JPH0810874A - Lead cutting device - Google Patents

Abstract

PURPOSE:To shorten the working time for changing a die. CONSTITUTION:A practice stage 20 and a set-up stages 21, 22 are set on a machine stand 11, and a die unit 29 is installed in reciprocally movably between the executing stage 20 and the set-up stages 21, 22. A driving device 26 to drive a die of the die unit 29 is installed on the practice stage 20, and a clamper 70 to oppose the die unit 29 to the driving device 26, to position and hold it is installed. Because the set-up working can be advanced on the set-up stage during operating the cutting working or a lead on the practice stage, the die unit preliminarily set up on the set-up stage can be moved to the executing stage in a time of changing the die. In short, the working time for changing the die can be shortened to the time of required minimum limit only to move the preceding die unit and the pre-prepared following die unit between the set-up stage and the practice stage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a lead cutting and molding apparatus,
In particular, regarding the technology for shortening the mold replacement work time, for example,
The present invention relates to a semiconductor device that is effectively used for separating a semiconductor device assembled in a multiple lead frame from the multiple lead frame and molding the outer leads in a manufacturing process of the semiconductor device.

[0002]

2. Description of the Related Art As a conventional lead cutting and forming apparatus of this type, for example, as described in Japanese Patent Application Laid-Open No. 55-8351, a supply apparatus for supplying multiple lead frames and a multiple lead frame are provided. A guide rail for guiding, a feeding device for pitch-feeding multiple lead frames, a cutting device for sequentially separating electronic devices from the multiple lead frames, and a lead forming device for bending the outer leads of the separated electronic devices. , Each of them has its own equipment.

[0003]

However, in such a lead cutting and forming apparatus, when the product type or specification of the product to be cut and formed is changed, the attachment / detachment work of each unit and the installation of each unit after the installation are performed. Adjustment is required, and in particular, the work of removing the mold from the mold drive unit, which is the final work, and the work of mounting the next mold require manual work by humans, so it is very difficult to replace the mold. There is a problem that the time is consumed.

An object of the present invention is to provide a lead cutting and molding apparatus for a semiconductor device, which can shorten the time for exchanging molds.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0006]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a work in which a plurality of electronic devices are assembled on a multiple lead frame is supplied to bend and form the leads of each electronic device of the multiple lead frame, and at the same time, each electronic device is connected to the multiple lead frame. In a lead cutting and molding apparatus equipped with a die unit for separating from a frame of a frame, an execution stage and a setup stage are respectively set on a machine base, and the die unit reciprocates between the execution stage and the setup stage. The execution stage is provided with a drive device that drives the mold of the mold unit, and a clamper that positions and holds the mold unit so as to face the drive device. It is characterized by

[0008]

According to the above-mentioned means, the setup work can be carried out in the setup stage while the lead cutting and forming work is being carried out in the execution stage. The pre-prepared mold unit can be moved to the execution stage. In other words, the mold replacement time is
It is possible to shorten the required minimum time for moving the previous die unit from the execution stage to the setup stage and moving the next prepared die unit from the setup stage to the execution stage.

When at least one pair of setup stages is set, the die unit before being lowered from the execution stage is moved to one setup stage, and immediately thereafter, it is prepared for the other setup stage. Since the next die unit present can be moved to the execution stage, the waiting time for movement can be suppressed to a minimum, and the die replacement work time can be further shortened.

Further, when the die unit moving device is installed on the machine base, the die unit can be automatically moved between the execution stage and the setup stage, so that the die can be replaced. The work time can be further shortened and the work safety can be improved. Also, since one moving device only needs to be installed on the machine base,
The facility cost can be reduced as compared with the case where the moving devices are respectively provided on the mold unit side.

[0011]

1 is a schematic plan view showing a lead cutting and forming apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view thereof. FIG. 3 is a front view showing the execution stage, and FIG. 4 is a side view thereof. FIG. 5 is a partially omitted perspective view showing the mold unit,
FIG. 6 is a plan view showing the lower mold, FIGS. 7A and 7B are partially omitted front views and side views, and FIGS. 8A and 8B are partially omitted front views showing the upper molds. It is a bottom view. FIG. 9 shows a mold unit moving device, (a) is a plan view,
10B is a front view, and FIGS. 10A and 10B are a left side view and a right side sectional view. FIG. 11 shows a clamper of the mold unit, (a) is a plan view, (b) is a partially omitted side sectional view taken along line bb of (a), and FIG. 12 is also FIG. 11 (a). Is a front sectional view taken along line XII-XII of FIG. 13, and FIG. 13 is a side view of FIG.

