JPH079653A - Thermal mimeograph processing device - Google Patents

Abstract

PURPOSE:To provide a novel thermal mimeograph processing device wherein jam does not occur at conveying a master and the cut face of the master does not have saw-like shape. CONSTITUTION:In a thermal mimeograph processing device, a thermal head 2 consisting of a plurality of resistance heating elements 3 arranged in the horizontal scanning direction is made to be in contact with a master 1, the master 1 is relatively moved to the thermal head 2 in the vertical scanning direction rectangular with respect to the arranging direction of the resistance heating elements 3, and punched image is formed in dot matrix method by selective heating of the resistance heating elements 3. The master 1 consists of substantially only a thermoplastic resin film. A moving device 15 for moving the thermal head 2 in the horizontal scanning direction is provided. After the formation of the punched image on the master 1 is completed, the thermal head 2 is moved in the horizontal scanning direction by the moving device 15. A control means is provided for controlling the resistance heating elements 3 so as to form a row of holes for cutting the master 1 from its one edge to other edge.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-sensitive stencil plate-making apparatus for forming a perforated image in a dot matrix manner by using a thermal head on a master for heat-sensitive stencil which is essentially composed of a thermoplastic resin film. is there.

[0002]

2. Description of the Related Art Digital thermal stencil printing apparatuses have been well known. FIG. 1 shows a plate making apparatus in this apparatus.
6 (a), (b) (c) and FIG.

This plate making apparatus has a master 71 for heat-sensitive stencil.
The thermal head 72 composed of the resistance heating elements 73 arranged in a line in the main scanning direction S is brought into contact with the resistance heating elements 7
The master 71 is relatively moved to the thermal head 72 by the platen roller 714 in the sub-scanning direction F orthogonal to the arrangement direction of 3 and the perforated image 74 is formed in a dot matrix manner by the selective heating of the resistance heating element 73. The master 71 on which the punched image 74 is formed is conveyed by the conveying roller pair 76 and automatically wound around the outer peripheral surface of the plate cylinder, the master 71 is cut by the cutter means 77, and the printing paper is pressed against the master 71 by a press roller or the like. The ink is bleeding out from the perforated portion of the master 71 by continuously pressing it by means to perform printing. The cutter means 77 has a rotary blade 78 that moves in the main scanning direction S inside the cutter unit 713, as shown in FIG.

The above-mentioned master is made by mixing a very thin thermoplastic resin film such as polyester (hereinafter referred to simply as "film") and synthetic fibers or Japanese paper as a porous flexible support, or a mixture of Japanese paper and synthetic fibers. It has a laminated structure in which the above are laminated together, and an overcoat layer is provided on the surface of the film for fusing with the surface of the thermal head and for preventing electrification.

As the cutter means, Japanese Patent Laid-Open No. 63-6 is used.
As disclosed in Japanese Patent No. 2773, a method has been proposed in which a movable blade is rotated along a band-shaped fixed blade and reciprocally moved in the width direction of the master to cut the master.

[0006]

Since the master uses Japanese paper or the like as its support, the passage of the ink is obstructed at the part where the fibers of the Japanese paper are entangled with each other, and the ink does not transfer to the printing paper. There is a problem of so-called fiber stitches in which a fiber pattern appears on the part or fine lines are faint.

Therefore, it is possible to prevent the generation of fiber grain by printing with a master consisting of only a film without using Japanese paper or the like as a support, but the thickness of the film itself is The thickness is about 2 to 8 μm, which is about 20 times smaller than the thickness of the Washi laminated master of about 40 to 50 μm. Therefore, when the master is cut by the above-mentioned cutter means, when the master is conveyed, If the tip of the is caught or stuck on the stepped portion of the moving path of the movable blade, jams and the like will occur frequently. Further, by cutting the master while rotating the rotary blade, the cut surface of the master becomes a saw shape, and therefore, the clamp means of the plate cylinder cannot apply a constant tension evenly to the master, causing creases and creases. It becomes impossible to wind around the plate cylinder without causing floating.

