JPH0787168B2 - Electronic component manufacturing equipment - Google Patents

Description

The present invention relates to an electronic component manufacturing apparatus.

In particular, the "electronic component" in the present specification means, for example,
Electronic parts having electrodes at both ends, such as resistors, capacitors, electronic jumper wires, etc., and include all axial lead type, radial lead type, or chip type.

[Conventional technology]

FIGS. 10 (a) and 10 (b) are explanatory views of the rectangular cap electrode in the conventional example. The square cap electrode 32 is formed into a plate 31 having a shape as shown in FIG. 10 (a) by a pressing device, and then squeezed several times by a pressing device equipped with a square die, The open portion 33 is trimmed by the trimming device as shown in FIG. In the case of an axial lead type electronic component, a lead wire (not shown) is connected to the square cap electrode 32 by a butt resistance welding machine. Then, a rectangular electronic component inserting device (not shown) is inserted from the open portion 33 of the rectangular cap electrode 32 by the rectangular electronic component inserting device, and the rectangular electronic component basic body is rubbed by friction between the two. It is electrically and mechanically connected without dropping from the mold cap electrode 32.

11 (a) and 11 (b) are explanatory views of another rectangular cap electrode in the conventional example. The rectangular cap electrode 42 is first formed by a pressing device to form a cross plate body 41 as shown in FIG. 11 (a), and then by another pressing device.
It is bent at a right angle according to the dotted line of 41, and then, as shown in FIG. 11 (b), the side ends are abutted to form a contact portion 44.

FIGS. 12 (a) and 12 (b) are explanatory views of another rectangular cap electrode in the conventional example.

The rectangular cap electrode 45 in this embodiment is designed to further increase the attachment strength between the rectangular electronic component element body and the rectangular cap electrode 42 shown in FIG. 11 and to reduce the manufacturing cost.

That is, first, when the four corners are drawn by the pressing device, the first portion is provided with the meat portion 49 for facilitating the drawing of the drawn portion 46.
The cross plate 48 as shown in FIG. 12A is formed. After that, the central portion of the pressing device is pressed by another pressing device equipped with a rectangular die (not shown), and the rectangular cap electrode 45 having the shape as shown in FIG.

The rectangular cap electrode 45 thus formed is formed with a contact portion 47 that comes into contact with the side end portions of the adjacent cross plate bodies 48 near the open portion 43.

Further, in a portion closer to the bottom than the open portion 43, a narrowed portion 46 in which the side end portion of the cross plate body 48 is continuous is formed.

The narrowed portion 46 shown in FIG. 12B depends on the cross-sectional area of the square cap electrode 45, but is approximately half of one side of the square cap electrode 45.
When it is set to about 1/3, the square cap electrode 45 can be narrowed down by pressing the die once.

Although the electronic component having a rectangular cross section of the element body has been described above, an electronic component having a rectangular, circular, or elliptical cross section can be manufactured in substantially the same manner as the conventional example.

[Problems to be Solved by the Invention]

The apparatus for manufacturing the rectangular cap electrode 32 shown in FIG. 10 has a problem in that a large number of expensive dies are required and the cost is high because it is necessary to perform multistage drawing on a small-shaped portion.

In addition, the rectangular cap electrode 42 shown in FIG.
When the thickness is reduced, the frictional force between the rectangular electronic component element body and the rectangular cap electrode 42 is weakened, and the mechanical strength and electrical connection between them are weakened. On the contrary, if the thickness of the cross plate 41 is increased, the strength of the rectangular cap electrode 42 and the frictional force between the rectangular electronic component element body and the rectangular cap electrode 42 become stronger. But,
An apparatus for processing a thick plate material is not only expensive for the mold but also expensive for the material.

The square cap electrode 45 shown in FIG. 12 is obtained by eliminating the defects in the square cap electrode 32 shown in FIG. 10 and the square cap electrode 42 shown in FIG.

However, in any of the conventional cap electrodes, the electronic component element body must be fitted to the cap electrode. Therefore, even if the working precision of the cap electrode and the electronic component element body is slightly uneven, there is a drawback in that some of the electronic element element bodies are difficult to insert or are easily detached. As described above, it is very difficult to develop a device in which the electronic component element body is easily inserted into the cap electrode and is hard to drop off. Therefore, the assembly speed at the time of inserting the electronic component body into the rectangular cap electrode is sacrificed, and the working precision of the electronic component body and the rectangular cap electrode is increased to prevent the electronic component body from falling off. However, it has a drawback of becoming an expensive electronic component.

Further, the manufacturing apparatus for welding the lead wires one by one to both ends of the electronic component to form the axial lead type electronic component takes a very long time and makes the cost of the electronic component expensive.

The present invention is for solving the above problems,
An object of the present invention is to provide an electronic component manufacturing apparatus capable of assembling electronic components at high speed.

