optical coupling is eliminated by using a spherical optical fiber and sealing is performed by using an inert liquid. In addition, more generally, a semiconductor laser chip alone or a semiconductor laser chip, an optical coupling lens, and an entire optical coupling system up to an optical fiber are packaged in a metal or ceramic package such as Kovar, brass, or aluminum filled with an inert gas. A semiconductor laser device or an optical transmitter module that is hermetically sealed and outputs light through a glass or lens window or an optical fiber on the outside is commercially available.

[0003]

However, in these materials, a strong metal is used to prevent the invasion of the inert liquid or the inert gas, or to prevent moisture or the like from entering the semiconductor laser chip so as to prevent them from entering. A hermetic package is used, and a ferrule is attached to the optical fiber for easy handling when optically coupling the optical fibers, which is a bottleneck in production and cost.

In the case of a high-bandwidth optical transmission module having a semiconductor laser driving circuit built-in, the electromagnetic waves generated in the electric circuit portion of the high-frequency optical transmission module affect other devices or the operation of the device itself as noise. In order to suppress this, a metal package is provided to shield against electromagnetic waves, which also contributed to the increase in cost.

An object of the present invention is to eliminate the labor of separately manufacturing a robust package, which is a problem in the above-mentioned prior art, and to integrate a lens for optical coupling and a ferrule to thereby realize an optical transmission module. To provide a structure of an optical transmitter module including a shield structure for electromagnetic waves.

[0006]

In order to solve the above problems, the present invention uses a resin that transmits light having an oscillation wavelength of a semiconductor laser chip and protects a light emission port and a fiber end face of the semiconductor laser chip. did.

That is, the first optical transmission module of the present invention is
A semiconductor laser chip and an optical fiber are used, which are hardened by a chemical reaction, a curing material, heat, or an electromagnetic wave, and a resin that transmits light having an oscillation wavelength of the semiconductor laser chip in a cured state is The optical coupling lens surface attached to the light emitting port or the semiconductor laser chip and the fiber end face are hermetically sealed,
The laser light from the semiconductor laser chip is characterized by passing through the resin before entering the optical fiber.

In this case, the semiconductor laser chip is preferably hermetically sealed with the resin. In this structure, the same resin is also used to hermetically seal the semiconductor laser chip. This eliminates the need for a separate hermetic package.

Further, in this case, the resin for hermetically sealing the semiconductor laser chip is provided with an optical path parallel to the optical axis direction of the laser light of the semiconductor laser chip from the surface to the laser light emitting port of the semiconductor laser chip. It is desirable to open a hole having a size and a length long enough to insert and fix the fiber, insert the optical fiber into the hole, and fix the optical fiber in a state of being optically coupled. In this structure, a hole is made in the resin that hermetically seals the semiconductor laser chip, the optical fiber is inserted, and the optical fiber is fixed in the state of optical coupling, thereby eliminating the need for a ferrule. Further, in this case, in order to securely fix the optical fiber, it is preferable to provide a convex or concave structure for position fixing in a portion of the optical fiber to which the resin is attached.

In any one of the above, it is preferable that the resin between the semiconductor laser chip and the optical fiber constitutes a lens for guiding the laser light from the semiconductor laser to the optical fiber. A lens for coupling will also be configured. Further, in this case, it is desirable that the lens is made of two or more kinds of resins having different light refractive indexes.

In any of the above, it is desirable that the resin also acts to fix the optical fiber to the substrate or the stem on which the semiconductor laser chip is mounted, and the same applies to the physical fixing of the optical fiber. By using a resin, fixing of the optical fiber can be simplified. Further, in this case, in order to securely fix the optical fiber, it is preferable to provide a convex or concave structure for fixing the position in a portion of the optical fiber to which the resin is attached. ◆ In any one of the above, it is preferable that the resin is an epoxy resin.