Therefore, the present invention solves the above-mentioned problems, and when the master is conveyed, the tip of the master is not caught by the stepped portion of the moving path of the movable blade, so that no jam occurs and the cut surface of the master is An object of the present invention is to provide a novel heat-sensitive stencil plate-making device which does not have a saw-like shape.

[0009]

The invention according to claim 1 is
A thermal head having a plurality of resistance heating elements arranged in a line in the main scanning direction is brought into contact with a master for heat-sensitive stencil, and the master is set relative to the thermal head in a sub-scanning direction orthogonal to the arrangement direction of the resistance heating elements. Move it
In a heat-sensitive stencil plate making apparatus for forming a perforated image in a dot matrix system by selective heating of the resistance heating element,
The master consists essentially of a thermoplastic resin film, has a moving device for moving the thermal head in the main scanning direction, after the formation of the perforated image on the master is completed, the thermal device by the moving device. A control means for controlling the resistance heating element is provided so as to move the head in the main scanning direction and to provide a hole row for cutting the master from one end side to the other end side of the master.

According to a second aspect of the present invention, a thermal head having a plurality of resistance heating elements arranged in a line in the main scanning direction is brought into contact with a master for heat-sensitive stencil, and the sub-scanning is orthogonal to the direction of arrangement of the resistance heating elements. In a heat-sensitive stencil plate making apparatus for forming a perforated image in a dot matrix system by selectively heating the resistance heating element in a direction relative to the thermal head, the master is substantially a thermoplastic resin. A resistance heating line consisting of only a film, which is arranged in parallel with the resistance heating element in the thermal head, and a moving device for moving the thermal head in the main scanning direction, and a punching image of the master. After the formation is completed, the thermal head is moved in the main scanning direction by the moving device to cut the master from one end side to the other end side of the master. Characterized in that a control means for controlling the resistance heating wire to provide a melt line use.

According to a third aspect of the present invention, a thermal head having a plurality of resistance heating elements arranged in a line in the main scanning direction is brought into contact with a master for heat-sensitive stencil, and the sub-scanning is orthogonal to the direction of arrangement of the resistance heating elements. In a heat-sensitive stencil plate making apparatus for forming a perforated image in a dot matrix system by selectively heating the resistance heating element in a direction relative to the thermal head, the master is substantially a thermoplastic resin. After the formation of the perforated image on the master is completed, the one end side of the master is formed of only a film and has a resistance heating line that is arranged in parallel with the resistance heating element in the thermal head and is longer than the resistance heating element row. To the other end side, a control means for controlling the resistance heating wire is provided so as to provide a melting wire for cutting the master.

Here, the sub-scanning direction means the direction in which the heat-sensitive stencil master is conveyed, and the main scanning direction means the direction orthogonal to the sub-scanning direction. Further, the master for heat-sensitive stencil consisting essentially of a thermoplastic resin film, in addition to those in which the master consists of only the thermoplastic resin film, those containing a minor component such as an antistatic agent in the thermoplastic resin film Further, it includes one in which one or more thin film layers such as an overcoat layer are formed on both main surfaces of the thermoplastic resin film, that is, at least one of the front surface and the back surface.

[0013]

According to the present invention, the thermal head is moved in the main scanning direction by the moving device, and the control means controls the resistance heating element to cut the master from one end side to the other end side. Drill a row of holes in the master.

According to the second aspect of the invention, the thermal head is moved in the main scanning direction by the moving device, and the control means controls the resistance heating line arranged in parallel with the resistance heating element of the thermal head to control the master. Forming a fusion line on the master for cutting the master from one end side to the other end side.

