JPH0794661A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To provide an integrated circuit device for inputting/outputting high speed signal in which the crosstalk and the interferential noise due to electrostatic coupling between the high speed signal wiring and the power supply/control signal wiring are suppressed. CONSTITUTION:The integrated circuit device comprising an integrated circuit chip 6 having first signal I/O electrodes 9A, 9B and second power supply/control signal electrodes 9C, 9D, a semiconductor circuit body 1 for mounting the integrated circuit chip, and a cover 2 covering the surface of the semiconductor circuit body 1, wherein the external wiring from the first electrodes 9A, 9B is formed on the semiconductor circuit body 1 whereas the external wiring from the second electrodes 9C, 9D is formed on the cover 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device, and more particularly, to an integrated circuit package having an integrated circuit body and a lid, and externally provided with lead terminals for signals and lead terminals for exchanging power and control signals. Regarding circuit devices.

[0002]

2. Description of the Related Art Conventionally, an integrated circuit device of this type is shown in FIG. 4 which is a packaged perspective view after assembly is completed and FIG. 5 is a plan view of an integrated circuit body 12.
2. It is composed of a spacer 11 and a lid 14. Here, the integrated circuit main body 12 has a chip 6 of the integrated circuit mounted on the ceramic substrate 3 in the center, and leads 9A to 5D for signal input / output from the electrodes 9A to 9D of the chip 6 and power / control signal transfer The lead terminals 5C and 5D are connected via the wire 7 and the lead terminals 4C and 4D. That is, all the electric circuits and the lead terminals for connection are arranged in the integrated circuit body 12, and the spacers 11 are arranged on the lead terminals.
It was sealed with a lid 14 via a via to form a package.

[0003]

In this conventional integrated circuit device, since the input / output lead terminals for the signal and the lead terminals for the power supply and the control signal are mounted on the integrated circuit main body, the dielectric body such as a ceramic substrate is provided. There is a drawback in that phenomena such as crosstalk and interference noise occur due to mutual coupling of signal lines and power supplies due to electrostatic coupling.

[0004]

SUMMARY OF THE INVENTION An integrated circuit device of the present invention includes an integrated circuit chip having a first electrode for inputting and outputting signals and a second electrode for supplying power and control signals.
In an integrated circuit device having a semiconductor circuit body on which this integrated circuit chip is mounted and a lid covering the surface of the semiconductor circuit body, wiring from the first electrode to the outside is formed in the semiconductor circuit body, Wiring from the second electrode to the outside is formed on the lid.

[0005]

The present invention will be described below with reference to the drawings. FIG. 1A is a perspective view showing the whole integrated circuit device of the first embodiment of the present invention after completion of assembly, and FIG.
1A is a plan view showing the lid 2, FIG. 1C is a plan view showing the integrated circuit body 1 of FIG. 1A, and FIG. 1D is FIG. 1A.
FIG. The structure of the integrated circuit device will be described with reference to FIGS. The device of this embodiment is composed of an integrated circuit body 1, a lid 2 and a spacer 11, and further leads from the lid 2 to the outside through lead terminals 5C and 5D and a chip 6 in the integrated circuit body 1 through a wire 7 to the outside. The lead terminals 5A and 5B are shown. The lid 2 shown in FIG. 1B is a view of the lid 2 in the state of FIG. 1 seen from the back side, and leads for connecting the lead terminals 5C and 5D to the bumps 8 of the protrusions 10 (see FIG. 1D). The terminals 4C and 4D are embedded in the ceramic substrate 3. In the integrated circuit body 1 shown in FIG. 1C, a chip 6 is mounted in a central recess, and leads for inputting and outputting signals from electrodes 9A to 9D of the chip 6 through wires 7 and lead terminals 4A and 4B. It is connected to terminals 5A and 5B. Here, since the lead terminals 4A and 4B serve as signal transmission paths, they are formed so as to have a desired characteristic impedance. The electrodes 9C and 9D are a power supply terminal and a control terminal, and are set so as to come into contact with the lead terminals 5C and 5D of the lid 2 through the bump-shaped bumps 8 having a buffer property when the lid 2 is assembled. Therefore, the spacer 11 is set to a height at which this contact is well maintained.

FIG. 2 is a view showing a second embodiment of the present invention, FIG. 2 (a) is a perspective view after completion of assembly, and FIG. 2 (d) is a vertical sectional view of FIG. 2 (a). 2 (b) is a plan view of the lid 2 of FIG. 2 (a) seen from the back side, and FIG. 2 (c) is a plan view of the integrated circuit body 1 of FIG. 2 (a). 1 (a)-(d) and FIG.
The reference numerals of the constituent parts of (a) to (d) are substantially the same, but lead terminals 5A and 5B for signal input / output are provided on the lid 2 side.
And lead terminals 5C and 5D for power supply and control signals are arranged toward the integrated circuit body 1.

FIG. 3 is a diagram showing a third embodiment of the present invention. FIG. 3 (a) is a diagram showing the integrated circuit body 1 of FIG. 1 (c) which is the first embodiment with a tab 13 added. There is. The tab 13 is shown in FIG.
As shown in the sectional view of (b), it is used as an intermediate connecting body of a wire connecting the chip 6 to the lead terminals 4A and 4B.

As described above, in the present invention, the signal lead terminals are arranged in the integrated circuit main body, the power supply and control signal lead terminals are arranged in the lid, and the spacers are provided between the lead terminals to provide a space therebetween. By eliminating the coupling between the two, for example, crosstalk can be reduced.

[0009]

As described above, according to the present invention, the signal lead terminal in the integrated circuit device, the lead terminal for the power source and the like and the wirings attached to them are separated into the integrated circuit body and the lid. The effect is that crosstalk and interference noise due to the coupling between the power source and the control signal can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view (a) of a first embodiment of the present invention, a plan view of a lid (b), a plan view of an integrated circuit body (c), and a sectional view after assembly (d).

FIG. 2 is a perspective view (a), plan views (b) and (c), and a sectional view (d) of a second embodiment of the present invention.

FIG. 3 is a plan view (a) of an integrated circuit body of a third embodiment of the present invention, and a sectional view (b) after assembly.

FIG. 4 is a perspective view of a conventional integrated circuit device.

FIG. 5 is a plan view of a conventional integrated circuit body.

[Explanation of symbols]

 1, 12 Integrated circuit body 2, 14 Lid 3 Ceramic substrate 4A, 4B Lead terminal 5A, 5B Signal lead terminal 5C, 5D Lead terminal for power supply 6 Chip 7 Wire 8 Bump 9A-9D Electrode 10 Protrusion 11 Spacer 13 tab

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01L 27/04 21/822 8832-4M H01L 27/04 E

Claims (3)

[Claims] 1. An integrated circuit chip having a first electrode for inputting and outputting a signal and a second electrode for a power source and a control signal, a semiconductor circuit body on which the integrated circuit chip is mounted, and the semiconductor circuit. In an integrated circuit device having a lid covering a surface of a body, wiring from the first electrode to the outside is formed in the semiconductor circuit body, and wiring from the second electrode to the outside is formed in the lid. An integrated circuit device characterized by: 2. The bumps that elastically contact the second electrode formed on the integrated circuit chip and the contact portion of the wiring tip formed on the lid. The integrated circuit device described. 3. The integrated circuit device according to claim 1, wherein a tab is used as an intermediate connecting portion of a wiring from the first electrode to the semiconductor circuit body.