JPH0793737A - Production of thin film magnetic head slider - Google Patents

Abstract

PURPOSE:To form an air bearing face of a fine complex shape by a dry process with high precision and to produce a thin film magnetic head slider suitable for mass production. CONSTITUTION:Slider bars 1 and spacing bars 12 are alternately arranged in a close contact state, they are bonded to a plate 2 with an adhesive 3 and a photoresist pattern 14 is formed using a liq. photoresist. Fine working is then carried out by dry etching to form an air bearing face.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thin film magnetic head slider.

[0002]

2. Description of the Related Art In recent years, there has been a rapid increase in the demand for higher recording density in magnetic recording devices, and it is certain that this tendency will increase in the future. In response to this requirement, the magnetic head slider is required to have a very low flying height of 0.1 μm or less and stable flying characteristics that do not change depending on the peripheral speed of the recording medium, and satisfy that requirement. In order to achieve this, technology for forming fine and complex air bearing surface shapes with high precision is essential.

The air bearing surface of the conventional magnetic head slider is manufactured by machining centering on grinding with a grindstone, and attempts have been made to satisfy the above requirements by raising the precision of the processing machine to a high degree. ,
Conventional machining has not reached the desired machining accuracy,
Furthermore, it is impossible to process complicated shapes including curves. Therefore, a method using photolithography technology, that is, a photomask corresponding to the air bearing surface is manufactured,
A method of processing by dry etching such as ion beam etching has been proposed.

Although dry etching is actively used in semiconductor processes and thin film magnetic head element forming processes, and its processing accuracy is certainly a method that sufficiently satisfies the above processing accuracy, semiconductor processing and thin film magnetic heads Whereas the element formation process targets the surface of a wafer having a size of about 3 to 5 inches, the thin film magnetic head slider is a strip having a plurality of thin film magnetic head elements cut out from the wafer on which the thin film magnetic head element is formed by machining. The difference is that the target is the surface of a block (hereinafter referred to as a slider), which is the biggest problem.

That is, it is important to form a good resist pattern in order to perform fine and highly accurate processing by a photolithography technique using dry etching or the like, but it is important to form a good resist pattern in a small area such as a slider bar. It is very difficult to form a photoresist film uniformly. For example, if a liquid photoresist is applied to a wafer by spin coating to form a resist film, the thickness of the center part is uniform, but the edge part is much thicker than the center part. A good resist pattern shape cannot be formed. Therefore, in the case of a wafer, only the center part is used excluding the end part. However, since the entire surface of the slider bar is the processing target, it cannot be excluded that the end part is not used. Therefore, a uniform resist film is formed on the entire surface. Must.

In the semiconductor process and the thin film magnetic head element forming process, hundreds to thousands of devices can be formed in the wafer, and the productivity can be improved relatively easily by increasing the diameter of the wafer. On the other hand, the magnetic head element in the slider bar is at most 20 to 3
The limit is 0, and if each slider bar is handled, the productivity is extremely low and it cannot be industrialized.

From the above reasons, it is obvious that it is inevitable that a large number of slider bars are arranged side by side and adhered to the plate and handled as a large area such as a wafer. However, at this time, the following problem occurs. 5 and 6
FIG. 6 is an explanatory diagram of a conventional method for manufacturing a thin film magnetic head slider. FIG. 5 shows a schematic view of a cross section in which a slider bar is adhered to a plate, and FIG. 6 shows a state in which a photomask is overlaid on the air bearing forming surface of one slider bar and viewed from above. The above problem will be described with reference to the drawings.

The state of FIG. 5A, that is, the slider bar 1
When the slider bar 1 is adhered to the plate 2 with the adhesive 3, if there is no gap between the slider bars 1 and the air bearing forming surface 5 is a flat surface, it can be handled in the same manner as a wafer. The thickness of the photoresist coating 6 applied to the layer 5 is also uniform, and a good photoresist pattern can be formed. But Figure 5
If there is a gap 7 between the slider bars 1 as shown in (b), a large unevenness is generated on the air bearing forming surface 5, and when photoresist is applied to it, as shown in the drawing, the end portion is thick and the center portion is thin and uneven photo is formed. The resist coating 6 is formed, and a good photoresist pattern cannot be formed. In addition, the side surface 1b of the slider bar 1 having the terminal portion of the thin film magnetic head element has a very thin photoresist coating 6 and is damaged by dry etching. As a result, the terminal portion is damaged, and this also causes a poor appearance. Further, since there is a tolerance in the thickness of the slider bar 1, the slider bar 1 has a thickness distribution, and the thickness variation of the adhesive 3 is also added.
As shown in FIG. 5C, the air bearing forming surface 5 is in a concavo-convex state, and a good photoresist pattern cannot be formed as in FIG. 5B. Although it is not technically impossible to eliminate the variation in the thickness of the slider bar 1 and the adhesive 3, it causes a significant increase in manufacturing cost due to an increase in the number of steps and a decrease in yield.