The present invention also provides a pick-and-place device for picking up electronic components from a carrier tape, an automatic mounter for mounting these electronic components on a circuit board, or an automatic insert for automatically inserting the leads of the electronic components into the through holes of the circuit board. An object of the present invention is to provide an electronic component that can be used as it is by a machine and the like, and an apparatus for manufacturing the electronic component.

[Means for Solving the Problems]

In order to achieve the above object, an electronic component manufacturing apparatus according to the present invention includes a winding portion around which a warp member is wound, a pilot hole for positioning and driving the warp member, and a position corresponding to the electronic component. An opening provided in the electronic component, a punching slit for the electronic component, and an element body receiving portion composed of a support piece supporting at least a part of both lower end portions of the electronic component element body and a vertical portion connected to the support piece. A plastic working portion to be formed, a welding portion including a welding electrode to be inserted into the element receiving portion and a chuck electrode for moving the tip of the lead wire toward the vertical portion, and an electronic component element A pick-and-placer that is taken out from the device and inserted into the element receiving section, a reflow furnace that solders the element electrode of the electronic element element and the element receiving section, and the warp material and the electronic element are separated. Do Composed of a vent press.

Further, the electronic component manufacturing apparatus according to the present invention includes a winding portion around which a warp material is wound, a pilot hole for positioning and driving the hoop material, and an opening provided at a position corresponding to the electronic component. , Slits for punching electronic parts,
And a plastically processed portion forming an element body receiving portion configured by a support piece that supports at least a part of both lower end portions of the electronic component body, and a vertical portion continuous with the support piece, and an electronic component body A pick-and-placer that is taken out from a supply device and inserted into the element body receiving portion, a reflow furnace that solders the element electrode of the electronic component element body and the element body receiving portion, and the warp material and the electronic component. It is composed of a punching press to be separated.

The electronic component manufacturing apparatus of the present invention may include a coating apparatus that coats with an insulating member while leaving the lead wire or the lower terminal electrode portion of the electronic component.

Furthermore, the electronic component manufacturing apparatus of the present invention includes a plastic working portion,
It is configured to have a weld, a pick and placer, and a punching press.

[Action]

An electronic component manufacturing apparatus according to the present invention includes a plastic working portion for processing at least electrodes of an electronic component, a pick-and-placer for inserting an electronic component element body into an electrode portion of the electronic component, a reflow furnace, and an electronic component. A punching press for separating the hoop material is driven, and the devices of the respective parts are associated with each other while driving the hoop material. That is, the electronic components are continuously assembled without separating one by one from the hoop material.

In the case of the axial lead type electronic component, the vertical portion of the electrode portion and the lead wire tip portion can be connected at the same time, so that the electronic component can be assembled easily and at high speed.
When the electronic component element body is inserted into the element body receiving portion, the insertion device used when inserting the electronic component element into the recessed hole of the carrier tape can be used as it is. Further, since the hoop material replaces the conveyor belt in a series of assembling devices for electronic parts, not only a special conveyor belt is not required, but also time for putting on or taking out the conveyor babet can be omitted.

〔Example〕

FIG. 1 is an explanatory view of perforating a hoop material according to the present invention, and FIG. 2 is an explanatory view of forming an electronic component body receiving portion according to the present invention. The plastic working apparatus shown in FIGS. 1 and 2 is a press machine, for example, while sequentially feeding a hoop material 1 made of a thin steel material having a thickness of 0.1 mm, as shown in FIG. 1, positioning and driving pilot holes 2, The openings 3 and the slits 4 and 4'are formed by respective molds.

Further, as shown in FIG. 1, the center of the opening 3 is formed on the hoop material 1 which is opened by a pressing device by a press die (not shown) having a size substantially equal to the electronic component body 11. By pressing, the element receiving portions 7, 7'are formed. The electronic component body receiving portions 7 and 7'formed in this manner have an area sufficient to mount at least a part of the lower end portion of the electronic component body 11 (see FIGS. 4 to 5). A pair of supporting pieces 5 and 5'and vertical portions 6 and 6'which are connected to the supporting pieces 5 and 5 '.
Composed of.

Therefore, the support pieces 5 and 5'are as shown in FIG.
It is not necessary to support the entire lower end portion of the electronic component element body 11, and the shape of the support pieces 5, 5'can be changed to an E shape, a U shape, or the like. The shape of the support pieces 5 and 5'may be any shape as long as the soldering strength is high. Also,
In the case of a cylindrical electronic component, a press die is used so as to form the support pieces 5, 5'shaped along the circumference thereof. Alternatively, the electronic component may have a rectangular or elliptical cross section.

The above-mentioned plastically worked portion is not described in the manufacturing apparatus shown in FIG. 9, but can be provided before the welded portion shown in FIG.

