JPH08102591A - Electronic apparatus - Google Patents
Electronic apparatusInfo
- Publication number
- JPH08102591A JPH08102591A JP23820694A JP23820694A JPH08102591A JP H08102591 A JPH08102591 A JP H08102591A JP 23820694 A JP23820694 A JP 23820694A JP 23820694 A JP23820694 A JP 23820694A JP H08102591 A JPH08102591 A JP H08102591A
- Authority
- JP
- Japan
- Prior art keywords
- ventilation port
- ventilation
- housing
- memory alloy
- shape memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は電子機器の筐体に設けら
れた放熱用通風口蓋の開閉手段に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a means for opening and closing a ventilation opening cover for heat radiation provided in a housing of electronic equipment.
【0002】[0002]
【従来の技術】電子機器を使用している間は内部に熱が
発生し温度が上昇するため、電子回路の動作等に影響が
でる。通常電子機器には放熱のための通風口が設けら
れ、電動ファンにより内部の空気を排出し、外部の空気
を取り入れることで内部温度を下げている。このように
通風口を設けることは、電子機器内部の温度を下げるた
めの有効な手段ではあるが、温度を下げる必要がないと
きには電子機器内部に塵埃が進入したり、電動ファンの
音が外部に漏れるという不利な面もある。ここで、内部
の温度が上昇したときに通風口を開くようにすれば、上
記問題が解決する。例えば、電子機器の筐体に放熱用の
通風口を設け、内部の温度上昇に連動してこの通風口を
開閉する技術として特願平3ー296154などが知ら
れている。この文献では、電子機器筐体内の温度が所定
の値になったことを温度検出手段が検出しその検出結果
に基づいて通風口を開閉する手段により通風口の調節を
行う方法が記載されている。また温度検出手段として温
度センサーを用い、通風口開閉手段としてスライド式の
開閉部財とこれをスライドさせる動力源としてモーター
を使用した装置が開示されている。特願昭58ー191
897ではスライド式の開閉部財の一端と筐体内部側面
との間に形状記憶合金を設け筐体内の温度が一定になっ
たときに形状記憶合金に発生する復元力を利用して開閉
部財をスライドさせる方法が記載されている。2. Description of the Related Art While an electronic device is in use, heat is internally generated and the temperature rises, which affects the operation of an electronic circuit. Generally, electronic devices are provided with a ventilation port for heat dissipation, and an internal air is exhausted by an electric fan, and external air is taken in to lower the internal temperature. Providing the ventilation port in this way is an effective means for lowering the temperature inside the electronic device, but when it is not necessary to lower the temperature, dust enters the inside of the electronic device or the sound of the electric fan is emitted outside. It also has the disadvantage of leaking. Here, if the ventilation port is opened when the internal temperature rises, the above problem is solved. For example, Japanese Patent Application No. 3-296154 and the like are known as a technique in which a ventilation hole for heat dissipation is provided in a housing of an electronic device and the ventilation hole is opened / closed in association with a rise in internal temperature. This document describes a method in which the temperature detecting means detects that the temperature inside the electronic device housing has reached a predetermined value, and based on the detection result, the ventilation opening is adjusted by means for opening and closing the ventilation opening. . Further, there is disclosed a device in which a temperature sensor is used as the temperature detecting means, a slide-type opening / closing member is used as the ventilation opening / closing means, and a motor is used as a power source for sliding the same. Japanese Patent Application Sho 58-191
In 897, a shape memory alloy is provided between one end of the sliding type opening / closing member and the inner side surface of the housing, and the restoring force generated in the shape memory alloy when the temperature inside the housing becomes constant is utilized. The method of sliding is described.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、例示し
たように通風口を開閉する手段として温度センサーや電
動式のモーターを用いた場合は、制御回路や電源供給用
の装置等を設ける必要があり、電子機器筐体の大型化や
消費電力の増大という問題がある。また、形状記憶合金
を用いた方法による通風口の開閉方法では、形状記憶合
金の形状が復元された後は復元前の状態に戻すための操
作が必要になる。However, when a temperature sensor or an electric motor is used as the means for opening and closing the ventilation port as illustrated, it is necessary to provide a control circuit, a device for power supply, etc. There are problems that the housing of the electronic device becomes large and power consumption increases. Further, in the method of opening and closing the ventilation port by the method using the shape memory alloy, after the shape of the shape memory alloy is restored, an operation for returning to the state before the restoration is required.