Next, the adhesive 3 is applied to the air bearing surface 5
In the processing step, the slider bar 1 should be firmly held, it can be easily peeled off after the processing step, and high temperature is not required at the time of adhesion (which causes deterioration of characteristics of the thin film magnetic head). However, there are very few adhesives 3 that satisfy all these conditions. Further, when the extruded portion 9 that rises due to the capillary phenomenon is generated between the slider bars 1 and 4, the pattern becomes defective in that portion.

Next, FIG. 6 will be described. The width H _SB of the slider bar 1 is the sum of the thickness H _{B of the} film formed in the thin film magnetic head element forming process and the thickness H _{A of the} wafer, and it is inevitable that the width H _SB has a constant distribution. H _SB When this distribution and ± a is represented by _{H SB = (H B + H} A) ± a.

On the other hand, assuming that the width of the photomask 10 is H _FM , when H _SB > H _FM , an unexposed portion 11 is formed and a pattern defect occurs, so that the width of the photo mask is H _FM ≧ H _SB = (H _B + H _a) must be at least equal to ± a or maximum width of the distribution of the slider bar 1, the photomask 10 is to be designed so as to be greater width only ΔH = H _FM -H _SB to slider bar 1 . As a result, if the slider bars 1 are arranged at intervals of ΔH or more, double exposure portions are formed. However, if they are arranged at intervals of ΔH or more, the state becomes as shown in FIG. 5B, and a good photoresist pattern is formed. Can not do.

[0012]

Therefore, according to the present invention, even a slider bar having dimensional tolerances in width and thickness can accurately form an air bearing surface having a fine and complicated shape by a dry process. Moreover, an object of the present invention is to provide a method of manufacturing a thin film magnetic head slider which is inexpensive and suitable for mass production by simultaneously handling a large number of slider bars.

[0013]

SUMMARY OF THE INVENTION A method of manufacturing a thin film magnetic head slider according to the present invention comprises a plurality of blocks having a plurality of thin film magnetic head elements and a thin film magnetic head element having substantially the same length and thickness as those blocks. Blocks that do not have are alternately arranged in close contact with each other, and the air bearing forming surface that is going to form the air bearing surface is brought into close contact with the horizontal surface and has the same height, and faces the air bearing forming surface. The adhesive surface on the back side corresponding to the plate and the plate are adhered with an adhesive, and a liquid photoresist is applied to the air bearing forming surface to form a photoresist pattern corresponding to the air bearing shape by photolithography means. Shape the air bearing surface by dry etching using the pattern as a mask It is obtained by way.

[0014]

According to the above construction, the slider bar and the spacing bar are closely contacted and arranged at the same height to bond the bonding surface to the plate, or the slider bars are arranged at a constant interval and arranged at the same height. After adhering to the plate, adhere the dry film to the air bearing surface,
By filling the gap formed by the slider bar and the dry film with a resin, it is possible to form a photoresist coating having no irregularities on the air bearing forming surface.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a manufacturing process diagram of a method of manufacturing a thin film magnetic head slider according to a first embodiment of the present invention, and FIG. 2A is a thin film magnetic head according to the first embodiment of the present invention. FIG. 2B is a partially enlarged perspective view of a portion K of FIG. 2A, in which the slider bar and the spacing bar are adhered to the plate in the method of manufacturing the slider. Note that FIG. 1 corresponds to a cross-sectional view taken along the line AA ′ of FIG.

In FIGS. 2A and 2B, a strip-shaped slider bar 1 is cut out from a wafer on which a thin film magnetic head element is formed by machining, and after lapping, a strip having a thickness substantially equal to those of the slider bar 1 is cut. A large number of pacing bars 12 are arranged side by side as shown in the figure and bonded to the bonding plate 2. The method will be described below with reference to FIG.

