JPH0537513Y2 - - Google Patents
Info
- Publication number
- JPH0537513Y2 JPH0537513Y2 JP1987187153U JP18715387U JPH0537513Y2 JP H0537513 Y2 JPH0537513 Y2 JP H0537513Y2 JP 1987187153 U JP1987187153 U JP 1987187153U JP 18715387 U JP18715387 U JP 18715387U JP H0537513 Y2 JPH0537513 Y2 JP H0537513Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal case
- shield plate
- mic
- integrated circuit
- microwave integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 35
- 238000005192 partition Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Description
【考案の詳細な説明】
［考案の目的］
（産業上の利用分野）
この考案は、金属ケース内の基板上に形成され
た複数のマイクロ波集積回路の間をシールド板で
シールドするマイクロ波集積回路装置の改良に関
する。[Detailed explanation of the invention] [Purpose of the invention] (Field of industrial application) This invention is a microwave integrated circuit in which a shield plate is used to shield between multiple microwave integrated circuits formed on a substrate inside a metal case. Related to improvements in circuit devices.
（従来の技術）
従来のマイクロ波集積回路（以下、MICと略
称する）装置としては、例えば第３図に示すもの
がある。即ち、第３図ａは３個のMIC基板１を
金属ケース２の各独立した部屋に収納した状態を
示す平面図、また同図ｂはａ図の金属ケース２の
Ａ−Ａ線を矢印方向に見た横断面図である。いず
れも、金属ケース蓋を外した状態を示している。
金属ケース２は金属部材の切削やダイカスト技術
により加工形成された３個のMIC基板収納室２
１を有する。各収納室２１を仕切る壁には隣接す
るMICを電気的に接続するための同軸線路３が
貫通して挿入されている。従つて、各収納室２１
に収納されたMIC間の不要電波は金属のシール
ド壁２２により遮断され、他の隣接するMICに
影響しないため電気的特性の安定したMIC装置
か得られる。特に、マイクロ波領域ではMICに
よる多段増幅回路、リミツタ回路、ミキサ回路あ
るいは発振回路などがしばしば構成されるが、回
路相互間で空間を伝わつての不要信号の回り込み
は、異常発振、不要共振の発生、さらには伝送損
失等の悪影響を発生しやすい。この傾向は、
MICの集積度の高いほど、また信号周波数が高
く取扱い電力が大きいほどこの傾向が強い。(Prior Art) As a conventional microwave integrated circuit (hereinafter abbreviated as MIC) device, there is one shown in FIG. 3, for example. That is, Fig. 3a is a plan view showing three MIC boards 1 housed in separate rooms of the metal case 2, and Fig. 3b is a plan view of the metal case 2 shown in Fig. FIG. Both figures are shown with the metal case lid removed.
The metal case 2 has three MIC board storage chambers 2 formed by cutting metal parts and die-casting technology.
1. A coaxial line 3 for electrically connecting adjacent MICs is inserted through the wall that partitions each storage chamber 21. Therefore, each storage room 21
Unnecessary radio waves between the MICs housed in the MIC are blocked by the metal shield wall 22 and do not affect other adjacent MICs, resulting in a MIC device with stable electrical characteristics. In particular, in the microwave region, multi-stage amplifier circuits, limiter circuits, mixer circuits, or oscillation circuits are often configured using MICs, but unnecessary signals traveling through space between circuits can cause abnormal oscillations and unnecessary resonances. , and even more likely to cause adverse effects such as transmission loss. This trend is
This tendency becomes stronger as the degree of integration of the MIC increases, and as the signal frequency increases and the handling power increases.
ところで、一般に金属ケースは切削やダイカス
ト技術で形成されているので従来のMIC装置は、
(イ) 壁２２の厚さが３〜５mmにもなり、ケース全
体の小形化が計りにくい。とりわけMIC自体
は一層小形化高密度化が進むだけに問題であ
る。 By the way, since metal cases are generally formed by cutting or die-casting techniques, in conventional MIC devices, (a) the wall 22 has a thickness of 3 to 5 mm, making it difficult to downsize the entire case. In particular, the MIC itself is a problem as it continues to become smaller and more dense.