FIG. 3 is an explanatory view of lead wire connection in the present invention. The welding portion for welding the lead wire in FIG. 3 is an axial lead type electronic component, and as shown in FIG. 3, the (-) side electrode of the butt resistance welding machine is attached to the element receiving portions 7, 7 '. The (+) side chuck electrodes 9 and 9'which are inserted and grip the lead wires 8 and 8'are the vertical portions 6 of the element receiving portions 7 and 7 '.
It moves toward 6'as shown by the arrow in FIG. After that, the lead wires 8 and 8'protruding from the tips of the (+) side chuck electrodes 9 and 9'abut the vertical portions 6 and 6 '. At this time, the welding current is
9'to lead wires 8, 8 ', vertical portions 6, 6', welding electrodes
10 and the Joule heat is generated at the tips of the lead wires 8 and 8'having the highest contact resistance and the vertical portions 6 and 6 '. And
As shown in FIG. 5, welded portions 13 and 13 'are formed to connect the two.

FIG. 4 is an explanatory diagram of insertion of an electronic component body according to the present invention, and FIG. 5 is a sectional view taken along the line AA 'in FIG. 4 and 5
The insertion device in the figure inserts the electronic component element body 11 into the element body receiving portions 7, 7'formed on the hoop material 1. When the electronic component element body 11 is inserted into the element body receiving portions 7 and 7 ′, the element electrodes 12 and 12 ′ of the electronic component element body 11 are, for example, cream solder is attached, although not shown in advance. ing.
The electronic component body inserting apparatus uses the electronic component supplying pick and placer 24 shown in FIG. This device
It is the same device that inserts an electronic component into a carrier tape, and is composed of a suction chuck that sucks the electronic component element body 11 and a device that moves the electronic component element body 11 to a predetermined position and then separates the electronic component element body 11 from the suction chuck. There is.

Thereafter, the reflow process for connecting the element electrodes 12 and 12 'of the electronic component element body 11 and the vertical portions 6 and 6'of the element body receiving portions 7 and 7'is performed by passing the solder furnace 25 shown in FIG. Thus, the above both are mechanically and electrically connected.

FIG. 6 is an explanatory diagram for separating electronic components according to the present invention.
As shown in FIG. 9, the punching device in FIG. 6 separates the electronic component 26 from the hoop material 1 by a punching press 27 provided with a press die (not shown). The die in the punching device has slits 4 and 4'as shown by a dotted line in FIG. 6, for example.
Press cutting parts 14 and 14 'along the body receiving parts 7 and 7'
To have a shape.

An external view of the axial lead type electronic component 26 completed as described above is shown in FIG. That is, by punching with the press, upper end frame portions 16 and 16 'are formed at the upper end portions of the element body receiving portions 7 and 7'. Also, in order to increase the connection strength between the electronic component element body 11 and the element body receiving portions 7, 7 ', as shown in FIG. 8, it is coated with an insulating paint 17 or a molding member. Further, the coating may be performed on each board after the electronic component 26 is attached to the circuit board.

Note that FIG. 9 is an explanatory diagram of an axial lead type electronic component manufacturing apparatus according to the present invention, and shows a series of manufacturing lines according to the present invention. That is, the hoop material winder 21
A hoop material 1 in which perforations and element receiving portions 7 and 7'are formed in advance as shown in FIG. 1 is wound. After that, the hoop material 1 that has become unnecessary after passing through each device is wound around the winding device 29 by the drive of the drive puller 28.

Further, in FIG. 9, a plastic working portion not shown,
The welding speed, the pick-and-placer, and the punching press can be provided together to increase the production speed. In this case, the speed is tripled or more compared with the speed of the conventional example.

Furthermore, although the embodiment shown in FIG. 9 does not have a plastic working portion, it can be a series of manufacturing apparatuses including the plastic working portion.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Various design changes can be made without departing from the present invention described in the claims.

For example, although the above-described embodiment has mainly described the axial lead type electronic component using the rectangular element body, the rectangular chip type electronic component or the axial lead type electronic component using the cylindrical element body is described.
It goes without saying that the present invention can also be applied to lead type electronic parts and cylindrical chip type electronic parts.

Further, the present invention can be applied to a radial lead type electronic component or the like in which lead wires having a deformed shape are drawn out in the same direction.

Further, the punching of the electronic component from the hoop material in the present embodiment has a shape like the upper end frame portions 16 and 16 'as shown in FIG. 6, but the shape is not limited to such a shape. That is, as long as the electronic component is connected to the hoop material 1 until punched out from the hoop material 1, the shape is not limited to the shape of this embodiment.