The second optical transmission module of the present invention is
It uses a semiconductor laser chip and an optical fiber.The semiconductor laser chip is covered with a resin that does not cure when it receives light of the oscillation wavelength of the semiconductor laser chip, and the resin is cured and cured while the semiconductor laser chip emits light. By removing the resin that did not exist, a hole with the same shape as the projection pattern of the semiconductor laser chip is made in the resin that covers the semiconductor laser chip, and the optical fiber is inserted into this hole to optically couple the semiconductor laser chip and the optical fiber. It is characterized by performing. That is, the method of making a hole for inserting an optical fiber and the resin are specified.

Further, the third optical transmission module of the present invention is
A semiconductor laser chip and an optical fiber are used, and when the cured resin receives light of the oscillation wavelength of the semiconductor laser chip, the semiconductor laser chip is covered with a resin that has the property that only the part that receives the light is altered. After the resin is cured, the semiconductor laser chip is made to emit light, and only the resin that has been deteriorated by receiving the laser light is removed, so that a hole with the same shape as the projection pattern of the semiconductor laser chip is formed in the resin covering the semiconductor laser chip. It is characterized in that the semiconductor laser chip is opened and an optical fiber is inserted into this hole to optically couple the semiconductor laser chip and the optical fiber. That is, the second aspect of the present invention
The optical transmission module is different from the optical transmission module described above in that a hole is made by using a resin and an optical fiber is inserted.

In the second and third optical transmission modules of the present invention described above, a lens is fitted into the hole having the same shape as the projection pattern of the semiconductor laser chip formed in the resin (the optical coupling lens is inserted), and the light is emitted. It is preferable to fix the optical fiber in the hole while the fiber and the semiconductor laser chip are optically coupled.

Further, in the second and third optical transmission modules of the present invention, another resin having a different refractive index from the resin is poured into a hole having the same shape as the projection pattern of the semiconductor laser chip formed in the resin, It is preferable to perform optical coupling by curing and utilizing the difference in the refractive index between the resins to optically couple the semiconductor laser chip and the optical fiber, that is, to guide the laser light from the semiconductor laser chip to the optical fiber.

Further, in any of the above-mentioned present invention, it is preferable that the semiconductor laser chip driving circuit is also hermetically sealed with a resin, so that the cost can be further reduced.
In any of the above inventions, a metal plate or film connected to earth or a power supply voltage on or in the surface of the resin for the purpose of shielding electromagnetic waves generated from its own or other electric circuit parts, or It is preferable to provide a structure in which the electromagnetic circuit absorber covers its own electric circuit part, that is, in order to suppress noise of electromagnetic waves generated from the electric circuit part, a shield is provided on or in the resin.

[0017]

In the present invention, the light emitting port of the semiconductor laser chip and the end face of the fiber are hermetically sealed by the resin which transmits the light of the oscillation wavelength of the semiconductor laser chip in the optically coupled state.
This makes it easy to protect each element. ◆ Further, by sealing the semiconductor laser chip with the same resin, it is not necessary to separately form an airtight package, and the cost can be reduced.

A hole is made in the resin that hermetically seals the semiconductor laser chip, the hole is used as a guide, the optical fiber is inserted, and the optical fiber is fixed in the state of being optically coupled. It is possible to improve productivity by eliminating the trouble of manufacturing ferrules. Also, by predetermining the shape, size, and position of the hole to be suitable for optical coupling between the optical fiber and the semiconductor laser chip, it is possible to achieve optical coupling simply by inserting the optical fiber firmly. Therefore, it is not necessary to adjust the position while turning on the semiconductor laser chip.

If the same resin used for hermetically sealing the semiconductor laser chip is used to form the lens for optical coupling, it is not necessary to separately manufacture the lens and mount it while aligning the lenses. ◆ If two types of resin with different light refraction index are used to construct a lens, the lens with a high refraction index can be placed inside the airtight sealing resin inside the hole of the cylindrical cross section. A lens can be built without using a difficult-to-process lens shape such as a spherical surface.