In the present embodiment, a work 1 which is an object to be processed by the lead cutting and molding apparatus according to the present invention is constructed by assembling a plurality of semi-finished products 3 of a semiconductor integrated circuit device as an electronic device on a multiple lead frame 2. Consists of Although detailed description and illustration are omitted, the semi-finished product 3 is generally manufactured as follows. The multiple lead frame 2 is provided with a plurality of unit lead frames (not shown) arranged in one row. A semiconductor pellet is bonded to the tab of each unit lead frame of the multiple lead frame 2, and the semiconductor pellet is Wires are bridged between the inner lead of each unit lead frame. Further, the semiconductor pellet, the inner lead and the bonding wire are resin-sealed by a resin sealing body formed of a molding material containing epoxy resin as a main component.

In the present embodiment, the lead cutting and molding apparatus 10 according to the present invention is provided with a machine base 11, and a loading stage is provided at a left end portion of the machine base 11 (left and right, front and rear are based on FIG. 1). 12 is set. A work transfer device 13 is installed on the loading stage 12. Although detailed description and illustration are omitted, the work transfer device 13 includes a holding head 14 that holds the work 1 by vacuum suction, and the holding head 14 in the front, rear, left, right, up, down (X
And a transfer device 15 for transferring in the YZ direction, and is configured to hold the work 1 supplied to the loading stage 12 by vacuum suction and transfer it to an execution stage described later.

An unloading stage 16 is set at the right end of the machine base 11, and a work transfer device 17 is also installed on the unloading stage 16. This work transfer device 17 is also the suction head 1.
8 and a transfer device 19, which holds the product 4 constituted by separating the semi-finished product 3 from the work 1 in the execution stage by vacuum suction, and the unloading stage 16
It is configured to be transferred to and stored in a tray or the like.

At the center of the machine base 11, an execution stage 20 for executing a cutting and forming operation, a first setup stage 21 and a second setup stage 22 are set. The execution stage 20 is arranged on the line segment connecting the loading stage 12 and the unloading stage 16, and
The setup stage 21 and the second setup stage 22 are arranged on both right and left sides directly behind the execution stage 20, respectively. A first guide rail 23 is laid in the front-rear direction (Y direction) directly behind the execution stage 20, and a second guide rail 24 is provided at the rear end portion of the first guide rail 23 in the left-right direction (X direction). ) Has been laid. These guide rails 23 and 24 are configured so that a die unit, which will be described later, can be slid and guided in the XY directions. A mold unit moving device 50, which will be described later, is installed at the rear end of the machine base 21, and the mold unit moving device 50 moves the mold unit along the guide rails 23 and 24 to the execution stage 20 and the first stage. First setup stage 21 and second
It is configured to be able to reciprocate between the setup stage 22.

A stand 25 is constructed on the execution stage 20, and a press device 26 as a mold driving device is installed on the stand 25 in a vertically downward direction. The press device 26 includes a pressing rod 27 that is vertically moved by using a motor as a drive source,
The pressing rod 27 is configured to be automatically connected to and released from the upper die of the die of the die unit.

In this embodiment, a plurality of mold units 29 are prepared, and these mold units 29 are reciprocally moved between the execution stage 20, the first setup stage 21 and the second setup stage 22. As a result, it is possible to save the time for changing the mold. That is, since the setup work can be advanced in the setup stages 21 and 22 while the lead cutting and forming work is being performed in the execution stage 20, the setup stages 21 and 22 need to be preliminarily set in advance during the die replacement work. Execution stage 20 of the prepared mold unit 29
Can be moved to. That is, in the die replacement work time, the previous die unit is moved from the execution stage 20 to the setup stages 21 and 22, and the next prepared die unit is moved from the setup stages 21 and 22 to the execution stage 20. It can be shortened to the minimum necessary time for moving.

Each mold unit 29 includes a lower mold 30 as a fixed mold and an upper mold 40 as a movable mold. The lower die 30 has a base 31 and a base 3
1 includes a lead cutting die 32 and a lead forming die 33.
And the separating die 34 are sequentially arranged from the left side to the right side, and are detachably installed. Then, these dies are manufactured so as to correspond to the type of the work 1 and appropriately installed on the base 31 of the lower die 30.