(ロ) MICの量産組立て上から考えらると、通常
は１個の基板上に多数のICを形成するところ
にメリツトがあるが、第３図に示す構成では基
板は各部屋ごとに分断されその利点が生かせな
い欠点がある。(b) Considering the mass production assembly of MICs, there is usually an advantage in forming a large number of ICs on one board, but in the configuration shown in Figure 3, the board is divided into each room. There are drawbacks that do not take advantage of its advantages.
(ハ) 壁２２の位置は固定され、他機種への応用が
困難であり、汎用性に欠ける。等種々の問題点
があつた。(c) The position of the wall 22 is fixed, making it difficult to apply to other models and lacking in versatility. Various problems arose.
（考案が解決しようとする問題点）
そこで、この考案は、従来のシールド効果を維
持しつつ、簡単な構造で、小形軽量、しかも量産
性、汎用性に適したMIC装置を提供するもので
ある。(Problem that the invention aims to solve) Therefore, this invention provides a MIC device that maintains the conventional shielding effect, has a simple structure, is small and lightweight, and is suitable for mass production and versatility. .
［考案の構成］
（問題点を解決するための手段）
この考案に係るMIC装置は、有底箱体からな
る金属ケースと、この金属ケースの上面にねじに
より閉塞されるケース蓋と、前記金属ケース内に
収納され、一方の面に形成された複数のマイクロ
波集積回路およびこれらマイクロ波集積回路の隣
接部に設けられて表裏間に貫通するスルーホール
を具備した集積回路基板と、この集積回路基板の
前記スルーホールに嵌合する凸部を有し前記金属
ケース内で前記マイクロ波集積回路間を仕切るシ
ールド板と、このシールド板を固定するためのシ
ールド板折曲げ部と、この折曲げ部を前記金属ケ
ースと金属ケース蓋との間に挟みかつ前記ねじに
よつてシールド板が固定されることを特徴とす
る。[Structure of the invention] (Means for solving the problem) The MIC device according to the invention includes a metal case consisting of a box with a bottom, a case lid that is closed with a screw on the top surface of the metal case, and a case lid that is closed with a screw on the top surface of the metal case. An integrated circuit board housed in a case and provided with a plurality of microwave integrated circuits formed on one surface and a through hole provided adjacent to the microwave integrated circuits and penetrating between the front and back sides, and this integrated circuit. A shield plate having a convex portion that fits into the through hole of the substrate and partitions the microwave integrated circuits within the metal case, a shield plate bent portion for fixing the shield plate, and this bent portion is sandwiched between the metal case and the metal case lid, and the shield plate is fixed by the screws.
（作用）
この考案のMIC装置は、上記のように構成し
シールド板はMIC間の位置に設けた貫通穴に嵌
合させ固定するので、MICの設計に応じた任意
の形状のシールド板を金属ケース内に設けること
ができる。また、シールド板は金属ケースとは別
個に独立して設けた構造にしているので、シール
ド効果を得るのに必要なだけの板厚で充分であ
り、装置全体の小形化が可能となる。(Function) The MIC device of this invention is constructed as described above, and the shield plate is fixed by fitting into the through hole provided between the MICs. It can be provided inside the case. Further, since the shield plate is provided separately from the metal case, the thickness of the plate is sufficient to obtain the shielding effect, and the entire device can be made smaller.
（実施例）
以下、この考案の一実施例を第１図ないし第２
図を参照して説明する。第１図はこの考案による
MIC装置を示す斜視図、第２図は第１図のMIC
基板を取出して示した斜視図である。即ち、金属
ケース２は有底箱体からなり、この中に複数の
MICパターンを形成した基板１が収納される。
このMIC基板１の互いに隣接するMIC間にはこ
の基板１の表裏を貫通するスルーホール１０が設
けられている。金属で構成されたシールド板４に
は前記スルーホール１０に嵌合する凸部４０が設
けられている。この実施例でのシールド板４は
0.1〜0.5mm程度の厚さからなり、またシールド効
果をより確実にするために、金属ケース２の側壁
および金属ケース蓋５にそれぞれ密着するシール
ド板折曲げ部４１が設けられている。(Example) Hereinafter, an example of this invention will be shown in Figures 1 to 2.
