JPH079074B2 - Surface-treated steel sheet for electronic device parts - Google Patents

Surface-treated steel sheet for electronic device parts

Info

Publication number
JPH079074B2
JPH079074B2 JP9381390A JP9381390A JPH079074B2 JP H079074 B2 JPH079074 B2 JP H079074B2 JP 9381390 A JP9381390 A JP 9381390A JP 9381390 A JP9381390 A JP 9381390A JP H079074 B2 JPH079074 B2 JP H079074B2
Authority
JP
Japan
Prior art keywords
plating
layer
steel sheet
resistance
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP9381390A
Other languages
Japanese (ja)
Other versions
JPH03291386A (en
Inventor
良一 吉原
亮介 和気
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP9381390A priority Critical patent/JPH079074B2/en
Publication of JPH03291386A publication Critical patent/JPH03291386A/en
Publication of JPH079074B2 publication Critical patent/JPH079074B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は電気製品の電子部品として使用され、片面が耐
錆性、溶接性に優れ、他面が耐錆性、耐ホイスカー性に
優れた電子機器部品用表面処理鋼板に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Use) The present invention is used as an electronic component of an electric product, and has excellent rust resistance and weldability on one side and excellent rust resistance and whisker resistance on the other side. The present invention relates to a surface-treated steel sheet for electronic device parts.

(従来の技術) 一般に電気製品の電子部品に使用される表面処理鋼板と
しては半田付けの要求されないものに対しては電気亜鉛
メッキ鋼板が、半田用途にはブリキ、ターンシートが使
用されている。また、一部、耐ホイスカーについても厳
しく要求されるものについては部品の加工後に鉛−錫メ
ッキが施され、溶接性を要求されるものに対しては同じ
く部品加工後にNiまたはNi−Pメッキが施されている。
このように電子部品用の表面処理鋼板は既存のメッキ鋼
板を用途別に使い分けをしている状態であり、特殊な用
途に対しては部品に加工後バレルメッキ等の手法により
後メッキしており、非常にコスト高となっているものも
あり、コストダウンのための安価な素材が近年、非常に
強く求められている。
(Prior Art) Generally, as a surface-treated steel sheet used for electronic parts of electric products, an electrogalvanized steel sheet is used for those which are not required to be soldered, and a tin plate and a turn sheet are used for soldering. In addition, some of the whisker resistance is strictly required to be plated with lead-tin after processing the parts, and those requiring weldability are also plated with Ni or Ni-P after processing of the parts. It has been subjected.
In this way, the surface-treated steel sheet for electronic parts is in a state where the existing plated steel sheet is used properly according to the application, and for special applications, the parts are post-plated by a method such as barrel plating after processing, In some cases, the cost is very high, and inexpensive materials for cost reduction have been very strongly demanded in recent years.

これに対して本出願人は特願平1-92075号で耐錆性、耐
ホイスカー性ならびに半田性に優れた電子機器部品用表
面処理鋼板を提案した。この先願発明の要旨は第8図に
示すように鋼板の表裏面各々に鋼板側から順にNi,Sn,Zn
メッキを施した後、加熱処理によってSn−Zn、Zn−Ni、
Sn−Ni、Fe−Ni合金層を形成し、さらに無電解処理によ
ってクロメート皮膜層を形成したことを特徴とする耐錆
性、耐ホイスカー性並びに半田性に優れる電子機器部品
用表面処理鋼板である。しかるに、この先願発明では鋼
板表裏面ともに同じ合金層構成となるため、電子部品の
中でも片面側に溶接性を要求される用途、例えば半導体
ケースにおいては、溶接の際に生じる溶接スプラッシュ
の点で満足の行くものではなかった。
On the other hand, the present applicant has proposed Japanese Patent Application No. 1-92075 a surface-treated steel sheet for electronic device parts, which is excellent in rust resistance, whisker resistance and solderability. As shown in FIG. 8, the gist of the invention of this prior application is that Ni, Sn, Zn are formed on the front and back surfaces of the steel sheet in order from the steel sheet side.
After plating, heat treatment Sn-Zn, Zn-Ni,
It is a surface-treated steel sheet for electronic device parts that has excellent rust resistance, whisker resistance, and solderability, characterized by forming a Sn-Ni, Fe-Ni alloy layer and further forming a chromate film layer by electroless treatment. . However, in this prior invention, the same alloy layer configuration is used on both the front and back surfaces of the steel sheet, so applications that require weldability on one side among electronic components, such as semiconductor cases, are satisfactory in terms of welding splash that occurs during welding. It wasn't going to happen.

(発明が解決しようとする課題) 以上述べたように電子部品用途、特に半導体ケースにお
いては片面側に耐錆性、耐ホイスカー性、もう片面側に
は耐錆性と溶接性が要求されており、本発明は表面処理
皮膜の構成ならびに鋼板の表面粗度を適正化することに
よって今までに適用が不可能であった電子部品に対して
要求される性能を全て満足する新素材を提供しようとす
るものである。
(Problems to be Solved by the Invention) As described above, in electronic parts applications, particularly in semiconductor cases, rust resistance and whisker resistance are required on one side, and rust resistance and weldability are required on the other side. The present invention intends to provide a new material satisfying all the performances required for electronic parts which have been impossible to apply by optimizing the constitution of the surface treatment film and the surface roughness of the steel sheet. To do.