Further, a pair of front and rear guide rails 35 are arranged on the lower die 30 at the front and rear sides of the dies 32, 33, 34, respectively.
It is laid so as to extend in the left-right direction, and a pitch feed device 36 is installed on the rear side of the rear guide rail 35. The pitch feeding device 36 is configured by using a slider type rodless cylinder device or the like, and the work 1 supplied by the loading device 13 onto the guide rail 35 is moved from the left side to the right side at a pitch of each unit lead frame. It is configured to pitch feed to.

In this embodiment, a connecting member 37 is fixed to the rear end side of the lower mold 31. A pair of front-rear movement connecting holes 38 are arranged in the left-right direction at the center of the connecting member 37 and are opened in the vertical direction. Each longitudinal movement connecting hole 38 is formed in a square hole shape into which a longitudinal movement connecting pin of a mold unit moving device described later can be inserted. In addition, a pair of left and right connecting holes 39 are formed in the vertical direction at both left and right ends of the connecting member 37. Each left-right movement connecting hole 39 is formed in a circular hole shape into which a left-right movement connecting pin of the mold unit moving device can be inserted.

The upper die 40 is provided with a base 41, and the base 41 is movably supported by guide posts 45 which are provided upright at four corners on the lower die base 31 so as to be vertically movable. The pressing rod 27 of the pressing device 26 is detachably connected to the base 41 by a pressing rod connecting device 46. That is, the upper mold 40 is vertically moved along the group of guide posts 45 by the connected pressing rod 27.

The upper die 40 is provided with a lead cutting punch 42, a lead forming punch 43, and a separating punch 44, and each of the punches 42, 43, 44 is located below the base 41 by a spring and a guide post. It is designed to be detachably mounted on a mounting plate 47 which is independently suspended. The punches 42, 43, 44 are arranged in order from the left side to the right side so as to face the dies 32, 33, 34 arranged in the lower die 30, and work together with the dies on the work 1. On the other hand, the lead cutting work, the lead forming work, and the separating work of the semi-finished product 3 from the multiple lead frame 2 are performed.

A pipe wiring joint device 48 is installed vertically upward on the front end side of the base 31 of the lower mold 30. This joint device 48 is a lower mold 30.
The electric wiring (not shown) for supplying electric power to the pitch feeding device 36 incorporated in the above, and the piping for supplying pneumatic pressure or hydraulic pressure to the pressing lot connecting device 46 incorporated in the upper die 40 are automatically provided. It is configured so that they can be jointed together.

The mold unit moving device 50 installed on the machine base 11 is provided with a front and rear movement cylinder device and a left and right movement cylinder device using a slider type rodless cylinder device. The one longitudinal cylinder device 51 is laid horizontally on the center line extending in the longitudinal direction of the execution stage 20 between the first setup stage 21 and the second setup stage 22 and installed on the machine base 11. There is. A front-rear movement slider 52 is provided on the front-rear movement cylinder device 51 so as to reciprocate in the front-rear direction. On the upper surface of the slider 52, a pair of front-rear movement connecting pins 53 are arranged side by side and project vertically upward and slidably supported. Both connecting pins 53, 53
Is configured to be moved up and down with respect to the slider 52 by a cylinder device (not shown). Both front-rear movement connecting pins 53, 53 are formed in square pillar shapes which can be inserted into the respective front-rear movement connecting holes 38, 38 formed in the connecting tool 37 of the lower die 30, and the connecting holes are moved by the vertical movement. It is designed to be inserted into and removed from 38, 38.

The other left-right movement cylinder device 54 is horizontally laid behind the first setup stage 21 and the second setup stage 22 so as to extend over the outermost ends of both stages 21 and 22, and the machine base 11 Is installed in. On the left-right movement cylinder device 54, a left-right movement slider 55 is provided so as to reciprocate in the left-right direction. A pair of mounting brackets 56 are juxtaposed side by side on the slider 55 so as to be juxtaposed to the left and right.
7 is installed vertically downward. Mounting plates 58 are horizontally fixed to the piston rods of the respective cylinder devices 57, and a pair of left and right movement pins 59 are provided on both left and right ends of the mounting plates 58, 58 so as to project vertically downward. . Each left-right movement pin 59 is formed in a columnar shape that can be inserted into the left-right movement connecting hole 39 formed in the connecting tool 37 of the lower mold 30, and the connecting hole is formed by vertical movement of the mounting plate 58 by each cylinder device 57. It is designed to be inserted into and removed from the device 39.