The fixing of the optical fiber is simplified by using the resin for fixing the optical fiber to the substrate or the stem. ◆ In order to securely fix the optical fiber, provide a convex or concave structure on the part of the optical fiber where the resin adheres,
When the resin adheres to this and hardens, this convex or concave structure functions as a hook, and functions to suppress the change in the position of the optical fiber and the dropout thereof. If this resin is specified as an epoxy-based resin, there are many types of epoxy-based resins as LED encapsulants, and many have low stress.

The semiconductor laser chip is covered with a resin that does not cure when it receives light of the oscillation wavelength of the semiconductor laser chip, and the resin is cured while the semiconductor laser chip emits light, and the uncured resin is removed. A hole with the same shape as the light projection pattern of the semiconductor laser chip is made in the resin covering without using a method such as machining or etching, and an optical fiber is inserted into this hole to optically couple the semiconductor laser chip and the optical fiber. By doing so, the cost and labor of drilling is reduced, and the optical coupling property is improved.

The semiconductor laser chip is covered with a resin having a property that when the light having the oscillation wavelength of the semiconductor laser chip is received by the cured resin, the semiconductor laser chip is covered with the resin, and the semiconductor is cured. By making the laser chip emit light and removing the resin that has deteriorated by receiving the laser light, a hole having the same shape as the projection pattern of the semiconductor laser chip is not machined or etched in the resin covering the semiconductor laser chip. By making an optical fiber into this hole and optically coupling the semiconductor laser chip and the optical fiber, the cost and labor of the hole making are reduced and the optical coupling property is improved.

In the second and third optical transmission modules of the present invention, the separately manufactured optical coupling lens is inserted into the hole formed by these, and the optical fiber and the semiconductor laser chip are optically coupled to each other. The fiber is fixed in the hole, and these can facilitate the optical coupling.

Further, in the second and third optical transmission modules of the present invention, another resin having a different refractive index is poured into the hole formed by these, and the difference in the refractive index is utilized to remove the resin from the semiconductor laser chip. By guiding the laser light to the optical fiber, the optical coupling is performed, so that the optical coupling can be facilitated.

Since the same resin is used for hermetically sealing the electric circuit for driving the semiconductor laser chip, the number of steps can be reduced and the cost can be reduced. ◆ By absorbing the electromagnetic wave generated from the electric circuit part by the metal plate or film connected to the earth or the power supply voltage, or the electromagnetic wave absorber, the influence of the electromagnetic wave on other circuits or itself can be suppressed.

[0026]

Embodiments of the present invention will be described below with reference to the drawings. 1 shows the structure of the optical transmission module according to the first embodiment of the present invention. The semiconductor laser chip 1 has a size of about 0.3 mm square, is fixed to the substrate 19, has an oscillation wavelength between about 0.65 μm and about 1.55 μm, and particularly near 0.85 μm and 1.3 μm. ,
The one having an oscillation wavelength in the vicinity of 1.55 μm is used.

Therefore, as the resin 2, a resin having a high transmittance of light of this wavelength is used, and an epoxy resin used for sealing an infrared LED or a high brightness or ultra high brightness LED can be used. These LED epoxy resins have a low stress, are less likely to damage the semiconductor laser chip and the fiber during curing, and often have a low chlorine ion concentration, and therefore are less likely to be damaged by chlorine during long-term use.

The end face of the optical fiber 5 is often angled in order to reduce the influence of the return of the reflected light to the semiconductor laser chip 1. This angle is 10
It is often less than °, especially 6.5 to 8 °. The substrate 19 is often made of silicon, glass epoxy, alumina, or the like, and often has a V-shaped groove for fixing the optical fiber 5.