【0004】[0004]
【課題を解決するための手段】この発明は、上記の目的
を達成するために、電子機器本体の筐体に放熱用の通風
口が形成された電子機器において、該通風口に開閉可能
な通風口蓋を設け、この通風口蓋の両端と電子機器本体
との間に形状記憶合金で作られたばねと、伸長伸縮方向
の逆方向に復元力を生じる弾性体とを設けたものであ
る。In order to achieve the above object, the present invention provides an electronic device in which a ventilation hole for heat dissipation is formed in a housing of an electronic device body, and the ventilation hole is openable and closable in the ventilation port. A palate is provided, and a spring made of a shape memory alloy is provided between both ends of the ventilation palate and the electronic device body, and an elastic body that generates a restoring force in a direction opposite to the extending and contracting direction.
【0005】[0005]
【作用】この発明による電子機器本体には、放熱用の通
風口と開閉可能な通風口蓋が形成されており、電子機器
筐体内の温度が上昇し一定の温度に達すると、通風口蓋
の両端と電子機器本体との間に設けられた形状記憶合金
で作られたばねに復元力が生じて通風口蓋が広げられ、
熱交換が可能になり筐体内の温度が低下する。The electronic device body according to the present invention is formed with a vent for heat dissipation and a vent cover that can be opened and closed. When the temperature inside the electronic device rises and reaches a certain temperature, both ends of the vent cover are closed. A restoring force is generated in the spring made of shape memory alloy provided between the electronic device body and the ventilation lid is expanded,
Heat can be exchanged, and the temperature inside the housing drops.
【0006】このとき通風口蓋の対になる位置に設けら
れた弾性体が、通風口蓋が広げられることにより押し縮
められる。続いて、筐体内の温度が下がり、形状記憶合
金の復元力が低下すると、通風口蓋が広げられたときの
変位により縮められた弾性体が変位エネルギーを開放し
てもとの位置に復元して通風口蓋を押し戻すとともに、
形状記憶合金で作られたばねが縮められる。At this time, the elastic body provided at the position where the ventilation port lid is paired is compressed by expanding the ventilation port lid. Subsequently, when the temperature inside the housing decreases and the restoring force of the shape memory alloy decreases, the elastic body contracted by the displacement when the ventilation lid is expanded restores its original position even when the displacement energy is released. While pushing back the ventilation palate,
A spring made of shape memory alloy is contracted.
【0007】[0007]
【実施例】以下、この発明の実施例を図面に基づいて具
体的に説明する。図1は、本発明の一実施例を示す電子
機器の構造を示す図である。この装置は、筐体1と、筐
体側面に設けられた通風口2と、通風口蓋3と、形状記
憶合金4、弾性体5、画像表示装置6と、電子回路や電
源回路を含む熱原モジュール7、とからなる表示装置一
体型の電子機器である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a diagram showing a structure of an electronic device showing an embodiment of the present invention. This device includes a housing 1, a ventilation opening 2 provided on a side surface of the housing, a ventilation opening lid 3, a shape memory alloy 4, an elastic body 5, an image display device 6, and a heat source including an electronic circuit and a power supply circuit. It is an electronic device integrated with a display device including a module 7 and.
【0008】まず、本装置の通風口2と通風口蓋3との
構造について説明する。通風口2は、筐体1の側面に設
けられた内部に発生した熱を外部に排出するためのもの
であり、筐体1の内部温度が常温のときは通風口3によ
り閉じられている。First, the structure of the ventilation port 2 and the ventilation port lid 3 of this apparatus will be described. The ventilating port 2 is provided on the side surface of the casing 1 for discharging heat generated inside, and is closed by the ventilating port 3 when the internal temperature of the casing 1 is room temperature.
【0009】本実施例の通風口蓋3は、上下に摺動可能
なように形成されている。例えば、通風口蓋3の両側に
摺動ガイドレール等を用いて一定の方向に移動できるよ
うに形成する。この通風口3の両側と筐体1の内部側面
との間には形状記憶合金4と弾性体5が設けられてい
る。本実施例では、形状記憶合金4と弾性体5とで通風
口蓋3が通風口2を完全に覆う位置に支えている。この
とき弾性体5の復元力は通風口蓋3の重力加速度が加わ
っても所定の位置で支えられるように調整されている。The ventilation port lid 3 of this embodiment is formed so as to be slidable up and down. For example, sliding guide rails or the like are used on both sides of the ventilation cover 3 so as to be movable in a certain direction. A shape memory alloy 4 and an elastic body 5 are provided between both sides of the ventilation port 3 and the inner side surface of the housing 1. In this embodiment, the shape memory alloy 4 and the elastic body 5 support the ventilation port cover 3 at a position where the ventilation port 2 is completely covered. At this time, the restoring force of the elastic body 5 is adjusted so as to be supported at a predetermined position even if the gravitational acceleration of the ventilation lid 3 is applied.