(課題を解決するための手段) 本発明は電子部品の中でも特殊な用途、即ち片面が耐錆
性、耐ホイスカー性、もう一方の面が耐錆性、溶接性に
優れるという要求に対して、それぞれの機能を形成され
る合金層の特性によって分離させ、さらに電子部品に対
する非常に厳しい溶接性を鋼板の表面粗度制御と組み合
わせることにより初めて可能としたものである。
(Means for Solving the Problems) The present invention has special applications among electronic components, that is, one surface has rust resistance, whisker resistance, and the other surface has a rust resistance and a requirement that the weldability is excellent. For the first time, it was possible to separate each function according to the characteristics of the alloy layer to be formed and to combine very severe weldability for electronic parts with surface roughness control of the steel sheet.

本発明の要旨とするところは下記のとおりである。The gist of the present invention is as follows.

(1) 片面の表面粗度Raが0.4μ以上の鋼板の他面上
に0.05g/m2以上のNiメッキを、このNiメッキ層上に0.05
g/m2以上のSnメッキを、このSnメッキ層上に上記Snメッ
キ量の10〜80%のZnメッキを施すと共に、上記片面上に
0.10g/m2以上のNiメッキを施した後、加熱処理によって
メッキ層を合金化させ、他面上にSn−Zn、Zn−Ni、Sn−
Ni、Fe−Ni合金層を、片面上にNi層及びFe−Ni合金層ま
たはFe−Ni合金層を形成し、更に上記両層上にクロメー
ト皮膜層を形成したことを特徴とする片面が耐錆性、溶
接性に優れ、他面が耐錆性、耐ホイスカー性に優れた電
子機器部品用表面処理鋼板。
(1) 0.05g / m 2 or more Ni plating is applied on the other side of the steel plate with a surface roughness Ra of 0.4μ or more on one side, and 0.05 on this Ni plating layer.
Sn plating of g / m 2 or more is applied on this Sn plating layer with 10 to 80% of the above Sn plating amount and Zn on one side.
After Ni plating of 0.10 g / m 2 or more, the plating layer is alloyed by heat treatment, and Sn-Zn, Zn-Ni, Sn-on the other surface.
Ni, Fe-Ni alloy layer, Ni layer and Fe-Ni alloy layer or Fe-Ni alloy layer is formed on one side, further one side characterized by forming a chromate film layer on both layers A surface-treated steel sheet for electronic device parts that has excellent rust resistance and weldability, and has excellent rust resistance and whisker resistance on the other surface.

(2) 片面の表面粗度Raが0.4μ以上の鋼板の他面上
に0.05g/m2以上のNiメッキを、このNiメッキ層上に0.05
g/m2以上のSnメッキを、このSnメッキ層上に上記Snメッ
キ量の10〜80%のZnメッキを施すと共に、上記片面上に
0.05g/m2以上のNiメッキを、このNiメッキ層上に0.05g/
m2以上のSnメッキを施した後、加熱処理によってメッキ
層を合金化させ、他面上にSn−Zn、Zn−Ni、Sn−Ni、Fe
−Ni合金層を、片面上にSn−Ni、Fe−Ni合金層を形成
し、更に上記両層上にクロメート皮膜層を形成したこと
を特徴とする片面が耐錆性、溶接性に優れ、他面が耐錆
性、耐ホイスカー性に優れた電子機器部品用表面処理鋼
板。
(2) Ni plating of 0.05 g / m 2 or more on one surface of the steel plate with surface roughness Ra of 0.4μ or more, 0.05 on this Ni plating layer.
Sn plating of g / m 2 or more is applied on this Sn plating layer with 10 to 80% of the above Sn plating amount and Zn on one side.
Apply 0.05 g / m 2 or more of Ni plating on this Ni plating layer by 0.05 g / m 2.
After applying Sn plating of m 2 or more, the plating layer is alloyed by heat treatment, and Sn-Zn, Zn-Ni, Sn-Ni, Fe on the other surface.
-Ni alloy layer, Sn-Ni on one side, Fe-Ni alloy layer is formed on one side, further one side characterized by forming a chromate film layer on both layers is excellent in rust resistance, weldability, Surface-treated steel sheet for electronic equipment parts, the other side of which has excellent rust resistance and whisker resistance.

(3) 片面の表面粗度Raが0.4μ以上の鋼板の他面上
に0.05g/m2以上のNiメッキを、このNiメッキ層上に0.05
g/m2以上のSnメッキを、このSnメッキ層上に上記Snメッ
キ量の10〜80%のZnメッキを施すと共に、上記片面上に
0.05g/m2以上のNiメッキを、このNiメッキ層上に0.05g/
m2以上のZnメッキを施した後、加熱処理によってメッキ
層を合金化させ、他面上にSn−Zn、Zn−Ni、Sn−Ni、Fe
−Ni合金層を、片面上にZn−Ni、Fe−Ni合金層を形成
し、更に上記両層上にクロメート皮膜層を形成したこと
を特徴とする片面が耐錆性、溶接性に優れ、他面が耐錆
性、耐ホイスカー性に優れた電子機器部品用表面処理鋼
板。
(3) Ni plating of 0.05 g / m 2 or more on the other surface of the steel plate with surface roughness Ra of 0.4 μ or more on one surface, and 0.05 on the Ni plating layer.
Sn plating of g / m 2 or more is applied on this Sn plating layer with 10 to 80% of the above Sn plating amount and Zn on one side.
Apply 0.05 g / m 2 or more of Ni plating on this Ni plating layer by 0.05 g / m 2.
After applying Zn plating of m 2 or more, the plating layer is alloyed by heat treatment, and Sn-Zn, Zn-Ni, Sn-Ni, Fe on the other surface.
-Ni alloy layer, Zn-Ni on one side, Fe-Ni alloy layer is formed on one side, further one side characterized by forming a chromate film layer on both layers is excellent in rust resistance, weldability, Surface-treated steel sheet for electronic equipment parts, the other side of which has excellent rust resistance and whisker resistance.