In FIG. 1, the laser light emitting port 3 of the semiconductor laser chip 1 and also the semiconductor laser chip 1 itself are covered with the resin 2 and hermetically sealed. ◆ Again
Also on the optical fiber 5 side, the end face 6 that receives the laser light from the semiconductor laser chip is covered with the resin 2. Furthermore, the lens 4 for optical coupling is also covered with the resin 2, and the optical coupling portion from the semiconductor laser chip to the optical fiber of this optical transmission module is hermetically sealed and protected by the resin 2.

The resin 2 may be applied only after the electrical wiring to the semiconductor laser chip 1 is completed, and the optical fiber 5 and the like may be inserted after the resin 2 is applied, but the resin 2 is hardened.
It must be performed in a state where the semiconductor laser chip 1 and the optical fiber 5 are optically coupled. Unlike the method of hermetically sealing an inert gas or the like using a hermetic package or the like, the hermetic sealing with the resin 2 does not require machining, is inexpensive, and has high productivity.

FIGS. 2, 3 and 4 show another embodiment of the present invention. FIG. 2 shows an embodiment in which the optical coupling lens 4 is removed from the optical transmission module of FIG. 1 and a direct optical coupling system of the semiconductor laser chip 1 and the optical fiber 5 is adopted. FIG. 3 shows an example in which the surface emitting semiconductor laser chip 6 is used.

In the surface-emitting semiconductor laser chip 6, since the laser light is output from the light-emitting surface 7 on the surface, not from the exit of the end face, the light-emitting surface 7 and the optical fiber 5 are oriented differently as in the structure shown in FIG. Structure 8 that changes the direction of light when
Is provided. It often consists of prisms or mirrors. Further, in this example, the optical coupling lens 9 is formed in advance on the surface emitting semiconductor laser chip 6.

FIG. 4 also shows a surface emitting semiconductor laser chip 6.
This is an example of the case of using direct optical coupling without using the structure 8 for changing the direction of light in FIG. Here, the structure 8 for changing the direction of light is eliminated by aligning the direction of the surface emitting semiconductor laser chip 6 with the optical fiber 5.

FIG. 5, FIG. 6 and FIG. 7 are explanatory views of an embodiment relating to claim 3. First, as shown in FIG. 5, the semiconductor laser chip 1 and the optical coupling lens 4 are adjusted in advance so that the optical coupling between the optical fiber 5 and the semiconductor laser chip 1 and the optical coupling lens 4 are adjusted in advance. Cover with resin 2, cure and hermetically seal. Here, as shown in FIG. 6, from the surface of the cured resin 2 to the laser beam emitting port 3 of the semiconductor laser chip 1.
A hole 10 having a size and a length long enough to insert and fix the optical fiber 5 is made in parallel with the optical axis direction of the laser light of the semiconductor laser chip 1 which is directed to F. Next, the optical fiber 5 is inserted into the hole 10 for optical coupling, and the fixative 1 placed in the hole 7
The optical fiber 2 is fixed by 1. Here, the fixing agent 11 may be the resin 2.

FIG. 7 is an explanatory view of another embodiment relating to claim 3. In this embodiment, after the resin 2 is hardened, the optical axis of the laser light of the semiconductor laser chip 1 is directed to the laser light emitting port 3 of the semiconductor laser chip 1 to which a lubricant is applied in advance, instead of forming the hole 10. After the resin 2 is cured with the mold 12 of the hole 10 having a size and length sufficient for inserting and fixing the optical fiber 5 parallel to the direction, the mold 12 is removed and the hole 10 is removed. To make. Further, a direct optical coupling system of the semiconductor laser chip 1 and the optical fiber 5 in which the lens 4 is omitted as in FIG.

FIG. 8 is an explanatory diagram relating to the embodiment of claim 4. Only the semiconductor laser chip 1 is hermetically sealed, and the cured resin 2 is provided with a hole 14 having a lens-shaped bottom surface 13. The optical fiber 5 is inserted therein, optically coupled and then fixed. This eliminates the need for a lens as a separate component, thus reducing the production cost. This hole 14
It is also possible to open the cured resin 2 by machining, but it is also possible to make it by putting a mold 15 having a lens shape at the tip as shown in FIG.