This will be explained with reference to the figures. Figure 1 is based on this idea.
A perspective view showing the MIC device, Figure 2 is the MIC in Figure 1.
FIG. 3 is a perspective view showing the board taken out. That is, the metal case 2 consists of a box with a bottom, in which a plurality of
A substrate 1 on which a MIC pattern is formed is housed.
A through hole 10 passing through the front and back of the MIC board 1 is provided between adjacent MICs of the MIC board 1. The shield plate 4 made of metal is provided with a protrusion 40 that fits into the through hole 10. The shield plate 4 in this embodiment is
The shield plate has a thickness of approximately 0.1 to 0.5 mm, and in order to further ensure the shielding effect, shield plate bent portions 41 are provided that are in close contact with the side wall of the metal case 2 and the metal case lid 5, respectively.
また、MIC基板１の構造は、第２図の斜視図
で示すように、アース電位となる金属のキヤリア
プレート１１上に誘電体基板１２が形成され、こ
の誘電体基板上にMICパターンが形成される。
誘電体基板１２上でMIC仕切り部に設けられた
スルーホール１０の内周面とシールド板４が接す
る領域を金属パターン１３で形成し、これらがキ
ヤリアプレート１１とスルーホールによつて同電
位で接続されることによつて一層のシールド効果
が得られる。なお、隣接するMIC間は例えばマ
イクロストリツプ線路１４で接続されるから、線
路の通るところのシールド板４は切込み４２が設
けられる。このように構成されたMIC基板１は、
金属ケース２に収納後、金属ケース蓋５が各ねじ
穴５１を通して各ねじ６により固定される。従つ
て、シールド板４は金属ケース、金属ケース蓋、
キヤリアプレートとは共通に同電位で接続された
状態となりMIC間の空間を確実に遮断するもの
である。なお、この実施例ではシールド板の形状
は、金属ケース内の側壁間を直線的に仕切るよう
に構成されているが、基板上のMICパターンの
形態にあわせて、任意に折曲げ仕切ることができ
る。勿論、１個に限らず複数個のシールド板を設
けることができる。 As shown in the perspective view of FIG. 2, the structure of the MIC board 1 is such that a dielectric substrate 12 is formed on a metal carrier plate 11 that is at ground potential, and a MIC pattern is formed on this dielectric substrate. Ru.
A metal pattern 13 is formed on the dielectric substrate 12 where the inner circumferential surface of the through hole 10 provided in the MIC partition portion contacts the shield plate 4, and these are connected to the carrier plate 11 at the same potential by the through hole. By doing so, a further shielding effect can be obtained. Note that since adjacent MICs are connected by, for example, a microstrip line 14, a notch 42 is provided in the shield plate 4 where the line passes. The MIC board 1 configured in this way is
After being housed in the metal case 2, the metal case lid 5 is fixed with each screw 6 through each screw hole 51. Therefore, the shield plate 4 is a metal case, a metal case lid,
The carrier plate is commonly connected at the same potential and reliably blocks the space between the MICs. In this example, the shape of the shield plate is configured to linearly partition the side walls inside the metal case, but it can be bent and partitioned as desired according to the form of the MIC pattern on the board. . Of course, the number of shield plates is not limited to one, but a plurality of shield plates can be provided.
このように、この考案によれば(イ)シールド板ケ
ースとは別個に薄く構成できるので、ケース全体
を小形軽量化できる。(ロ)シールド板を別構成とし
たのでMIC基板の数を増やすことなく集積度を
高めた各種MICに対応できる。(ハ)全体の構造が
簡単になり、組立て製造が容易となつた。などの
利点が得られる。 As described above, according to this invention, (a) the shield plate case can be constructed separately and thinly, so that the entire case can be made smaller and lighter. (b) Since the shield plate is configured separately, it is possible to support various types of MICs with increased integration without increasing the number of MIC boards. (c) The overall structure has become simpler, making assembly and manufacturing easier. Benefits such as:
［考案の効果］
この考案のMIC装置は、金属ケース内に収容
されるMIC基板にスルーホールを設け、このス
ルーホールにシールド板の凸部を嵌合させて互い
に隣接するMIC間の空間を遮断するように構成
したので、構造が簡単で組立てが容易である。ま
た、振動に強く、シールド効果が大である。さら
に、小型軽量化に適し、汎用性に富んだものを提
供できる。[Effects of the invention] The MIC device of this invention has a through hole in the MIC board housed in the metal case, and the convex part of the shield plate is fitted into this through hole to block the space between adjacent MICs. The structure is simple and assembly is easy. It is also resistant to vibration and has a great shielding effect. Furthermore, it is suitable for reduction in size and weight, and can be provided with high versatility.