The first setup stage 21 and the second setup stage 21
The setup stage 22 is equipped with a clamper 60 for preventing the die unit from moving. This clamper 60
Is the first setup stage 21 and the second setup stage 2
By pressing the side surface of the lower die base 31 of the die unit 29 installed in 2 with a pressing roller, it is possible to prevent the die unit 29 from floating during the setup work or the cutting and forming work on the execution stage 20. Is configured to get.

Further, in this embodiment, the execution stage 20 is equipped with a mold unit clamper 70.
The clamper 70 includes a pedestal 71 formed in a substantially square flat plate shape, and the pedestal 71 is installed on the machine base 11. A product outlet 72 having a chute is opened in the center of the pedestal 71 in a rectangular shape that is long in the left-right direction. The drop port 72 is configured so that the product 4 separated from the multiple lead frame 2 can be slid off by a chute and sequentially stored in a tray (not shown) waiting below.

A plurality of fixed blocks 73 are arranged on the pedestal 71 at the front position and the left side position of the product drop port 72, and the inner side surface of each fixed block 73 is in each mold unit 29. The lower die base 31 is arranged so as to face the front side surface and the left side surface, respectively. A pair of pressing cylinder devices 74 are installed on the right side of the product dropping port 72 in the pedestal 71 in a horizontal left direction. The pressing rods 75, 75 are rotatable on the piston rods of both cylinder devices 74, 74, respectively. Is supported by. Each press roller 75
Is rotatably supported in a horizontal plane, and is pressed against the side surface of the lower die base 31 facing each fixed block 73 by each cylinder device 74.

On the other hand, a pair of guide roller blocks 76 are arranged behind the product dropping port 72 on the pedestal 71 and are laid on both sides, respectively, and the left and right guide roller blocks 76, 76 are formed in a mold. By making rolling contact with the left and right side surfaces of the lower die base 31 of the die unit 29 which is moved with respect to the execution stage 20 by the unit moving device 50, the die unit 29 can be properly placed in the inner space of the fixed block 73 group. It is designed to move back and forth.

Further, the pedestal 71 is provided with four pressing devices 77 for pressing the lower mold base 31 of the mold unit 29 from above, and two pressing devices 77 on the left and right of the product drop port 72. Each pressing device 77 is provided with a guide pin 78 fixed vertically on the pedestal 71.
A pressing member 79 formed in the shape of a rectangular parallelepiped is supported by 8 so as to be vertically movable. The upper end of the operating rod 80 is connected to the pressing member 79.
The lower end of the pedestal penetrates the pedestal 71 downward. The lower end of the operating rod 80 is connected to a pressing cylinder device 82 via a link device 81. Therefore, the pressing member 79 can be moved up and down through the link device 81 and the operation rod 80 by the expansion and contraction operation of the cylinder device 82. Each pressing member 79 in each of the four pressing devices 77 is arranged so that the lower surface of the inner end thereof can press the upper edge portions of the left and right ends of the lower die base 31 from above.

Further, on the pedestal 71, four push-up devices 83 for pushing up the mold unit 29 from below are arranged at the inner facing positions of the pressing devices 77, respectively. Each push-up device 83 includes a push-up cylinder device 84,
The cylinder device 84 is arranged on the lower surface of the pedestal 71 at a position facing the inner side of the pressing device 77, and is installed vertically upward. A push-up pin 85 is connected upward to the upper end of the piston rod of the cylinder device 84. Therefore, each push-up pin 85 is capable of pushing up four positions on the upper end surface of the push-up pin 85, which oppose each push-down member 79 of the lower die base 31, from below by the extension operation of the cylinder device 84.

Next, the operation will be described. First, the lead cutting and forming operation by the lead cutting and forming apparatus 10 having the above-described configuration will be briefly described. In a state where the mold unit 29 corresponding to the type of the work 1 is carried into the execution stage 20 and positioned and fixed by the clamper 70, the predetermined work 1 from the loading stage 12 is guided by the work transfer device 13 to the guide rail of the mold unit 29. 35 is transferred.