第4図ならびに第5図は本発明の請求第1項、第6図は
本発明の請求第2項、第7図は本発明の請求第3項にそ
れぞれ相当する合金皮膜構造概念を示す。
FIGS. 4 and 5 show the alloy coating structure concept corresponding to claim 1 of the present invention, FIG. 6 is claim 2 of the present invention, and FIG. 7 is corresponding to claim 3 of the present invention.

以下、本発明の請求項に述べた限定範囲について各々メ
ッキ層面別に説明する。
Hereinafter, the limited ranges described in the claims of the present invention will be described for each plating layer surface.

まず最初に耐錆性、耐ホイスカー性に優れた三層メッキ
側のNiメッキについてであるが、Niメッキの目的は前述
したようにメッキ皮膜の均一性を向上させるための下地
メッキとしての効果を得るためであり、耐錆性に関係す
る。従って、Ni下地メッキとしての効果を十分に発揮す
るには鋼板の表面をある程度均一に被覆する必要がある
ため0.05g/m2を下限とする。また、上限については付着
量が増加するに従って耐錆性が向上するが、当然、コス
トアップにつながるため一般的に1.0g/m2程度が好まし
いが、本発明では上限を特に限定するものではない。
First of all, regarding the Ni plating on the three-layer plating side, which has excellent rust resistance and whisker resistance, the purpose of Ni plating is to provide the effect as a base plating to improve the uniformity of the plating film as described above. This is to obtain rust resistance. Therefore, in order to sufficiently exert the effect as the Ni undercoat, the surface of the steel sheet needs to be coated to some extent uniformly, so the lower limit is 0.05 g / m 2 . Regarding the upper limit, although the rust resistance improves as the adhesion amount increases, naturally it is preferably about 1.0 g / m 2 because it leads to cost increase, but the present invention does not particularly limit the upper limit. .

次にSnメッキ量の限定範囲について述べる。Snメッキ量
についてもNiと同様に耐錆性を満足する最低付着量とし
て0.05g/m2が必要である。また、上限についてはこれも
要求される耐錆性によって付着量が異なるため厳密な規
定は出来ないが、コストとの関係から一般的に5.0g/m2
程度が好ましいが、本発明では特に限定するものではな
い。
Next, the limited range of the Sn plating amount will be described. As with Ni, the amount of Sn plating is required to be 0.05 g / m 2 as the minimum amount of adhesion that satisfies rust resistance. In addition, the upper limit cannot be strictly defined because the amount of adhesion varies depending on the required rust resistance, but it is generally 5.0 g / m 2 due to the cost.
The degree is preferred, but is not particularly limited in the present invention.

次にZnメッキ量の限定範囲について述べる。Znメッキ量
については本発明の場合は熱拡散後に形成される合金層
が耐錆性と耐ホイスカー性に大きく影響するため、特に
Snメッキ量との割合で限定する。
Next, the limited range of the Zn plating amount will be described. Regarding the amount of Zn plating, in the case of the present invention, the alloy layer formed after thermal diffusion has a great influence on rust resistance and whisker resistance.
Limited by the ratio with the Sn plating amount.

第1図は先に述べた限定範囲で下地Niメッキ量0.05〜1.
0g/m2、Snメッキ量0.05〜5.0g/m2におけるZn/Snの割合
と錆発生率の関係の一例を示す。この場合の熱処理条件
は加熱温度300℃、加熱速度30℃/秒で電気抵抗加熱方
式を用いた。図のようにZnメッキ量の割合の増加に従っ
て耐湿試験(60℃×90%RH)120時間後の赤錆発生は減
少し、Zn/Sn比率10%で赤錆の発生は見られなくなる。
第2図も第1図と同様のSn、Ni付着量範囲ならびに熱処
理条件におけるZn/Sn比率とホイスカーの発生との関係
の一例を示すものである。図のように亜鉛の割合が高く
なるに従ってホイスカーの発生は減少して行き、Zn/Sn
比率10%以上でホイスカーの発生は見られなくなる。し
かしながらZn/Sn比率が80%を越えると今度はZnメッキ
に近づくため、またホイスカーが発生するようになる。
Fig. 1 shows the amount of Ni plating on the base 0.05-1.
Shows an example of the relationship between the percentage and rust incidence of Zn / Sn in 0g / m 2, Sn plating weight 0.05 to 5.0 g / m 2. The heat treatment conditions in this case were an electric resistance heating method with a heating temperature of 300 ° C. and a heating rate of 30 ° C./sec. As shown in the figure, the red rust generation after 120 hours in the humidity resistance test (60 ° C x 90% RH) decreases as the proportion of Zn plating increases, and the red rust disappears at the Zn / Sn ratio of 10%.
FIG. 2 also shows an example of the relationship between the Zn / Sn ratio and the generation of whiskers under the Sn and Ni deposition amount ranges and heat treatment conditions similar to those in FIG. As shown in the figure, the generation of whiskers decreases as the proportion of zinc increases, and Zn / Sn
When the ratio is 10% or more, the occurrence of whiskers disappears. However, if the Zn / Sn ratio exceeds 80%, it will come close to Zn plating this time, and whiskers will occur again.

以上、Znメッキ量については耐錆性、対ホイスカー性の
点からSnメッキ量の10%以上80%以下に限定される。
As described above, the Zn plating amount is limited to 10% or more and 80% or less of the Sn plating amount from the viewpoint of rust resistance and whisker resistance.

続いて特に溶接性に優れ、且つ耐錆性にも優れるメッキ
面側について説明する。
Next, the plated surface side, which is particularly excellent in weldability and rust resistance, will be described.