FIG. 10 is an explanatory diagram concerning the embodiment of claim 5. Hole 10 opened by molding or processing
The lens 17 is formed by inserting another resin 16 having a higher refractive index into the lens. After that, the optical fiber 5 is inserted, optically coupled, and fixed to form an optical transmission module.

FIG. 11 shows an embodiment of claim 6. In the above-mentioned embodiment, the optical fiber 5 maintains the optical coupling with the semiconductor laser chip 1 or the lens 4, etc.
The position was fixed. However, in order to actually mount the optical transmission module on the circuit board, it is better that the outer shape of the module is arranged in terms of mounting. That is, the optical fiber 5
Of the optical fiber 5 to the substrate 19 in order to make the place where the resin comes out of the resin constant or to make the bottom surface 18 of the module flat.
It becomes necessary to fix it against. Conventionally, an adhesive or solder has been used for such a fixed portion 20, but the cost can be reduced by using the airtight sealing resin 2 as it is.

FIG. 12 shows an embodiment of claim 7 in which a portion 21 having a convex shape is provided on a portion of the optical fiber 5 fixed by the resin 2. Such a shape can be formed by heating the tip of the optical fiber 5 to crush it, or shaving the fiber by machining. Such a convex structure acts as a hook in the resin 2 and acts like a hook, so that it is possible to prevent the optical fiber 5 from coming off, misaligning, and the like. The same effect can be expected with a concave structure.

FIG. 13 shows an embodiment relating to claim 9. First, the semiconductor laser chip 1 is covered with a resin 22 that does not cure when it receives light of the oscillation wavelength of the semiconductor laser chip 1, and the resin 22 is cured while the semiconductor laser chip 1 emits light.
By removing the holes, a hole 24 having the same shape as the projection pattern of the semiconductor laser chip 1 as shown in FIG. 14 is made in the resin 22 covering the semiconductor laser chip 1, and the optical fiber 5 is aligned with the hole 24. The semiconductor laser chip 1 is attached and the optical fiber 5 is optically coupled.
In this example, according to this method, a hole having the same shape as the projection pattern of the semiconductor laser chip 1 can be formed without performing mechanical processing, so that the production cost can be reduced. In this embodiment, the connection portion of the resin 22 with the optical fiber 5 is formed by separately processing.

FIG. 15 shows an embodiment of claim 10 in which when the cured resin 25 receives the light having the oscillation wavelength of the semiconductor laser chip 1, only the portion that receives the light is changed in quality. After the semiconductor laser chip 1 is covered and the resin 25 is cured, the semiconductor laser chip 1 is made to emit light, and only the resin 26 that has been altered by receiving the laser light is removed by using a solvent or the like to cover the semiconductor laser chip 1. A hole 27 having the same shape as the projection pattern of the semiconductor laser chip 1 as shown in FIG.
Open, connect the optical fiber 5 according to this hole 27,
The semiconductor laser chip 1 and the optical fiber 5 are optically coupled. With this method as well, a hole having the same shape as the projection pattern of the semiconductor laser chip 1 can be formed without performing mechanical processing as in the method described in claim 9. In this embodiment, the connection portion of the resin 17 with the optical fiber 5 is formed by separately processing.

FIG. 17 shows an embodiment according to claim 11. The hole 29 having the same shape as the light projection pattern of the semiconductor laser chip 1 opened in the resin 28 covering the semiconductor laser chip is formed by the method described in claim 9 or 10. By inserting the lens 30 here, condensing the laser light from the semiconductor laser chip 1 and putting it in the optical fiber 5, the optical coupling efficiency can be increased.