According to the third aspect of the invention, the control means controls the resistance heating wire arranged in parallel with the resistance heating element of the thermal head to melt the master for cutting from one end side to the other end side. Form a line on the master.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 100 indicates a heat-sensitive stencil plate making apparatus in a stencil printing apparatus. Heat-sensitive stencil plate making apparatus 100
Is a pair of conveyance rollers 6 that conveys the master 1 in the sub-scanning direction F.
1, a platen roller 14 disposed on the downstream side of the transport roller, a thermal head 2 extending in parallel with the platen roller 14 and provided so as to be able to come into contact with and separate from the platen roller 14, and a thermal head 2. It mainly comprises a linear motor 5 as a moving device for moving the master 1 in the main scanning direction, and a pressing roller pair 62 for carrying the master 1 to a plate cylinder (not shown) while holding the master 1.

The master 1 is made of only a thermoplastic resin film having a width of 320 mm and a thickness of substantially 4 μm, is made of polyester or the like, is wound in a roll shape, and is supported by the shaft 1s so as to be able to be drawn out.

The platen roller 14 extends in the main scanning direction S, and its surface is made of conductive silicon rubber or the like. The length of the platen roller 14 in the main scanning direction S is the main scanning direction S of the master 1. The width is set longer than the width of the master 1 in order to punch the master 1 from one end side to the other end side. In this embodiment, it is set to 330 mm.

The thermal head 2 is shown in FIGS.
As shown in a), it is mainly configured by a plurality of perforation image forming resistance heating elements 3 arranged in one line in the main scanning direction S and a holder 10 for holding and cooling the resistance heating elements 3. There is. At both ends in the main scanning direction S below the holder 10, springs 12 for urging the thermal head 2 in a direction for pressing the thermal head 2 against the platen roller 14 are arranged,
A solenoid 11 for separating the thermal head 2 from the platen roller 14 is provided between the springs 12 against the biasing force of the springs 12. Therefore, the thermal head 2 is provided so as to come into contact with and separate from the platen roller 14 by the solenoid 11 and the spring 12.

The thermal head 2 selectively melts and perforates the master 1 based on a digital image signal which is processed and transmitted by an A / D conversion unit of a document reading unit (not shown) and the control means 15 to form a perforated image. Have the function to In addition,
In this embodiment, the thermal head 2 is 400 DPI.
Of the resistance heating elements 3 in the main scanning direction S over the length of 293 mm (A3).
08 pieces are arranged in a row at a constant pitch, and are divided into first to fourth blocks for control by the control means 15 described later.

The linear motor 5 is arranged below the holder 10 of the thermal head 2 and has a center point in the main scanning direction S of the resistance heating element 3 of the thermal head 2 and a center point in the main scanning direction S of the master 1. The thermal head 2 is moved relative to the master 1 in the main scanning direction S with the coincident position as the home position. Linear motor 5 for forming punched images
Is set to position the thermal head 2 at the home position.

The control means 15, as shown in FIG.
The resistance heating element 3 of the thermal head 2 is selectively heated to contact the master 1 to form a perforated image 4, and the master 1 is conveyed in the sub-scanning direction F by the platen roller 14 for a predetermined length. By controlling the time (applied pulse width) for energizing the resistance heating element 3 of No. 3, the hole array 7 for cutting the master 1 extending from one end side to the other end side in the main scanning direction S of the master 1 is formed.

To form the perforated image 4, the main scanning direction S
It is necessary that the holes adjacent to each other in the sub-scanning direction F are independent without being connected, but when the hole row 7 for cutting of the master 1 is formed, the holes adjacent to each other in the main-scanning direction S are formed. Since it is more convenient to connect the
The applied pulse width in the case of forming the perforation is set to be larger than that in the case of forming the perforated image 4.

As shown in FIG. 4, the applied pulse width when forming the punched image 4 is as follows: time t1 450 μs to 530 μs Input energy 54 μJ to 64 μJ Applied power 120 mW On the other hand, the hole train 7 for cutting the master 1 is formed. In this case, the time t2 is set to 600 μs to 700 μs, the input energy is set to 72 μJ to 84 μJ, and the applied power is set to 120 mW. As described above, since the resistance heating element 3 is divided into four blocks, the control of the energization time and the like is also divided into four.

