JPH0793483B2 - Power composite parts - Google Patents

Power composite parts

Info

Publication number
JPH0793483B2
JPH0793483B2 JP2236656A JP23665690A JPH0793483B2 JP H0793483 B2 JPH0793483 B2 JP H0793483B2 JP 2236656 A JP2236656 A JP 2236656A JP 23665690 A JP23665690 A JP 23665690A JP H0793483 B2 JPH0793483 B2 JP H0793483B2
Authority
JP
Japan
Prior art keywords
circuit pattern
circuit
magnetic substrate
magnetic
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2236656A
Other languages
Japanese (ja)
Other versions
JPH04116886A (en
Inventor
崇文 戸田
薫明 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP2236656A priority Critical patent/JPH0793483B2/en
Publication of JPH04116886A publication Critical patent/JPH04116886A/en
Publication of JPH0793483B2 publication Critical patent/JPH0793483B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、小型のビデオムービーや携帯型パソコン等の
小型電気機器に電力を供給する回路部分をユニット化し
た電力用複合部品の構成に関するものである。
The present invention relates to a structure of a power composite component in which a circuit part for supplying power to a small electric device such as a small video movie or a portable personal computer is unitized. Is.

〔従来の技術とその課題〕[Conventional technology and its problems]

近年、電気機器の小型化に伴い電源周辺の回路装置も一
段と軽量で薄形のものが望まれている。
2. Description of the Related Art In recent years, with the miniaturization of electric devices, circuit devices around power sources are required to be even lighter and thinner.

従来のこの種の複合部品としては、両面プリント基板の
上下面に回路素子を取付けたものや、片面プリント基板
の上に回路素子を取付けた構造のものがある。電力用回
路には大きな電流が流れるので、動作中のこれら複合部
品には大量の熱が発生する。しかし、チョークコイルや
コンデンサ等を多用する電力用回路は、プリント基板の
表面が多数の回路素子や回路パターンで覆われるので、
効果的にその熱を逃がす構造とするのが困難であった。
As a conventional composite component of this type, there are one having a circuit element mounted on the upper and lower surfaces of a double-sided printed circuit board and one having a structure having a circuit element mounted on a single-sided printed circuit board. Due to the large currents flowing through the power circuit, a large amount of heat is generated in these composite components during operation. However, since the surface of the printed circuit board is covered with a large number of circuit elements and circuit patterns in a power circuit that makes heavy use of choke coils and capacitors,
It was difficult to have a structure that effectively dissipates the heat.

〔発明の目的〕[Object of the Invention]

本発明は上記のような問題点を解決するためになされた
もので、放熱効果にすぐれ、しかも薄形化が可能な電力
用の複合部品を提供することを目的とするものである。
The present invention has been made to solve the above problems, and an object of the present invention is to provide a composite component for electric power, which has an excellent heat dissipation effect and can be thinned.

〔課題を解決するための手段〕[Means for Solving the Problems]

本発明は、スルーホールを通じて電気的に接続した回路
パターンとプリントコイルを、第1の磁性体基板の上面
及び下面にそれぞれ形成するとともに、第1の磁性体基
板の下面に平板状の第2の磁性体基板を積層して固定
し、回路パターン上に回路素子を取付けた構成を特徴と
する。
According to the present invention, the circuit pattern and the print coil electrically connected through the through holes are formed on the upper surface and the lower surface of the first magnetic body substrate, respectively, and the flat plate-shaped second coil is formed on the lower surface of the first magnetic body substrate. It is characterized in that magnetic substrates are laminated and fixed, and circuit elements are mounted on a circuit pattern.

〔実施例〕〔Example〕

第1図および第2図は、本発明をDC−DCコンバータに適
用した場合の一実施例を示すものである。
1 and 2 show an embodiment in which the present invention is applied to a DC-DC converter.

これらの図において、10および20はニッケルジンクフェ
ライト等からなる磁性体基板である。第3図に拡大して
示すように、一方の磁性体基板10の上面には、ガラス膜
などの絶縁層21を設けてあり、その上には、銅等からな
る回路パターン22が印刷焼付けなどの手段で形成してあ
る。回路パターン22の上には、さらに絶縁層23を介し
て、さらに別の回路パターン24が形成してある。これら
の二層の回路パターン22、24はスルーホール25を通じて
電気的に接続されている。磁性体基板10の下面には、ス
ルーホール15を介して回路パターン22に接続した第4図
のようなプリントコイル30が複数個形成してある。磁性
体基板10の下面にはプリントコイル30を覆うようにして
別の磁性体基板20が接着固定してある。28はプリントコ
イル30に対向する位置に設けた磁性体基板20の凹部であ
る。このように二枚の磁性体基板10、20の間にプリント
コイル30を挟み込むことにより、薄形にもかかわらず電
源回路のチョークコイルとして充分大きなインダクタン
スを得ることができる。
In these figures, 10 and 20 are magnetic substrates made of nickel zinc ferrite or the like. As shown in an enlarged view in FIG. 3, an insulating layer 21 such as a glass film is provided on the upper surface of one magnetic substrate 10, and a circuit pattern 22 made of copper or the like is printed and printed on the insulating layer 21. It is formed by the means. Another circuit pattern 24 is formed on the circuit pattern 22 via an insulating layer 23. These two layers of circuit patterns 22 and 24 are electrically connected through through holes 25. A plurality of printed coils 30 as shown in FIG. 4 connected to the circuit pattern 22 through the through holes 15 are formed on the lower surface of the magnetic substrate 10. Another magnetic substrate 20 is bonded and fixed to the lower surface of the magnetic substrate 10 so as to cover the print coil 30. Reference numeral 28 is a concave portion of the magnetic substrate 20 provided at a position facing the printed coil 30. By thus sandwiching the print coil 30 between the two magnetic substrates 10 and 20, it is possible to obtain a sufficiently large inductance as a choke coil for a power supply circuit, despite the thinness.

