JPS5881303A - Resonance circuit and electronic circuit - Google Patents

Abstract

PURPOSE:To obtain a small-sized resonance circuit without complicated connection with a circuit part and a decrease in Q value by inserting a dielectric coaxial line into a through hole formed in a substrate for a microwave integrated circuit, and connecting it to an earth conductor part. CONSTITUTION:Part of a dielectric coaxial line 1 is inserted into a substrate 6 constituting a microwave integrated circuit, and a coating 4 of conductive metal formed on end surface of the coaxial line 1 is connected to conductive metal coating the internal surface of a circular hole at the center part at the same potential and also connected to a conductive pattern 5 as the earth conductor of the microwave integrated circuit at the same potential. The other end surface of the coaxial line 1, on the other hand, has only the center conductor connected to a capacitor 9 through a conductive pattern 8 on the microwave integrated circuit substrate 6 and further to an earth pattern part 51 on the substrate 6.

Description

[Detailed Description of the Invention] The present invention is directed to a resonant quadrivalent device whose main component is a coaxial line made of a high dielectric material, and in which a capacitor and a coaxial line are integrated on a substrate for a microwave integrated circuit. This relates to electronic circuits.

Recently, there has been a coaxial line using a high dielectric material as a method of downsizing a resonant circuit, but in the past.

3 As a coaxial TEM mode resonator, 1 of the resonant frequency part
A wavelength or a quarter wavelength is used. Furthermore, coaxial resonators are used to increase the Q. In a microwave integrated circuit configuration, when various circuit elements are integrated on one dielectric substrate material such as alumina ceramic material or Teflon material, especially when a high Q is required in the resonant circuit section, If the pattern formed on this substrate is a resonant line such as a cyclostrip line, the Q may be too low, causing a problem. In this case, conventionally, coaxial cavity resonators and three-dimensional line wiring were used.
A method was used to increase the Q value of the resonant circuit, but this part of the microwave integrated circuit had a separate circuit configuration or, in some cases, a separate housing, making the configuration complicated. The present invention eliminates the above-mentioned drawbacks, does not significantly complicate the connections with other circuit parts in the configuration of the microwave integrated circuit, and also reduces the Q value of the resonant circuit. It is an object of the present invention to provide a resonant circuit for a microwave integrated circuit that is miniaturized without reducing the size. One embodiment will be described below with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, in which a coaxial line section 1 using a dielectric is connected to a substrate 6 constituting a microwave integrated circuit.
A part of it is inserted into the dielectric coaxial line 1 to form a conductive metal coating 4 on one end of the dielectric coaxial line 1, and the end surface and the inside of the circular hole in the center are also coated with the conductive metal. Connect them to the same potential.

Conductive pattern section 6 serving as a grounding conductor for the microwave integrated circuit
Connect them so that they have the same potential. On the other hand, the other end face of the coaxial line is connected to a capacitor 9 through a conductor pattern 8 on the same microwave integrated circuit board.
and further connect the ground pattern section 5 on the integrated circuit board 6.
Connect with 1.

In this case, the length of the coaxial line 1 may be shorter than a quarter wavelength of the resonant frequency, and by using the distributed constant pattern on the microwave integrated circuit board 6, a high Q can be obtained. At the same time, since the coaxial line 1 can be inserted and held within the integrated circuit board, the overall size can be reduced.

FIG. 2 is a sectional view for explaining the embodiment of FIG. 1 in more detail. The coaxial transmission line 1 is constructed by forming a hollow part 11 in the dielectric body 21 and forming conductive coatings on the inner side 3 and outer side 2 of the dielectric body 21 to form conductor parts 22 and 23, respectively. A conductive coating 4 is attached to one end surface of this line 1,
The outer conductor part 22 and the inner conductor part are connected so that they have the same potential. This is inserted into the microwave integrated circuit board 6, and the ground plane 5 and the conductive coating 4 provided on one side of the coaxial line 1 are connected. The other surface of the coaxial line 1 passes through its center conductor portion 23 and the conductor/ζ turn 8 on the circuit board 6,
The capacitor element 9 is held, and the other side thereof is connected to the ground conductor, C-turn 51, on the substrate θ. The conductor 77 on the back side of the integrated circuit board 6 acts as a ground conductor in the case of a microstrip line configuration, and is unnecessary in the case of a suspended line configuration, and the entire board is placed inside the metal conductor. Hold.