In this way, the applied pulse width is controlled by the control means 15 so that all the resistance heating elements 3 are energized and a in FIG.
As shown in FIG. 3, a hole array 7 for cutting the master 1 is formed from one end side to the other end side of the master 1 in the main scanning direction S.
As shown in FIG. 5b, the control means 15 energizes each resistance heating element to form the non-perforated portion 1a, and the length d of the non-perforated portion 1a is set to 0 to 150 μm. Is also good.

Next, the operation of the heat-sensitive stencil plate making apparatus 100 will be described below. The master 1 is the platen roller 14
At a position slightly downstream of the end, the tip end portion is waiting with the tip thereof aligned in a direction substantially parallel to the platen roller 14. By pressing a plate-making start key (not shown), a plate-making command is sent to a step motor (not shown) and the platen roller 14 starts rotating. The resistance heating element 3 of the thermal head 3, which is pressed against the platen roller 14 by sandwiching the master 1 by a digital image signal processed and sent by an A / D converter and control means 15 (not shown)
Is selectively heated and the master 1 is selectively melted and perforated to form a perforated image 4. Then, the leading end portion of the master 1 on which the punched image 4 is formed in this manner is conveyed to the upstream side of the pressing roller pair 62.

The above plate making command is sent to the pressing roller pair 62, and the master 1 is held by the pressing roller pair 62 as shown in FIG. . When the conveyance distance of the master 1 reaches a predetermined length, the solenoid 11 causes the thermal head 2 that is in pressure contact with the platen roller 14 to move to the spring 1
It is pulled downward from the platen roller 14 against the urging force of 2, and the linear motor 5 operates to move the thermal head 2 to one side in the main scanning direction S by 15 mm from the home position. At this position, the operation of the solenoid 11 is released, and the thermal head 2 causes the platen roller 14 to move to the master 1
Contact through. At this time, the control means 15 controls the resistance heating element 3 of the thermal head 2 to heat the resistance heating element 3 and melt the master 1 corresponding to the length 293 mm of the resistance heating element 3 to melt the master 1. A part of the hole array 7 for cutting is formed. After that, the solenoid 11 is operated as described above to separate the thermal head 2 downward from the platen roller 14, and the linear motor 5 moves the thermal head 2 to the other side in the main scanning direction S from the home position by 15 mm.
The master 1 is moved and melted at this position by the same operation as the above-mentioned operation, and as shown in FIG. 2B, a row of holes for cutting the master 1 is formed in a straight line from one end side to the other end side of the master 1. Form 7.

Next, when the master 1 is further conveyed by the rotation of the pressing roller pair 62 and the hole array 7 reaches a position slightly downstream of the pressing roller pair 62, the pressing roller pair 62 is held while holding the master 1. Stops rotating. At the same time, the leading end of the master 1 reaches the clamping means (not shown) of the plate cylinder, and the leading end of the master 1 is locked by the clamping means. Then, the plate cylinder rotates and the master 1 starts to be wound around the outer peripheral surface of the plate cylinder. By further rotation of the plate cylinder 1, the master 1 is stretched across the row of holes 7 as shown in FIG.
After the master 1 is wound around the outer peripheral surface of the plate cylinder, the printing process is started.

Further, as shown in FIG. 6B, resistance heating elements 8 for forming the hole rows 7 are provided adjacent to both ends of the resistance heating element 3 in the main scanning direction S, and all the resistance heating elements are provided. The length may be 298 mm. By adopting such a configuration, the amount of movement from the home position of the thermal head 2 by the linear motor 5 to one and the other in the main scanning direction S at the time of forming the hole array 7 is 13 mm, which is required for the movement. Time is reduced.