【0010】次に、筐体1の内部の温度が上昇した場合
について図2を用いて説明する。表示装置6、熱源モジ
ュール7が動作状態になると通電による熱が発生し筐体
1内の温度が上昇する。一定の温度に達すると、形状記
憶合金4の内部に復元力が発生し記憶されていた形状に
戻る。このとき通風口蓋3には下方向に力が加わるが、
通風口蓋3は摺動可能な構造になっているので、下方向
に移動して通風口2の一部が開口される。通風口3の移
動に伴い弾性体5は押し縮められ復元力が発生するが、
形状記憶合金4の復元力の方が強くなるように調整する
ので、通風口2の一部が開口された状態がそのまま保持
される。Next, the case where the temperature inside the housing 1 rises will be described with reference to FIG. When the display device 6 and the heat source module 7 are in the operating state, heat is generated by energization, and the temperature inside the housing 1 rises. When a certain temperature is reached, a restoring force is generated inside the shape memory alloy 4 and the shape remembered is restored. At this time, a downward force is applied to the ventilation lid 3,
Since the ventilation port cover 3 has a slidable structure, it moves downward to open a part of the ventilation port 2. With the movement of the ventilation port 3, the elastic body 5 is compressed and a restoring force is generated.
Since the restoring force of the shape memory alloy 4 is adjusted to be stronger, the state in which a part of the ventilation port 2 is opened is maintained as it is.
【0011】続いて、筐体1内部の温度が降下する場合
について図3を用いて説明する。筐体1内部の温度が下
がると形状記憶合金4の復元力も徐々に失われていく
が、復元した形状はそのまま保持されている。該温度が
さらに下がると、形状記憶合金4の復元力が、筐体1内
の温度が高温のときに押し縮められていた弾性体5の復
元力より小さくなる。Next, a case where the temperature inside the housing 1 drops will be described with reference to FIG. When the temperature inside the housing 1 decreases, the restoring force of the shape memory alloy 4 is gradually lost, but the restored shape is retained as it is. When the temperature further decreases, the restoring force of the shape memory alloy 4 becomes smaller than the restoring force of the elastic body 5 that is compressed when the temperature inside the housing 1 is high.
【0012】このとき弾性体5が通風口蓋3を押し上げ
始めると同時に、形状記憶合金4が押し戻されていく。
弾性体5は通風口蓋3が通風口2を完全に塞ぐ位置に釣
り合うように調整してあるので、所定の位置まで通風口
蓋3を押し上げて止まる。At this time, the elastic body 5 starts pushing up the ventilation lid 3, and at the same time, the shape memory alloy 4 is pushed back.
Since the elastic body 5 is adjusted so that the ventilation port cover 3 balances with the position where the ventilation port 2 is completely closed, the elastic body 5 pushes up the ventilation port cover 3 to a predetermined position and stops.
【0013】本実施例である図1の形状記憶合金4はつ
る巻ばね、リボン状の板を折り畳んだばね、巻き線状の
ばね等の構造を用いてで実現できる。The shape memory alloy 4 of FIG. 1 according to the present embodiment can be realized by using a structure such as a spiral spring, a spring formed by folding a ribbon-shaped plate, or a spiral spring.
【0014】本実施例である図1の弾性体5の材質は金
属、合成樹脂等を使って、つる巻ばね、リボン状の板を
折り畳んだばね、巻き線状のばね等の構造を用いてで実
現できる。The elastic body 5 shown in FIG. 1 according to the present embodiment is made of metal, synthetic resin, or the like, and has a structure such as a spiral spring, a spring formed by folding a ribbon-shaped plate, or a spiral spring. Can be achieved with.