FIG. 18 shows an embodiment according to claim 12. Instead of inserting the lens 30 as shown in FIG. 17, a lens is formed by inserting a resin 31 having a light refractive index of 28 or more and a resin 32 having a higher light refractive index, which covers the semiconductor laser chip, into the hole 29. Is. By adjusting the thickness appropriately, the resin 32 on the inner side has a higher refractive index than the resin 31, so that reflection or refraction occurs at the boundary surface 33 and functions as a lens.

FIG. 19 shows an embodiment relating to claim 13. In order to drive the semiconductor laser chip 1, an electric circuit for driving is required, and most of them are currently made into IC chips. The drive IC chip 35 needs to be mounted in a hermetically sealed state as close to the semiconductor laser chip 1 as possible in terms of mounting area, noise countermeasures, power consumption, etc. Often they were placed in an airtight package along with the components, which made it necessary to make a large airtight package.
In the present invention, the driving IC chip 35 is hermetically sealed together with the resin 34 that hermetically seals the semiconductor laser chip 1 to reduce the number of steps.

20, 21, and 22 show an embodiment relating to claim 14. FIG. 20 is a cross-sectional view of the optical transmission module, in which the metal box 36 connected to the ground in the hermetically sealing resin 34 covers the electric circuit portion 37 as an electromagnetic wave shield so as not to contact other conductive portions. The material of the metal box may be copper, kovar, aluminum, gold-plated metal, gold-tin alloy, lead-tin alloy, or the like, but in order to effectively suppress electromagnetic waves, a highly conductive material such as copper is preferable. If importance is attached to the life of hermetic sealing, it is preferable that the coefficient of linear expansion and Young's modulus be close to that of the hermetic resin 34. Most of the electromagnetic waves generated from the self or other electric circuit parts are released from the box 36 as a current to the ground and do not affect the own circuit. However, the box 36 has a hole for passing the laser beam through the resin or the optical fiber, and is not hermetically sealed. The hermetic sealing is performed only by the resin 34.

In the example of FIG. 21, the metal film 38 in which the airtight sealing resin 34 is connected to the ground is covered. However, this metal film does not contact other conductive parts. The material of this membrane is
Copper, kovar, aluminum, gold-plated metal, gold-tin alloy,
A lead-tin alloy is considered, but a highly conductive material such as copper is preferable in order to efficiently suppress electromagnetic waves, and if the life of hermetic sealing is emphasized, the linear expansion coefficient or Young's modulus is the hermetic sealing resin 3.
Those close to 4 are good. This film suppresses electromagnetic noise to the other as in the case of FIG.

In FIG. 22, the airtight sealing resin 34 is covered with the electromagnetic wave absorbing material 39. Most of the electromagnetic waves generated from the electric circuit portion 37 are dissipated as heat by the electromagnetic wave absorber 39 or released to the ground as an electric current.
Electromagnetic noise can be suppressed as in the case shown in FIG. If this electromagnetic wave absorber 39 also attaches importance to the life of hermetic sealing, it is preferable that its linear expansion coefficient and Young's modulus are close to those of the hermetic sealing resin 34.

[0048]

According to the present invention, for the hermetic sealing of the semiconductor laser chip, the lens, the optical fiber, the circuit for driving the semiconductor laser chip, etc. in the optical transmission module, the separately manufactured hermetic package of metal, ceramic or the like is used. A structure and a method for airtightly and easily sealing at low cost are shown, and the cost can be reduced by forming the lens with resin. Also, electromagnetic noise countermeasures can be taken by combining the structure for electromagnetic wave shielding.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the structure of an optical transmission module according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the structure of an optical transmission module according to another embodiment of the present invention.

FIG. 3 is a sectional view showing the structure of an optical transmission module according to another embodiment of the present invention.

FIG. 4 is a sectional view showing the structure of an optical transmission module according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a state in which a hole for mounting an optical fiber is opened in a sealing resin when manufacturing an optical transmission module which is an embodiment of the present invention.

6 is a cross-sectional view showing a state in which an optical fiber is mounted in the optical fiber mounting hole shown in FIG.