7 to 9 show another embodiment. The thermal head 20 shown in this embodiment is different from the embodiment shown in FIGS. 1 to 6 only in that the thermal head 20 has another resistance heating wire 9 arranged in parallel with the resistance heating element 3. Be different. Unlike the resistance heating element 3, the resistance heating line 9 is not used to form a perforated image, and therefore the resistance heating elements 3 are not arranged in a line, and the length in the main scanning direction S is 298 mm, The resistance heating element has a width of 70 μm in the scanning direction F. Regarding the operation of this embodiment, only the points different from the above embodiment will be described.
Similar to the above-described embodiment, as shown in FIG. 7A, after the punched image 4 is formed, the thermal head 20 is pulled downward from the platen roller 14 and the linear motor 5 is operated to move the thermal head 20 in the main scanning direction. 13 mm to the one side of S from the home position. At this position, the operation of the solenoid 11 is released, and the thermal head 20 contacts the platen roller 14 via the master 1. At this time, the control means 15 controls the applied pulse width supplied to the resistance heating wire 9 of the thermal head 20 to 1 mS to cause the resistance heating wire 9 to generate heat, which corresponds to the length 298 mm of the resistance heating wire 9. 1 is melted to form a part of the melting line 70 for cutting the master 1. After that, the solenoid 11 is operated as described above to pull the thermal head 20 downward from the platen roller 14, and the linear motor 5 moves the thermal head 20 to the other side in the main scanning direction S from the home position to the first position.
The master 1 is moved by 3 mm, and the master 1 is melted at this position by the same operation as described above.
A fusion line 70 for cutting the master 1 is formed in a straight line from one end side to the other end side, and the master 1 is cut as shown in FIG.

According to this embodiment, since the resistance heating wire 9 for forming the melting line 70 for cutting the master 1 is composed of one resistance heating element, wiring to the resistance heating wire 9 and resistance heating The circuit controlling the line 9 is simplified.

10 to 12 show still another embodiment. The thermal head 21 shown in this embodiment is different from the embodiment shown in FIGS. 1 to 9 in the linear motor 5 (FIG. 9).
Except for the other resistance heating wire 90 and the other resistance heating wire 9 arranged in parallel with the resistance heating element 3 in the thermal head 21.
The only difference is the configuration having the platen roller 14 and another platen roller 142 provided in parallel to the position facing 0.

Unlike the resistance heating element 3, the resistance heating line 90 is not used for forming a perforated image, so that the resistance heating element 90 does not have a plurality of resistance heating elements 3 arranged in a line but in the main scanning direction S.
Is 325 mm, which is wider than the width of the master 1, and the width in the sub-scanning direction F is 70 μm. Regarding the operation of this embodiment, only the points different from the above embodiment will be described. Similar to the above-described embodiment, as shown in FIG. 10A, after the punched image 4 is formed, the control means 15 controls the resistance heating wire 9 of the thermal head 21 at a predetermined position.
The applied pulse width supplied to 0 is controlled to 1 mS to heat the resistance heating wire 90 to melt the master 1 and, as shown in FIG. 10 b, form a straight line from one end side to the other end side of the master 1. The fusion line 70 for cutting the master 1 is formed, and the master 1 is cut as shown in FIG.

According to this embodiment, since the resistance heating wire 90 for forming the melting line 70 for cutting the master 1 is composed of one resistance heating element wider than the width of the master 1, the resistance heating wire 90 is formed. And the circuit for controlling the resistance heating wire 90 are simplified, the movement of the thermal head 21 is eliminated, and the linear motor becomes unnecessary.