【0015】本実施例では、図1のように通風口蓋3を
上下に摺動可能に形成したが、これを横に摺動可能に形
成することもできる。この場合は、弾性体の復元力と通
風口蓋の重力との関係を調整する必要はなくなる。In this embodiment, the ventilation port lid 3 is formed so as to be slidable up and down as shown in FIG. 1, but it may be formed so as to be slidable laterally. In this case, it is not necessary to adjust the relationship between the restoring force of the elastic body and the gravity of the ventilation palate.
【0016】通風口と通風口蓋の構造は、実施例1以外
であってもい。図4は、通風口蓋3の一端を支持点9で
回転可能に取り付けた実施例である。形状記憶合金4と
弾性体5は、通風口板3と支持部財8との間に設けてあ
る。支持部財8は筐体1に固定されている。ここで、電
子機器筐体1内の温度が上昇すると、形状記憶合金4に
復元力が発生して記憶されていた形状に復元する(この
場合は、短くなる)。このとき通風口蓋3は支持部財8
側に引き寄せられるが、支持点9を支点に回転し通風口
2を開口する。同時に弾性体5も押し縮められる。筐体
1内の温度が下がると、形状記憶合金4の復元力が小さ
くなり、弾性体5の復元力により通風口蓋3が押し戻さ
れて通風口2が閉じる。The structure of the ventilation port and the ventilation port lid may be different from that of the first embodiment. FIG. 4 shows an embodiment in which one end of the ventilation cover 3 is rotatably attached at a support point 9. The shape memory alloy 4 and the elastic body 5 are provided between the ventilation port plate 3 and the support member 8. The support material 8 is fixed to the housing 1. Here, when the temperature inside the electronic device housing 1 rises, a restoring force is generated in the shape memory alloy 4 to restore the stored shape (in this case, the shape is shortened). At this time, the ventilation palate 3 is the support member 8
Although it is attracted to the side, the support point 9 is rotated as a fulcrum to open the ventilation port 2. At the same time, the elastic body 5 is also compressed. When the temperature inside the housing 1 decreases, the restoring force of the shape memory alloy 4 becomes small, and the restoring force of the elastic body 5 pushes the ventilation port lid 3 back to close the ventilation port 2.
【0017】図5は、通風口蓋3を回転できるように形
成した実施例である。本実施例では通風口蓋11が支持
点10で配転可能に筐体1に取り付けられている。この
通風口蓋11の内側には筐体1に設けられた通風口とは
別に第2の通風口12が設けられている。形状記憶合金
4と弾性体5とは、取付け部財9を介して筐体1の内側
と通風口蓋11に固着されている。通風口蓋11に設け
られた第2の通風口12は、筐体内1の温度が常温のと
きには 筐体に設けられた通風口とは重ならない位置に
ある。FIG. 5 shows an embodiment in which the ventilation port lid 3 is formed so as to be rotatable. In this embodiment, the ventilation port lid 11 is attached to the housing 1 so as to be displaceable at the support points 10. A second ventilation port 12 is provided inside the ventilation port lid 11 in addition to the ventilation port provided in the housing 1. The shape memory alloy 4 and the elastic body 5 are fixed to the inside of the housing 1 and the ventilation port lid 11 via the attachment parts 9. The second ventilation port 12 provided in the ventilation port lid 11 is in a position that does not overlap with the ventilation port provided in the housing when the temperature inside the housing 1 is room temperature.
【0018】ここで、筐体1内部の温度が上昇すると形
状記憶合金4に記憶されていた形状が復元し取付け部財
9を押し戻し、通風口蓋11が支持点10を中心に回転
し筐体1に設けられた通風口と第2の通風口12が重な
り筐体1内側と外側の熱交換が可能になる。この回転に
より弾性体5が引き伸ばされる。次に筐体1内の温度が
下がると、形状記憶合金4の復元力が弱まり、弾性体5
の復元力により弾性体5が縮み始め取付け部財9が引き
寄せられて通風口11が前記と逆の方向に回転すると、
筐体1の通風口と第2の通風口12が重ならなくなり、
筐体1の通風口が塞がれる。Here, when the temperature inside the casing 1 rises, the shape memorized in the shape memory alloy 4 is restored, the mounting member 9 is pushed back, and the ventilation cover 11 rotates around the support point 10 to rotate the casing 1. The ventilation port provided on the second ventilation port 12 and the second ventilation port 12 overlap with each other, and heat exchange between the inside and the outside of the housing 1 becomes possible. The elastic body 5 is stretched by this rotation. Next, when the temperature inside the housing 1 decreases, the restoring force of the shape memory alloy 4 weakens, and the elastic body 5
When the elastic body 5 begins to contract due to the restoring force of, the attachment part 9 is drawn and the ventilation port 11 rotates in the opposite direction,
The ventilation opening of the housing 1 and the second ventilation opening 12 do not overlap,
The ventilation port of the housing 1 is closed.