Strip-shaped slider bar 1 and spacing
The bars 12 are alternately arranged in close contact with each other (Fig. 1 (a)).
The surface on which the air bearing surface is to be formed (hereinafter referred to as the air bearing
Aligning surface 5) is directed downwards on the horizontal surface 13.
They are brought into close contact with each other to have the same height (Fig. 1 (b)). 1a
Is the adhesive surface. The material of the slider bar 1 is Al₂ O
₃ , Al₂ O₃ / TiC, ferrite, etc.
The material of the pacing bar 12 is the same as that of the slider bar 1.
It is desirable to use a material, but the material may be different. This
In the state of the adhesive 3 and the air bearing forming surface 5
Play with the back side, which is the opposite side (hereinafter referred to as the adhesive side 1a)
And the adhesive 2 (FIG. 1 (c)). Next, take the horizontal plane 13.
The slider bar 1 and plate 2 upside down.
If (Fig. 1 (d)), slider bar 1 and space
The thickness distribution of the bonding bar 12 is absorbed by the difference in the thickness of the adhesive 3.
The air bearing surface 5 has a large diameter and is flat
It becomes a face. Therefore, in the subsequent steps,
Wafers handled in the thin film magnetic head element formation process
The same handling is possible.

Next, liquid photoresist is applied to form a photoresist coating 6 (FIG. 1E), and a photoresist pattern 14 corresponding to the intended air bearing surface is formed by the photolithography technique (FIG. 1).
(F)). Next, the air bearing surface is formed by dry etching such as ion beam milling using the formed photoresist pattern 14 as a mask (see FIG. 1).
(G)), the remaining photoresist residue is removed with a solvent such as acetone, and the slider bar 1 and the spacing bar 12 are separated from the plate 2 (FIG. 1 (h)).

By setting the width of the spacing bar 12 to be ΔH or more during the above process, the conventional problem in arranging the slider bars 1 at regular intervals can be solved.

Next, the adhesive 3 is applied to the air bearing surface 5
In the processing step of, the spacing bar 12 is firmly held,
Can be easily peeled off after the process, and does not require high temperature for adhesion (causes deterioration of magnetic head characteristics)
However, a liquid photoresist or a silicone resin is particularly excellent as the adhesive 3. This effect will be described with reference to the manufacturing process diagrams of the method for manufacturing the thin film magnetic head slider in the first embodiment of the present invention shown in FIGS.

FIGS. 3A to 3D correspond to the AA 'sectional view in FIG. 2B. The liquid photoresist is not an adhesive by nature, but a strong adhesive force can be obtained by baking after adhering as shown in FIG. A baking temperature of 120 ° C. or lower for about 60 minutes is sufficient, and does not deteriorate the characteristics of the thin film magnetic head. The greatest feature of using the liquid photoresist is that the photoresist coating 6 is applied using the liquid photoresist for patterning even if the bleeding portion 15 is generated as shown in FIG. 3B. In the state shown in (3), the exuding portion 15 is redissolved to form a new photoresist coating 16, which does not become a defect as shown in FIG. 3 (d). However, the liquid photoresist is classified into a positive type and a negative type, but it is desirable that the photoresist as an adhesive and the photoresist for patterning have the same type. Furthermore, since the liquid photoresist is easily dissolved with a solvent or the like, the slider bar 1 can be peeled off very easily after the process.

Next, regarding the silicone resin, in this case, when the bleeding portion 15 is generated, it does not redissolve like liquid photoresist and becomes a defect, so it is necessary to remove it with a solvent such as toluene. There is an increase in the number of steps in this respect. However, the exudation portion 15 itself can be easily removed, the bonding temperature can be kept at room temperature, and the slider bar 1 can be peeled off very easily after the process similar to the liquid photoresist. Any silicone resin can be used as an adhesive, but siloxane bond (Si-OS)
i), a silicone varnish composed of an organic methyl group, a phenyl group and the like is particularly preferable because it is excellent in heat resistance, water resistance and flame retardancy, and very excellent in solubility in a solvent such as toluene or xylene. The viscosity can also be adjusted freely, but 10
A low viscosity of 0 cp (25 ° C.) or less is easier to handle.