Modifications of the embodiment shown in FIGS. 10 to 12 are shown in FIGS. The thermal head 22 shown in this embodiment is different from the embodiment shown in FIGS. 10 to 12 in that the platen roller 142 (see FIG. 12) is removed.
Another resistance heating wire 90 is arranged at the end of the thermal head 22 in the sub-scanning direction F in parallel with the resistance heating element 3, and the pressing roller pair 62 sets the master 1 to the other resistance heating wire at the end of the thermal head 22. Only the configuration in which the pressing roller pair 62 is arranged at a position displaced with respect to the sub-scanning direction F so as to be pressed against 90 is different. The operation of this embodiment is shown in FIGS.
Since it is similar to that of the embodiment shown in FIG.

According to this embodiment, since the resistance heating wire 90 for forming the melting line 70 for cutting the master 1 is composed of one resistance heating element wider than the width of the master 1, the resistance heating wire 90 is formed. To the platen roller 142 (see FIG. 12).
Becomes unnecessary.

[0037]

As described above, according to the first aspect of the invention, the thermal head is moved in the main scanning direction by the moving device, the control means controls the resistance heating element, and the one end side to the other end side of the master. Since the hole row for cutting the master is provided over the side, the cutting surface of the master does not have a saw-tooth shape, and a jam does not occur when the master is conveyed.

According to the second aspect of the present invention, a resistance heating wire is provided in the thermal head in parallel with the resistance heating element, the thermal head is moved in the main scanning direction by the moving device, and the control means controls the resistance heating wire. However, since the melting line for cutting the master extending from one end side to the other end side of the master is provided, the cutting surface of the master does not have a saw-tooth shape, and a jam is not generated when the master is conveyed.

According to the third aspect of the invention, a resistance heating wire longer than the resistance heating element array is provided in parallel with the resistance heating element in the thermal head, and the control means controls the resistance heating wire from one end side of the master. Since the melting line for cutting the master is provided over the other end side, the cutting surface of the master does not have a saw-tooth shape, and a jam does not occur when the master is conveyed.

[Brief description of drawings]

FIG. 1 is a front view of a heat-sensitive stencil plate making apparatus showing one embodiment of the present invention.

2A is a top view of the heat-sensitive stencil plate making apparatus shown in FIG. 1, FIG. 2B is a top view showing a master in which a row of holes is formed by the heat-sensitive stencil plate making apparatus shown in FIG. 1, and FIG. It is a top view which shows the master stretched | disconnected by the hole row shown in 1 b.

3 (a) is a side view showing a thermal head in the heat-sensitive stencil plate making apparatus shown in FIG. 1, and FIG. 3 (b) is a front view of the thermal head shown in FIG. 3 (a).

FIG. 4 is a time chart showing an applied pulse width when forming a punched image and a hole row by the heat-sensitive stencil plate making apparatus shown in FIG.

FIG. 5 is an enlarged plan view of an essential part showing an example of the hole array shown in FIG. 2B, and FIG. 5B is an enlarged plan view of an essential part showing an example of another hole array.

6A is a top view showing a resistance heating element of the thermal head shown in FIG. 3, and FIG. 6B is a top view showing another example of the resistance heating element shown in FIG.

FIG. 7A is a top view of a heat-sensitive stencil plate making apparatus showing another embodiment of the present invention, and FIG. 7B shows a master having a melting line formed by the heat-sensitive stencil plate making apparatus shown in FIG. 7A. FIG. 7C is a top view showing a master stretched across the fusion line shown in FIG. 7B.

8 is a plan view showing a thermal head in the heat-sensitive stencil plate making apparatus shown in FIG. 7 (a).

9 is a front view of the heat-sensitive stencil plate making apparatus shown in FIG. 7 (a).

10A is a top view of a heat-sensitive stencil plate making apparatus showing still another embodiment of the present invention, and FIG. 10B is a master in which a melting line is formed by the heat-sensitive stencil plate making apparatus shown in FIG. 10A. FIG. 11 (c) is a top view showing the master stretched across the fusion line shown in FIG. 10 (b).

11 is a plan view showing a thermal head in the heat-sensitive stencil plate making apparatus shown in FIG. 10 (a).