FIG. 7 is a cross-sectional view illustrating the making of an optical fiber mounting hole using a mold according to another embodiment of the present invention.

FIG. 8 is a cross-sectional view when the bottom surface of the optical fiber mounting hole that is an embodiment of the present invention has a lens shape.

FIG. 9 is a cross-sectional view illustrating a method of forming an optical fiber mounting hole having a lens-shaped bottom surface using a mold according to an embodiment of the present invention.

FIG. 10 is a cross-sectional view illustrating a method of forming a lens using another resin that is an embodiment of the present invention.

FIG. 11 is a cross-sectional view showing fixing of an optical fiber to a substrate which is an embodiment of the present invention.

FIG. 12 is a cross-sectional view showing fixing of an optical fiber having a convex structure, which is an embodiment of the present invention, to a substrate.

FIG. 13 is a cross-sectional view showing sealing of the semiconductor laser chip with a resin that does not cure when it receives light having an oscillation wavelength of the semiconductor laser chip according to the embodiment of the present invention.

FIG. 14 is a cross-sectional view showing a state in which an unhardened portion of the resin in FIG. 13 is removed.

FIG. 15 is an example of the present invention, in which a semiconductor laser chip is sealed with a resin having a property that when a cured resin receives light having an oscillation wavelength of a semiconductor laser chip, only a portion that receives the light is deteriorated. It is explanatory drawing which shows a state.

16 is a cross-sectional view showing a state in which a modified portion of the resin in FIG. 15 is removed.

FIG. 17 is an explanatory diagram showing a state in which a lens is inserted into the resin hole in FIG. 14 or FIG. 16 that is an embodiment of the present invention.

FIG. 18 is an explanatory diagram showing a state in which a lens is made of resin instead of the lens in FIG. 17 that is an example of the present invention.

FIG. 19 is an explanatory diagram showing a state in which the electric circuit portion according to the embodiment of the present invention is also resin-sealed.

FIG. 20 is an explanatory view showing a state in which a metal box for electromagnetic wave shielding is provided in resin which is an example of the present invention.

FIG. 21 is an explanatory view showing a state in which the surface of the sealing resin according to the embodiment of the present invention is covered with a metal film, and the electric circuit portion is also resin-sealed.

FIG. 22 is an explanatory diagram showing a state in which the surface of the sealing resin according to the embodiment of the present invention is covered with an electromagnetic wave absorbing material.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor laser chip, 2 ... Resin, 3 ... Laser light emission light, 4 ... Optical coupling lens, 5 ... Optical fiber, 6 ... Surface emitting semiconductor laser chip, 7 ... Light emitting surface, 8 ... Structure which changes the direction of light Object, 9 ... Lens, 10 ... Fiber insertion hole, 11 ...
Fiber fixing agent, 12 ... Hole mold, 13 ... Hole bottom surface, 14
... Fiber insertion hole whose bottom surface is lens-shaped, 15 ... Lens-shaped hole mold, 16 ... Sealing resin, 17 ... Lens, 18
... Module bottom, 19 ... Substrate, 20 ... Fixed part, 21
... convex structure, 22 ... sealing resin, 23 ... uncured resin, 24 ... hole, 25 ... sealing resin, 26 ... altered resin, 27 ... hole, 28 ... sealing resin, 29 ... hole, 30 ... Lens, 31 ... Resin for lens construction No. 1, 32 ... Resin for lens construction No. 2, 33 ... Resin interface for lens construction, 34 ...
Sealing resin, 35 ... Laser driving IC chip, 36 ... Metal box, 37 ... Electric circuit, 38 ... Metal film, 39 ... Electromagnetic wave absorber.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical indication location H04B 10/28 10/02 (72) Inventor Tetsuo Kumazawa 502 Kandachi-cho, Tsuchiura-shi, Ibaraki Japan Inc. Tate Seisakusho Mechanical Research Center

Claims (14)