Next, this embodiment will be described in more detail by showing specific numerical values. A width of 2.00 m from a 4.5 inch square Al ₂ O ₃ / TiC wafer on which a thin film magnetic head element is formed by grinding using a grindstone and lapping.
A strip-shaped slider bar 1 having dimensional tolerances of m ± 0.02 mm, length 50.00 ± 0.05 mm and thickness 0.45 ± 0.01 mm was prepared, and no thin film magnetic head element was formed. 4 Width 0.50 mm ± 0.0 from a 5 inch square Al ₂ O ₃ wafer by grinding using a grindstone
5mm, length 50.00 ± 0.10mm, thickness 0.45
A strip-shaped spacing bar 12 having a dimensional tolerance of ± 0.02 mm was produced. Next, the slider bars 1 and the spacing bars 12 are alternately arranged and brought into close contact with each other, and the air bearing forming surface 5 faces downward so as to come into close contact with a horizontal glass surface, and a slight amount of 0.5 kg / cm ² is applied from the front, rear, left and right directions. It was pressurized with pressure and mechanically fixed. In this state, the adhesive 3 was used to bond the 4.5-inch square Al ₂ O ₃ / TiC wafer to the adhesive surface 1 a opposite to the air bearing processed surface. For example, a liquid photoresist AZ4903 manufactured by Hoechst Co., Ltd. is used as the adhesive 3, and the liquid photoresist AZ4903 is applied to the plate 2 by a spin coating method to form a film of 15 μm for adhesion.
The photoresist was solidified by baking at 0 ° C. for 60 minutes. As a result, the level difference on the air bearing forming surface 5 is 0.0
It could be set to 02 mm or less.

Next, a liquid photoresist was dropped and coated by spin coating, followed by baking at 90 ° C. for 2 hours to form a photoresist film 6 having a film thickness of 25 μm. In the formation of the photoresist coating 6 by the spin coating method, if the substrate has irregularities, the film thickness distribution becomes remarkably large and a good photoresist pattern cannot be obtained. However, in this embodiment, the film thickness distribution is 0.5 μm or less. We were able to.

Next, the air bearing forming surface 5 was exposed with a photomask having a width of 2.05 mm and developed to obtain a photoresist pattern. Here, the width of the photomask is 2.00 mm ± 0.02 when the width of the slider bar 1 is
Since the maximum width is 2.0 mm, it is 0.0 rather than 2.02 mm.
The width was 3 mm wider. Etching is performed by ion beam milling using this photoresist pattern as a mask.
It was processed to a depth of μm.

Then, the remaining photoresist was removed by immersing in acetone, the slider bar 1 was peeled from the plate 2, and then the magnetic head element was cut into individual pieces to manufacture a thin film magnetic head slider.

(Embodiment 2) Next, a method of manufacturing a thin film magnetic head slider according to a second embodiment of the present invention will be described. FIG. 4 is a manufacturing process diagram of a method of manufacturing a thin film magnetic head slider according to a second embodiment of the present invention. A strip-shaped slider bar 1 is cut out from the wafer on which the thin film magnetic head element is formed by machining (FIG. 4).
(A)). Next, the slider bars 1 are arranged at intervals of ΔH or more, with the air bearing forming surface 5 facing downward, and the horizontal surface 1
The height of the air bearing forming surface 5 is made the same by closely contacting with 7 (FIG. 4 (b)). To arrange the slider bars 1 at regular intervals, it is possible to provide counterbore holes 17a of the same size as the slider bar 1 at predetermined intervals on the horizontal surface 17 and drop the slider bars 1 into the counterbore holes 17a. Is. In this state, the bonding surface 1a and the plate 2 to which the adhesive 3 has been applied in advance are bonded (see FIG. 4).
(C)). The adhesive 3 should firmly hold the slider bar 1 in the process of forming the air bearing forming surface 5, can be easily peeled off after the process, and further needs to satisfy the characteristic that high temperature is not required at the time of bonding. For the same reason, the liquid photoresist or silicone resin is particularly excellent.

Next, if the horizontal plane 17 is removed and the slider bar 1 and the plate 2 are turned upside down, the state shown in FIG. 4D is obtained, and the thickness distribution of the slider bar 1 is absorbed by the difference in the thickness of the adhesive 3 and the air is absorbed. Although the bearing forming surface 5 is horizontal, the formation of the gap 7 results in a state similar to that of FIG. 5B, and cannot be handled as a wafer as it is. Therefore, as shown in FIG. 4E, the dry film photoresist 18 is brought into close contact with the air bearing forming surface 5 by a laminator or the like so that the air bearing forming surface 5 has a gap 7 between the slider bars 1.
Thus, a flat surface without unevenness can be obtained, and the photoresist pattern can be formed by the photolithography technique as it is.