〔The invention's effect〕

According to the present invention, since a series of devices can be continuously operated while the hoop material is driven like a conveyor belt, the time for putting electronic components and / or lead wires on the conveyor belt or taking them out can be omitted. Therefore, the manufacturing speed of electronic parts can be significantly improved.

Further, according to the present invention, the device for supplying electronic components and the lead wire can use the taping device for the carrier tape in the conventional example as it is, and the device for supplying the cap electrode is unnecessary. be able to. Further, the production speed can be further improved by providing the devices for pressing, supplying the lead wire and the electronic component element body in parallel.

Furthermore, according to the present invention, since the electrode structure of the electronic component is not the cap electrode as in the conventional case, a fitting device for the electronic component element body and the cap electrode is not required, and the production line can be speeded up.

[Brief description of drawings]

FIG. 1 is an explanatory view of perforating a hoop material according to the present invention, FIG. 2 is an explanatory view of forming an electronic component body receiving portion according to the present invention, and FIG.
FIG. 4 is an explanatory view of lead wire connection in the present invention, FIG. 4 is an explanatory view of insertion of an electronic component element body in the present invention, and FIG. 5 is FIG. 4A.
-A 'cross-sectional view, FIG. 6 is an explanatory view for separating electronic parts according to the present invention, FIG. 7 is a completed view of the electronic part element body and lead wire connection according to the present invention, and FIG. 8 is an axial lead type electronic part according to the present invention. FIG. 9 is an external view, FIG. 9 is an explanatory diagram of an axial lead type electronic component manufacturing apparatus according to the present invention, and FIG.
And (b) are explanatory diagrams of the rectangular cap electrode in the conventional example, FIGS. 11 (a) and (b) are explanatory diagrams of other rectangular cap electrodes in the conventional example, and FIGS. 12 (a) and (b) are conventional. It is another square cap electrode explanatory drawing in an example. 1 ... Hoop material 2 ... Pilot hole 3 ... Open hole 4, 4 '... Slit 5, 5' ... Support piece 6, 6 '... Vertical part 7, 7' ... Element receiving part 8, 8 '... Lead wire 9, 9' ... Chuck electrode 10 ... Welding electrode 11 ... Electronic component body 12, 12 '... Element body electrode 13, 13' ... Welded portion 14, 14 '... Press Cutting part 15 …… Opening holes 16, 16 ′ …… Upper frame part 17 …… Insulating paint 21 …… Hoop material winding machine 22 …… Reel 23 …… Electronic component body supply device 24 …… Electronic component supply pick And placer 25 …… Solder furnace 26 …… Electronic components 27 …… Punching press 28 …… Drive pulley 29 …… Winding device

Claims (4)

[Claims] 1. A winding portion around which a hoop material 1 is wound, a pilot hole 2 for positioning and driving the hoop material 1, an opening 3 provided at a position corresponding to an electronic component,
Supporting pieces 5, 5'for supporting at least a part of both lower ends of the electronic component blank 11 and the punching slits 4, 4'for electronic parts, and vertical parts 6, 6'which are continuous with the supporting pieces 5, 5 '.
A plastically worked portion forming an element body receiving portion 7, 7 ', a welding electrode 10 inserted into the element body receiving portion 7, 7', and a lead wire toward the vertical portions 6, 6 '. A welding part composed of chuck electrodes 9 and 9'for moving the tips of 8 and 8 ', and a pick-and-insert for taking out the electronic component element body 11 from the electronic component supply device and inserting it into the element body receiving portions 7, 7'. A placer, a reflow furnace for soldering the element electrodes 12, 12 'of the electronic component element body 11 and the element body receiving portions 7, 7', and punching for separating the hoop material 1 and the electronic component 26 An electronic component manufacturing apparatus comprising a press 27 and. 2. A winding portion around which the hoop material 1 is wound, a pilot hole 2 for positioning and driving the hoop material 1, an opening 3 provided at a position corresponding to an electronic component,
Punching slits 4, 4'for electronic parts, and a supporting piece 5 for supporting at least a part of both lower ends of the electronic part body 11.
5'and a plastic working portion forming an element body receiving portion 7, 7'consisting of vertical portions 6, 6'that are connected to the supporting pieces 5, 5 ', and an electronic component body 11 from an electronic component supply device. A pick-and-placer for taking out and inserting into the element receiving portions 7, 7 ', and a reflow furnace for soldering the element electrodes 12, 12' of the electronic component element 11 and the element receiving portions 7, 7 ' And a punching press 27 for separating the hoop material 1 and the electronic component 26 from each other. 3. A coating device for coating with an insulating member while leaving the lead wires 8, 8'or the lower terminal electrode portion of the electronic component, the coating device according to claim 1 or 2. Manufacturing equipment for electronic components. 4. An electronic component manufacturing apparatus according to claim 1, further comprising a plastic working portion, a welding portion, a pick and placer, and a punching press.