In this configuration, the capacitor element 9 is an example of a single GL element, but a capacitor is integrated on the same substrate using two gaps between the conductor pattern 8 and the ground pattern 510 on the integrated circuit board θ. For example, a capacitance formed by a conductor pattern having an interdigital structure may be used as the gap capacitance method.

FIG. 3 shows another embodiment of the present invention, in particular the shape of the microwave integrated circuit substrate 6 is different from that of the first embodiment. A protrusion 5 forming a hole 10 for holding a coaxial line (not shown) and having a conductor portion integrated with the ground conductor pattern on the substrate θ
5 is provided, and this protrusion 65 is inserted into the hollow part of the coaxial line,
It has the same potential as the conductive ground pattern 5, and has the advantage that the coaxial line can be easily aligned and held. 9
0 is the capacitance connected to the coaxial line, and in this case, the capacitance of the air gap formed on the board is used. 051 is the ground conductor pattern. 0 integrated circuit board 4 showing a case where a plurality of the above-mentioned resonant circuits are arranged on a board
4. Resonant elements 41, 42, and 43 using coaxial lines are arranged in parallel to configure an electronic circuit such as an F-wave device, further enhance the shielding effect, and avoid complicating the microwave integrated circuit configuration. As described above, a plurality of circuits arranged in a row are covered with a metal shielding box 46 and integrated into a substrate.

As described above, the present invention includes a dielectric coaxial line consisting of a dielectric coaxial line and a capacitor, and a dielectric coaxial line formed with a through hole in a part of a microphone 0-wave integrated circuit board. The ground conductor of the microwave integrated circuit board, the outer conductor of the dielectric coaxial line, and the conductor at the other end of the dielectric coaxial line are electrically connected so that they all have the same potential. It has the advantage that a more compact resonant circuit can be realized not only in a microwave integrated circuit configuration but also in a microwave integrated circuit configuration.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a resonant circuit according to an embodiment of the present invention, FIG. 2 is a cross-sectional view thereof, and FIGS. 3 and 4 are cross-sectional views and perspective views showing other embodiments of the present invention. 1... Coaxial line, 4... Conductive metal coating. 6... Conductor grounding pattern, 6... Microwave integrated circuit board, 7... Back conductor pattern, 9
...Medium capacitor element-51...Grounding pattern. Name of agent: Patent attorney Toshio Nakao and one other person I1
Figure 1 Figure 2 Figure 11E3

Claims (5)

[Claims] (1) A dielectric coaxial line and a capacitor are provided on a substrate for a microwave integrated circuit, and a conductive coating formed on one end, an inner peripheral surface, and an outer peripheral surface of the dielectric coaxial line is provided on the substrate. A resonant circuit characterized in that it is connected to a ground conductor to have the same potential, and a capacitor is connected to the other end of the dielectric coaxial line. (2) One side of the capacitor is connected to a conductive coating provided on the inner peripheral surface of the other end of the dielectric coaxial line via a conductor section provided on the board, and the other end is connected to a ground conductor section provided on the board. 2. A resonant circuit according to claim 1, wherein the resonant circuit is connected to a resonant circuit. (3) A resonant circuit according to claim 1 or 2, characterized in that the capacitor is integrated with a conductor pattern formed on a substrate. (4) Providing a protrusion at one end of the induction hole provided in the substrate,
2. The resonant circuit according to claim 1, wherein the protrusion is connected and fixed to a conductive coating provided on the inner peripheral surface of the dielectric coaxial line. (5) Insert a dielectric coaxial line having an inner circumferential surface and an outer circumferential surface into a dielectric hole provided in a microwave integrated circuit board, and conduct electricity between one end of the dielectric coaxial line, the inner circumferential surface, and the outer circumferential surface. At the other end of the dielectric coaxial line, the conductive coating provided on the inner peripheral surface was connected to the ground conductor provided on the board via a capacitor. An electronic circuit that has a basic configuration of a resonant circuit, and is characterized in that a plurality of these resonant circuits are arranged on the same substrate, and a part of the substrate is protected by a θ shielding plate.