最初に本発明の請求項1ならびに第4図、第5図に示さ
れるNiについては耐錆性の点からメッキ付着量の下限は
0.10g/m2が限界である。また上限については一般的にコ
ストの点から5g/m2程度が好ましいが、本発明ではそれ
を特に限定するものではない。
First, for Ni shown in claim 1 and FIGS. 4 and 5 of the present invention, from the viewpoint of rust resistance, the lower limit of the coating amount is
The limit is 0.10 g / m 2 . In addition, the upper limit is generally preferably about 5 g / m 2 from the viewpoint of cost, but the present invention is not particularly limited thereto.

なお、第4図と第5図の違いはNiメッキ量と熱処理条件
の差によって形成される合金層の構造が二種類あること
を示す。この場合、合金層はNi、Ni−Fe合金ならびにNi
−Fe合金のみとなるが、溶接強度に対する影響はほとん
ど見られない。
The difference between FIGS. 4 and 5 indicates that there are two types of structures of the alloy layer formed depending on the difference between the Ni plating amount and the heat treatment condition. In this case, the alloy layer consists of Ni, Ni-Fe alloy and Ni.
-Fe alloy only, but almost no effect on welding strength.

次に本発明の請求項2項ならびに第6図に示されるSn−
Niについては耐錆性の点からそれぞれのメッキ付着量の
下限は0.05g/m2が限界である。また上限については一般
的にコストの点から5g/m2程度が好ましいが、本発明で
はそれを特に限定するものではない。Sn/Niの比率につ
いては溶接する対象金属によって変化するものであるた
め本発明では特に限定されない。一例として溶接対象金
属がNiおよびNiメッキ板の場合、溶接強度に対するSn/N
i比率の最適範囲の30〜95%である。
Next, Sn- shown in claim 2 and FIG. 6 of the present invention
Regarding Ni, the lower limit of the coating weight of each is 0.05 g / m 2 from the viewpoint of rust resistance. In addition, the upper limit is generally preferably about 5 g / m 2 from the viewpoint of cost, but the present invention is not particularly limited thereto. The Sn / Ni ratio is not particularly limited in the present invention because it changes depending on the metal to be welded. As an example, when the metal to be welded is Ni or Ni-plated plate, Sn / N against welding strength
It is 30 to 95% of the optimum range of the i ratio.

次に本発明の請求項3ならびに第7図に示されるZn−Ni
についても耐錆性の点からそれぞれのメッキ付着量の下
限は0.05g/m2が限界である。また上限については一般的
にコストの点から5g/m2程度が好ましいが、本発明では
それを特に限定するものではない。Zn/Niの比率につい
ては溶接する対象金属によって変化するものであるため
本発明では特に限定しない。一例として溶接対象金属が
NiおよびNiメッキ板の場合、溶接強度に対するZn/Ni比
率の最適範囲は10〜75%である。
Next, Zn-Ni shown in claim 3 and FIG. 7 of the present invention
Also, from the viewpoint of rust resistance, the lower limit of the coating weight of each is 0.05 g / m 2 . In addition, the upper limit is generally preferably about 5 g / m 2 from the viewpoint of cost, but the present invention is not particularly limited thereto. The Zn / Ni ratio is not particularly limited in the present invention because it changes depending on the metal to be welded. As an example,
For Ni and Ni plated plates, the optimum range of Zn / Ni ratio to weld strength is 10-75%.

これら溶接面側のメッキ皮膜の組成は溶接対象金属の種
類による溶接強度に対する比較的広い適性範囲が存在す
るが、電子部品用途では溶接強度のみならず溶接時に発
生するスプラッシュが電子回路の短絡に直結するための
非常に厳しく制限されている。本発明では鋼板の表面粗
度をコントロールすることによってこの溶接スプラッシ
ュを大幅に改善し、前述したメッキ皮膜組成と組み合わ
せることによって初めて電子部品の溶接性を満足するこ
とが可能となった。第3図に各種溶接最適メッキ皮膜に
対する原板粗度と溶接スプラッシュ発生度の関係を示
す。図のように溶接面側のメッキ皮膜の種類(Ni,Ni−F
e合金、Ni−Sn合金、Ni−Zn合金:何れも溶接強度適性
範囲のもの)による差はほとんど見られず、何れのメッ
キ皮膜でも原板粗度が04μRa以上でスプラッシュ発生が
良好となる。従って、溶接面側の原板粗度は0.4μRa以
上に限定され、一般的な薄板の表面粗度として1.0μRa
程度が好ましいが、その上限は特に限定するものではな
い。
The composition of the plating film on the welding surface side has a relatively wide range of suitability for welding strength depending on the type of metal to be welded, but in electronic parts applications, not only the welding strength, but also the splash that occurs during welding is directly linked to short circuits in electronic circuits. You are very severely restricted to. In the present invention, this welding splash is significantly improved by controlling the surface roughness of the steel sheet, and it becomes possible to satisfy the weldability of electronic parts only by combining with the above-mentioned plating film composition. Fig. 3 shows the relationship between the original plate roughness and the weld splash occurrence rate for various welding optimum plating films. As shown in the figure, the type of plating film on the welding side (Ni, Ni-F
Almost no difference due to e-alloy, Ni-Sn alloy, Ni-Zn alloy: all of which are in the welding strength suitable range), and any of the plating films have a roughness of the original plate of 04 μRa or more and good splash generation. Therefore, the roughness of the original plate on the welding surface side is limited to 0.4 μRa or more, and the surface roughness of a general thin plate is 1.0 μRa.
The degree is preferable, but the upper limit is not particularly limited.