However, depending on the shape of the patterning, there is a portion where the gap 7 formed by the slider bar 1 and the dry film photoresist 18 is exposed. If dry etching is performed as it is, the side surface 1b of the slider bar 1 is etched. , The terminal portion of the thin film magnetic head element is damaged and the appearance is impaired. Therefore, filling the gap 7 with a liquid photoresist or resin 20 solves the above problem. The liquid photoresist or resin 20 filling the gap 7 may be any that can be easily removed after the process. When a liquid photoresist is used, it is baked at 90 ° C. for about 60 minutes. The one shown in FIG. 4E obtained by the above method can be handled in the same manner as a wafer like the one shown in FIG.

Next, a photoresist pattern 19 corresponding to the target air bearing forming surface 5 is formed by photolithography (FIG. 4 (f)), and dry etching such as ion beam milling is performed using the photoresist pattern 19 as a mask. After forming the air bearing surface (FIG. 4 (g)), the remaining dry film photoresist 18 and the liquid photoresist or resin 20 filling the gap 7 are removed, and the slider bar 1 is peeled from the plate 2 (FIG. 4). (H)).

Next, the second embodiment will be described in more detail by showing concrete numerical values. A width of 2.50 mm ± 3 mm by grinding and lapping a 3 inch φ Al ₂ O ₃ / TiC wafer on which a thin film magnetic head element is formed by using a grindstone.
A strip-shaped slider bar 1 having a dimensional tolerance of 0.02 mm, a length of 25.00 ± 0.05 mm and a thickness of 0.45 ± 0.01 mm was produced. The slider bars 1 were arranged at intervals of 0.30 mm, and the air bearing forming surface 5 faced downward, and the slider bar 1 was brought into close contact with the Al ₂ O ₃ surface whose surface was finished horizontally. The Al ₂ O ₃ surface has the same shape as the air bearing forming surface 5 and has a width of 2.57 mm, a length of 25.07 mm, and a depth of 0.02 mm in consideration of a clearance of 50 μm.
The counterbored holes 17a of the slider bar 1 are provided at an interval of 0.03 mm, which is equal to the interval of the slider bar 1, and the slider bar 1 is dropped into the countersunk hole 17a to accurately measure 0.3.
The slider bars 1 were arranged at intervals of 0 mm. In this state, the adhesive 3 is used to form a 4.5 inch square Al ₂ O with the adhesive surface 1a.
_{The 3} / TiC wafer was bonded. As the adhesive 3, for example, a silicone varnish KR251 manufactured by Shin-Etsu Chemical Co., Ltd. is used, and this is applied to the plate 2 by a spin coating method to form a 10 μm film and adhered, and the adhesive is solidified by baking at 50 ° C. for 60 minutes. Promoted. As described above, the step difference of the air bearing forming surface 5 could be 0.002 mm or less.

Next, for example, dry film photoresist AP950 (thickness: 50 μm) manufactured by Tokyo Ohka Kogyo Co., Ltd.
Liquid is made by Hoechst liquid in a space formed by the slider bar 1 and the dry film photoresist 18 by closely contacting the air bearing forming surface 5 with a laminator under the conditions of 10 ° C., pressure of 1.5 kg / cm ² and speed of 0.8 m / min. The photoresist AZ4400 was injected and baked at 80 ° C. for 30 minutes to fill the space.

Next, a photomask having a width of the air bearing forming surface 5 of 2.55 mm was used for exposure and development to obtain a photoresist pattern 19. Here, the width of the photomask is 2.50 mm ± 0.
Since it was 02 mm, the width was made 0.03 mm wider than the maximum width of 2.52 mm. Using this photoresist pattern 19 as a mask, etching was performed by ion beam milling to give a depth of 12 μm.

Next, the remaining dry film photoresist 18 is stripped with KOH, the photoresist filling the space is removed with acetone, and the slider bar 1 is stripped from the plate 2 by further immersing it in toluene and then the magnetic head element. A thin film magnetic head slider was manufactured by cutting into a single piece.