After that, when the work 1 is pitch-fed by the pitch feeding device 36 of the die unit 29 and the semi-finished products 3 are set on the predetermined dies 32, 33, 34, respectively, the press device 26 is driven to press the press. Rod 27
Is lowered. When the pressing rod 27 is lowered, the upper die 40 connected to the pressing rod 27 by the connecting device 46 is lowered. Then, the cutting work for the work 1 is performed by the dies 32, 33, 34 and the punches 42, 43, 44.
A lead forming operation and a product separating operation are executed respectively.

When the predetermined work is completed, the pressing device 26
Is switched to raise the press pressing rod 27. When the press pressing rod 27 is raised, the upper mold 4
0 is lifted by the press pressing rod 11 and is in a standby state for the next work.

On the other hand, the product 4 separated from the multiple lead frame 2 is automatically stored in the tray waiting below by dropping the chute from the product dropping port 72. Further, the work 1 from which the product 4 has been cut off is fed one pitch by the pitch feeding device 36, and enters a standby state in which the above-mentioned operations are executed for each semi-finished product 3.

By repeating the above operation,
The cutting, forming and separating operations for the work 1 are sequentially carried out.

Next, the replacement work of the mold unit 29 will be described. Disconnection in the execution stage 20 described above,
During the execution of the forming and separating work, for example, in the first setup stage 21, another die unit 29 is installed, and each die and punch corresponding to the type of the work 1 to be flown next is provided in the lower die 30 and the upper die. Each is set in the mold 40. At this time, the pitch feed device 3 for the work 1
The adjustment work for 6 and the adjustment work for the pressing rod connecting device 46 are also performed. That is, all the setup work that can be performed in advance is performed.

Thereafter, the mold unit 2 is changed along with the change of the product type.
When 9 is replaced, the fluid piping and electric wiring are automatically disconnected by the wiring and piping joint device 48 of the mold unit 29 set on the execution stage 20. Further, the forward / backward movement slider 52 is moved forward by the forward / backward movement cylinder device 51 of the die unit moving device 50, and the forward / backward movement connecting pin 53 is moved to the execution stage 20.
The pin 53 is opposed to the longitudinal movement connecting hole 38 of the connecting member 37 in the upper mold unit 29, and the pin 53 is lifted and inserted into the connecting hole 38 from below. Further, the clamping of the mold unit 29 by the mold unit clamper 70 at the execution stage is released.

Next, the forward / backward movement slider 52 is moved rearward by the forward / backward movement cylinder device 51 of the die unit moving device 50, and the forward / backward movement connecting pin 53 is connected to the connecting hole 38.
The mold unit 29 inserted into the mold is pulled downward from the execution stage 20.

The mold unit 29 is the first setup stage 2
When retracted to a position between the first and second setup stage 22, the vertical movement cylinder device 57 is actuated and the horizontal movement pin 59 is inserted into the horizontal movement connecting hole 39 of the connecting member 37 from above. At this time, the left-right movement pin 59 of one bracket 56 is inserted into the left-right movement connection hole 39 of the mold unit 29 moved from the execution stage 20,
The left / right moving pin 59 of the other bracket 56 is also inserted into the left / right moving connection hole 39 of the mold unit 29 that has already been set up in the first setup stage 21. Further, the forward / backward movement connecting pin 53 is pulled out downward from the connecting hole 38.

Then, the left / right moving slider 55 is moved to the right by the operation of the left / right moving cylinder device 54. By this movement, the used mold unit 29 moved from the execution stage 20 is sent to the second setup stage 22, and the next mold unit 29 set up by the first setup stage 21 is executed by the execution stage 20. It is sent to the position just behind. Subsequently, the forward / backward movement connecting pin 53 is lifted and inserted into the forward / backward movement connecting hole 38 of the mold unit 29 which has been set up from below, and the cylinder device 57 is operated to move the left / right moving pin 59 to the left and right of the connecting tool 37. It is extracted upward into the dynamic connecting hole 39.

Thereafter, the forward / backward movement slider 52 is moved forward by the forward / backward movement cylinder device 51, and the forward / backward movement connecting pin 53 is inserted into the connecting hole 38.
Are sent to the execution stage 20. At this time, the mold unit 29 is guided not only by the second guide rail 23 but also by the left and right guide roller blocks 76, 76. The lower die base 31 of the sent die unit 29 is brought into contact with each fixed block 73.