なお、この場合の各種メッキ合金皮膜の組成および製造
条件は以下の通りである。
The composition and manufacturing conditions of various plated alloy coatings in this case are as follows.

Ni;Ni=3.0g/m2、加熱温度=300℃、加熱速度=30
℃/秒 Sn−Ni;Sn=2.0、Ni=0.5各g/m2、加熱温度=300
℃、加熱速度=30℃/秒 Zn−Ni;Zn=1.0、Ni=1.0各g/m2、加熱温度=300
℃、加熱速度=30℃/秒 メッキ皮膜の合金化加熱処理の条件、方法については工
業的に生産するために短時間で行うことが必要であり、
その場合の一般的な条件は加熱温度150〜400℃、加熱速
度も数℃/秒〜数百℃/秒の範囲であり、好ましくは加
熱温度300℃、加熱速度30℃/秒である。また、加熱方
法についても電気およびガスによる加熱炉、通電抵抗加
熱、高周波誘導加熱あるいはこれらの組み合わせがあ
り、製造工程上、現行の錫メッキラインには通電加熱装
置があるためこれを利用するのが好ましいが、本発明で
は特に限定しない。
Ni; Ni = 3.0g / m 2 , heating temperature = 300 ℃, heating rate = 30
° C / sec Sn-Ni; Sn = 2.0, Ni = 0.5 g / m 2 for each, heating temperature = 300
℃, heating rate = 30 ℃ / sec Zn-Ni; Zn = 1.0, Ni = 1.0 g / m 2 for each, heating temperature = 300
℃, heating rate = 30 ℃ / sec Regarding the conditions and method of alloying heat treatment of plating film, it is necessary to carry out in a short time for industrial production,
In that case, the general conditions are a heating temperature of 150 to 400 ° C., and a heating rate of several degrees Celsius / second to several hundred degrees Celsius / second, preferably 300 ° C. and 30 ° C./second. Further, as a heating method, there are a heating furnace using electricity and gas, electric resistance resistance heating, high frequency induction heating, or a combination thereof, and in the manufacturing process, there is an electric current heating device in the current tin plating line, so it is recommended to use this Although preferred, the present invention is not particularly limited.

最後にメッキ鋼板の後処理として一般にクロメート処理
が行われるが、これに関しては、電解ならびに無電解に
よる処理方法を採用でき、その皮膜量は一般的な1〜10
0mg/m2の範囲であれば溶接性、耐ホイスカー性に対して
は影響なく、耐錆性が向上し、その量に関しては耐錆性
の要求レベルによって適時選択すればよい。
Finally, a chromate treatment is generally performed as a post-treatment for plated steel sheets. For this, electrolytic and electroless treatment methods can be adopted, and the coating amount is generally 1-10.
Within the range of 0 mg / m 2, the weldability and whisker resistance are not affected, and the rust resistance is improved, and the amount thereof may be appropriately selected according to the required level of rust resistance.

(実施例) 以下、実施例に基づいて本発明の内容を説明する。(Examples) Hereinafter, the contents of the present invention will be described based on Examples.

実施例−1 通常の方法で冷間圧延および焼鈍され、さらに表面粗度
0.5μRa以上に調整された低炭素冷延鋼板に通常の方法
で樹脂・酸洗を行った後、順に(1)に示す処理条件で
Niメッキ、(2)に示す処理条件でSnメッキ、(3)に
示す処理条件でZnメッキを施した。各メッキの付着量は
第1表中に示す。そして引き続いて通電抵抗加熱方式に
よって鋼板表面温度300℃で3秒程度の加熱処理を大気
中で実施し、片面側のメッキ層表面にSn−Zn二元合金、
メッキ層内部にZn−Ni、Sn−Ni二次合金並びにFe−Ni合
金を形成させ、他面のメッキ層にSn−Ni、Zn−Ni、Niま
たはFe−Ni合金の三種の何れか一種を形成させた。これ
ら表層に形成された合金層中のZn、SnおよびNiの成分分
析(重量%)は蛍光X線分析並びにGDS(グロー放電発
光分光分析)を併用して実施し、その値も第1表中に示
した。更に、(4)に示す条件でクロメート処理を施し
た後、各種評価試験に供した。
Example 1 Cold rolled and annealed by a conventional method, and further surface roughness
After low-carbon cold-rolled steel sheet adjusted to 0.5 μRa or more is subjected to resin / pickling by the usual method, the treatment conditions shown in (1) are applied in order.
Ni plating, Sn plating under the treatment conditions shown in (2), and Zn plating under the treatment conditions shown in (3) were performed. The adhesion amount of each plating is shown in Table 1. Then, subsequently, a heat treatment for 3 seconds at a steel plate surface temperature of about 3 seconds is carried out in the atmosphere by an electric resistance heating method, and a Sn-Zn binary alloy is formed on the plating layer surface on one side.
Zn-Ni, Sn-Ni secondary alloy and Fe-Ni alloy are formed inside the plating layer, and Sn-Ni, Zn-Ni, Ni or Fe-Ni alloy is formed on the plating layer on the other surface. Formed. The component analysis (wt%) of Zn, Sn and Ni in the alloy layers formed on these surface layers was carried out by using X-ray fluorescence analysis and GDS (glow discharge emission spectroscopy) together, and the values are also shown in Table 1. It was shown to. Furthermore, after performing a chromate treatment under the conditions shown in (4), it was subjected to various evaluation tests.