第１図はこの考案のマイクロ波集積回路装置の
一実施例を示す斜視図、第２図は第１図に示す装
置の集積回路基板を示す斜視図、第３図ａは従来
のマイクロ波集積回路装置を示す平面図、第３図
ｂは同図ａのＡ−Ａ切断面を矢印方向にみた横断
面図である。
１……集積回路基板、２……金属ケース、４…
…シールド板、５……金属ケース蓋、６……ね
じ、１０……スルーホール、１１……キヤリアプ
レート、１２……誘電体基板、４０……（シール
ド板の）凸部、４１……シールド板折曲げ部、５
１……ねじ穴。
Fig. 1 is a perspective view showing an embodiment of the microwave integrated circuit device of this invention, Fig. 2 is a perspective view showing an integrated circuit board of the device shown in Fig. 1, and Fig. 3a is a conventional microwave integrated circuit device. FIG. 3b, a plan view showing the circuit device, is a cross-sectional view taken along the line AA in FIG. 3a in the direction of the arrow. 1... integrated circuit board, 2... metal case, 4...
... Shield plate, 5 ... Metal case lid, 6 ... Screw, 10 ... Through hole, 11 ... Carrier plate, 12 ... Dielectric substrate, 40 ... Convex part (of shield plate), 41 ... Shield Plate bending part, 5
1...Screw hole.
Claims (1)
スの上面にねじにより閉塞されるケース蓋と、前
記金属ケース内に収納され、一方の面に形成され
た複数のマイクロ波集積回路およびこれらマイク
ロ波集積回路の隣接部に設けられて表裏間に貫通
するスルーホールを具備した集積回路基板と、こ
の集積回路基板の前記スルーホールに嵌合する凸
部を有し前記金属ケース内で前記マイクロ波集積
回路間を仕切るシールド板と、このシールド板を
固定するためのシールド板折曲げ部と、この折曲
げ部を前記金属ケースと金属ケース蓋との間に挟
みかつ前記ねじによつてシールド板が固定される
ことを特徴とするマイクロ波集積回路装置。 A metal case consisting of a box with a bottom, a case lid that is closed with a screw on the top surface of the metal case, a plurality of microwave integrated circuits housed in the metal case and formed on one surface, and these microwave integrated circuits. An integrated circuit board having a through hole provided adjacent to the integrated circuit and penetrating between the front and back sides, and a convex part that fits into the through hole of the integrated circuit board, and the microwave integrated circuit board is installed in the metal case. A shield plate that partitions between circuits, a bent portion of the shield plate for fixing the shield plate, this bent portion is sandwiched between the metal case and the metal case lid, and the shield plate is fixed by the screw. A microwave integrated circuit device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987187153U JPH0537513Y2 (en) | 1987-12-10 | 1987-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987187153U JPH0537513Y2 (en) | 1987-12-10 | 1987-12-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0192196U JPH0192196U (en) | 1989-06-16 |
| JPH0537513Y2 true JPH0537513Y2 (en) | 1993-09-22 |
Family
ID=31478327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987187153U Expired - Lifetime JPH0537513Y2 (en) | 1987-12-10 | 1987-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537513Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0793483B2 (en) * | 1990-09-06 | 1995-10-09 | 東光株式会社 | Power composite parts |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58131697U (en) * | 1982-02-26 | 1983-09-05 | 日本電気ホームエレクトロニクス株式会社 | Shield case structure |
| JPH051119Y2 (en) * | 1986-01-08 | 1993-01-12 |
-
1987
- 1987-12-10 JP JP1987187153U patent/JPH0537513Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0192196U (en) | 1989-06-16 |
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