Subsequently, the side surface pressing cylinder device 74 of the die unit clamper 70 at the execution stage moves the holding roller 75 to the left, so that the holding roller 75 fixes the lower die base 31 of the die unit 29. Press on block 73. Further, each pressing member 79 is lowered by the cylinder device 82 of the pressing device 77 via the link device 81 and the operating rod 80,
The lower die base 31 is pressed at four positions by the respective pressing members 79. Further, the push-up cylinder device 84 of the push-up device 83 pushes up the push-up pins 85, and the push-up pins 85 push up the lower die base 31 at four positions facing the press members 79. In this state, the new mold unit 29 sent to the execution stage 20 is clamped by the clamper 70.

Further, the piping / wiring joint device 48 automatically connects the pressure piping and the electric wiring. Further, the pressing rod 27 of the pressing device 26 is connected to the upper die 40 by the pressing rod connecting device 46. After that, the mold unit 2 newly set on the execution stage 20
By repeating the above-mentioned operation by 9, the cutting work, the lead forming work, and the separating work are executed for the work 1 whose type has been changed.

On the other hand, in the second setup stage 22 to which the used die unit 29 has been fed, the die unit 29 is clamped by the die floating prevention clamper 60 of the setup stage. After that, in the second setup stage 22, a predetermined setup work is carried out as described above.

According to the above embodiment, the following effects can be obtained. (1) By setting the execution stage and the setup stage respectively on the machine base, and installing the die unit so that it can reciprocate between the execution stage and the setup stage, the cutting and forming work of the lead is executed in the execution stage. Since the setup work can be advanced in the setup stage while the setup is being performed, the die unit previously set up in the setup stage can be moved to the execution stage in the die replacement work.

(2) By the above (1), it is necessary to move the previous die unit from the execution stage to the setup stage, and at the same time, move the next prepared die unit from the setup stage to the execution stage. It is possible to shorten the mold replacement work time up to the limit time.

(3) By providing a drive unit for driving the die of the die unit on the execution stage and a clamper for positioning and holding the die unit so as to face the drive unit, the die is mounted on the execution stage. Since it is possible to ensure the disconnection of the unit and the drive device, it is possible to prevent looseness during work execution,
The movement of the die unit with respect to the execution stage can be realized.

(4) Since the first setup stage and the second setup stage are set, the previous die unit lowered from the execution stage is moved to one setup stage and immediately thereafter the other setup unit is moved to the other setup stage. Since the next die unit prepared in the setup stage can be moved to the execution stage, the waiting time for movement can be suppressed to a minimum and the die replacement work time can be further shortened. You can

(5) Since the mold unit moving device is installed on the machine stand, the mold unit can be automatically moved between the execution stage and the setup stage, and therefore, the mold can be replaced. The work time can be further shortened and the work safety can be improved.

(6) Since the mold unit moving device is installed on the machine base, it is sufficient to install one mold unit moving device on the machine base. Therefore, the moving devices are arranged on the mold unit side respectively. The equipment cost can be reduced as compared with the case of installing.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the die unit moving device is not limited to be provided on the machine base side, but may be provided on each die unit side to be self-propelled. Furthermore, the moving device for automatically moving the die unit may be omitted, and the die unit may be moved manually.

The set-up stage is not limited to a pair of set-up stages,
There may be a single or three locations.

The dies and punches are not limited to three sets of die punches for cutting, lead forming and cutting, and one set or two sets or four sets or more may be provided.

Further, the concrete structures of the mold driving device, the mold unit clamper, the mold unit, and the like are not limited to the structures of the above-described embodiments, but it is desirable to design them appropriately according to the requirements of the work and manufacturing. .

In the above description, the invention made by the present inventor was mainly described for the case where the multiple lead frame, which is the field of application behind the invention, is the work.
The present invention is not limited to this, and can be applied to the case where the work is a tape or a single lead frame.

[0058]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

Since the setup work can be advanced in the setup stage while the lead cutting and forming work is being performed in the execution stage, the die unit preliminarily set up in the setup stage can be used in the die replacement work. Can be moved to the execution stage. In other words, the mold replacement work time is the minimum required to move the previous mold unit from the execution stage to the setup stage and to move the next prepared mold unit from the setup stage to the execution stage. It can be shortened in time.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a lead cutting and forming apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view thereof.