(1) Niメッキ 浴条件 NiSO4:7H2O:200〜300g/ NiCl2・6H2O:0〜50g/ H3BO340g/ メッキ条件 浴温度:40〜50℃ 電流密度:5〜30A/dm2 (1) Snメッキ 浴条件 硫酸錫:20〜30g/ フェノールスルフォン酸:20〜30g/ エトキシ化α−ナフトールスルフォン酸:2〜3g/ メッキ条件 浴温度:35〜45℃ 電流密度:2〜30A/dm2 (3) Znメッキ 浴条件 ZnSO4・7H2O:200〜400g/ Na2SO4:50〜150g/ メッキ条件 浴温度:40〜50℃ 電流密度:5〜30A/dm2 (4) クロメート処理 浴条件 CrO3:50〜100g/ H2SO4:0 処理条件 浴温度:40〜50℃ 電流密度:0A/dm2 (浸漬のみ5秒程度) 実施例−2 実施例−1においてクロメート処理条件として実施例−
1の(4)に替えて下記に示す(5)とした実施例であ
り、その他の項目は実施例−1と同じである。
(1) Ni plating bath conditions NiSO 4 : 7H 2 O: 200 to 300g / NiCl 2 · 6H 2 O: 0 to 50g / H 3 BO 3 40g / plating conditions Bath temperature: 40 to 50 ° C Current density: 5 to 30A / dm 2 (1) Sn plating bath conditions Tin sulfate: 20 to 30 g / Phenol sulfonic acid: 20 to 30 g / Ethoxylated α-naphthol sulfonic acid: 2 to 3 g / Plating conditions Bath temperature: 35 to 45 ° C Current density: 2 ~30A / dm 2 (3) Zn plating bath conditions ZnSO 4 · 7H 2 O: 200~400g / Na 2 SO 4: 50~150g / plating conditions bath temperature: 40 to 50 ° C. current density: 5~30A / dm 2 (4) Chromate treatment Bath conditions CrO 3 : 50 to 100 g / H 2 SO 4 : 0 treatment conditions Bath temperature: 40 to 50 ° C Current density: 0 A / dm 2 (immersion only for about 5 seconds) Example-2 Example- Example 1 as chromate treatment conditions in No. 1-
This is an example in which (4) of 1 is replaced by (5) shown below, and other items are the same as in Example-1.

(5) クロメート処理 浴条件 CrO3:50〜100g/ H2SO4:0.1〜20g/ 処理条件 浴温度:40〜60℃ 電流密度:20〜100A/dm2 Cr付着量:1〜100mg/m2 比較例−1 実施例−1において鋼板の両面にNi、Sn、Zn三層メッキ
を施し、リフロー加熱処理後、両面にSn−Zn、Zn−Ni、
Ni−Fe合金を生成させ、さらにクロメート処理条件とし
て実施例−1の(4)と同じ処理を行った実施例であ
り、その他の項目は実施例−1と同じである。
(5) Chromate treatment Bath condition CrO 3 : 50-100g / H 2 SO 4 : 0.1-20g / treatment condition Bath temperature: 40-60 ° C Current density: 20-100A / dm 2 Cr deposit: 1-100mg / m 2 Comparative Example-1 Ni, Sn, Zn three-layer plating on both sides of the steel sheet in Example-1, after reflow heat treatment, Sn-Zn, Zn-Ni on both sides,
This is an example in which a Ni-Fe alloy was produced and the same treatment as (4) in Example-1 was performed as the chromate treatment condition, and other items are the same as in Example-1.

比較例−2 実施例−1において鋼板の表面粗度を0.3μRa以下とし
たものであり、その他の項目は実施例−1と同じであ
る。
Comparative Example-2 The surface roughness of the steel sheet in Example-1 was 0.3 μRa or less, and the other items were the same as in Example-1.

比較例−3 実施例−2において鋼板の表面粗度を0.3μRa以下とし
たものであり、その他の項目は実施例−2と同じであ
る。
Comparative Example-3 In Example-2, the surface roughness of the steel sheet is 0.3 μRa or less, and the other items are the same as in Example-2.

比較例−4 片面当りのSnメッキ量が5.6g/m2、表面に施したクロメ
ート皮膜量が全Cr量として金属Cr換算で8mg/m2の電気メ
ッキブリキ(#50ブリキと称す)である。
Comparative Example-4 An electroplated tin plate (referred to as # 50 tin plate) with a Sn plating amount of 5.6 g / m 2 on one side and a total chromium amount of 8 mg / m 2 in terms of metallic Cr in terms of the amount of chromate film applied on the surface. .

比較例−5 片面当りのZnメッキ量が20.5g/m2、表面に施したクロメ
ート皮膜量が全Cr量として金属Cr換算で70mg/m2の電気
亜鉛メッキ鋼板(EG20と称す)である。
Comparative Example-5 An electrogalvanized steel sheet (referred to as EG20) having a Zn plating amount per one surface of 20.5 g / m 2 and a chromate coating amount applied to the surface of the total Cr amount of 70 mg / m 2 in terms of metal Cr.

比較例−6 片面当りのNiメッキ量が30.0g/m2の電気ニッケルメッキ
鋼板である。
Comparative Example-6 This is an electric nickel-plated steel sheet with a Ni plating amount of 30.0 g / m 2 on one surface.

以上、本発明実施例、比較例を以下に示す(a)〜
(e)の評価テストに供し、特性を比較した。
As described above, examples of the present invention and comparative examples are shown below (a) to
The evaluation test of (e) was performed to compare the characteristics.

(a) 耐湿テスト(非溶接面側のみ) 耐湿テストは供試材をそのまま60℃、90%RHの雰囲気中
で240時間経時させた。評価は目視にて行ない、評価基
準は○赤錆、白錆、変色、黒錆発生無し、△赤錆、白
錆、黒錆発生無し、変色あり、×赤錆、白錆、変色、黒
錆発生ありとした。
(A) Humidity resistance test (only on the non-welded surface side) For the humidity resistance test, the test material was aged for 240 hours in an atmosphere of 60 ° C. and 90% RH. Evaluation is performed visually, and the evaluation criteria are: ○ red rust, white rust, discoloration, black rust does not occur, △ red rust, white rust, black rust does not occur, discoloration, × red rust, white rust, discoloration, black rust occurrence did.