[Claims] 1. An optical transmission module using a semiconductor laser chip and an optical fiber, wherein a resin that is cured by a chemical reaction or a curing material or heat or electromagnetic waves and that transmits a light having an oscillation wavelength of the semiconductor laser chip in a cured state is used. The light emitting port of the semiconductor laser chip or the surface of the optical coupling lens attached to the semiconductor laser chip and the end face of the fiber are hermetically sealed, and the laser light from the semiconductor laser chip passes through the resin before the optical fiber. An optical transmitter module characterized by entering. 2. The optical transmission module according to claim 1, wherein the semiconductor laser chip is hermetically sealed with the resin. 3. The resin according to claim 2, wherein the resin that hermetically seals the semiconductor laser chip is parallel to the optical axis direction of the laser light of the semiconductor laser chip, from the surface thereof toward the laser light emission port of the semiconductor laser chip. Then insert the optical fiber,
An optical transmission module characterized by forming a hole having a size and a length sufficient for fixing, inserting an optical fiber into the hole, and fixing the optical fiber in a state of being optically coupled. 4. The light according to any one of claims 1 to 3, wherein the resin between the semiconductor laser chip and the optical fiber constitutes a lens for guiding the laser light from the semiconductor laser to the optical fiber. Send module. 5. The optical transmission module according to claim 4, wherein the lens is made of two or more kinds of resins having different light refractive indexes. 6. The optical transmitter module according to claim 1, wherein the resin also acts to fix an optical fiber to a substrate or a stem on which a semiconductor laser chip is mounted. . 7. The optical transmission module according to claim 3 or 6, wherein a convex or concave structure for fixing a position is provided in a portion of the optical fiber to which the resin is attached. 8. The optical transmission module according to claim 1, wherein the resin is an epoxy resin. 9. In an optical transmission module using a semiconductor laser chip and an optical fiber, the semiconductor laser chip is covered with a resin that does not cure when it receives light having an oscillation wavelength of the semiconductor laser chip, and the resin is emitted while the semiconductor laser chip emits light. By hardening and removing the unhardened resin, a hole with the same shape as the projection pattern of the semiconductor laser chip is made in the resin that covers the semiconductor laser chip, and an optical fiber is inserted into this hole to form the semiconductor laser chip. An optical transmission module, which performs optical coupling of optical fibers. 10. An optical transmission module using a semiconductor laser chip and an optical fiber, wherein when a cured resin receives light having an oscillation wavelength of the semiconductor laser chip, only a portion of the resin that receives the light is altered. After the semiconductor laser chip is covered and the resin is cured, the semiconductor laser chip is made to emit light, and only the resin that has deteriorated due to the laser light is removed, so that the resin that covers the semiconductor laser chip has a projection pattern of the semiconductor laser chip. An optical transmission module characterized by opening a hole of the same shape, inserting an optical fiber into this hole, and optically coupling the semiconductor laser chip and the optical fiber. 11. An optical transmission module according to claim 9 or 10, wherein a lens is fitted in a hole having the same shape as the projection pattern of the semiconductor laser chip formed in the resin to perform optical coupling with an optical fiber. 12. The refraction between resins according to claim 9 or 10, wherein another resin having a different refractive index from the resin is poured into a hole formed in the resin and having the same shape as the projection pattern of the semiconductor laser chip, and the resin is cured. An optical transmission module characterized in that a semiconductor laser chip and an optical fiber are optically coupled by utilizing the difference in the rate. 13. The method according to any one of claims 1 to 12,
An optical transmitter module in which the semiconductor laser chip drive circuit is also hermetically sealed with resin. 14. The method according to any one of claims 1 to 13,
In order to shield the electromagnetic wave generated from its own or other electric circuit part, the electric circuit part of itself is covered with a metal plate or film connected to the earth or the power supply voltage or the electromagnetic wave absorber on or in the resin. An optical transmitter module having a structure.