FIG. 3 is a front view showing an execution stage.

FIG. 4 is a side view thereof.

FIG. 5 is a partially omitted perspective view showing a mold unit.

FIG. 6 is a plan view showing a lower mold.

FIG. 7 is a front view of the lower die, in which (a) is partially omitted.
(B) is a side view.

FIG. 8 shows an upper mold, (a) is a partially omitted front view, (b)
Is a bottom view.

9A and 9B show a mold unit moving device, FIG. 9A is a plan view, and FIG. 9B is a front view.

FIG. 10 is a view showing a mold unit moving device, FIG.
Is a side view and (b) is a side sectional view.

11A and 11B show a clamper of a mold unit, FIG. 11A is a plan view, and FIG. 11B is a partially omitted side sectional view taken along line bb of FIG.

12 is a front sectional view taken along line XII-XII in FIG.

FIG. 13 is a side view of FIG.

[Explanation of symbols]

1 ... Work, 2 ... Multiple lead frame, 3 ... Semi-finished product of semiconductor integrated circuit device, 4 ... Product (semiconductor device), 10 ... Lead cutting / molding device, 11 ... Machine base, 12 ... Loading stage, 13 ... Work transfer Device, 14 ... Holding head, 15 ... Holding head transfer device, 16 ... Unload stage, 17 ... Work transfer device, 18 ... Holding head, 19 ... Holding head transfer device, 20 ... Execution stage, 21 ... First setup stage, 22 ... 2nd setup stage, 23 ... 1st guide rail, 24 ... 2nd guide rail, 25 ... Stand, 26 ... Press device (mold drive device), 27 ... Press rod, 29 ... Mold unit, 30 ...
Lower mold, 31 ... Lower mold base, 32 ... Lead cutting die, 3
3 ... Lead forming die, 34 ... Separating die, 35 ... Guide rail, 36 ... Pitch feeding device, 37 ... Coupling tool, 3
8 ... Back-and-forth movement connection hole, 39 ... Left-and-right movement connection hole, 40 ... Upper mold, 41 ... Upper mold base, 42 ... Lead cutting punch, 4
3 ... Lead forming punch, 44 ... Separation punch, 45
... guide post, 46 ... push rod connecting device, 47 ... mounting plate, 50 ... mold unit moving device, 51 ... longitudinal movement cylinder device, 52 ... longitudinal movement slider, 53 ... longitudinal movement connecting pin, 54 ... lateral movement cylinder device 55 ... Horizontal movement slider, 56 ... Mounting bracket, 57 ... Vertical movement cylinder device, 58 ... Mounting plate, 59 ... Horizontal movement pin, 60
... Clamper for preventing movement of die unit in setup stage,
70 ... Mold unit clamper for execution stage, 71 ... Pedestal, 72 ... Product drop port, 73 ... Fixed block, 74 ...
Side-holding cylinder device, 75 ... Holding roller, 7
6 ... Guide roller block, 77 ... Pressing device,
78 ... Guide pin, 79 ... Pressing member, 80 ... Operation rod, 81 ... Link device, 82 ... Pressing cylinder device, 83 ... Pushing up device, 84 ... Pushing up cylinder device,
85 ... push-up pin.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tadayoshi Kinami 393 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitate Shonan Electronics Co., Ltd. (72) Noboru Senba 393 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Tachishonan Electronics Co., Ltd.

Claims (3)

[Claims] 1. A work in which a plurality of electronic devices are assembled to a multiple lead frame is supplied to bend and form the leads of each of the electronic devices of the multiple lead frame, and at the same time, the electronic devices are connected to the multiple lead. In a lead cutting and molding apparatus provided with a die unit for separating from a frame of a frame, an execution stage and a setup stage are set on a machine base, and the die unit reciprocates between the execution stage and the setup stage. The execution stage is provided with a drive device for driving the mold of the mold unit, and a clamper for positioning and holding the mold unit so as to face the drive device. A lead cutting and forming device. 2. A plurality of setup stages are set,
The lead cutting and molding apparatus according to claim 1, wherein the mold unit is configured to move from each setup stage to the execution stage. 3. The lead according to claim 1, wherein a moving device for automatically moving the die unit between the execution stage and the setup stage is provided on the machine base. Cutting and molding equipment.