(b) 耐ホイスカーテスト(非溶接面側のみ) 耐ホイスカーテストは供試材をφ100×30mmの円筒絞り
加工を行った後に、耐湿テスト同様の60℃、90%RHの雰
囲気中で3〜6ケ月経時させた。評価は目視および走査
型電子顕微鏡にて行ない、評価基準は○ホイスカー発生
無し、×ホイスカー発生ありとした。
(B) Whisker resistance test (only on the non-welded surface side) The whisker resistance test was performed by subjecting the test material to cylindrical drawing of φ100 x 30 mm, and then 3-6 in the same humidity resistance test at 60 ° C and 90% RH. It was allowed to stand for a month. The evaluation was carried out visually and with a scanning electron microscope, and the evaluation criteria were ○ no whisker generation and x whisker generation.

(c) 溶接テスト(溶接面側のみ) 溶接テストは直径5mmの鋼電極を用い、Niメッキ鋼板を
溶接対象とし、加圧力50〜200kg/mm2、全電流2〜4KAで
行ない、溶接強度とスプラッシュの発生を評価した。評
価は溶接強度の良好なものを○、不良を×、スプラッシ
ュ発生大のものを×、微小スプラッシュを△、発生の無
かったものを○とした。
(C) Welding test (welding surface side only) The welding test uses a steel electrode with a diameter of 5 mm and targets Ni-plated steel plate for welding, with a pressing force of 50 to 200 kg / mm 2 and a total current of 2 to 4 KA to obtain welding strength. The occurrence of splash was evaluated. The evaluation was as follows: good welding strength was good, bad was bad, large splash was bad, fine splash was good, and no splash was good.

以上、テスト結果を第1表にまとめて示した。The test results are summarized in Table 1 above.

(発明の効果) 以上述べたように本発明は溶接用の電子部品用途として
片面が溶接性、耐錆性に優れ他面が耐錆性、耐ホイスカ
ー性に優れた性能を有するものである。本発明により低
コストで溶接に適した電子部品用表面処理鋼板の供給を
可能とするものである。
(Advantages of the Invention) As described above, the present invention has excellent weldability and rust resistance on one side and excellent rust resistance and whisker resistance on the other side for use as electronic parts for welding. The present invention makes it possible to supply a surface-treated steel sheet for electronic parts, which is suitable for welding at low cost.

【図面の簡単な説明】[Brief description of drawings]