【0019】なお、実施例として表示装置一体型の電子
機器について説明したが通電により筐体内部温度が上昇
する電子機器ならば全てに応用することが可能である。Although the electronic device integrated with the display device has been described as an embodiment, the present invention can be applied to any electronic device in which the temperature inside the housing rises due to energization.
【0020】[0020]
【発明の効果】以上説明したように、この発明による電
子機器は筐体内部温度の変化に伴って通風口を開閉する
ことで、必要以上に通風口を開くことがなくなり塵埃の
進入や内部の騒音漏れを減少させることができる。As described above, the electronic device according to the present invention opens and closes the ventilation port in accordance with the change in the temperature inside the housing, so that the ventilation port is not opened more than necessary and dust enters and internal Noise leakage can be reduced.
【図1】この発明の一実施例を示す電子機器の断面図で
ある。FIG. 1 is a sectional view of an electronic device showing an embodiment of the present invention.
【図2】筐体内部の温度が上昇したときの例を示す断面
図である。FIG. 2 is a cross-sectional view showing an example when the temperature inside the housing rises.
【図3】筐体内部の温度が下降したときの例を示す断面
図である。FIG. 3 is a cross-sectional view showing an example when the temperature inside the housing is lowered.
【図4】この発明の第2の実施例を示す電子機器の断面
図である。FIG. 4 is a sectional view of an electronic device showing a second embodiment of the present invention.
【図5】この発明の第3の実施例を示す電子機器の断面
図である。FIG. 5 is a sectional view of an electronic device showing a third embodiment of the present invention.
1 電子機器筐体 2 通風口 3 通風口蓋 4 形状記憶合
金 5 弾性体 6 表示装置 7 熱原モジュール 8 支持部財 9 取付け部財 10 支持点 11 通風口蓋 12 第2の通風
口1 Electronic Device Housing 2 Vent Vent 3 Vent Vent 4 Shape Memory Alloy 5 Elastic Body 6 Display Device 7 Heat Source Module 8 Support Part Goods 9 Mounting Part Goods 10 Support Points 11 Ventilate End 12 Second Vent
Claims (1)
成された電子機器において、該通風口に開閉可能な通風
口蓋を設け、この通風口蓋の一端と電子機器本体との間
に形状記憶合金で作られたばねを設け、前記通風口蓋の
一端と対になる位置に弾性体とを設けたことを特徴とす
る電子機器。1. An electronic device in which a ventilation hole for heat dissipation is formed in a casing of the electronic device body, wherein an openable and closable ventilation cover is provided at the ventilation port, and between one end of the ventilation port cover and the electronic device body. An electronic device, comprising: a spring made of a shape memory alloy; and an elastic body at a position that is paired with one end of the ventilation port cover.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23820694A JPH08102591A (en) | 1994-09-30 | 1994-09-30 | Electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23820694A JPH08102591A (en) | 1994-09-30 | 1994-09-30 | Electronic apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08102591A true JPH08102591A (en) | 1996-04-16 |
Family
ID=17026733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23820694A Pending JPH08102591A (en) | 1994-09-30 | 1994-09-30 | Electronic apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08102591A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007045561A (en) * | 2005-08-09 | 2007-02-22 | Mitsubishi Electric Corp | Elevator control device |
JP2011199016A (en) * | 2010-03-19 | 2011-10-06 | Fujitsu Ltd | Actuator and electronic apparatus |
CN109631694A (en) * | 2018-12-20 | 2019-04-16 | 南京理工大学 | A kind of pressure relief of memorial alloy formula insensitive munitions |
-
1994
- 1994-09-30 JP JP23820694A patent/JPH08102591A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007045561A (en) * | 2005-08-09 | 2007-02-22 | Mitsubishi Electric Corp | Elevator control device |
JP2011199016A (en) * | 2010-03-19 | 2011-10-06 | Fujitsu Ltd | Actuator and electronic apparatus |
CN109631694A (en) * | 2018-12-20 | 2019-04-16 | 南京理工大学 | A kind of pressure relief of memorial alloy formula insensitive munitions |
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