[0036]

As described above, according to the present invention, the slider bar and the spacing bar are brought into close contact with each other and arranged at the same height so that the adhesive surface is adhered to the plate, or the slider bars are provided at regular intervals so that they have the same height. After adhering side by side and adhering the adhesive surface to the plate, dry film photoresist is adhered to the air bearing forming surface, and the space formed by the slider bar and dry film photoresist is filled with resin, so that the air bearing forming surface has no irregularities Since a photoresist film can be formed, handling many slider bars in the same state as wafers at one time greatly improves the productivity, and the thickness and width of the slider bar are not strictly controlled, and a certain degree of distribution can be obtained. Even if it has, it is possible to form an air bearing surface of any shape with fineness and high precision. , And the it can be expected further improvement in simplicity and yield of the process.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram of a method of manufacturing a thin film magnetic head slider according to a first embodiment of the present invention.

2A is a perspective view of a slider bar and a spacing bar adhered to a plate in the method of manufacturing the thin film magnetic head slider according to the first embodiment of the present invention, and FIG. 2B is a perspective view of FIG. Partial enlarged perspective view of part K

3A is a manufacturing process diagram of a method for manufacturing a thin film magnetic head slider according to a first embodiment of the present invention, and FIG. 3B is a manufacturing process diagram of a method for manufacturing a thin film magnetic head slider according to the first embodiment of the present invention. Process drawing (c) is a manufacturing process drawing of the method for manufacturing a thin film magnetic head slider in the first embodiment of the present invention (d) is a manufacturing process drawing of the manufacturing method of a thin film magnetic head slider in the first embodiment of the present invention

FIG. 4 is a manufacturing process diagram of a method of manufacturing a thin film magnetic head slider according to a second embodiment of the present invention.

5A is a manufacturing process diagram of a conventional thin film magnetic head slider manufacturing method, FIG. 5B is a manufacturing process diagram of a conventional thin film magnetic head slider manufacturing method, and FIG. 5C is a conventional thin film magnetic head slider manufacturing process. Manufacturing process diagram of the method

FIG. 6 is an explanatory view of a conventional method for manufacturing a thin film magnetic head slider.

[Explanation of symbols]

 1 Slider bar 1a Adhesive surface 2 Plate 3 Adhesive 5 Air bearing forming surface 6 Photoresist coating 7 Gap 12 Spacing bar 13,17 Horizontal surface 14 Photoresist pattern

Claims (4)

[Claims] 1. An air bearing in which a large number of blocks having a plurality of thin film magnetic head elements and blocks having no thin film magnetic head elements having substantially the same length and thickness are alternately arranged in close contact with each other. In a state where the air bearing forming surface to form a surface is in close contact with the horizontal surface and the height is the same, the back surface side adhesive surface and the plate, which face the air bearing forming surface, are bonded with an adhesive, After forming a photoresist pattern corresponding to the air bearing shape by a photolithography means by applying a liquid photoresist to the air bearing forming surface, the air bearing surface is formed by dry etching using the photoresist pattern as a mask. A method of manufacturing a thin film magnetic head slider having the characteristics. 2. A large number of blocks having a plurality of the thin film magnetic head elements and blocks having no thin film magnetic head element having substantially the same length and thickness as those blocks are formed by using a liquid photoresist or a silicone resin as an adhesive. It adheres to the said plate, The Claim 1 characterized by the above-mentioned.
A method for manufacturing the thin film magnetic head slider described. 3. A plurality of blocks having a plurality of thin film magnetic head elements are arranged at regular intervals, and the air bearing forming surface is brought into close contact with a horizontal surface so that the heights thereof are the same and the adhesive surface and the plate. With an adhesive, a dry film photoresist is adhered to the air bearing forming surface, a gap formed by the block and the dry film photoresist is filled with a liquid photoresist or resin, and the air bearing is formed by photolithography means. A method of manufacturing a thin film magnetic head slider, characterized in that a photoresist pattern corresponding to the surface is formed, and the air bearing surface is formed by dry etching using the photoresist pattern as a mask. 4. A method of manufacturing a thin film magnetic head slider according to claim 3, wherein a large number of the blocks having a plurality of thin film magnetic head elements are bonded to the plate by using a liquid photoresist or a silicone resin as an adhesive. .