第1図はSnメッキ量に対するZnメッキ量の割合と錆発生
率の関係の一例を示す。 第2図はZn/Sn比率とホイスカーの発生との関係の一例
を示す。 第3図は原板表面粗度と溶接スプラッシュ発生との関係
を示す。 第4図は請求項1記載の方法により得られる電子部品用
表面処理鋼板のメッキ層概念図の一例を示す。 第5図は請求項1記載の方法により得られる電子部品用
表面処理鋼板のメッキ層概念図の一例を示す。 第6図は請求項2記載の方法により得られる電子部品用
表面処理鋼板のメッキ層概念図の一例を示す。 第7図は請求項3記載の方法により得られる電子部品用
表面処理鋼板のメッキ層概念図の一例を示す。 第8図は特願平1-92075号の方法により得られる電子部
品用表面処理鋼板のメッキ層概念図の一例を示す。
FIG. 1 shows an example of the relationship between the ratio of the Zn plating amount to the Sn plating amount and the rust occurrence rate. FIG. 2 shows an example of the relationship between the Zn / Sn ratio and the occurrence of whiskers. FIG. 3 shows the relationship between the surface roughness of the original plate and the occurrence of welding splash. FIG. 4 shows an example of a conceptual diagram of the plating layer of the surface-treated steel sheet for electronic parts obtained by the method according to claim 1. FIG. 5 shows an example of a conceptual drawing of the plating layer of the surface-treated steel sheet for electronic parts obtained by the method of claim 1. FIG. 6 shows an example of a conceptual diagram of the plating layer of the surface-treated steel sheet for electronic parts obtained by the method of claim 2. FIG. 7 shows an example of a conceptual diagram of the plating layer of the surface-treated steel sheet for electronic parts obtained by the method of claim 3. FIG. 8 shows an example of a conceptual diagram of the plating layer of the surface-treated steel sheet for electronic parts obtained by the method of Japanese Patent Application No. 1-92075.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】片面の表面粗度Raが0.4μ以上の鋼板の他
面上に0.05g/m2以上のNiメッキを、このNiメッキ層上に
0.05g/m2以上のSnメッキを、このSnメッキ層上に上記Sn
メッキ量の10〜80%のZnメッキを施すと共に、上記片面
上に0.10g/m2以上のNiメッキを施した後、加熱処理によ
ってメッキ層を合金化させ、他面上にSn−Zn、Zn−Ni、
Sn−Ni、Fe−Ni合金層を、片面上にNi層及びFe−Ni合金
層またはFe−Ni合金層を形成し、更に上記両層上にクロ
メート皮膜層を形成したことを特徴とする片面が耐錆
性、溶接性に優れ、他面が耐錆性、耐ホイスカー性に優
れた電子機器部品用表面処理鋼板。
1. A Ni plate having a surface roughness Ra of 0.4 μ or more on one side and a Ni plating of 0.05 g / m 2 or more on the other surface of the steel plate on the Ni plating layer.
Apply Sn plating of 0.05g / m 2 or more on the Sn plating layer.
Along with performing Zn plating of 10 to 80% of the plating amount, after performing 0.10 g / m 2 or more Ni plating on the above-mentioned one surface, alloy the plating layer by heat treatment, and Sn-Zn on the other surface, Zn-Ni,
Sn-Ni, Fe-Ni alloy layer, a Ni layer and an Fe-Ni alloy layer or Fe-Ni alloy layer is formed on one side, further characterized by forming a chromate film layer on both layers Has excellent rust resistance and weldability, and the other surface has excellent rust resistance and whisker resistance.
【請求項2】片面の表面粗度Raが0.4μ以上の鋼板の他
面上に0.05g/m2以上のNiメッキを、このNiメッキ層上に
0.05g/m2以上のSnメッキを、このSnメッキ層上に上記Sn
メッキ量の10〜80%のZnメッキを施すと共に、上記片面
上に0.05g/m2以上のNiメッキを、このNiメッキ層上に0.
05g/m2以上のSnメッキを施した後、加熱処理によってメ
ッキ層を合金化させ、他面上にSn−Zn、Zn−Ni、Sn−N
i、Fe−Ni合金層を、片面上にSn−Ni、Fe−Ni合金層を
形成し、更に上記両層上にクロメート皮膜層を形成した
ことを特徴とする片面が耐錆性、溶接性に優れ、他面が
耐錆性、耐ホイスカー性に優れた電子機器部品用表面処
理鋼板。
2. Ni plating of 0.05 g / m 2 or more is formed on the other surface of the steel plate having a surface roughness Ra of 0.4 μ or more on one surface on the Ni plating layer.
Apply Sn plating of 0.05g / m 2 or more on the Sn plating layer.
Zn plating of 10 to 80% of the plating amount is performed, and 0.05 g / m 2 or more of Ni plating is applied on the one side and 0.
After applying Sn plating of 05 g / m 2 or more, heat treatment is used to alloy the plating layer and Sn-Zn, Zn-Ni, Sn-N on the other surface.
i, Fe-Ni alloy layer, Sn-Ni, Fe-Ni alloy layer formed on one side, further characterized by forming a chromate film layer on both layers rust resistance, weldability A surface-treated steel sheet for electronic device parts that has excellent rust resistance and whisker resistance on the other side.
【請求項3】片面の表面粗度Raが0.4μ以上の鋼板の他
面上に0.05g/m2以上のNiメッキを、このNiメッキ層上に
0.05g/m2以上のSnメッキを、このSnメッキ層上に上記Sn
メッキ量の10〜80%のZnメッキを施すと共に、上記片面
上に0.05g/m2以上のNiメッキを、このNiメッキ層上に0.
05g/m2以上のZnメッキを施した後、加熱処理によってメ
ッキ層を合金化させ、他面上にSn−Zn、Zn−Ni、Sn−N
i、Fe−Ni合金層を、片面上にZn−Ni、Fe−Ni合金層を
形成し、更に上記両層上にクロメート皮膜層を形成した
ことを特徴とする片面が耐錆性、溶接性に優れ、他面が
耐錆性、耐ホイスカー性に優れた電子機器部品用表面処
理鋼板。
3. Ni plating of 0.05 g / m 2 or more is formed on the other surface of the steel plate having a surface roughness Ra of 0.4 μ or more on one surface, on this Ni plating layer.
Apply Sn plating of 0.05g / m 2 or more on the Sn plating layer.
Zn plating of 10 to 80% of the plating amount is performed, and 0.05 g / m 2 or more of Ni plating is applied on the one side and 0.
After applying Zn plating of 05 g / m 2 or more, heat treatment is used to alloy the plating layer, and Sn-Zn, Zn-Ni, Sn-N on the other surface.
i, Fe-Ni alloy layer, Zn-Ni, Fe-Ni alloy layer was formed on one side, and further a chromate film layer was formed on both layers, one side is rust resistance, weldability A surface-treated steel sheet for electronic device parts that has excellent rust resistance and whisker resistance on the other side.
JP9381390A 1990-04-09 1990-04-09 Surface-treated steel sheet for electronic device parts Expired - Fee Related JPH079074B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9381390A JPH079074B2 (en) 1990-04-09 1990-04-09 Surface-treated steel sheet for electronic device parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9381390A JPH079074B2 (en) 1990-04-09 1990-04-09 Surface-treated steel sheet for electronic device parts

Publications (2)

Publication Number Publication Date
JPH03291386A JPH03291386A (en) 1991-12-20
JPH079074B2 true JPH079074B2 (en) 1995-02-01

Family

ID=14092842

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Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JPH079074B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496825B1 (en) * 2000-12-23 2005-06-22 주식회사 포스코 Zn-Ni-Fe alloy electrodeposited steel sheet for good shielding electromagnetic wave
EP1241281A1 (en) * 2001-03-16 2002-09-18 Shipley Co. L.L.C. Tin plating
JP4954406B2 (en) * 2001-09-27 2012-06-13 東洋鋼鈑株式会社 Surface-treated steel sheet for electronic parts and manufacturing method thereof
DE10251658B4 (en) * 2002-11-01 2005-08-25 Atotech Deutschland Gmbh Method for connecting microstructured component layers suitable for the production of microstructure components and microstructured component
US10189229B2 (en) 2014-01-28 2019-01-29 Nippon Steel & Sumitomo Metal Corporation Surface-treated steel sheet
JP6565308B2 (en) * 2015-05-01 2019-08-28 日本製鉄株式会社 Steel plate for container and method for producing steel plate for container

Also Published As

Publication number Publication date
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