回路パターン24上には、トランジスタやダイオードなど
の面付型の回路素子40と共に、第5図のように積層して
形成された誘電体板51の内部に電極52、53を埋設して構
成した平板状のコンデンサ50を固定し、回路パターン24
との電気的な接続をとってある。本実施例では、このよ
うなコンデンサ50が2個設けてある。コンデンサ50の誘
電体板51の上面には、絶縁層63を介して二層の回路パタ
ーン62、64が形成してあり、回路パターン64の上にも面
付型の回路素子40が取付けてある。回路パターン62の一
部は誘電体板51の側面まで導出してあり、この部分を回
路パターン24に半田付けして接続してある。
On the circuit pattern 24, electrodes 52 and 53 are embedded inside a dielectric plate 51 formed by stacking as shown in FIG. 5 together with a surface-mounted circuit element 40 such as a transistor and a diode. Circuit board pattern 24
It has an electrical connection with. In this embodiment, two such capacitors 50 are provided. Two layers of circuit patterns 62, 64 are formed on the upper surface of the dielectric plate 51 of the capacitor 50 with an insulating layer 63 interposed therebetween, and the surface-mounted circuit element 40 is also mounted on the circuit pattern 64. . A part of the circuit pattern 62 extends to the side surface of the dielectric plate 51, and this part is connected to the circuit pattern 24 by soldering.

第6図に示すように、磁性体基板10の一部には貫通した
孔12が設けてあり、この孔12の中にトランス70が取付け
てある。トランス70は、断面E形のコア72と磁性体基板
20とで閉磁路を形成するようにコア72の端部を磁性体基
板20の上面に突き合わせた形に取付けてある。コア72に
は、リード74を側面に植設した合成樹脂からなる枠体76
が嵌め込まれている。そして、第7図のようにリード74
は配線パターン23に半田付けしてある。
As shown in FIG. 6, a through hole 12 is provided in a part of the magnetic substrate 10, and a transformer 70 is mounted in the hole 12. The transformer 70 includes a core 72 having an E-shaped cross section and a magnetic substrate.
The end of the core 72 is attached to the upper surface of the magnetic substrate 20 so as to form a closed magnetic path together with 20. In the core 72, a frame body 76 made of a synthetic resin in which the leads 74 are planted on the side surface is formed.
Is fitted. Then, as shown in FIG. 7, the lead 74
Are soldered to the wiring pattern 23.

このように積層した磁性体基板10、20およびコンデンサ
50や、これに組み込まれたトランス70その他の回路素子
40は、底面板81と蓋体82からなるシールド用の金属ケー
ス80内に収納してある。そして、磁性体基板20の下面は
ケース80の底面板81に接着固定してある。第2図におけ
る符号90は、外部接続用の端子91を植設した端子板を示
している。
Magnetic substrates 10, 20 and capacitors laminated in this way
50, transformer 70 and other circuit elements incorporated therein
40 is housed in a shield metal case 80 including a bottom plate 81 and a lid 82. The lower surface of the magnetic substrate 20 is adhered and fixed to the bottom plate 81 of the case 80. Reference numeral 90 in FIG. 2 denotes a terminal plate in which terminals 91 for external connection are implanted.

なお、コンデンサ50は必ずしも平板状である必要はな
い。コンデンサ50上面の回路パターン62、64がなくなる
ので少し大型の磁性体基板10が必要となるが、面付型の
コンデンサを回路パターン24上に取付けるようにしても
よい。
The capacitor 50 does not necessarily have to be flat. Since the circuit patterns 62 and 64 on the upper surface of the capacitor 50 are eliminated, a slightly larger magnetic substrate 10 is required, but a surface-mounted capacitor may be mounted on the circuit pattern 24.