FIG. 12 is a front view of the heat-sensitive stencil plate making apparatus shown in FIG.

13A is a top view of a heat-sensitive stencil plate making apparatus showing a modification of the embodiment shown in FIGS. 10 to 12, and FIG.
13A is a top view of the master on which a fusion line is formed by the heat-sensitive stencil plate making apparatus, and FIG. 13C is a top view of the master stretched at the fusion line shown in FIG. 13B. .

14 is a plan view showing a thermal head in the heat-sensitive stencil plate making apparatus shown in FIG. 13 (a).

FIG. 15 is a front view of the heat-sensitive stencil plate making apparatus shown in FIG.

16A is a top view showing a conventional heat-sensitive stencil plate making apparatus, FIG. 16B is a top view of a master in which a cutting portion is formed by cutter means in the heat-sensitive stencil plate making apparatus shown in FIG. 16A, FIG. 17C is a top view showing the master cut along the cutting section shown in FIG. 16B.

FIG. 17 is a front view of the heat-sensitive stencil plate making apparatus shown in FIG.

18 is a plan view showing a rotary blade of a cutter means in the heat-sensitive stencil plate making apparatus shown in FIG. 17 (a).

[Explanation of symbols]

 1 master 2, 20, 21, 22 thermal head 3, 8 resistance heating element 4 punching image 5 linear motor as moving device 7 hole array 9, 90 resistance heating wire 11 solenoid 12 spring 14, 142 platen roller 70 fusion line S main Scanning direction F Sub-scanning direction

Claims (3)

[Claims] 1. A thermal head having a plurality of resistance heating elements arranged in a line in the main scanning direction is brought into contact with a master for heat-sensitive stencil, and the master is set in the sub-scanning direction orthogonal to the arrangement direction of the resistance heating elements. In a heat-sensitive stencil plate making apparatus that forms a perforated image in a dot matrix manner by selectively heating the resistance heating element by moving relative to a thermal head, the master substantially consists of a thermoplastic resin film, and Having a moving device that moves the thermal head in the main scanning direction, after the formation of the perforation image on the master is completed, the thermal head is moved by the moving device in the main scanning direction, and one end side of the master A heat-sensitive stencil product, characterized in that a control means for controlling the resistance heating element is provided so as to provide a hole row for cutting the master across the end side. Apparatus. 2. A thermal head having a plurality of resistance heating elements arranged in a line in the main scanning direction is brought into contact with a master for heat-sensitive stencil, and the master is set in the sub-scanning direction orthogonal to the arrangement direction of the resistance heating elements. In a heat-sensitive stencil plate making apparatus that forms a perforated image in a dot matrix manner by selectively heating the resistance heating element by moving relative to a thermal head, the master substantially consists of a thermoplastic resin film, and A resistance heating wire arranged in parallel with the resistance heating element in the thermal head, and a moving device for moving the thermal head in the main scanning direction, after the formation of the punched image on the master is completed, The thermal head is moved in the main scanning direction by the moving device to provide a melting line for cutting the master from one end side to the other end side of the master. Stencil making apparatus, characterized in that a control means for controlling the urchin the resistance heating wire. 3. A thermal head having a plurality of resistance heating elements arranged in a line in the main scanning direction is brought into contact with a master for heat-sensitive stencil, and the master is set in the sub-scanning direction orthogonal to the arrangement direction of the resistance heating elements. In a heat-sensitive stencil plate making apparatus that forms a perforated image in a dot matrix manner by selectively heating the resistance heating element by moving relative to a thermal head, the master substantially consists of a thermoplastic resin film, and After the formation of the perforated image on the master is completed, the master is arranged in parallel with the resistance heating element in the thermal head and has a resistance heating wire longer than the row of resistance heating elements. A heat-sensitive stencil plate making apparatus characterized in that a control means for controlling the resistance heating line is provided so as to provide a melting line for cutting.