また、磁性体基板10や誘電体板51上の回路パターン、お
よびプリントコイル30は、実施例に限らず絶縁層を介し
てもっと多層に形成してもよい。磁性体基板20の下面
は、例えば底面板81のような一枚の金属板に接着するだ
けでもよく、あるいは金属板に接着せず平面状のままに
しておき、電気機器への組み込み時にその筐体等に密着
させて固定できるようにしてもよい。
Further, the magnetic substrate 10 and the circuit pattern on the dielectric plate 51, and the printed coil 30 are not limited to the embodiments, but may be formed in multiple layers with an insulating layer interposed. The lower surface of the magnetic substrate 20 may be adhered to a single metal plate such as the bottom plate 81, or may be left flat without adhering to the metal plate and its housing is incorporated into an electric device. It may be fixed to the body or the like so that it can be fixed.

〔発明の効果〕〔The invention's effect〕

本発明によれば、熱伝導性のよい磁性体基板を用いる
上、その下面を金属板や電気機器のケース等に密着固定
できる構成なので、きわめて放熱効果の高い複合部品を
得ることができる。また、積層した薄いプリント基板内
にコイルやコンデンサを作り込んだ形になるので高さ寸
法が従来12mm前後あったものを6mm以下にできるなど、
著しい薄型化を達成できる効果がある。
According to the present invention, since the magnetic substrate having good thermal conductivity is used and the lower surface of the magnetic substrate can be adhered and fixed to the metal plate or the case of electric equipment, it is possible to obtain a composite component having an extremely high heat dissipation effect. In addition, since the coil and the capacitor are built in the laminated thin printed circuit board, the height dimension can be reduced to 6 mm or less from the conventional 12 mm.
There is an effect that a remarkable thinning can be achieved.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の複合部品の一実施例を示す一部断面正
面図、第2図は同複合部品のケースの一部を切欠した平
面図、第3図はその一部を拡大して示す正面断面図、第
4図は磁性体基板の一部の下面図、第5図はコンデンサ
の拡大正面断面図、第6図はトランス部分の拡大正面断
面図、第7図はトランス部分の拡大側面断面図である。 10・20……磁性体基板、30……プリントコイル 22・24……回路パターン、40……回路素子 62・64……回路パターン、50……コンデンサ 80……金属ケース
FIG. 1 is a partially sectional front view showing an embodiment of the composite component of the present invention, FIG. 2 is a plan view in which a part of the case of the composite component is cut away, and FIG. 3 is an enlarged view thereof. 4 is an enlarged front sectional view of the capacitor, FIG. 6 is an enlarged front sectional view of the transformer portion, and FIG. 7 is an enlarged front sectional view of the transformer portion. It is a side sectional view. 10 ・ 20 …… magnetic substrate, 30 …… print coil 22 ・ 24 …… circuit pattern, 40 …… circuit element 62 ・ 64 …… circuit pattern, 50 …… capacitor 80 …… metal case

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】スルーホールを通じて電気的に接続した回
路パターンとプリントコイルを、第1の磁性体基板の上
面及び下面にそれぞれ形成するとともに、第1の磁性体
基板の下面に平板状の第2の磁性体基板を積層して固定
し、該回路パターン上に回路素子を取付けたことを特徴
とする電力用複合部品。
1. A circuit pattern and a print coil electrically connected through a through hole are formed on an upper surface and a lower surface of a first magnetic substrate, respectively, and a flat second plate is formed on a lower surface of the first magnetic substrate. The magnetic composite substrate is laminated and fixed, and a circuit element is mounted on the circuit pattern.
【請求項2】誘電体の内部に電極を埋設してなる平板状
のコンデンサを該回路パターン上に固定するとともに、
該回路パターンに電気的に接続した第2の回路パターン
を該コンデンサの上面に設け、第2の回路パターン上に
回路素子を取付けた請求項1の電力用複合部品。
2. A flat plate-shaped capacitor having electrodes embedded in a dielectric is fixed on the circuit pattern, and
The composite component for electric power according to claim 1, wherein a second circuit pattern electrically connected to the circuit pattern is provided on the upper surface of the capacitor, and a circuit element is mounted on the second circuit pattern.
JP2236656A 1990-09-06 1990-09-06 Power composite parts Expired - Fee Related JPH0793483B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2236656A JPH0793483B2 (en) 1990-09-06 1990-09-06 Power composite parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2236656A JPH0793483B2 (en) 1990-09-06 1990-09-06 Power composite parts

Publications (2)

Publication Number Publication Date
JPH04116886A JPH04116886A (en) 1992-04-17
JPH0793483B2 true JPH0793483B2 (en) 1995-10-09

Family

ID=17003845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2236656A Expired - Fee Related JPH0793483B2 (en) 1990-09-06 1990-09-06 Power composite parts

Country Status (1)

Country Link
JP (1) JPH0793483B2 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139395A (en) * 1985-12-13 1987-06-23 松下電器産業株式会社 Multi-function circuit board
JPS63300593A (en) * 1987-05-29 1988-12-07 Nec Corp Ceramic composite substrate
JPH0537513Y2 (en) * 1987-12-10 1993-09-22
JPH0227793A (en) * 1988-07-15 1990-01-30 Nec Corp Hybrid integrated circuit
JPH0249757Y2 (en) * 1988-07-27 1990-12-27

Also Published As

Publication number Publication date
JPH04116886A (en) 1992-04-17

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